A cryogenic bonding clamp

Abstract

This utility model relates to the field of bonding fixture technology, specifically to a low-temperature bonding fixture, including a base, a lower fixture, an upper fixture, a guide post, a sliding sleeve, a sliding seat, a connecting rod, a driving component, and a guiding component. The guide post and sliding sleeve guide the upper fixture, ensuring precise alignment between the upper and lower fixtures. This solves the problem in existing technologies where the upper and lower fixtures are hinged together for flipping and closing, relying solely on the pushing action of a support rod to ensure the closing position. Furthermore, the lack of a dedicated guiding and positioning structure, coupled with wear gaps on the hinges after long-term use, leads to horizontal offset or tilting of the upper fixture during closing, resulting in misalignment of the upper and lower silicon wafers and affecting bonding alignment accuracy.

Description

Technical Field

[0001] This utility model relates to the field of bonding fixture technology, and in particular to a low-temperature bonding fixture. Background Technology

[0002] Bonding temperature is the most important indicator in wafer bonding technology. High-temperature bonding technology is not suitable for bonding devices containing temperature-sensitive materials. Therefore, reducing the bonding temperature to achieve low-temperature wafer bonding is of great significance. Surface plasmon activation technology can generate dangling bonds on the wafer surface, achieving surface activity and thus enabling low-temperature wafer bonding. Wafer bonding technology is one of the fundamental technologies of microsystem packaging and has become an important tool in the field of microelectromechanical systems (MEMS). Wafer bonding technology has wide applications in wafer-level packaging, 3D chip stacking, and silicon-on-insulator (SiI) technology. As bonding technology develops towards lower cost, higher performance, higher integration, smaller size, and lower power consumption, it has moved from the era of two-dimensional packaging to three-dimensional stacking. The high integration of devices and circuits places higher demands on wafer bonding processes. In the low-temperature bonding process, the activation and bonding of wafer surface bonds must be completed in the same vacuum environment. Existing vacuum cryogenic bonding fixtures cannot guarantee stable clamping during bonding operations. When gaps appear at the fixture connection points during operation, they can easily cause problems such as ineffective bonding. Therefore, a new vacuum cryogenic bonding fixture is needed to help solve this problem.

[0003] Prior art CN222281939U discloses a bonding fixture for vacuum cryogenic bonding. This fixture includes a mounting frame, with a vertical plate vertically fixed to one end of the top of the mounting frame. A fixture body is mounted on the top of the mounting frame, and the fixture body includes a lower fixture fixed to the top of the mounting frame. The lower fixture has a receiving cavity inside, and a support plate is slidably disposed within the receiving cavity. An upper fixture is hinged to the end of the lower fixture near the vertical plate via a hinge. A lifting cavity is vertically formed on the side of the vertical plate facing the upper fixture, and a support assembly is installed within the lifting cavity. The support assembly includes a lead screw vertically rotatably disposed within the lifting cavity, a sliding block sleeved on the lead screw, and a threaded engagement between the sliding block and the lead screw. A support rod is hinged between the sliding block and the upper fixture. A support motor for assisting the rotation of the lead screw is mounted on the top of the vertical plate. This vacuum cryogenic bonding fixture ensures that the upper fixture can stably cover the top of the lower fixture, guarantees that the upper fixture is stably closed together during operation, and ensures that the lower and upper fixtures are stably tightened after they are closed, thus ensuring the smooth progress of subsequent bonding work.

[0004] For the aforementioned bonding fixture for vacuum cryogenic bonding, since the upper and lower fixtures are hinged together to achieve flipping and closing, the closing position is only guaranteed by the pushing action of the support rod, and there is no special guiding and positioning structure. After long-term use, the hinges are prone to wear gaps, which can cause horizontal offset or tilting when the upper fixture closes, resulting in misalignment of the upper and lower silicon wafers and affecting the bonding alignment accuracy. Utility Model Content

[0005] The purpose of this invention is to provide a low-temperature bonding fixture that solves the problems of existing technologies where the upper and lower fixtures are hinged together to achieve flipping and closing, relying solely on the pushing action of the support rod to ensure the closing position, and lacking a dedicated guiding and positioning structure. Furthermore, the hinges are prone to wear and gaps after long-term use, which leads to horizontal offset or tilting when the upper fixture closes, resulting in misalignment of the upper and lower silicon wafers and affecting the bonding alignment accuracy.

