Rolling platform and heat dissipation patch mounting device

Abstract

The application provides a rolling platform and a heat dissipation patch mounting device. The rolling platform is used for mounting the heat dissipation patch on a COF product in cooperation with a roller. The rolling platform comprises a first platform, a surface of the first platform comprising a first area and a second area arranged in the first area, the first area being provided with a vacuum groove, and the second area being provided with a screw fixing hole penetrating through the thickness of the platform; a second platform arranged on the surface of the first platform, the second platform being provided with a plurality of vacuum holes penetrating through the thickness thereof, the vacuum holes being in communication with the vacuum groove, and the distribution pattern of the vacuum holes being consistent with the distribution pattern of the vacuum groove. The rolling platform can improve the problem of insufficient number and distribution density of the vacuum holes, help to increase the effective adsorption area, and ensure the flatness of the COF product in the adsorption state.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and more specifically, to a rolling platform and a heat sink mounting device. Background Technology

[0002] In the semiconductor packaging field, the process of mounting thermal pads on COF products is typically accomplished using a fixture (thermal pad mounting device) that combines a roller platform and rollers. The roller platform holds the COF product flat, and then, together with the rollers, mounts the thermal pad onto the COF product.

[0003] Existing rolling platforms typically feature vacuum holes on their surface and internal vacuum through-holes connecting these holes to external vacuum equipment. During vacuuming, COF products can be adsorbed onto the rolling platform surface. Additionally, rolling platforms usually include screw holes for securing the product. However, in practical applications, the number and distribution of vacuum holes on the platform surface are limited by the distribution of screw holes and the machining method of the vacuum through-holes. This can lead to insufficient number and density of vacuum holes, resulting in a reduced effective adsorption area and affecting the flatness of the COF products. Utility Model Content

[0004] This application provides at least one rolling platform and a heat sink mounting device. The rolling platform can improve the problem of insufficient number and distribution density of vacuum holes, help increase the effective adsorption area, and ensure the flatness of COF products in the adsorption state.

[0005] In a first aspect, embodiments of this application provide a rolling platform for attaching heat sinks to COF products in conjunction with rollers, the rolling platform comprising:

[0006] A first platform, the surface of the first platform includes a first region and a second region disposed in the first region, the first region is provided with vacuum grooves, and the second region is provided with screw fixing holes that penetrate the thickness of the platform;

[0007] A second platform is disposed on the surface of the first platform. The second platform is provided with a plurality of vacuum holes penetrating its thickness. The vacuum holes are connected to the vacuum grooves, and the distribution pattern of the vacuum holes is consistent with the distribution pattern of the vacuum grooves.

[0008] In one optional implementation, a positioning structure is provided between the first platform and the second platform, the positioning structure being configured to locate the position of the second platform relative to the first platform.

[0009] In one optional embodiment, the positioning structure includes a first positioning feature and a second positioning feature. The first positioning feature is disposed on the first platform, and the second positioning feature is disposed on the second platform. The first positioning feature and the second positioning feature are used to cooperate with each other when the second platform is disposed on the first platform to locate the position of the second platform relative to the first platform.

[0010] In one optional implementation, one of the first positioning feature and the second positioning feature is a positioning post, and the other is a positioning hole.

[0011] In one alternative embodiment, the surface of the second platform is provided with an IC clearance groove.

[0012] In one alternative embodiment, the surface of the second platform is provided with a groove, in which a support block is detachably disposed, and the surface of the support block away from the first platform is provided with an IC clearance groove.

[0013] In one alternative embodiment, the support block has multiple sides of the same shape along its circumference, and each of the multiple sides of the support block is provided with an IC clearance groove for accommodating different IC sizes. The support block is configured to be positioned in the groove at different angles so that one of the multiple sides of the support block is away from the first platform.

[0014] In one alternative embodiment, the cross-section of the support block is triangular or square.

[0015] In one optional embodiment, the groove is a through hole; the surface of the first platform further includes a third region disposed in the first region, the third region being opposite to the groove, and the third region being used to support the support block.

[0016] Secondly, embodiments of this application also provide a heat sink mounting device, including rollers and the rolling platform described above.

