Self-heating chip manufacturing precision opening mechanism components

Abstract

This utility model relates to the field of chip manufacturing technology and provides a precision drilling mechanism assembly for self-heating chip manufacturing, including: a fixing frame; and a chip positioning mechanism, which is disposed at the lower end of the inner side of the fixing frame to fix the position of the chip before drilling. Through the chip positioning mechanism, the self-heating chip is placed on the top of the chip fixing box during use. Then, a pneumatic telescopic rod is used to push the first support plate to slide on the top of the connecting rail. At this time, rotating the connecting rod will drive the connecting piece to rotate, completing a Z-shaped movement. This allows the positioning plate to move relative to the first support plate, thereby achieving synchronous movement of clamping or releasing the self-heating chip. During this process, the Z-shaped movement enables the positioning plate to clamp the chip synchronously and symmetrically, effectively avoiding chip displacement or damage caused by uneven force, and significantly improving the stability of clamping.

Description

Technical Field

[0001] This utility model belongs to the field of chip manufacturing technology, and in particular relates to a precision opening mechanism component for self-heating chip manufacturing. Background Technology

[0002] With the rapid development of information technology, semiconductor chips, as its core foundation, are constantly evolving towards higher integration, smaller feature sizes, higher performance, and lower power consumption. In advanced packaging, MEMS manufacturing, and certain chip processing technologies, high-precision micro-hole processing is often required on wafers, substrates, or the chip itself.

[0003] Chinese patent disclosure CN216528830U discloses a hole-opening device for semiconductor chip production. The paper states that "a spring is provided on the lower part of the outer wall of the hole-opening machine, and grooves are provided on both sides of the outer wall of the spring. A slider is installed inside the grooves. This hole-opening device for semiconductor chip production includes a support rod, an electric push rod, a fixed plate, a movable block, a movable hook, and a rubber pad. The electric push rod can be switched on first, causing it to move the fixed plate, which facilitates fixing the semiconductor chip during hole opening and prevents it from shifting and affecting normal operation. Then, the movable hook is inserted into the movable block, allowing the hook and block to cooperate and enabling the rubber pad to function properly. This provides protection during semiconductor chip fixing, preventing damage from an overly rigid fixed plate."

[0004] However, the above solution only uses a single-sided electric push rod to push the fixing plate for clamping, lacking a symmetrical and synchronous clamping mechanism. This can easily lead to uneven force on the chip during clamping, causing chip displacement or local stress concentration, affecting the opening accuracy, or even causing chip damage. Utility Model Content

[0005] This invention provides a self-heating precision hole-opening mechanism assembly for chip manufacturing, aiming to solve the above problems.

[0006] This invention is achieved as follows: a self-heating chip manufacturing precision opening mechanism assembly, comprising;

[0007] Fixture;

[0008] A chip positioning mechanism, located at the lower end of the inner side of the fixing frame, is used to fix the chip in position before the hole is opened.

[0009] An opening movement mechanism, located on top of the mounting bracket, is used to adjust the opening position of the chip.

[0010] An opening drive mechanism is located on one side of the second moving block in the opening moving mechanism and is used to drive the opening of the chip.

[0011] Preferably, a fixing arm is fixedly mounted on one side of the fixing frame, and a display is fixedly mounted on one side of the fixing arm.

[0012] Preferably, the chip positioning mechanism includes a chip fixing box, a rotating shaft is fixedly installed inside the chip fixing box, a connecting piece is rotatably installed on the outside of the rotating shaft, connecting rails are fixedly installed on both sides inside the chip fixing box, a first support plate is slidably installed on the outside of the connecting rails, a first moving block is fixedly installed on the top of the first support plate, a connecting rod is installed on the top of both the connecting piece and the first support plate, a first fixing seat is fixedly installed on one side of the first support plate on the left side, the first fixing seat is fixedly installed on the output end of the pneumatic telescopic rod, and a positioning plate is fixedly installed on the top of the first moving block.

