Quartz wafer cleaning carrier
Patent Information
- Application Number
- CN202522209060.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-20
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-10-20
AI Technical Summary
[0002]目前,清洗石英晶片有两种方法,一种是将很多石英晶片混合放于一个金属笼中,然后将金属笼放于清洗机中进行清洗,清洗过程中容易出现叠片等问题,造成清洗不全面;另外一种方法是用金属夹片固定石英晶片的四角,金属夹具随石英晶片一起放于清洗槽中清洗,虽然避免了石英晶片间相互干涉,但是石英晶片被金属夹具夹持的位置为清洗盲区,无法清洗干净
1、每个石英晶片被托板和压板单独竖直放置,且石英晶片在窗口内存在活动余量,将石英晶片放置到溶液中,并对石英晶片进行超声波清理,由此方便对石英晶片进行清理,杂质脱离石英晶片后能够快速掉落,提高石英晶片的清理效果;
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Figure CN224775390U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of quartz wafer cleaning equipment, and more particularly to quartz wafer cleaning carriers. Background Technology
[0002] Currently, there are two methods for cleaning quartz wafers. One method involves mixing many quartz wafers together in a metal cage, then placing the metal cage in a cleaning machine for cleaning. However, this method is prone to problems such as wafer stacking during the cleaning process, resulting in incomplete cleaning. The other method involves using metal clamps to fix the four corners of the quartz wafers. The metal clamps are placed in the cleaning tank along with the quartz wafers for cleaning. Although this avoids interference between the quartz wafers, the areas where the quartz wafers are clamped by the metal clamps are cleaning blind spots and cannot be cleaned thoroughly. Utility Model Content
[0003] To improve the cleaning effect of quartz wafers, this application provides a quartz wafer cleaning carrier.
[0004] The quartz wafer cleaning carrier provided in this application adopts the following technical solution: A quartz wafer cleaning carrier includes a column, on the periphery of which are arranged a plurality of evenly distributed carrier components, each carrier component including a support plate and a pressure plate. One side of the support plate and one side of the pressure plate are rotatably connected, and the other side is fixedly connected by fixing bolts and fixing nuts. The support plate is provided with a plurality of windows protruding toward the side away from the pressure plate. The quartz wafer is located between the windows and the pressure plate. A connecting assembly is provided between the support plate and the column.
[0005] By adopting the above technical solution, the fixing bolts and nuts are opened, allowing the pressure plate and support plate to open. The quartz wafer is then placed on the support plate and sinks into the corresponding window. The pressure plate is then reassembled with the support plate, and the fixing bolts and nuts are used to secure them again. The support plate is then mounted on the column via a connecting assembly. This allows the quartz wafer to be placed vertically and individually, with sufficient room for movement within the window. The quartz wafer is then placed in a solution and ultrasonically cleaned, facilitating cleaning. Impurities detach from the quartz wafer and fall off quickly, improving the cleaning effect.
[0006] Optionally, the pressure plate includes a frame, and a barrier mesh is provided inside the frame to restrict the quartz wafer within the window.
[0007] By adopting the above technical solution, the quartz wafer is sealed inside the window by the barrier net, thereby removing impurities from the quartz wafer through the window and the barrier net, preventing impurities from remaining inside the window, and thus improving the cleaning efficiency and effect of the quartz wafer.
[0008] Optionally, the lower side of the window has an opening, and multiple support rods are arranged in the opening, with the quartz wafer abutting against the support rods.
[0009] By adopting the above technical solution, impurities on the quartz wafer can fall off through adjacent support rods, avoiding impurity accumulation and improving the cleaning effect of the quartz wafer.
[0010] Optionally, the connecting assembly includes two connecting rings mounted on the column, each connecting ring having a connecting rod corresponding to the carrier, a connecting block passing through the end of the connecting rod away from the connecting ring, the connecting block being fixed to the side of the support plate, and a reinforcing nut threaded onto the connecting rod abutting against the side wall of the connecting block.
[0011] Optionally, a base is rotatably connected below the column, and a drive motor is installed inside the base. The output shaft of the drive motor is connected to the column via gears.
[0012] By adopting the above technical solution, the drive motor drives the column to rotate, and the column drives all the carriers to rotate, thereby allowing the solution to flush the quartz wafer, so that the impurities detached from the quartz wafer can be quickly discharged, improving the cleaning efficiency.
[0013] Optionally, the column is further provided with a vibration assembly, which is connected to the connecting rod.
[0014] By adopting the above technical solution, the vibration component further enhances the removal of impurities on the quartz wafer, thereby improving cleaning efficiency.
[0015] Optionally, the vibration assembly includes a fixed rod that passes through the column and is coaxial with the column. The fixed rod is fixed to the base. A vibrating plate with the same horizontal plane as the connecting rod is provided on the fixed rod. The edge of the vibrating plate is wavy. One end of the connecting rod passes through a connecting ring and is slidably connected to the column. The end of the connecting rod abuts against the side of the vibrating plate. A spring for driving the connecting rod is also provided inside the column.
