A semi-automatic wafer film pasting device

Abstract

The utility model discloses a kind of semi-automatic wafer film pasting device, including base, further include: support frame, support frame is located at the top of base, support frame top is fixedly connected with slide rail, the top of slide rail is slidably connected with sliding mechanism, sliding mechanism inside is fixedly connected with first telescopic mechanism;Workbench, workbench is located at the top of first telescopic mechanism, workbench is slidably connected with first telescopic mechanism, and workbench top is equipped with multiple placing blocks;Through being equipped with multiple placing blocks on workbench, multiple wafer chips needing film pasting can be placed on placing block, so that multiple wafer chips can be simultaneously placed on equipment to carry out film pasting operation, wafer chip does not need to be frequently replaced, more manual operation is not needed, and practicality is strong.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a semi-automatic wafer lamination device. Background Technology

[0002] The side of a wafer that performs the chip's function is usually called the front side, and the other side is called the back side. During wafer fabrication, a thin film is often applied to the wafer surface for various applications, usually using a wafer lamination device.

[0003] A search revealed that Chinese Patent Publication No. CN222880796U belongs to the field of wafer processing technology, specifically relating to a wafer lamination device. The device includes a stage, a lamination assembly, and a cutting assembly. The lamination assembly includes lamination rollers and a drive mechanism for driving the lamination rollers. The drive mechanism includes a rotary motor, a drive pulley, an intermediate pulley, a drive rod, a synchronous pulley, and a driven pulley. Connecting blocks are provided between both ends of the lamination rollers and a second synchronous belt, and the lamination rollers are elastically connected to the connecting blocks. The cutting assembly includes an elastically configured rotary cutting mechanism and a linear cutting mechanism. In this invention, the rotary motor sequentially drives the connecting blocks on both sides to move synchronously via the drive pulley, the first synchronous pulley, the intermediate pulley, the drive rod, the synchronous pulley, and the second synchronous belt. This causes the lamination rollers between the two connecting blocks to reciprocate, thus laminating the protective film onto the wafer. This replaces manual operation, improves the lamination effect, and the elastically configured lamination rollers act as a buffer, preventing damage to the wafer.

[0004] A search revealed that Chinese Patent Publication No. CN220794251U discloses a wafer bonding device. This device includes a vacuum adsorption unit and a foot switch connected to the vacuum adsorption unit. When the foot switch is pressed, the vacuum adsorption unit adsorbs the wafer; when the foot switch is not pressed, the vacuum adsorption unit releases the wafer. This configuration, using a foot switch to control the adsorption and release of the wafer by the vacuum adsorption unit, eliminates the need for manual operation, freeing the operator's hands from assisting in wafer fixation, ensuring proper wafer bonding, and improving yield.

[0005] However, in the existing technology, multiple wafers cannot be placed on the equipment at the same time for film application, requiring frequent wafer replacement and a lot of manual operation, which makes it impractical.

[0006] To address these issues, we propose a semi-automatic wafer lamination device. Utility Model Content

[0007] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semi-automatic wafer lamination device.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] A semi-automatic wafer lamination device includes a base and further includes:

[0010] A support frame is provided at the top of the base. A slide rail is fixedly connected to the top of the support frame. A sliding mechanism is slidably connected to the top of the slide rail. A first telescopic mechanism is fixedly connected inside the sliding mechanism.

[0011] A workbench is located at the top of the first telescopic mechanism and is slidably connected to the first telescopic mechanism. The top of the workbench is provided with multiple placement blocks.

[0012] More preferably, the spacing between the plurality of placement blocks is consistent, the plurality of placement blocks are snapped and fixed to the worktable, and protective pads are fixedly connected to the top of the plurality of placement blocks.

[0013] More preferably, the base has four corner brackets fixedly connected to its bottom end, and a fixed bracket is fixedly connected to the top end of the base on one side of the workbench. Two fixed plates are fixedly connected to the two ends of the fixed bracket facing the workbench.

[0014] More preferably, two raw material turntables are rotatably connected to the top two sides of the fixed bracket, the two raw material turntables are located on the side facing the worktable, and the two raw material turntables are composed of diaphragm winding.

[0015] More preferably, a plurality of rollers are rotatably connected to one side of the two fixed plates facing the worktable, and the diaphragm is wound around the plurality of rollers.