[0006] To achieve the above objectives, this utility model provides a low-temperature bonding fixture, including a base, a lower fixture, an upper fixture, and a structural assembly. The lower fixture is fixedly mounted on the base, and the upper fixture is mounted on the base via the structural assembly. The structural assembly includes a guide post, a sliding sleeve, a sliding seat, a connecting rod, a driving component, and a guiding component. The guide post is fixedly connected to the base and located on the side of the base near the lower fixture. The sliding sleeve is sleeved on the outside of the guide post and slidably connected to it. The sliding seat is fixedly connected to the sliding sleeve and located on the outside of it. One end of the connecting rod is rotatably connected to the sliding seat, and the other end is fixedly connected to the upper fixture. The driving component drives the upper fixture to move, and the guiding component guides the rotation of the upper fixture.

[0007] The driving component includes a connecting seat and a control unit. The connecting seat is fixedly connected to the upper clamp and is located on one side of the upper clamp. The control unit controls the movement of the connecting seat.

[0008] The control unit includes a first hinge seat, a second hinge seat, and an electric cylinder. The first hinge seat is fixedly connected to the connecting seat and is located on the side of the connecting seat away from the upper clamp. The second hinge seat is fixedly mounted on the base. The two ends of the electric cylinder are fixedly connected to the first hinge seat and the second hinge seat, respectively.

[0009] The guide component includes an arc-shaped guide rail, a support member, and an extension rod. The arc-shaped guide rail is connected to the base through the support member. The support member is installed on the base and supports the arc-shaped guide rail. One end of the extension rod is fixedly connected to the upper clamp, and the other end extends into the arc-shaped guide rail and cooperates with the arc-shaped guide rail.

[0010] The support includes a fixed base, a support arm, and a fixed column. The fixed base is fixedly connected to the base and is located on one side of the base. The support arm is fixedly connected to the fixed base and is located on the side of the fixed base away from the base. The two ends of the fixed column are fixedly connected to the support arm and the arc-shaped guide rail, respectively.

[0011] The guide component further includes a roller, which is installed at one end of the extension rod that extends into the arc-shaped guide rail and contacts the arc-shaped guide rail.

[0012] The guide component further includes a rubber sleeve, which is fitted over the outside of the roller and fixedly connected to the roller.

[0013] The structural component further includes a limiting block, which is fixedly connected to the guide post and located at the top of the guide post.

[0014] The structural component further includes a pressure sensor and a contact point. The pressure sensor is fixedly mounted on the lower clamp and located on the side of the lower clamp closer to the upper clamp. The contact point is fixedly connected to the upper clamp and located on the side of the upper clamp closer to the pressure sensor.

[0015] The lower clamp has an alignment groove located on the side of the lower clamp closer to the upper clamp; the upper clamp has an alignment protrusion that engages with the alignment groove.

[0016] This utility model discloses a low-temperature bonding fixture, comprising a base, a lower fixture, an upper fixture, and a structural assembly. The lower fixture is fixedly mounted on the base, and the upper fixture is mounted on the base via the structural assembly. The structural assembly includes a guide post, a sliding sleeve, a sliding seat, a connecting rod, a driving component, and a guiding component. The guide post is fixedly connected to the base and located on the side of the base closer to the lower fixture. The sliding sleeve is sleeved on the outside of the guide post and slidably connected to it. The sliding seat is fixedly connected to the sliding sleeve and located on the outside of the sliding sleeve. One end of the connecting rod is rotatably connected to the sliding seat, and the other end of the connecting rod is fixedly connected to the upper clamp. The driving component drives the upper clamp to move, and the guiding component guides the rotation of the upper clamp. This solves the problem in the prior art where the upper and lower clamps are hinged together to achieve flipping and closing, relying solely on the pushing action of the support rod to ensure the closing position, and lacking a dedicated guiding and positioning structure. After long-term use, the hinge is prone to wear gaps, causing horizontal offset or tilting when the upper clamp closes, which in turn causes misalignment of the upper and lower silicon wafers and affects the bonding alignment accuracy. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0018] Figure 1 This is a schematic diagram of the overall structure of the low-temperature bonding fixture of this utility model.

