A clamping tool for semiconductor wafer transfer

Abstract

This utility model discloses a semiconductor wafer transfer clamping fixture, relating to the field of semiconductor wafer manufacturing technology. The utility model includes a mounting base, with a robotic arm fixedly mounted on the top of the mounting base. A mounting frame is fixedly connected to the end of the robotic arm, and an adsorption component is provided at the bottom of the mounting frame. An elastic support component is provided at the bottom of the adsorption component. This utility model uses a lifting component to move the adsorbed semiconductor wafer upwards to a predetermined height. The support end continuously resets under the elastic force of the elastic end, supporting and clamping the semiconductor wafer. In this configuration, because the support end can lift and support the semiconductor wafer, the force exerted when clamping the semiconductor wafer is effectively reduced, making it less likely for the edges of the semiconductor wafer to break or experience stress deformation. Furthermore, the semiconductor wafer will not fall during transfer.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor wafer manufacturing technology, and specifically relates to a semiconductor wafer transfer clamping fixture. Background Technology

[0002] In the semiconductor wafer manufacturing process, semiconductor wafers need to undergo multiple processes such as photolithography, etching, deposition, and doping. Because the wafers themselves are relatively brittle, in order to ensure the continuity of processing while maintaining their quality, specialized transfer and clamping fixtures are needed to hold the semiconductor wafers, thereby enabling the safe and stable transfer of semiconductor wafers between various processes.

[0003] Currently, the main clamping methods for transporting semiconductor wafers are mechanical grippers and adsorption trays. When transporting semiconductor wafers using grippers, if the gripping force is too large, the edges of the semiconductor wafer are prone to breakage or stress deformation. If the gripping force is too small, the semiconductor wafer is prone to loosening and falling off during transport. When transporting semiconductor wafers using adsorption trays, the adsorption effect of the adsorption tray depends on its seal with the wafer surface. If there are tiny particles, scratches, or pits on the wafer surface, air leakage can occur through the pores of the adsorption tray. In this case, it is difficult to maintain the negative pressure of the adsorption tray, resulting in the semiconductor wafer falling off due to unstable adsorption. Utility Model Content

[0004] To address the problem of semiconductor wafers easily detaching during transport, this invention proposes a clamping fixture for semiconductor wafer transfer, thereby overcoming the aforementioned technical problems in existing related technologies.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model is a semiconductor wafer transfer clamping fixture, including a mounting base, a robotic arm fixedly mounted on the top of the mounting base, a mounting frame fixedly connected to the end of the robotic arm, an adsorption component at the bottom of the mounting frame, an elastic support component at the bottom of the adsorption component, a squeezing component between the adsorption component and the elastic support component, and a lifting component at the bottom of the mounting frame, the lifting component being poweredly connected to the adsorption component.

[0007] After the semiconductor wafer is adsorbed by the adsorption end of the adsorption component, the lifting component moves the semiconductor wafer upward through the adsorption end. At the same time, the squeezing component moves upward continuously under the action of the adsorption end, so that the support end of the elastic support component is constantly reset under the elastic force of the elastic end. When the semiconductor wafer moves to a predetermined height, the support end completes the support and clamping of the semiconductor wafer.

[0008] Furthermore, the adsorption assembly includes a connecting frame, which is fixedly installed at the bottom of the mounting frame. A fixing ring is fixedly installed at the bottom of the connecting frame. A lifting tube is movably connected inside the fixing ring. An adsorption plate is fixedly connected to the bottom end of the lifting tube. A vacuum pump is fixedly installed on the outer surface of the robotic arm. A connecting tube is fixedly connected between the vacuum pump and the lifting tube.

[0009] Furthermore, the elastic support assembly includes a fixing plate, and several fixing plates are arranged in a circular array at the bottom of the fixing ring. Each fixing plate is fixedly connected to the fixing ring. A guide rod is fixedly connected to one side of the fixing plate, and a U-shaped support plate is movably connected to the outer surface of the guide rod. The top of the inner wall of the U-shaped support plate is in contact with the top of the fixing ring.

[0010] Furthermore, a connecting plate is fixedly connected to one end of the guide rod, and a spring is fixedly connected between the connecting plate and the U-shaped support plate.

[0011] Furthermore, the extrusion assembly includes an extrusion plate, which is fixedly connected to the top of the U-shaped support plate. One side of the extrusion plate is inclined, and an extrusion rod is fixedly connected to the outer surface of the lifting tube corresponding to the extrusion plate.

[0012] Furthermore, an extrusion groove is provided on one side of the extrusion plate, the extrusion rod is movably connected to the extrusion groove, and a ball bearing is rotatably connected to one end of the extrusion rod.