[0017] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0018] The rolling platform of this application adopts a double-layer (first platform and second platform) structure design. The first platform is provided with screw fixing holes and vacuum grooves, and the second platform is provided with vacuum holes. Compared with the traditional single-layer structure design, the vacuum grooves are easier to process and can easily expand the processing range while avoiding the screw fixing holes. This helps to increase the number and density of vacuum holes connected to the vacuum grooves, thereby improving the problem of insufficient number and distribution density of vacuum holes, helping to increase the effective adsorption area, and ensuring the flatness of COF products in the adsorption state.

[0019] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the structure of a rolling platform in the prior art is shown;

[0022] Figure 2 This paper shows a schematic diagram of the structure of a rolling platform provided in an embodiment of this application;

[0023] Figure 3 It shows Figure 2 Floor plan of the first platform in the middle;

[0024] Figure 4 It shows Figure 2 Floor plan of the second platform in the middle;

[0025] In the picture:

[0026] 1. Roller pressing platform; 2. Vacuum hole; 3. Vacuum through hole; 4. Screw fixing hole;

[0027] 100, First platform; 110, First region; 111, Vacuum trench; 120, Second region; 121, Screw fixing hole; 130, Third region; 140, First positioning feature; 200, Second platform; 210, Vacuum hole; 220, Second positioning feature; 230, Groove; 240, Support block; 241, IC clearance groove. Detailed Implementation

[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0029] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0030] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In the semiconductor packaging field, the process of mounting thermal pads on COF products is typically accomplished using a fixture (thermal pad mounting device) that combines a roller platform and rollers. The roller platform holds the COF product flat, and then, together with the rollers, mounts the thermal pad onto the COF product.

[0034] like Figure 1As shown, existing rolling platforms 1 typically have vacuum holes 2 on their surface and vacuum through holes 3 inside them for connecting the vacuum holes 2 to external vacuum equipment. During vacuuming, COF products can be adsorbed onto the surface of the rolling platform 1. In addition, the rolling platform 1 usually has screw fixing holes 4 for fixing. However, in practical applications, the number of vacuum holes 2 and their distribution on the platform surface are limited by the distribution of the screw fixing holes 4 and the processing method of the vacuum through holes 3. This results in insufficient number and density of vacuum holes 2, leading to a reduction in the effective adsorption area and affecting the flatness of the COF products.

[0035] To address this issue, this application provides a rolling platform that can improve the problem of insufficient number and distribution density of vacuum pores, help increase the effective adsorption area, and ensure the flatness of the COF product in the adsorption state.

[0036] refer to Figures 2 to 4 The rolling platform includes a first platform 100 and a second platform 200. The surface of the first platform 100 includes a first region 110 and a second region 120 disposed within the first region 110. The first region 110 is provided with vacuum grooves 111, and the second region 120 is provided with screw fixing holes 121 penetrating the thickness of the platform. The second platform 200 is disposed on the surface of the first platform 100 and is provided with multiple vacuum holes 210 penetrating its thickness. The vacuum holes 210 are connected to the vacuum grooves 111, and the distribution pattern of the vacuum holes 210 is consistent with the distribution pattern of the vacuum grooves 111. In actual installation, the first platform 100 is first fixed using fixing screws, and then the second platform 200 is disposed on the surface of the first platform 100. In practical use, the vacuum port 210 is connected to an external vacuum pumping device via the vacuum groove 111. After the external vacuum pumping device is activated, a negative pressure is formed inside the vacuum port 210, adsorbing the COF product placed on the surface of the rolling platform (i.e., the surface of the second platform 200 away from the first platform 100). Subsequently, the operator or a robot can drive the rollers to roll the heat dissipation pads placed on the surface of the COF product, so that the heat dissipation pads are attached to the surface of the COF product. It should be noted that the bottom or side of the vacuum groove 111 can be provided with an air extraction port for external vacuum pumping equipment to extract air.

