Chip pick-up device and chip bonding system

Abstract

The utility model belongs to the technical field of semiconductor material processing, disclose a kind of chip pickup device and chip bonding system. Chip pickup device includes pickup piece and air pressure adjusting piece. Pickup piece includes holding space, holding space is configured as its adsorption chip, the inner wall of holding space only abuts at the exclusion area of chip, holding space is trapezoidal along the cross-sectional shape parallel to chip thickness direction, and the area that the exclusion area is chip front edge inward not more than 0.3mm. Air pressure adjusting piece is communicated with holding space, for reducing the air pressure in holding space. Chip is bonded system from bottom to top, including frame structure, wafer fixed platform, chip fixed platform, chip pickup device and driving mechanism. The utility model can reduce the contact to chip front, effectively prevent chip front scratch and produce dirt, reduce the risk of wafer to be bonded surface falling into particle, guarantee bonding effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing technology, and in particular to a chip pickup device and a chip bonding system. Background Technology

[0002] The bonding process between a chip and a bonding material refers to the process of tightly bonding a chip to a bonding material using physical or chemical means. This process involves the picking up and transporting of the chip.

[0003] In existing technologies, chips are typically adhered to an adhesive film or carried in a tray. First, an ejector device lifts the chip from the back, then a mechanism picks it up from the front and transports it to a specific location for bonding. However, the contact between the mechanism and the chip's front surface easily leads to scratches and contamination, affecting the final bonding effect. Furthermore, in current chip-wafer bonding processes, the wafer is usually placed below with the bonding surface facing upwards, and the chip is bonded to the wafer from top to bottom. Prolonged placement of the wafer with the bonding surface facing upwards increases the risk of particles falling in and introducing voids at the bonding interface.

[0004] In other words, existing mechanisms pick up and transfer the chip from the front at the ejection device, which has the disadvantages of easily causing scratches and dirt on the front of the chip, and the risk of particles falling into the wafer, thus affecting the bonding effect. Utility Model Content

[0005] The purpose of this invention is to provide a chip pickup device and a chip bonding system that can reduce contact with the front side of the chip, effectively prevent scratches and dirt from forming on the front side of the chip, reduce the risk of particles falling into the wafer bonding surface, and ensure bonding effect.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model provides a chip pickup device, comprising:

[0008] The pickup element includes a holding space, which, when configured to pick up a chip, has its inner wall abutting only the exclusion area of ​​the chip. The holding space has a trapezoidal cross-sectional shape along a direction parallel to the thickness of the chip, and the exclusion area is the region of the chip's front edge extending inwards by no more than 0.3 mm.

[0009] A pressure regulating component, connected to the holding space, is used to reduce the air pressure within the holding space.

[0010] As an optional technical solution for a chip pickup device, the pressure regulating component includes a gas delivery component, which is connected to the holding space and is used to deliver gas into the holding space.

[0011] The holding space has an opening end that contacts the chip, an air inlet, and an air outlet; the air inlet is located away from the opening end and is connected to the gas delivery component; the air outlet is located close to the opening end.

[0012] As an optional technical solution for a chip pickup device, the pickup component includes a side wall and a bottom wall, which together form the holding space. A through groove is formed by a recess on the side surface of the side wall near the opening end, and the through groove forms the vent hole.

[0013] As an optional technical solution for a chip pickup device, the air inlet is disposed opposite to the sidewall with the air outlet.

[0014] As an optional technical solution for a chip pickup device, the holding space includes a bottom wall, the bottom wall is provided with a protrusion, the protrusion protrudes from the bottom wall surface, and the air inlet is provided on the side of the protrusion facing the side wall.

[0015] As an optional technical solution for a chip pickup device, the protrusion includes an interconnected group of air holes, the group of air holes including two air inlets, the opening directions of the two air inlets being opposite, and the two air inlets being located at both ends of the protrusion along a first direction, the first direction intersecting the thickness direction of the protrusion.

[0016] As an optional technical solution for a chip pickup device, the air pressure regulating component includes a vacuum pumping device, which is connected to the holding space.