[0019] Figure 2 This is a structural schematic diagram of the driving component of this utility model.

[0020] Figure 3 This is a structural schematic diagram of the guide component of this utility model.

[0021] Figure 4 This is a schematic diagram of the structure of the roller and rubber sleeve of this utility model.

[0022] In the diagram: 101-base, 102-lower clamp, 103-upper clamp, 104-guide post, 105-sliding sleeve, 106-sliding seat, 107-connecting rod, 108-connecting seat, 109-first hinge seat, 110-second hinge seat, 111-electric cylinder, 112-arc guide rail, 113-extension rod, 114-fixed seat, 115-support arm, 116-fixed post, 117-roller, 118-rubber sleeve, 119-limiting block, 120-pressure sensor, 121-contact point, 122-alignment groove, 123-alignment protrusion. Detailed Implementation

[0023] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0024] The embodiment of this application is as follows:

[0025] Please see Figures 1-4 , Figure 1 This is a schematic diagram of the overall structure of the low-temperature bonding fixture of this utility model. Figure 2 This is a structural schematic diagram of the driving component of this utility model. Figure 3 This is a structural schematic diagram of the guide component of this utility model. Figure 4 This is a schematic diagram of the structure of the roller 117 and the rubber sleeve 118 of this utility model.

[0026] This utility model discloses a low-temperature bonding fixture, comprising a base 101, a lower fixture 102, an upper fixture 103, a guide post 104, a sliding sleeve 105, a sliding seat 106, a connecting rod 107, a connecting seat 108, a first hinge seat 109, a second hinge seat 110, an electric cylinder 111, an arc-shaped guide rail 112, an extension rod 113, a fixed seat 114, a support arm 115, a fixed post 116, a roller 117, a rubber sleeve 118, a limiting block 119, a pressure sensor 120, a contact point 121, an alignment groove 122, and an alignment protrusion 123. It solves the problem in existing technologies where the upper and lower fixtures are hinged together for flipping and closing, relying solely on the pushing action of the support rod to ensure the closing position, and lacking a dedicated guiding and positioning structure. Furthermore, the hinges are prone to wear and gaps after long-term use, leading to horizontal offset or tilting when the upper fixture closes, resulting in misalignment of the upper and lower silicon wafers and affecting bonding alignment accuracy. Understandably, the aforementioned solution can also be used to improve alignment accuracy.

[0027] In this embodiment, the base 101 is L-shaped, serving as a stable support. The lower clamp 102 and the upper clamp 103 are both existing technologies, with the specific structure referring to the existing technology CN222281939U, a bonding fixture for vacuum low-temperature bonding. The structural components are installed on the base 101, allowing the upper clamp 103 and the lower clamp 102 to be precisely aligned. This solves the problem in the existing technology where the upper and lower clamps are hinged together to achieve flipping and closing, relying solely on the pushing action of the support rod to ensure the closing position. Furthermore, the lack of a dedicated guiding and positioning structure means that the hinges are prone to wear and gaps after long-term use, leading to horizontal offset or tilting when the upper clamp closes, which in turn causes misalignment of the upper and lower silicon wafers and affects the bonding alignment accuracy.