[0037] In some embodiments, a positioning structure is provided between the first platform 100 and the second platform 200. The positioning structure is configured to position the second platform 200 relative to the first platform 100. Positioning the second platform 200 relative to the first platform 100 by the positioning structure ensures that the vacuum hole 210 and the vacuum groove 111 are vertically aligned, avoiding the problem that the vacuum hole 210 cannot achieve adsorption due to misalignment.

[0038] In some embodiments, such as Figure 3 and Figure 4 As shown, the positioning structure includes a first positioning feature 140 and a second positioning feature 220. The first positioning feature 140 is disposed on the first platform 100, and the second positioning feature 220 is disposed on the second platform 200. The first positioning feature 140 and the second positioning feature 220 cooperate with each other when the second platform 200 is disposed on the first platform 100 to position the second platform 200 relative to the first platform 100. Alternatively, one of the first positioning feature 140 and the second positioning feature 220 may be a positioning post, and the other may be a positioning hole. Figure 2 As shown in the exemplary embodiment, three positioning posts are provided on the surface of the first platform 100 (i.e., the surface facing the second platform 200). These three positioning posts are located at the three corners of the first platform 100. The second platform 200 is provided with three positioning holes, each conforming to one of the positioning posts, also located at one of the three corners of the second platform 200. When the three positioning posts are inserted into their respective positioning holes, the position of the second platform 200 relative to the first platform 100 can be determined. Of course, in specific implementations, the positions of the positioning posts and positioning holes can be interchanged.

[0039] In some embodiments, the cross-section of the positioning post can be circular. Of course, in specific implementations, the cross-section of the positioning post can also be other shapes, such as triangular or regular quadrilateral. Furthermore, when the positioning structure includes multiple positioning posts, the cross-sectional shapes of the multiple positioning posts can be the same or different.

[0040] In other embodiments, the positioning structure may also be a positioning groove disposed circumferentially along the edge of the first platform 100 or the second platform 200.

[0041] In some embodiments, the surface of the second platform 200 is provided with an IC clearance groove 241. By providing the IC clearance groove 241, physical damage such as chip breakage and pin deformation caused by direct contact between the IC of the COF product and the surface of the fixture (i.e., the rolling platform) during the rolling process can be prevented.

[0042] In some embodiments, a groove 230 is provided on the surface of the second platform 200, and a support block 240 is detachably disposed in the groove 230. An IC clearance groove 241 is provided on the surface of the support block 240 away from the first platform 100. That is, the support block 240 with the IC clearance groove 241 is detachably installed in the groove 230. In practical use, operators can adapt the device to different COF product packaging processes by replacing the support block 240 with one having a different IC clearance groove 241, thus improving the applicability of the device. It should be noted that in specific implementations, the groove 230 can be a blind via or a through-hole.

[0043] In some embodiments, the support block 240 has multiple identically shaped sides along its circumference. Each side of the support block 240 has an IC clearance slot 241 for accommodating different IC sizes. The support block 240 is configured to be positioned within the recess 230 at different angles, such that one of its sides is away from the first platform 100. That is, the support block 240 can be installed within the recess 230 after being rotated at different angles, allowing each IC clearance slot 241 of the support block 240 to be used for mounting different COF products. In practical use, if the current IC clearance slot 241 does not match the IC of the COF product to be mounted with a heatsink, the operator can remove the support block 240 from the recess 230, rotate it, and then reinstall it into the recess 230 to match the IC clearance slot 241 with the IC of the COF product to be mounted with a heatsink. Compared to using a support block 240 with a single IC clearance slot 241, this design reduces the number of components and avoids the hassle of managing components.

[0044] In some embodiments, the cross-section of the support block 240 is triangular or square. Of course, in specific implementations, the cross-section of the support block 240 can also be other shapes, such as regular pentagon or regular hexagon.

[0045] In some embodiments, such as Figure 3 and Figure 4 As shown, the groove 230 is a through hole. The surface of the first platform 100 also includes a third region 130 disposed in the first region 110. The third region 130 does not have a vacuum hole 210. The third region 130 is positioned opposite to the groove 230 and is used to support the support block 240. That is, if the groove 230 is a through hole, the support block 240 can contact the third region 130 of the first platform 100 when it is installed in the groove 230, and the third region 130 of the first platform 100 provides support for the support block 240. Compared with the first region 110 supporting the support block 240, using the third region 130 to support the support block 240 can avoid gas leakage affecting the adsorption effect. It should be noted that when the groove 230 is a through hole, in order to ensure airtightness, a sealing material can be provided at the position where the groove 230 contacts the second platform 200.