[0017] As an optional technical solution for a chip pickup device, the sidewall surface includes a first sidewall surface, a second sidewall surface, and a stepped surface. The first sidewall surface and the second sidewall surface are connected through the stepped surface, and the second sidewall surface is connected to the bottom wall surface of the bottom wall. At least the first sidewall surface has a trapezoidal cross-sectional shape along the direction parallel to the chip thickness, and the stepped surface is used to abut against the exclusion area of ​​the chip.

[0018] As an optional technical solution for a chip pickup device, it also includes a rotating component connected to the adsorption component, wherein the rotation axis of the rotating component intersects with the adsorption direction of the adsorption component.

[0019] This utility model provides a chip bonding system from bottom to top, comprising:

[0020] Framework structure;

[0021] A wafer fixing platform is located at the top of the frame structure. The wafer fixing platform is used to selectively fix the wafer so that the bonding side of the wafer faces downward.

[0022] A chip fixing platform is located at the bottom of the frame structure. The chip fixing platform is used to selectively fix the chip so that the bonding surface of the chip faces upward.

[0023] A drive mechanism, connected to a wafer mounting platform and / or a chip mounting platform, is used to drive the wafer mounting platform and the chip mounting platform to move relative to each other.

[0024] Beneficial effects:

[0025] This invention provides a chip pickup device and a chip bonding system. The chip pickup device includes a pickup component and a pressure regulating component. The pickup component includes a holding space, which is configured to abut against and adsorb the chip's rejection area. The holding space has a trapezoidal cross-sectional shape along a direction parallel to the chip thickness. The rejection area is the region on the front side of the chip, extending no more than 0.3 mm inward from the edge. The pressure regulating component communicates with the holding space and is used to reduce the air pressure within the holding space. By adsorbing and holding the chip's rejection area through the holding space of the pickup component, contact with the front side of the chip is reduced, effectively preventing scratches and contamination. Simultaneously, the back side of the chip can serve as a pick-up space for connecting chips, ensuring effective bonding.

[0026] This invention discloses a bottom-up chip bonding system, comprising a frame structure; a wafer fixing platform disposed at the top of the frame structure, used to selectively fix the wafer with the bonding surface facing down; a chip fixing platform disposed at the bottom of the frame structure, used to selectively fix the chip with the bonding surface facing up; and a driving mechanism connected to the wafer fixing platform and / or the chip fixing platform, used to drive the relative movement of the wafer fixing platform and the chip fixing platform. By employing the above system, the introduction of particles at the bonding interface during chip-wafer bonding can be reduced, thereby improving bonding quality.

[0027] The technical solution of this utility model reduces the contact area with the chip and reduces the probability of particles falling into the bonding surface of the wafer by inverting the wafer. The two work together to significantly improve the bonding quality between the chip and the wafer and avoid introducing voids at the bonding interface. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the axial structure of the pickup component provided in this embodiment of the utility model;

[0029] Figure 2 This is a simplified schematic diagram of the chip picking device provided in this embodiment of the present invention picking up a chip;

[0030] Figure 3 This is a simplified schematic diagram of the chip pickup device adsorbing a chip according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the axial structure of another pickup component provided in this embodiment of the utility model;

[0032] Figure 5 This is a simplified schematic diagram of another chip pickup device for adsorbing chips provided in this embodiment of the utility model;

[0033] Figure 6 This is a simplified schematic diagram of another chip pickup device for adsorbing chips, provided by an embodiment of the present invention.

[0034] Figure 7 This is a partial structural schematic diagram of the chip pickup device provided in an embodiment of the present invention;

[0035] Figure 8 This is a simplified schematic diagram of the chip bonding system from bottom to top provided in this embodiment of the utility model.