[0013] Preferably, limit blocks are fixedly provided at both ends of the connecting piece, and the pneumatic telescopic rod is fixedly provided inside the chip fixing box.

[0014] Preferably, the connecting rod is rotatably connected to the connecting piece and the first support plate via a fixed shaft, and an anti-slip pad is fixedly provided on one side of the positioning plate.

[0015] Preferably, the opening and moving mechanism includes a pneumatic cylinder and an air pump, an air pipe is fixedly provided between the pneumatic cylinder and the air pump, a support frame is fixedly provided at the output end of the pneumatic cylinder, a screw is rotatably provided inside the support frame, the screw is fixedly provided at the output end of the motor, and a second moving block is threaded on the outer side of the screw.

[0016] Preferably, a pressure gauge is fixedly installed on the top of the air pump, and the motor is fixedly installed on one side of the support frame.

[0017] Preferably, the hole-opening driving mechanism includes a second fixed base, with slide rods slidably disposed at the four corners of the bottom of the second fixed base, a second support plate fixedly disposed at the bottom of the slide rods, and a hole-opening machine disposed at the top of the second support plate.

[0018] Compared with related technologies, the self-heating chip manufacturing precision hole-opening mechanism assembly provided by this utility model has the following beneficial effects:

[0019] 1. Through the chip positioning mechanism, the self-heating chip is placed on the top of the chip fixing box during use. Then, the pneumatic telescopic rod pushes the first support plate to slide on the top of the connecting rail. At this time, the rotating connecting rod will drive the connecting piece to rotate, so as to complete the Z-shaped movement. This allows the positioning plate to move relative to the first support plate, thereby realizing the synchronous movement of clamping or releasing the self-heating chip. In this process, the Z-shaped movement allows the positioning plate to clamp the chip in a synchronous and symmetrical manner, effectively avoiding chip displacement or damage caused by uneven force, and significantly improving the stability of clamping. After clamping, the hole moving mechanism is used to push the hole driving mechanism to perform hole opening processing on the clamped chip.

[0020] 2. By using the hole-opening moving mechanism, the pneumatic cylinder is driven by the air pump in the hole-opening moving mechanism to move the Z-axis telescopically. Furthermore, the screw is driven by the motor in the hole-opening moving mechanism to rotate, so that the hole-opening driving mechanism can complete the X-axis calibration movement. In this way, multiple chips are opened by moving the Z-axis and X-axis positions, which greatly improves the hole-opening efficiency of the chips. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the axial side structure of this utility model;

[0022] Figure 2 This is a front structural diagram of the present invention;

[0023] Figure 3 This is a schematic diagram of the positioning plate in this utility model;

[0024] Figure 4 This is a schematic diagram of the internal structure of the chip fixing box in this utility model.

[0025] In the diagram: 1. Fixing frame; 2. Fixing arm; 3. Display; 4. Chip positioning mechanism; 401. Chip fixing box; 402. Rotating shaft; 403. Connecting piece; 404. Connecting rail; 405. Limiting block; 406. First support plate; 407. Connecting rod; 408. Fixing shaft; 409. First fixed seat; 410. Pneumatic telescopic rod; 411. First moving block; 412. Positioning plate; 413. Anti-slip pad; 5. Hole opening moving mechanism; 501. Pneumatic push cylinder; 502. Air pump; 503. Air pipe; 504. Air pressure gauge; 505. Support frame; 506. Screw; 507. Motor; 508. Second moving block; 6. Hole opening drive mechanism; 601. Second fixed seat; 602. Slide rod; 603. Second support plate; 604. Hole opening machine. Detailed Implementation

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0027] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0028] Example 1