[0046] The rolling platform provided in this application adopts a double-layer (first platform 100 and second platform 200) structure design. The first platform 100 is provided with screw fixing holes 121 and vacuum grooves 111, and the second platform 200 is provided with vacuum holes 210. Compared with the traditional single-layer structure design, the vacuum grooves 111 are easier to process and can easily expand the processing range while avoiding the screw fixing holes 121. This helps to increase the number and density of vacuum holes 210 connected to the vacuum grooves 111, thereby improving the problem of insufficient number and distribution density of vacuum holes 210, helping to increase the effective adsorption area and ensure the flatness of COF products in the adsorption state.

[0047] This application also provides a heat sink mounting device, including rollers and a rolling platform. The rolling platform is the same as described above. The specific structure of the rolling platform has been described in detail above and will not be repeated here.

[0048] The heat dissipation patch mounting device provided in this application includes a rolling platform. The rolling platform adopts a double-layer (first platform 100 and second platform 200) structure design. The first platform 100 is provided with screw fixing holes 121 and vacuum grooves 111, and the second platform 200 is provided with vacuum holes 210. Compared with the traditional single-layer structure design, the vacuum grooves 111 are easier to process and can easily expand the processing range while avoiding the screw fixing holes 121. This helps to increase the number and density of vacuum holes 210 connected to the vacuum grooves 111, thereby improving the problem of insufficient number and distribution density of vacuum holes 210, helping to increase the effective adsorption area and ensure the flatness of COF products in the adsorption state.

[0049] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0050] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A rolling platform for attaching heat sinks to COF products in conjunction with rollers, characterized in that, The rolling platform includes: A first platform, the surface of the first platform includes a first region and a second region disposed in the first region, the first region is provided with vacuum grooves, and the second region is provided with screw fixing holes that penetrate the thickness of the platform; A second platform is disposed on the surface of the first platform. The second platform is provided with a plurality of vacuum holes penetrating its thickness. The vacuum holes are connected to the vacuum grooves, and the distribution pattern of the vacuum holes is consistent with the distribution pattern of the vacuum grooves.

2. The rolling platform according to claim 1, characterized in that, A positioning structure is provided between the first platform and the second platform, and the positioning structure is configured to locate the position of the second platform relative to the first platform.

3. The rolling platform according to claim 2, characterized in that, The positioning structure includes a first positioning feature and a second positioning feature. The first positioning feature is disposed on the first platform, and the second positioning feature is disposed on the second platform. The first positioning feature and the second positioning feature are used to cooperate with each other when the second platform is disposed on the first platform to locate the position of the second platform relative to the first platform.

4. The rolling platform according to claim 3, characterized in that, One of the first positioning feature and the second positioning feature is a positioning post, and the other is a positioning hole.

5. The rolling platform according to claim 1, characterized in that, The surface of the second platform is provided with an IC clearance groove.

6. The rolling platform according to claim 5, characterized in that, The second platform has a groove on its surface, and a support block is detachably disposed in the groove. An IC clearance groove is disposed on the surface of the support block away from the first platform.

7. The rolling platform according to claim 6, characterized in that, The support block has multiple sides of the same shape along its circumference. Each side of the support block has an IC clearance groove for accommodating different IC sizes. The support block is configured to be positioned at different angles within the grooves so that one of the multiple sides of the support block is away from the first platform.

8. The rolling platform according to claim 7, characterized in that, The cross-section of the support block is triangular or square.

9. The rolling platform according to claim 6, characterized in that, The groove is a through hole; The surface of the first platform also includes a third region disposed in the first region, the third region being opposite to the groove, and the third region being used to support the support block.

10. A heat sink mounting device, characterized in that, Includes rollers and the rolling platform as described in any one of claims 1-9.

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