[0028] Furthermore, the guide post 104 is fixedly connected to the base 101 and located on the side of the base 101 near the lower clamp 102. The sliding sleeve 105 is sleeved on the outside of the guide post 104 and slidably connected to the guide post 104. The sliding seat 106 is fixedly connected to the sliding sleeve 105 and located on the outside of the sliding sleeve 105. One end of the connecting rod 107 is rotatably connected to the sliding seat 106, and the other end of the connecting rod 107 is fixedly connected to the upper clamp 103. The driving component drives the upper clamp 102. The clamp 103 moves, and the guide member guides the rotation of the upper clamp 103. The guide post 104 is a smooth cylinder, with two vertically arranged posts, one on each side of the lower clamp 102. Two sliding sleeves 105 are fitted onto the outer sides of the two guide posts 104. With the aid of lubricating oil, the sliding sleeves 105 can slide directionally along the guide posts 104. Two sliding seats 106 are installed on the outer sides of the two sliding sleeves 105, providing support for the connecting rod 107. For installation purposes, the connecting rods 107 are cylindrical, and there are two of them, horizontally arranged on the left and right sides of the upper clamp 103 respectively. One end of each connecting rod 107 is fixedly connected to the center of one side of the upper clamp 103, and the other end is connected to the sliding seat 106 via a bearing, allowing the upper clamp 103 to rotate. The driving component is used to drive the upper clamp 103 to move up and down, and the guiding component is used to guide the rotation of the upper clamp 103, so that the upper clamp 103 can move according to the design when rising and falling. The design route is flipped, and the upper clamp 103 is guided by the guide post 104 and the sliding sleeve 105, so that the upper clamp 103 and the lower clamp 102 can be accurately aligned. This solves the problem in the prior art where the upper and lower clamps are flipped and closed by hinges, and the closing position is only guaranteed by the pushing action of the support rod. Furthermore, there is a lack of a dedicated guiding and positioning structure. After long-term use, the hinges are prone to wear gaps, which can cause horizontal offset or tilting when the upper clamp is closed, resulting in misalignment of the upper and lower silicon wafers and affecting the bonding alignment accuracy.

[0029] Furthermore, the connecting seat 108 is fixedly connected to the upper clamp 103 and is located on one side of the upper clamp 103; the control unit controls the movement of the connecting seat 108, and the connecting seat 108 is fixedly installed on the back side of the upper clamp 103 by bolts. The control unit can control the movement of the connecting seat 108, thereby driving the upper clamp 103 to rise and fall.

[0030] Furthermore, the first hinge seat 109 is fixedly connected to the connecting seat 108 and is located on the side of the connecting seat 108 away from the upper clamp 103; the second hinge seat 110 is fixedly installed on the base 101; both ends of the electric cylinder 111 are fixedly connected to the first hinge seat 109 and the second hinge seat 110 respectively. The first hinge seat 109 is fixedly installed on the connecting seat 108, and the second hinge seat 110 is fixedly installed at the top position of the base 101. The bottom of the electric cylinder 111 is fixedly connected to the second hinge seat 110, and the output end of the electric cylinder 111 is fixedly connected to the first hinge seat 109. By extending and retracting the electric cylinder 111, the connecting seat 108 is moved, thereby realizing the lifting and lowering of the upper clamp 103.

[0031] Furthermore, the arc-shaped guide rail 112 is connected to the base 101 via the support member, which is mounted on the base 101 and supports the arc-shaped guide rail 112. One end of the extension rod 113 is fixedly connected to the upper clamp 103, and the other end extends into the arc-shaped guide rail 112 and cooperates with it. There are two arc-shaped guide rails 112, respectively located on both sides of the upper clamp 103. The two arc-shaped guide rails 112 are respectively connected to the base 101 via two sets of support members. The upper clamp 103 is supported by an arc-shaped guide rail 112, which guides the flipping of the upper clamp 103. There are two extension rods 113, which are respectively arranged on both sides of the upper clamp 103. One end of each extension rod 113 is fixedly connected to both sides of the upper clamp 103, and the other end extends into the guide grooves of the two arc-shaped guide rails 112. When the upper clamp 103 moves, it is guided by the arc-shaped guide rails 112 and thus flips. The arc-shaped guide rails 112 guide the flipping of the upper clamp 103.