[0016] More preferably, two drive housings are fixedly connected to one side of the top of the base. The two drive housings are located on the back of two fixed plates. A rotating mechanism is provided inside the two drive housings. The rotating mechanism is located at the top of the base.

[0017] More preferably, the rotating mechanism is rotatably connected to two rotating disks on one side of the worktable, and multiple partition blocks are provided at the edges of the two rotating disks, with the diaphragm wrapped around the two rotating disks.

[0018] More preferably, a lifting mechanism is provided above the two rotating turntables, and a lifting rod is provided at the top of the two lifting mechanisms. The two lifting rods pass through the lifting mechanisms, and a cutting head is fixedly connected to the bottom of the two lifting rods.

[0019] More preferably, a second telescopic mechanism is provided on one side of the two rotating disks facing the rotating mechanism, and a connecting rod is slidably connected to one end of the two second telescopic mechanisms facing the two rotating disks, and a connecting mechanism is fixedly connected to one end of the two connecting rods facing the two rotating disks.

[0020] More preferably, the two connecting mechanisms are fixedly connected to one side of the two rotating disks with a cutting blade, and a cutting slit is provided between the plurality of partition blocks for the cutting blade to pass through.

[0021] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0022] The worktable is equipped with multiple placement blocks, allowing multiple wafers to be coated simultaneously. This eliminates the need for frequent wafer replacements and reduces manual operation, making it highly practical. Attached Figure Description

[0023] Figure 1 This is a front structural diagram of a semi-automatic wafer lamination device proposed in this utility model;

[0024] Figure 2 This is a schematic diagram of the back structure of a semi-automatic wafer lamination device proposed in this utility model;

[0025] Figure 3 for Figure 1 Enlarged schematic diagram of the structure at point A in the middle;

[0026] Figure 4 for Figure 1 Enlarged schematic diagram of the structure at point B.

[0027] In the diagram: 1. Base; 2. Leg; 3. Support frame; 4. Slide rail; 5. Sliding mechanism; 6. Workbench; 7. First telescopic mechanism; 8. Raw material turntable; 9. Rotary wheel; 10. Fixed plate; 11. Fixed bracket; 12. Drive housing; 13. Rotating mechanism; 14. Rotating turntable; 15. Second telescopic mechanism; 16. Placement block; 17. Protective pad; 18. Connecting rod; 19. Connecting mechanism; 20. Lifting mechanism; 21. Lifting rod; 22. Cutting head; 23. Diaphragm; 24. Cutting blade; 25. Separator block. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0029] refer to Figure 1A semi-automatic wafer lamination device, wherein a base 1 is used to support components such as a support frame 3, and four corners of the bottom end of the base 1 are fixedly connected to legs 2. The legs 2 can support the base 1. The bottom end of the legs 2 can be set as a rough rubber block, which can increase the friction between the legs 2 and the ground contact surface.

[0030] refer to Figure 1 The support frame 3 is located at the top of the base 1. The support frame 3 is used to support the slide rail 4. The slide rail 4 is fixedly connected to the top of the support frame 3. The slide rail 4 is used to allow the sliding mechanism 5 to slide. The sliding mechanism 5 is slidably connected to the top of the slide rail 4. The sliding mechanism 5 is used to adjust the horizontal position of the worktable 6.

[0031] refer to Figure 1 The sliding mechanism 5 is internally fixedly connected to the first telescopic mechanism 7, which also includes a telescopic rod. The worktable 6 is fixedly connected to the telescopic rod. The longitudinal position of the worktable 6 can be adjusted by extending and retracting the telescopic rod of the first telescopic mechanism 7. Both the sliding mechanism 5 and the first telescopic mechanism 7 are electrically controlled by the drive housing 12.

[0032] refer to Figure 1 and Figure 3 The worktable 6 is located at the top of the first telescopic mechanism 7. The wafers are processed and coated on the worktable 6. The worktable 6 is slidably connected to the first telescopic mechanism 7. The longitudinal position of the worktable 6 can be adjusted by telescopic rods of the first telescopic mechanism 7. The top of the worktable 6 is provided with multiple placement blocks 16. Before the equipment is started, the wafers to be coated need to be placed on the placement blocks 16 manually in one go.

[0033] refer to Figure 1 and Figure 3 The worktable 6 is equipped with multiple placement blocks 16, which can be used to place multiple wafers that need to be coated. This allows multiple wafers to be placed on the equipment for coating operations at the same time, eliminating the need for frequent wafer replacements and extensive manual operation, making it highly practical.