[0036] In the picture:

[0037] 1. Chip; 2. Wafer; 3. Chip pickup device; 4. Frame structure; 5. Wafer fixing platform; 6. Chip fixing platform; 7. Drive mechanism;

[0038] 10. Pick-up part; 11. Holding space; 12. Air inlet; 13. Air outlet; 14. Side wall; 141. First side wall surface; 142. Stepped surface; 143. Second side wall surface; 15. Bottom wall; 16. Protrusion; 17. Air extraction hole;

[0039] 20. Rotating component; 21. Rotating shaft; 22. Rotating head. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0041] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0044] Figure 1 This is a schematic diagram of the axial structure of the pickup component provided in this embodiment of the utility model. Figure 2 This is a simplified schematic diagram of the chip picking device provided in this embodiment of the present invention picking up a chip. Figure 3 This is a simplified schematic diagram of the chip picking device adsorbing a chip according to an embodiment of the present invention. Figure 4 This is a schematic diagram of the axial structure of another pickup component provided in this embodiment of the utility model. Figure 5 This is a simplified schematic diagram of another chip pickup device for adsorbing chips, provided in an embodiment of this utility model. Figure 6 This is a simplified schematic diagram of another chip pickup device for adsorbing chips, provided by an embodiment of this utility model. Figure 7 This is a partial structural schematic diagram of the chip pickup device provided in an embodiment of the present invention. Figure 8 This is a simplified schematic diagram of the chip bonding system from bottom to top provided in this embodiment of the utility model.

[0045] like Figures 1 to 8As shown, this embodiment provides a chip pickup device 3, which includes a pickup component 10 and a pressure regulating component. The pickup component 10 includes a holding space 11. When the holding space 11 is configured to pick up the chip 1, the inner wall of the holding space 11 only abuts against the rejection area of ​​the chip 1. The cross-sectional shape of the holding space 11 along the thickness direction of the chip 1 is trapezoidal, and the rejection area is the area no more than 0.3 mm inward from the front edge of the chip 1. The pressure regulating component is connected to the holding space 11 and is used to reduce the air pressure in the holding space 11.

[0046] Chip 1 has a front side and a back side, which are arranged opposite to each other along the thickness direction of chip 1. The front side of chip 1 is used to bond with the material to be bonded, including but not limited to wafer 2, chip 1 or PCB.

[0047] In some examples, the exclusion zone is the front edge of chip 1, meaning that when chip 1 is adsorbed, the inner wall of space 11 is in contact with the front edge of chip 1. In other examples, the exclusion zone is the front edge of chip 1 and the area extending inward from the edge to the front edge by no more than 0.3 mm, meaning that when chip 1 is adsorbed, the inner wall of space 11 is in contact with both the front edge of chip 1 and the area extending inward from the edge to the front edge of chip 1 by no more than 0.3 mm. The front edge of chip 1 refers to the edge formed by the intersection of the front edge and the side edge of chip 1.

[0048] The pickup component 10 includes a holding space 11. The inner wall of the holding space 11 can abut against the rejection area of ​​the chip 1, and the holding space 11 can also generate an adsorption force on the chip 1, so that the chip 1 can be fixed on the pickup component 10 and not fall off. The cross-sectional shape of the holding space 11 along the thickness direction of the chip 1 is trapezoidal. In other words, the holding space 11 is recessed inward from one side of the pickup component 10, and the opening area of ​​the holding space 11 becomes smaller as it goes inward, so that the side wall 14 of the holding space 11 is inclined outward from the opening. When the pickup component 10 adsorbs the chip 1, the rejection area of ​​the chip 1 is tangentially abutted against the side wall 14 of the holding space 11, so that the chip 1 is stuck in a preset holding position to facilitate subsequent handover. At the same time, the inclined side wall 14 also has a guiding function, allowing the chip 1 to move into the holding space 11 along the inclined direction of the side wall 14 during the process of the pickup component 10 adsorbing the chip 1.

[0049] For example, the pickup 10 is provided with an air passage that connects the air pressure regulator and the holding space 11. The air pressure regulator can reduce the air pressure in the holding space 11 so that the air pressure in the holding space 11 is less than the air pressure outside the holding space 11, thereby causing the chip 1 to be pushed into the holding space 11 under the action of the pressure difference.

[0050] In some alternative embodiments, the pressure regulator includes a gas delivery member communicating with the holding space 11 for delivering gas into the holding space 11. The holding space 11 has an open end that contacts the chip 1, an inlet 12, and an outlet 13. The inlet 12 is disposed away from the open end and communicates with the gas delivery member. The outlet 13 is disposed close to the open end.