[0032] Furthermore, the fixed base 114 is fixedly connected to the base 101 and located on one side of the base 101; the support arm 115 is fixedly connected to the fixed base 114 and located on the side of the fixed base 114 away from the base 101; the two ends of the fixed column 116 are respectively fixedly connected to the support arm 115 and the arc-shaped guide rail 112. There are two fixed bases 114, which are respectively arranged on the left and right sides of the bottom of the base 101. The support arm 115 is arc-shaped and there are two of them. The two support arms 115 are respectively connected to the two fixed bases 114 by bolts to fix them. There are multiple fixed columns 116, which are used to connect the support part and the arc-shaped guide rail 112. Through the support members, the arc-shaped guide rail 112 is stably supported.

[0033] Furthermore, the roller 117 is installed at one end of the extension rod 113 that extends into the arc-shaped guide rail 112 and contacts the arc-shaped guide rail 112. There are two rollers 117, which are fixedly installed at the ends of the two extension rods 113 respectively. Both rollers 117 can rotate freely. The rollers 117 contact the inner wall of the guide groove of the arc-shaped guide rail 112. Through the rollers 117, the friction can be reduced and the smoothness can be improved.

[0034] Furthermore, the rubber sleeve 118 is fitted over the outside of the roller 117 and is fixedly connected to the roller 117. The rubber sleeve 118 wraps around the outside of the roller 117, thereby reducing the noise when the roller 117 rolls.

[0035] Furthermore, the limiting block 119 is fixedly connected to the guide post 104 and located at the top of the guide post 104. There are two limiting blocks 119, which are fixedly installed on the top of the two guide posts 104 respectively. The limiting block 119 can limit the sliding sleeve 105.

[0036] Furthermore, the pressure sensor 120 is fixedly mounted on the lower clamp 102 and located on the side of the lower clamp 102 near the upper clamp 103; the contact point 121 is fixedly connected to the upper clamp 103 and located on the side of the upper clamp 103 near the pressure sensor 120; a mounting groove is provided on the top surface of the lower clamp 102, and the pressure sensor 120 is embedded in the mounting groove; the contact point 121 protrudes from the upper clamp 103; when the upper clamp 103 and the lower clamp 102 are in close contact, the contact point 121 will contact the pressure sensor 120; by squeezing the pressure sensor 120, it is possible to measure whether the upper clamp 103 and the lower clamp 102 are in close contact.

[0037] Furthermore, the lower clamp 102 has an alignment groove 122 located on the side of the lower clamp 102 near the upper clamp 103; the upper clamp 103 has an alignment protrusion 123 that engages with the alignment groove 122. The alignment groove 122 is formed on the top surface of the lower clamp 102, and the alignment protrusion 123 protrudes from the upper clamp 103. Through the engagement of the alignment groove 122 and the alignment protrusion 123, the upper clamp 103 and the lower clamp 102 can be further aligned accurately.

[0038] In this embodiment, during use, the wafer disk is placed in the adsorption cavities of the lower clamp 102 and the upper clamp 103, respectively. Then, the electric cylinder 111 is controlled to extend, causing its output end to extend. The extension of the electric cylinder 111 drives the upper clamp 103 to move. Under the action of the guide post 104 and the sliding sleeve 105, the upper clamp 103 moves downward along the guide post 104. Simultaneously, under the action of the arc-shaped guide rail 112, the upper clamp 103 flips forward during its downward movement, thus mounting the wafer disk in the upper clamp 103. One side of the disc faces the lower clamp 102. As the electric cylinder 111 continues to extend, the upper clamp 103 will fit tightly against the lower clamp 102. In addition, the contact point 121 will squeeze the pressure sensor 120, which can monitor the pressure value in real time. The pressure value fed back by the pressure sensor 120 can determine whether the upper clamp 103 and the lower clamp 102 are tightly fitted. Furthermore, the cooperation between the alignment protrusion 123 and the alignment groove 122 can also assist the upper clamp 103 and the lower clamp 102 in precise positioning. This application uses the guide post 104 and the sliding sleeve 105 to guide the upper clamp 103, so that the upper clamp 103 and the lower clamp 102 can be accurately aligned. This solves the problem in the prior art where the upper and lower clamps are hinged together to achieve flipping and closing, relying only on the pushing action of the support rod to ensure the closing position, and lacking a dedicated guiding and positioning structure. After long-term use, the hinge is prone to wear and gaps, which causes horizontal offset or tilting when the upper clamp closes, resulting in misalignment of the upper and lower silicon wafers and affecting the bonding alignment accuracy.