[0034] refer to Figure 3 The spacing between the multiple placement blocks 16 is consistent, which facilitates the accuracy of film application during the application process. The multiple placement blocks 16 are snapped together and fixed to the worktable 6, allowing the placement blocks 16 to be disassembled for maintenance or cleaning. Protective pads 17 are fixedly connected to the top of the multiple placement blocks 16. The protective pads 17 are made of soft insulating rubber, which protects the wafers while increasing the friction between the wafers and the contact surfaces.

[0035] refer to Figure 1The top of the base 1 is fixedly connected to a fixed bracket 11 on one side of the workbench 6. The fixed bracket is used to fix and limit the raw material turntable 8 and the fixed plate 10. Two fixed plates 10 are fixedly connected to the two ends of the fixed bracket 11 facing the workbench 6. The fixed plates 10 are used to limit and fix the turntable 9 and the drive mechanism. The drive mechanism can be connected to the fixed plate 10 by screw fixing.

[0036] refer to Figure 1 Two raw material turntables 8 are rotatably connected to the top two sides of the fixed bracket 11. The two raw material turntables 8 are located on the side facing the worktable 6. The two raw material turntables 8 are composed of a diaphragm 23 wound around it. Specifically, the raw material turntable 8 is composed of a rotatable round rod and a diaphragm 23. It is rotatably connected to the fixed bracket 11 through a rotatable round rod, and the diaphragm 23 is wound around the round rod.

[0037] refer to Figure 1 Multiple rotating wheels 9 are rotatably connected to the two fixed plates 10 facing the worktable 6. The diaphragm 23 is wound around the multiple rotating wheels 9, and the multiple rotating wheels 9 form a function similar to a fixed pulley. The diaphragm 23 is taut and wound around the rotating wheels 9. The diaphragm 23 is transported to the rotating turntable 14 through the rotating wheels 9. The rotating wheels 9 also have the function of limiting and fixing the diaphragm 23.

[0038] refer to Figure 2 Two drive housings 12 are fixedly connected to one side of the top of the base 1. The drive housing 12 is a PLC control housing, which controls other components through a preset program. The two drive housings 12 are located on the back of the two fixed plates 10. A rotating mechanism 13 is provided inside the two drive housings 12. The rotating mechanism 13 is located at the top of the base 1. The rotating mechanism 13 includes a motor and a rotating roller. The rotating roller is rotatably connected to the rotating turntable 14 through a belt. The rotating roller is rotated by the motor.

[0039] refer to Figure 2 The rotating mechanism 13 is rotatably connected to two rotating disks 14 on one side of the worktable 6. Multiple partition blocks 25 are provided at the edges of the two rotating disks 14. The diaphragm 23 is wound around the two rotating disks 14. Specifically, the diaphragm 23 contacts the top of the partition block 25. The contact surface between the outermost end of the output diaphragm 23 and the partition block 25 can be fixed by adhesive. The diaphragm 23 is straightened and bonded to the partition block 25.

[0040] refer to Figure 4Above the two rotating turntables 14, there is a lifting mechanism 20. The top of the two lifting mechanisms 20 is provided with lifting rods 21. The two lifting rods 21 pass through the lifting mechanism 20 and slide on the lifting rods 21 to lift and lower. The lifting mechanism 20 is driven to lift and lower by the drive housing 12. The bottom of the two lifting rods 21 is fixedly connected to a cutting head 22. The cutting head 22 is used to stick the cut film 23 on the separator block 25. The surface of the cutting head 22 is adhesive or the cutting head 22 is made adhesive by applying glue.

[0041] refer to Figure 4 Two rotating disks 14 are provided with a second telescopic mechanism 15 on one side facing the rotating mechanism 13. The two second telescopic mechanisms 15 are slidably connected to a connecting rod 18 at one end facing the two rotating disks 14. The connecting rod 18 can be driven to extend or retract through the second telescopic mechanism 15. The two connecting rods 18 are fixedly connected to a connecting mechanism 19 at one end facing the two rotating disks 14. The extension or retraction of the connecting rod 18 can synchronously drive the connecting mechanism to extend or retract.