[0016] By adopting the above technical solution, during the rotation of the column, the vibratory plate and spring work together to drive the connecting rod to move back and forth, thereby keeping the carrier and quartz crystal vibrating, which facilitates the removal of impurities from the quartz crystal and improves cleaning efficiency and effect.
[0017] Optionally, the column has cavities distributed along the length of the connecting rod, and a limiting block is slidably connected in the cavity. The limiting block is fixed on the connecting rod, and one end of the spring is fixed on the limiting block, while the other end is fixed on the column.
[0018] By adopting the above technical solution, the limiting block prevents the connecting block from detaching from the column, maintains the overall stability of the carrier, and improves the safety of the quartz wafer cleaning process.
[0019] In summary, this application includes at least one of the following beneficial technical effects: 1. Each quartz wafer is placed vertically by a tray and a pressure plate, and there is room for movement within the window. The quartz wafer is placed in the solution and ultrasonically cleaned, which facilitates the cleaning of the quartz wafer. Impurities can fall off quickly after being removed from the quartz wafer, improving the cleaning effect of the quartz wafer. 2. The vibration component further enhances the removal of impurities from the quartz wafer, improving cleaning efficiency. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.
[0021] Figure 2 This is a schematic diagram of the structure of the carrier in an embodiment of this application.
[0022] Figure 3 This is a schematic diagram of the internal structure of an embodiment of this application.
[0023] Figure 4 This is a schematic diagram of the structure of the vibration component according to an embodiment of this application.
[0024] Explanation of reference numerals in the attached drawings: 1. Column; 2. Carrier; 21. Support plate; 211. Window; 212. Opening; 213. Support rod; 22. Pressure plate; 221. Frame; 222. Barrier net; 3. Connecting assembly; 31. Connecting ring; 32. Connecting rod; 33. Connecting block; 34. Reinforcing nut; 4. Base; 5. Vibration assembly; 51. Fixing rod; 52. Vibration plate; 53. Spring; 6. Limiting block. Detailed Implementation
[0025] The present application will be further described in detail below with reference to the accompanying drawings.
[0026] This application discloses a quartz wafer cleaning carrier. (Refer to...) Figure 1 and Figure 2The quartz wafer cleaning carrier includes a column 1. Four evenly distributed carriers 2 are arranged on the outer periphery of the column 1. Each carrier 2 includes a vertically arranged support plate 21 and a pressure plate 22. The vertical side of the support plate 21 and the vertical side of the pressure plate 22 are rotatably connected. The pressure plate 22 includes a frame 221 attached to the support plate 21. A barrier net 222 is fixed inside the frame 221. When the support plate 21 and the pressure plate 22 are together, the other side of the support plate 21 and the pressure plate 22 are provided with fixing bolts and fixing nuts. The frame 221 of the pressure plate 22 and the support plate 21 are fixedly connected by fixing bolts and fixing nuts. The support plate 21 has multiple windows 211 protruding away from the side away from the pressure plate 22. The quartz wafer is located between the window 211 and the pressure plate 22. The barrier net 222 restricts the quartz wafer within the window 211. A connecting component 3 is provided between the support plate 21 and the column 1.
[0027] Open the fixing bolts and nuts to open the pressure plate 22 and the support plate 21. Then place the quartz wafer on the support plate 21 and let it sink into the corresponding window 211. Then the pressure plate 22 is closed with the support plate 21 again, and the quartz wafer is sealed in the window 211 by the barrier net 222. The fixing bolts and nuts are then used to fix the support plate 21 and the pressure plate 22. The support plate 21 is then installed on the column 1 by the connecting component 3. Thus, the quartz wafer is placed vertically by itself, and there is room for movement within the window 211. The quartz wafer is placed in the solution and ultrasonically cleaned. This facilitates the cleaning of the quartz wafer. Impurities can fall off quickly after detaching from the quartz wafer. Impurities on the quartz wafer can be cleaned from the window 211 and the barrier net 222, preventing impurities from remaining in the window 211.
[0028] To prevent impurities from accumulating, an opening 212 is provided on the lower side of the window 211, and multiple support rods 213 are installed inside the opening 212. The quartz wafer abuts against the support rods 213. Impurities on the quartz wafer can fall directly through the adjacent support rods 213, thereby preventing impurity accumulation.
[0029] Reference Figure 2 and Figure 3 The connecting component 3 includes two connecting rings 31 that are fixed to the column 1 from top to bottom. The connecting rings 31 are provided with connecting rods 32 corresponding to the carrier 2. A connecting block 33 is provided at the end of the connecting rod 32 away from the connecting rings 31. The connecting block 33 is fixed to the side of the support plate 21. A reinforcing nut 34 is threaded onto the connecting rod 32 and abuts against the side wall of the connecting block 33.