[0051] Gas delivery components can deliver compressed gas streams, such as compressed dry air or compressed inert gases (e.g., nitrogen).

[0052] In these alternative embodiments, the gas delivery member delivers compressed airflow into the holding space 11 through the air inlet 12. As the compressed airflow flows through the air inlet 12 to the wall of the holding space 11, a high-speed airflow is formed, thereby creating a low-pressure zone inside the holding space 11 relative to the outside of the holding space 11, so that a pressure difference is generated inside and outside the holding space 11. The air outlet 13 can carry the high-speed airflow away from the holding space 11, so that the holding space 11 maintains the low-pressure zone state, thereby ensuring continuous adsorption of the chip 1.

[0053] In some alternative embodiments, the pickup member 10 includes a sidewall 14 and a bottom wall 15, which together form a holding space 11. The sidewall 14 is recessed toward the side for picking up the chip 1 to form a through groove, which forms an vent 13.

[0054] Optionally, the sidewall 14 includes two sets of sidewalls 14 disposed opposite to each other, each set of sidewalls 14 including two oppositely disposed sidewalls 14. The through-groove can be disposed on one set of sidewalls 14 or on both sets of sidewalls 14. The through-groove is formed by a recess in the side surface of the sidewall 14 facing the chip 1. Exemplarily, the sidewall 14 has a through-groove and a protrusion protruding relative to the through-groove, the protrusion or other areas of the sidewall 14 surface being used to abut against the exclusion area of ​​the chip 1.

[0055] In some alternative embodiments, the air inlet 12 is disposed opposite to the sidewall 14 which has the air outlet 13.

[0056] For example, the air inlet 12 is located in the central area of ​​the bottom wall 15 or any area of ​​the bottom wall 15. The air inlet 12 is arranged opposite to the side wall 14 with the air outlet 13, so that the gas entering through the air inlet 12 will flow along the side wall 14 after hitting the side wall 14 with the air outlet 13, and will flow out through the air outlet 13, thereby shortening the flow distance of the gas in the holding space 11, avoiding turbulence and other phenomena in the holding space 11, and improving the adsorption reliability.

[0057] In some alternative embodiments, the retaining space 11 includes a bottom wall 15, the bottom wall 15 having a protrusion 16 that protrudes from the bottom wall surface, and an air inlet 12 on the side of the protrusion 16 facing the side wall 14.

[0058] Optionally, the projection shape of the protrusion 16 onto the bottom wall 15 may include a rectangle, a circle, a cross, or other shapes.

[0059] It is understandable that when the holding space 11 holds the chip 1, the side of the chip 1 facing the bottom wall 15 is spaced apart from the side of the protrusion 16 facing away from the bottom wall 15, thereby reducing the possibility of interference between the chip 1 and the protrusion 16.

[0060] Optionally, the specifications of the pickup 10 and the chip 1 to be picked up can be set in a one-to-one correspondence, that is, one pickup 10 can only pick up one size of chip 1; or, the pickup 10 can pick up multiple sizes of chip 1. Since the side wall 14 of the holding space 11 is an inclined side wall 14, the exclusion area of ​​chips 1 of different sizes can abut at different positions on the side wall 14.

[0061] The bottom wall 15 of the holding space 11 extends into the holding space 11 to form a protrusion. An air inlet 12 is provided on the protrusion. The air inlet 12 is used to connect with the gas pipeline to the outside. The gas pipeline blows compressed air into the holding space 11 through the air inlet 12. The compressed air flows through the narrow space between the protrusion 16 and the side wall 14 to form a high-speed airflow. The high-speed airflow reduces the air pressure in this space (i.e., a low-pressure area is formed in the holding space 11). The air pressure outside the holding space 11 is greater than the low-pressure area, which generates a pressure difference and pushes the chip 1 into the holding space 11 to achieve adsorption of the chip 1.