[0029] A preferred embodiment of the self-heating chip manufacturing precision aperture mechanism assembly provided by this utility model is, for example... Figures 1 to 4 As shown: A precision opening mechanism assembly for self-heating chip manufacturing includes: a fixing frame 1; and a chip positioning mechanism 4, which is disposed at the lower end of the inner side of the fixing frame 1. The chip positioning mechanism 4 includes a chip fixing box 401, a rotating shaft 402 fixedly disposed inside the chip fixing box 401, a connecting piece 403 rotatably disposed outside the rotating shaft 402, connecting rails 404 fixedly disposed on both sides inside the chip fixing box 401, a first support plate 406 slidably disposed on the outer side of the connecting rails 404, a first moving block 411 fixedly disposed on the top of the first support plate 406, connecting rods 407 disposed on the top of the connecting piece 403 and the first support plate 406, a first fixing seat 409 fixedly disposed on one side of the left side of the first support plate 406, the first fixing seat 409 being fixedly disposed at the output end of the pneumatic telescopic rod 410, and a positioning plate 412 fixedly disposed on the top of the first moving block 411.

[0030] In this embodiment, when in use, the self-heating chip is placed on the top of the chip fixing box 401, and then the pneumatic telescopic rod 410 is used to push the first support plate 406 to slide on the top of the connecting rail 404. At this time, the rotating connecting rod 407 will drive the connecting piece 403 to rotate, so as to complete the Z-shaped movement, thereby causing the positioning plate 412 to move relative to the first support plate 406, thereby realizing the synchronous movement of clamping or releasing the self-heating chip.

[0031] In a further preferred embodiment of this utility model, the hole-opening moving mechanism 5 is disposed on the top of the fixed frame 1. The hole-opening moving mechanism 5 includes a pneumatic push cylinder 501 and an air pump 502. An air pipe 503 is fixedly disposed between the pneumatic push cylinder 501 and the air pump 502. A support frame 505 is fixedly disposed at the output end of the pneumatic push cylinder 501. A screw 506 is rotatably disposed inside the support frame 505. The screw 506 is fixedly disposed at the output end of the motor 507. A second moving block 508 is threaded on the outer side of the screw 506.

[0032] In this embodiment, the air pump 502 in the hole-opening moving mechanism 5 drives the pneumatic push cylinder 501 to perform telescopic movement of the Z-axis. Furthermore, the motor 507 in the hole-opening moving mechanism 5 drives the screw 506 to rotate, so that the hole-opening driving mechanism 6 can complete the calibration movement of the X-axis. Then, the Z-axis and X-axis position movements are used to open holes in multiple chips, thereby greatly improving the hole-opening efficiency of the chips.

[0033] Example 2

[0034] Based on Embodiment 1, a preferred embodiment of the self-heating chip manufacturing precision aperture mechanism assembly provided by this utility model is, for example... Figures 1 to 4 As shown: the hole-opening driving mechanism 6 is disposed on one side of the second moving block 508 in the hole-opening moving mechanism 5. The hole-opening driving mechanism 6 includes a second fixed base 601. Slide rods 602 are slidably disposed at the four corners of the bottom of the second fixed base 601. A second support plate 603 is fixedly disposed at the bottom of the slide rods 602. A hole-opening machine 604 is disposed at the top of the second support plate 603.

[0035] In this embodiment, the hole-opening drive mechanism 6 is rigidly connected to the second moving block 508 through the second fixed base 601 to ensure the stability of the overall structure during hole-opening operations.

[0036] In a further preferred embodiment of this utility model, a fixed arm 2 is fixedly installed on one side of the fixed frame 1, and a display 3 is fixedly installed on one side of the fixed arm 2. Limit blocks 405 are fixedly installed at both ends of the connecting piece 403. The pneumatic telescopic rod 410 is fixedly installed inside the chip fixing box 401. The connecting rod 407 is rotatably installed with the connecting piece 403 and the first support plate 406 respectively through the fixed shaft 408. An anti-slip pad 413 is fixedly installed on one side of the positioning plate 412.

[0037] In this embodiment, the anti-slip pad 413 provided on one side of the positioning plate 412 effectively increases the friction with the chip surface, preventing slippage or displacement during clamping, thereby ensuring the chip remains stable during the hole-making process and improving processing accuracy and product yield.