[0030] Reference Figure 3 and Figure 4A base 4 is rotatably connected below the column 1. A drive motor is installed inside the base 4, and the output shaft of the drive motor is connected to the column 1 via gears. A vibration assembly 5 is also provided inside the column 1, and the vibration assembly 5 is connected to the connecting rod 32. The vibration assembly 5 includes a fixed rod 51 that passes through the column 1 and is coaxial with the column 1. The fixed rod 51 is fixed to the base 4. A vibrating disk 52 with the same horizontal plane as the connecting rod 32 is fixed on the fixed rod 51. The edge of the vibrating disk 52 is wavy. One end of the connecting rod 32 passes through the connecting ring 31 and is slidably connected inside the column 1. The end of the connecting rod 32 abuts against the side of the vibrating disk 52. A spring 53 for driving the connecting rod 32 is also provided inside the column 1.
[0031] The column 1 has cavities distributed along the length of the connecting rod 32. A limit block 6 is slidably connected in the cavity. The limit block 6 is fixed on the connecting rod 32, and one end of the spring 53 is fixed on the limit block 6, while the other end is fixed on the column 1.
[0032] The drive motor drives the column 1 to rotate, which in turn drives all the carrier components 2 to rotate, thereby causing the solution to wash over the quartz wafer. The vibration component 5 further promotes the removal of impurities from the quartz wafer. During the rotation of the column 1, the limiting block 6 prevents the connecting block 33 from detaching from the column 1, maintaining the overall stability of the carrier. The vibrating plate 52 and the spring 53 work together to drive the connecting rod 32 to move back and forth, thereby keeping the carrier components 2 and the quartz wafer vibrating, which facilitates the removal of impurities from the quartz wafer.
[0033] The implementation principle of the quartz wafer cleaning carrier in this application embodiment is as follows: the quartz wafer is placed between the tray 21 and the pressure plate 22, which are supported by the connecting component 3. After the quartz wafer is immersed in the solution, the drive motor drives the column 1 to rotate, thereby driving the quartz wafer to rotate. The vibration component 5 drives the quartz wafer to vibrate, thereby accelerating the removal of impurities.
[0034] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A quartz wafer cleaning carrier, characterized in that: The system includes a column (1), and a plurality of evenly distributed carriers (2) are provided around the column (1). Each carrier (2) includes a support plate (21) and a pressure plate (22). One side of the support plate (21) and one side of the pressure plate (22) are rotatably connected, and the other side is fixedly connected by a fixing bolt and a fixing nut. The support plate (21) is provided with a plurality of windows (211) protruding toward the side away from the pressure plate (22). The quartz wafer is located between the window (211) and the pressure plate (22). A connecting assembly (3) is provided between the support plate (21) and the column (1).
2. The quartz wafer cleaning carrier according to claim 1, characterized in that: The pressure plate (22) includes a frame (221), and a barrier net (222) is provided inside the frame (221) to restrict the quartz wafer within the window (211).
3. The quartz wafer cleaning carrier according to claim 2, characterized in that: The lower side of the window (211) has an opening (212), and multiple support rods (213) are provided in the opening (212), with the quartz wafer abutting against the support rods (213).
4. The quartz wafer cleaning carrier according to claim 1, characterized in that: The connecting assembly (3) includes two connecting rings (31) set on the column (1). The connecting rings (31) are provided with connecting rods (32) corresponding to the carrier (2). A connecting block (33) is provided at one end of the connecting rod (32) away from the connecting ring (31). The connecting block (33) is fixed on the side of the support plate (21). A reinforcing nut (34) is threaded on the connecting rod (32) and abuts against the side wall of the connecting block (33).
5. The quartz wafer cleaning carrier according to claim 4, characterized in that: A base (4) is rotatably connected below the column (1), and a drive motor is installed inside the base (4). The output shaft of the drive motor is connected to the column (1) through a gear.
6. The quartz wafer cleaning carrier according to claim 5, characterized in that: The column (1) is also equipped with a vibration component (5), which is connected to the connecting rod (32).
7. The quartz wafer cleaning carrier according to claim 6, characterized in that: The vibration assembly (5) includes a fixed rod (51) that passes through the column (1) and is coaxial with the column (1). The fixed rod (51) is fixed on the base (4). A vibrating plate (52) with the same horizontal plane as the connecting rod (32) is provided on the fixed rod (51). The edge of the vibrating plate (52) is wavy. One end of the connecting rod (32) passes through the connecting ring (31) and is slidably connected in the column (1). The end of the connecting rod (32) abuts against the side of the vibrating plate (52). A spring (53) for driving the connecting rod (32) is also provided in the column (1).
8. The quartz wafer cleaning carrier according to claim 7, characterized in that: The column (1) has a cavity distributed along the length of the connecting rod (32). A limiting block (6) is slidably connected in the cavity. The limiting block (6) is fixed on the connecting rod (32), and one end of the spring (53) is fixed on the limiting block (6), while the other end is fixed on the column (1).