[0062] When compressed air flows at high speed into the narrow space between the protrusion 16 and the side wall 14, a low-pressure zone is formed. However, without the vent 13, the airflow cannot escape, causing the air pressure in the space 11 to gradually increase, the low-pressure zone to disappear, and the adsorption force to fail. The presence of the vent 13 allows the airflow to continuously "slip away" from the through slot, ensuring both the continuous passage of high-speed airflow (maintaining the high flow rate required for the Bernoulli effect) and the stable maintenance of the low-pressure state within the space 11, ensuring that the pressure difference always exists, thereby continuously adsorbing objects. Furthermore, by adjusting the leakage balance pressure, the adsorption force is kept within a suitable range, effectively adsorbing the chip 1 without damaging it.

[0063] In some alternative embodiments, the protrusion 16 includes an interconnected group of air holes, the group of air holes including two air inlets 12 with opposite opening directions and the two air inlets 12 located at both ends of the protrusion 16 along a first direction, the first direction intersecting the thickness direction of the protrusion 16.

[0064] For example, the protrusion 16 may include one or more sets of air holes. For instance, when the sidewall 14 includes two sets of opposing sidewalls 14, and one set of sidewalls 14 is provided with an air outlet 13, the protrusion 16 may have one set of air holes, which is opposite to the sidewall 14 with the air outlet 13. Two air holes in this set are respectively located at both ends of the protrusion 16 along a first direction. Optionally, the protrusion 16 may extend along the first direction; when the sidewall 14 includes two sets of opposing sidewalls 14, and each set of sidewalls 14 is provided with an air outlet 13, the protrusion 16 may have two sets of air holes, each set of air holes being opposite to the opposing set of sidewalls 14. For example, two sets of oppositely arranged sidewalls 14 are respectively a set of sidewalls 14 arranged opposite each other along a first direction and a set of sidewalls 14 arranged opposite each other along a second direction. One set of air holes is distributed at both ends of the protrusion 16 along the first direction, and the other set of air holes is distributed at both ends of the protrusion 16 along the second direction. Optionally, the protrusion 16 includes a first protrusion extending along the first direction and a second protrusion extending along the second direction. Optionally, the two air inlets 12 in each set of air holes can be in the same plane along the side-by-side arrangement direction of the two air inlets 12, so that the distance between the two air inlets 12 and their opposite sidewalls 14 is the same, thereby making the negative pressure on both sides the same, thereby improving the stability of the adsorption chip 1 and reducing the risk of the chip 1 tilting after adsorption.

[0065] Optionally, the inner diameters of the two air inlets 12 within each air inlet group can be the same.

[0066] Optionally, the inner diameter of the air inlet 12 in different groups of air inlets can be the same or different.

[0067] In some alternative embodiments, the pressure regulating component includes a vacuum pumping device that is connected to the holding space 11. The vacuum pumping device evacuates the holding space 11, reducing the pressure within it and thus adsorbing the chip 1, thereby simplifying the overall structure of the pickup 10 and reducing manufacturing costs.

[0068] Optionally, an air extraction port 17 may be provided in the retaining space 11, which is used to communicate with a vacuum pumping device.

[0069] Optionally, the vacuuming device includes a vacuum pump, vacuuming pipelines, etc.

[0070] In some alternative embodiments, the sidewall 14 of the wall portion includes a first sidewall 141, a second sidewall 143, and a stepped surface 142. The first sidewall 141 and the second sidewall 143 are connected by the stepped surface 142. The second sidewall 143 is connected to the bottom wall surface of the bottom wall 15. At least the first sidewall 141 has a trapezoidal cross-sectional shape along the thickness direction of the chip 1. The stepped surface 142 is used to abut against the exclusion area of ​​the chip 1.

[0071] For example, along the recessed direction of the retaining space 11, the first side wall 141, the stepped surface 142, and the second side wall 143 are sequentially connected to each other. The second side wall 143 is connected to the bottom wall, and the connection between the second side wall 143 and the stepped surface 142 extends beyond the side surface of the protrusion 16 facing away from the bottom wall in a direction away from the bottom wall.