[0038] In summary, during this process, the Z-shaped movement enables the positioning plate 412 to clamp the chip synchronously and symmetrically, effectively avoiding chip displacement or damage caused by uneven force, and significantly improving the stability of clamping. After clamping, the hole-opening moving mechanism 5 pushes the hole-opening driving mechanism 6 to open the chip after clamping.

[0039] It is worth noting that the circuits, electronic components, and modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0040] It should be understood that the disclosed apparatus can be implemented in other ways, given the several embodiments provided in this application. For example, the apparatus embodiments described above are merely illustrative; the division of units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or communication connections shown or discussed may be through some interfaces; the indirect coupling or communication connections between devices or units may be telecommunications or other forms.

[0041] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. A self-heating chip manufacturing precision aperture mechanism assembly, characterized in that: include; Fixture (1); The chip positioning mechanism (4) is located at the lower end of the inner side of the fixing frame (1) and is used to fix the position of the chip before the hole is opened. An opening moving mechanism (5) is disposed on the top of the fixing frame (1) and is used to adjust the opening position of the chip; The hole-opening driving mechanism (6) is located on one side of the second moving block (508) in the hole-opening moving mechanism (5) and is used to drive the opening of the chip.

2. The self-heating chip manufacturing precision aperture mechanism assembly according to claim 1, characterized in that: A fixing arm (2) is fixedly installed on one side of the fixing frame (1), and a display (3) is fixedly installed on one side of the fixing arm (2).

3. The self-heating chip manufacturing precision aperture mechanism assembly according to claim 1, characterized in that: The chip positioning mechanism (4) includes a chip fixing box (401), a rotating shaft (402) is fixedly installed inside the chip fixing box (401), a connecting piece (403) is rotatably installed on the outside of the rotating shaft (402), a connecting rail (404) is fixedly installed on both sides inside the chip fixing box (401), a first support plate (406) is slidably installed on the outside of the connecting rail (404), a first moving block (411) is fixedly installed on the top of the first support plate (406), a connecting rod (407) is installed on the top of the connecting piece (403) and the first support plate (406), a first fixing seat (409) is fixedly installed on one side of the first support plate (406) on the left side, the first fixing seat (409) is fixedly installed on the output end of the pneumatic telescopic rod (410), and a positioning plate (412) is fixedly installed on the top of the first moving block (411).

4. The self-heating chip manufacturing precision aperture mechanism assembly according to claim 3, characterized in that: Limiting blocks (405) are fixedly installed at both ends of the connecting piece (403), and the pneumatic telescopic rod (410) is fixedly installed inside the chip fixing box (401).

5. The self-heating chip manufacturing precision aperture mechanism assembly according to claim 3, characterized in that: The connecting rod (407) is rotatably connected to the connecting piece (403) and the first support plate (406) respectively via the fixed shaft (408), and an anti-slip pad (413) is fixedly provided on one side of the positioning plate (412).

6. The self-heating chip manufacturing precision aperture mechanism assembly according to claim 1, characterized in that: The opening moving mechanism (5) includes a pneumatic push cylinder (501) and an air pump (502). An air pipe (503) is fixedly arranged between the pneumatic push cylinder (501) and the air pump (502). A support frame (505) is fixedly arranged at the output end of the pneumatic push cylinder (501). A screw (506) is rotatably arranged inside the support frame (505). The screw (506) is fixedly arranged at the output end of the motor (507). A second moving block (508) is threaded on the outside of the screw (506).

7. The self-heating chip manufacturing precision aperture mechanism assembly according to claim 6, characterized in that: A pressure gauge (504) is fixedly installed on the top of the air pump (502), and the motor (507) is fixedly installed on one side of the support frame (505).

8. The self-heating chip manufacturing precision aperture mechanism assembly according to claim 1, characterized in that: The hole-opening driving mechanism (6) includes a second fixed base (601), and slide rods (602) are slidably arranged at the four corners of the bottom of the second fixed base (601). A second support plate (603) is fixedly arranged at the bottom of the slide rods (602), and a hole-opening machine (604) is arranged at the top of the second support plate (603).

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