[0042] refer to Figure 4 Two connecting mechanisms 19 are fixedly connected to one side of the two rotating turntables 14 with cutting blades 24. A cutting slit is provided between multiple partition blocks 25 for the cutting blades 24 to pass through. The connecting mechanisms 19 can extend and retract to allow the cutting blades 24 to extend and retract toward the partition blocks 25. The cutting blades 24 can cut the membrane 23 on the partition blocks 25 by passing through the cutting slit.

[0043] Furthermore, when the terms "first," "second," "third," etc., are used in this application specification to describe various features, these terms are only used to distinguish these features and should not be construed as indicating or implying the correlation or relative importance between features or implicitly indicating the number of features indicated.

[0044] In addition, this application specification describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or perspective views. Therefore, differences from the illustrated shapes are foreseeable due to factors such as manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but should include deviations in shape caused, for example, by manufacturing processes. Thus, the regions shown in the figures are substantially schematic, and their shapes are not intended to illustrate the actual shapes of the regions of the device, nor to limit the scope of the exemplary embodiments.

Claims

1. A semi-automatic wafer lamination device, comprising a base (1), characterized in that, Also includes: Support frame (3), the support frame (3) is located at the top of the base (1), the top of the support frame (3) is fixedly connected to a slide rail (4), the top of the slide rail (4) is slidably connected to a sliding mechanism (5), and the sliding mechanism (5) is fixedly connected to a first telescopic mechanism (7). A workbench (6) is located at the top of the first telescopic mechanism (7). The workbench (6) is slidably connected to the first telescopic mechanism (7). A plurality of placement blocks (16) are provided at the top of the workbench (6).

2. The semi-automatic wafer film pasting device according to claim 1, wherein The spacing between the multiple placement blocks (16) is consistent, the multiple placement blocks (16) and the worktable (6) are snapped together and fixed, and the top of the multiple placement blocks (16) is fixedly connected with a protective pad (17).

3. The semi-automatic wafer film pasting device according to claim 1, wherein The base (1) has four fixed corners at the bottom and legs (2). The top of the base (1) is fixedly connected to a fixed bracket (11) on one side of the workbench (6). The fixed bracket (11) has two fixed plates (10) fixedly connected to the two ends of the fixed bracket (11) facing the workbench (6).

4. The semi-automatic wafer lamination device according to claim 3, characterized in that, The fixed bracket (11) has two raw material turntables (8) rotatably connected to the top two sides. The two raw material turntables (8) are located on the side facing the worktable (6). The two raw material turntables (8) are composed of a diaphragm (23) wound together.

5. The semi-automatic wafer film pasting device according to claim 4, wherein Multiple rollers (9) are rotatably connected to the two fixed plates (10) on the side facing the worktable (6), and the diaphragm (23) is wound around the multiple rollers (9).

6. A semi-automatic wafer lamination device according to claim 5, characterized in that, Two drive housings (12) are fixedly connected to one side of the top of the base (1). The two drive housings (12) are located on the back of the two fixed plates (10). A rotating mechanism (13) is provided inside the two drive housings (12). The rotating mechanism (13) is located at the top of the base (1).

7. The semi-automatic wafer film pasting device according to claim 6, wherein The rotating mechanism (13) is rotatably connected to two rotating disks (14) on one side facing the worktable (6). Multiple partition blocks (25) are provided at the edges of the two rotating disks (14), and the diaphragm (23) is wound around the two rotating disks (14).

8. The semi-automatic wafer film pasting device according to claim 7, wherein, A lifting mechanism (20) is provided above the two rotating turntables (14), and a lifting rod (21) is provided at the top of the two lifting mechanisms (20). The two lifting rods (21) pass through the lifting mechanism (20), and a cutting head (22) is fixedly connected to the bottom of the two lifting rods (21).

9. The semi-automatic wafer film pasting device according to claim 8, wherein, A second telescopic mechanism (15) is provided on one side of the two rotating turntables (14) facing the rotating mechanism (13). A connecting rod (18) is slidably connected to one end of the two second telescopic mechanisms (15) facing the two rotating turntables (14). A connecting mechanism (19) is fixedly connected to one end of the two connecting rods (18) facing the two rotating turntables (14).

10. The semi-automatic wafer film pasting device according to claim 9, wherein Two of the connecting mechanisms (19) are fixedly connected to one side of the two rotating disks (14) with cutting blades (24), and a cutting slit is provided between the plurality of partition blocks (25) for the cutting blades (24) to pass through.

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