[0072] In some alternative embodiments, the first sidewall 141 has a trapezoidal cross-sectional shape parallel to the thickness direction of the chip 1; in other examples, both the first sidewall 141 and the second sidewall 143 have trapezoidal cross-sectional shapes parallel to the thickness direction of the chip 1. Optionally, the angle between the first sidewall 141 and the bottom wall and the angle between the second sidewall 143 and the bottom wall can be the same or different.

[0073] Optionally, the stepped surface 142 may be parallel to the front side of the chip 1, or the stepped surface 142 may be inclined, that is, the cross-sectional shape of the stepped surface 142 along the thickness direction of the chip 1 is trapezoidal.

[0074] By setting the stepped surface 142 in this embodiment, it is beneficial to reduce the possibility of the chip 1 picked up by the pickup 10 tilting, improve the parallelism of the chip 1 picked up by the pickup 10, and thus reduce the difficulty of the chip pickup device 3 handing over the chip 1 to other mechanisms.

[0075] In some alternative embodiments, the chip pickup device 3 further includes a rotating member 20 connected to the adsorption member, the rotation axis 21 of the rotating member 20 intersecting the adsorption direction of the adsorption member.

[0076] Specifically, the rotating component 20 may include a rotating shaft 21 and a rotating head 22. The extending direction of the rotating shaft 21 is perpendicular to the extending direction of the rotating head 22. When the rotating shaft 21 rotates around the shaft, it drives the end of the rotating head 22 to rotate. The end of the rotating head 22 is used to connect to the adsorption component. The extending direction of the rotating head 22 intersects with the adsorption direction of the adsorption component. The rotation of the end of the rotating head 22 can drive the chip 1 adsorbed by the adsorption component to rotate, so that the chip 1 forms an angle with respect to the horizontal direction, thereby causing the front and back sides of the chip 1 to change position with respect to the vertical direction.

[0077] Optionally, the rotating component 20 may also include a drive unit that drives the rotating shaft 21 to rotate.

[0078] As shown in the figure, another aspect of this embodiment provides a bottom-to-top bonding system for chip 1, which includes a frame structure 4, a wafer fixing platform 5, a chip fixing platform 6, a chip pick-up device 3 as described in any of the preceding embodiments, and a driving mechanism 7. The wafer fixing platform 5 is disposed at the top of the frame structure 4 and is used to selectively fix the wafer 2 with the bonding surface of the wafer 2 facing downwards. The chip fixing platform 6 is disposed at the bottom of the frame structure 4 and is used to selectively fix the chip 1 with the bonding surface of the chip 1 facing upwards. The chip pick-up device 3 is used to transfer the chip 1 to the chip fixing platform 6. The driving mechanism 7, connected to the wafer fixing platform 5 and / or the chip fixing platform 6, is used to drive the wafer fixing platform 5 and the chip fixing platform 6 to move relative to each other.

[0079] Exemplarily, both the wafer mounting platform 5 and the chip mounting platform 6 can be installed within the frame structure 4. The top of the frame structure 4 may have a mounting structure for mounting the wafer mounting platform 5 on top of the frame structure 4. The bottom of the frame structure may have a mounting structure for mounting the chip mounting platform 6 on the bottom of the frame structure 4. It is understood that when the wafer mounting platform 5 is located at the top of the frame structure 4, the fixing member for fixing the wafer 2 is located on the side of the wafer mounting platform 5 facing away from the top of the frame structure 4, so that the bonding surface of the wafer 2 faces downwards when the fixing member fixes the wafer 2. Optionally, the fixing member includes an electrostatic chuck. When the chip mounting platform 6 is located at the bottom of the frame structure 4, the structure for fixing the chip 1 is located on the side of the chip mounting platform 6 facing the wafer mounting platform 5, so that the bonding surface of the chip 1 and the bonding surface of the wafer 2 are opposite to each other. The driving mechanism 7 can connect only one of the wafer mounting platform 5 and the chip mounting platform 6, driving one to move towards the other, so that the wafer 2 and the chip 1 move closer together and are bonded. Of course, the drive mechanism 7 can also be connected to the wafer mounting platform 5 and the chip mounting platform 6 respectively, so that the wafer mounting platform 5 and the chip mounting platform 6 can move towards each other, thereby shortening the travel distance. After picking up chip 1, the chip pick-up device 3 in any of the aforementioned embodiments transfers chip 1 to the chip mounting platform 6, so that the back side of chip 1 faces down and the front side faces up. Here, "side to be bonded" refers to "front side". For example, the side to be bonded of chip 1 is the front side of chip 1, and the side to be bonded of wafer 2 is the front side of wafer 2. For ease of understanding, "facing down" in this embodiment means vertically downward, and "facing up" means vertically upward.