[0013] Furthermore, the lifting assembly includes a threaded cylinder, which is fixedly connected to the top of the inner wall of the lifting pipe. A lifting threaded rod is threadedly connected inside the threaded cylinder. The top end of the lifting threaded rod passes through the connecting frame and the mounting frame. A lifting motor is fixedly installed inside the mounting frame, and the output end of the lifting motor is fixedly connected to the lifting threaded rod.

[0014] This utility model has the following beneficial effects:

[0015] 1. This utility model uses a lifting component to move the adsorbed semiconductor wafer upwards. As the adsorbed end moves upwards, the squeezing force of the squeezing component on the elastic support component decreases, causing the support end to continuously reset under the elastic force of the elastic end. When the semiconductor wafer moves to the predetermined position, the support end can support and clamp the semiconductor wafer. In the above configuration, since the support end can lift and support the semiconductor wafer, the force when the support end clamps the semiconductor wafer is effectively reduced, making it less likely for the edge of the semiconductor wafer to break or be stress-deformed. At the same time, the semiconductor wafer will not fall off during the transfer process.

[0016] 2. This utility model uses a lifting motor to drive the lifting threaded rod, and when the lifting threaded rod moves the lifting tube downward through the threaded cylinder, the extrusion rod on the surface of the lifting tube can extrude the extrusion plate outward through the extrusion groove. The above arrangement ensures that when the lifting tube adsorbs the semiconductor wafer through the adsorption plate and moves upward, the several C-shaped support plates will not obstruct it. At the same time, when the semiconductor wafer moves to the predetermined height, the semiconductor wafer can be placed inside the several C-shaped support plates, thereby allowing the several C-shaped support plates to support and clamp the semiconductor wafer.

[0017] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the utility model embodiments, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the external outline structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the adsorption component structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the elastic support component structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the lifting pipe structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the extrusion assembly structure of this utility model;

[0024] Figure 6This is a schematic diagram of the extrusion plate structure of this utility model;

[0025] Figure 7 This is a schematic diagram of the extrusion rod structure of this utility model;

[0026] Figure 8 This is a schematic diagram of the lifting component structure of this utility model.

[0027] The attached diagram lists the components represented by each number as follows:

[0028] 1. Mounting base; 2. Robotic arm; 3. Mounting frame; 4. Adsorption assembly; 401. Connecting frame; 402. Fixing ring; 403. Lifting pipe; 404. Adsorption plate; 405. Vacuum pump; 406. Connecting pipe; 5. Elastic support assembly; 501. Fixing plate; 502. Guide rod; 503. C-shaped support plate; 504. Connecting plate; 505. Spring; 6. Extrusion assembly; 601. Extrusion plate; 602. Extrusion rod; 603. Extrusion groove; 604. Ball bearing; 7. Lifting assembly; 701. Threaded cylinder; 702. Lifting threaded rod; 703. Lifting motor. Detailed Implementation

[0029] The technical solutions of the utility model embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the utility model.

[0030] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "top", "middle", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0031] Please see Figures 1-8 As shown, this utility model is a semiconductor wafer transfer clamping fixture, including a mounting base 1, a robotic arm 2 fixedly mounted on the top of the mounting base 1, a mounting frame 3 fixedly connected to the end of the robotic arm 2, an adsorption component 4 provided at the bottom of the mounting frame 3, an elastic support component 5 provided at the bottom of the adsorption component 4, a squeezing component 6 provided between the adsorption component 4 and the elastic support component 5, and a lifting component 7 provided at the bottom of the mounting frame 3, the lifting component 7 being poweredly connected to the adsorption component 4;

[0032] After the semiconductor wafer is adsorbed by the adsorption end of the adsorption component 4, the lifting component 7 drives the semiconductor wafer to move upward through the adsorption end. At the same time, the squeezing component 6 moves upward continuously under the drive of the adsorption end, so that the support end of the elastic support component 5 is continuously reset under the elastic force of the elastic end. When the semiconductor wafer moves to a predetermined height, the support end completes the support and clamping of the semiconductor wafer.

[0033] The robotic arm 2 is installed in a suitable position using mounting base 1. When transferring the semiconductor wafer, the robotic arm 2 can move the adsorption component 4 to the top of the semiconductor wafer, where the adsorption end is vertically perpendicular to the wafer. Then, the lifting component 7 moves the adsorption end downward, while the adsorption end continuously moves the elastic support component 5 through the squeezing component 6, causing the support end of the elastic support component 5 to continuously expand outward. After the adsorption end contacts and adsorbs the semiconductor wafer, the lifting component 7 moves the semiconductor wafer through the adsorption end, while the support end continuously resets under the elastic force of the spring end. When the semiconductor wafer reaches a predetermined height, the support end can move to the bottom of the semiconductor wafer, where it can support and clamp the wafer. Finally, the robotic arm 2 begins to transfer the semiconductor wafer.