[0039] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A low-temperature bonding fixture, comprising a base and a lower clamp, wherein the lower clamp is fixedly mounted on the base, characterized in that, It also includes a structural assembly and an upper clamp, the upper clamp being mounted on the base via the structural assembly; The structural components include a guide post, a sliding sleeve, a sliding seat, a connecting rod, a driving component, and a guiding component. The guide post is fixedly connected to the base and located on the side of the base near the lower clamp. The sliding sleeve is sleeved on the outside of the guide post and slidably connected to it. The sliding seat is fixedly connected to the sliding sleeve and located on the outside of it. One end of the connecting rod is rotatably connected to the sliding seat, and the other end is fixedly connected to the upper clamp. The driving component drives the upper clamp to move, and the guiding component guides the rotation of the upper clamp.

2. The low-temperature bonding fixture as described in claim 1, characterized in that, The driving component includes a connecting seat and a control unit. The connecting seat is fixedly connected to the upper clamp and is located on one side of the upper clamp. The control unit controls the movement of the connecting seat.

3. The low-temperature bonding fixture as described in claim 2, characterized in that, The control unit includes a first hinge seat, a second hinge seat, and an electric cylinder. The first hinge seat is fixedly connected to the connecting seat and is located on the side of the connecting seat away from the upper clamp. The second hinge seat is fixedly mounted on the base. The two ends of the electric cylinder are fixedly connected to the first hinge seat and the second hinge seat, respectively.

4. The low-temperature bonding fixture as described in claim 1, characterized in that, The guide component includes an arc-shaped guide rail, a support member, and an extension rod. The arc-shaped guide rail is connected to the base through the support member. The support member is installed on the base and supports the arc-shaped guide rail. One end of the extension rod is fixedly connected to the upper clamp, and the other end extends into the arc-shaped guide rail and cooperates with the arc-shaped guide rail.

5. The low-temperature bonding fixture as described in claim 4, characterized in that, The support includes a fixed base, a support arm, and a fixed column. The fixed base is fixedly connected to the base and is located on one side of the base. The support arm is fixedly connected to the fixed base and is located on the side of the fixed base away from the base. The two ends of the fixed column are fixedly connected to the support arm and the arc-shaped guide rail, respectively.

6. The low-temperature bonding fixture as described in claim 4, characterized in that, The guide member also includes a roller, which is mounted on one end of the extension rod that extends into the arc-shaped guide rail and contacts the arc-shaped guide rail.

7. The low-temperature bonding fixture as described in claim 6, characterized in that, The guide component also includes a rubber sleeve, which is fitted over the outside of the roller and fixedly connected to the roller.

8. The low-temperature bonding fixture as described in claim 1, characterized in that, The structural component also includes a limiting block, which is fixedly connected to the guide post and located at the top of the guide post.

9. The low-temperature bonding fixture as described in claim 1, characterized in that, The structural assembly also includes a pressure sensor and a contact point. The pressure sensor is fixedly mounted on the lower clamp and located on the side of the lower clamp closer to the upper clamp. The contact point is fixedly connected to the upper clamp and located on the side of the upper clamp closer to the pressure sensor.

10. The low-temperature bonding fixture as described in claim 1, characterized in that, The lower clamp has an alignment groove located on the side of the lower clamp closer to the upper clamp; the upper clamp has an alignment protrusion that mates with the alignment groove.

Images