[0080] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A chip pick-up device, characterized by include: The pickup (10) includes a holding space (11), which is configured to adsorb a chip. When the holding space (11) is configured to adsorb the chip, the inner wall of the holding space (11) only abuts against the exclusion area of ​​the chip. The holding space (11) has a trapezoidal cross-sectional shape along a direction parallel to the thickness of the chip. The exclusion area is the area of ​​the chip's front edge extending inwards by no more than 0.3 mm. A pressure regulator is connected to the holding space (11) and is used to reduce the pressure in the holding space (11).

2. The chip pick-up device according to claim 1, characterized in that The pressure regulating component includes a gas conveying component, which is connected to the holding space (11) and is used to convey gas into the holding space (11); The holding space (11) has an opening end that contacts the chip, an air inlet (12) and an air outlet (13); the air inlet (12) is located away from the opening end and is connected to the gas delivery component; the air outlet (13) is located close to the opening end.

3. The chip pick-up device according to claim 2, wherein The pickup (10) includes a side wall (14) and a bottom wall (15), the side wall (14) and the bottom wall (15) enclose the holding space (11), and the side surface of the side wall (14) near the opening end is recessed to form a through groove, the through groove forming the air outlet (13).

4. The chip pick-up device according to claim 3, characterized in that The air inlet (12) is disposed opposite to the side wall (14) which has the air outlet (13).

5. The chip pickup device according to claim 4, characterized in that, The retaining space (11) includes a bottom wall (15), the bottom wall (15) is provided with a protrusion (16), the protrusion (16) protrudes from the bottom wall surface, and the protrusion (16) is provided with an air inlet (12) on the side facing the side wall (14).

6. The chip pick-up device according to claim 5, wherein The protrusion (16) includes an interconnected group of air holes, the group of air holes including two air inlets (12), the two air inlets (12) opening in opposite directions, and the two air inlets (12) located at both ends of the protrusion (16) along a first direction, the first direction intersecting the thickness direction of the protrusion (16).

7. The chip pick-up device according to claim 1, wherein The pressure regulating component includes a vacuum pumping device, which is connected to the holding space (11).

8. The chip pick-up device according to claim 3, wherein The sidewall (14) includes a first sidewall (141), a second sidewall (143), and a stepped surface (142). The first sidewall (141) and the second sidewall (143) are connected by the stepped surface (142). The second sidewall (143) is connected to the bottom wall (15). At least the first sidewall (141) has a trapezoidal cross-sectional shape parallel to the thickness direction of the chip. The stepped surface (142) is used to abut against the exclusion area of ​​the chip.

9. The chip pick-up device according to claim 1, wherein It also includes a rotating component (20), which is connected to the adsorption component, and the rotation axis of the rotating component (20) intersects with the adsorption direction of the adsorption component.

10. A die bonding system, characterized by, include: Framework structure (4); A wafer fixing platform (5) is disposed on the top of the frame structure (4). The wafer fixing platform (5) is used to selectively fix the wafer so that the bonding surface of the wafer faces downward. A chip fixing platform (6) is disposed at the bottom of the frame structure (4). The chip fixing platform (6) is used to selectively fix the chip so that the bonding surface of the chip faces upward. The chip pickup device (3) according to any one of claims 1 to 9 is used to transfer the chip to the chip fixing platform; A drive mechanism (7) is connected to the wafer fixing platform (5) and / or the chip fixing platform (6) for driving the wafer fixing platform (5) and the chip fixing platform (6) to move relative to each other.

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