[0034] The lifting component 7 causes the adsorption end to move the adsorbed semiconductor wafer upward. As the adsorption end moves upward, the squeezing component 6 continuously reduces the squeezing force on the elastic support component 5, thereby causing the support end to continuously reset under the elastic force of the elastic end. When the semiconductor wafer moves to the predetermined position, the support end can support and clamp the semiconductor wafer. In the above configuration, since the support end can lift and support the semiconductor wafer, the force when the support end clamps the semiconductor wafer is effectively reduced, so that the edge of the semiconductor wafer is not easy to break or be stress-deformed. At the same time, the semiconductor wafer will not fall off during the transfer process.

[0035] In addition, in specific applications, when the robotic arm 2 moves the adsorption end to the top of the semiconductor wafer, it mainly relies on the vision recognition system to complete the task.

[0036] In one embodiment, the adsorption component 4 includes a connecting frame 401, which is fixedly installed at the bottom of the mounting frame 3. A fixing ring 402 is fixedly installed at the bottom of the connecting frame 401. A lifting tube 403 is movably connected inside the fixing ring 402. An adsorption plate 404 is fixedly connected to the bottom end of the lifting tube 403. A vacuum pump 405 is fixedly installed on the outer surface of the robotic arm 2. A connecting pipe 406 is fixedly connected between the vacuum pump 405 and the lifting tube 403.

[0037] When the robotic arm 2 moves the suction plate 404 at the bottom of the lifting tube 403 to the upper side of the semiconductor wafer to be adsorbed via the mounting frame 3, connecting frame 401, and fixing ring 402, the lifting tube 403 can move inside the fixing ring 402. When the suction plate 404 comes into contact with the top of the semiconductor wafer, the vacuum pump 405 extracts the air inside the lifting tube 403 through the connecting pipe 406, thereby creating a negative pressure inside the lifting tube 403. At the same time, the suction plate 404 can adsorb the semiconductor wafer. The lifting suction plate 404 is designed to separate the semiconductor wafer from the tray, so that the subsequent elastic support component 5 can lift, support, and clamp the semiconductor wafer. Since the distance that the suction plate 404 moves the semiconductor wafer is not too far, the semiconductor wafer is less likely to fall off due to unstable adsorption by the suction plate 404.

[0038] In one embodiment, the elastic support component 5 includes a fixing plate 501. Several fixing plates 501 are arranged in a circular array around the bottom of the fixing ring 402. The fixing plates 501 are all fixedly connected to the fixing ring 402. A guide rod 502 is fixedly connected to one side of the fixing plate 501. A U-shaped support plate 503 is movably connected to the outer surface of the guide rod 502. The top of the inner wall of the U-shaped support plate 503 is in contact with the top of the fixing ring 402.

[0039] When the lifting tube 403 moves downward, it can squeeze several C-shaped support plates 503 through the extrusion component 6, thereby causing the C-shaped support plates 503 to continuously expand outward. During this process, the guide rod 502 can guide the C-shaped support plates 503, thus ensuring the stability of the C-shaped support plates 503 during movement. The above configuration allows the lifting tube 403 to normally drive the semiconductor wafer upward after it is adsorbed by the adsorption plate 404, and move the semiconductor wafer into the interior of the C-shaped support plates 503.

[0040] In one embodiment, for the guide rod 502, one end of the guide rod 502 is fixedly connected to a connecting plate 504, and a spring 505 is fixedly connected between the connecting plate 504 and the U-shaped support plate 503.

[0041] When the lifting tube 403 moves upward, the squeezing force of the extrusion assembly 6 on the C-shaped support plate 503 will continuously decrease. At this time, the spring 505 can push the C-shaped support plate 503, so that the C-shaped support plate 503 can continuously reset. When the semiconductor wafer rises to the predetermined height, the C-shaped support plate 503 can move to the bottom of the semiconductor wafer under the push of the spring 505 and support and clamp it.

[0042] In one embodiment, the extrusion assembly 6 includes an extrusion plate 601, which is fixedly connected to the top of the U-shaped support plate 503. One side of the extrusion plate 601 is inclined, and an extrusion rod 602 is fixedly connected to the outer surface of the lifting tube 403 corresponding to the extrusion plate 601.

[0043] When the lifting tube 403 moves downward, it can drive the pressing rod 602 to move downward synchronously. At this time, the pressing rod 602 presses the pressing plate 601 through the pressing plate 601, which is set at an angle, so that the U-shaped support plate 503 moves outward continuously under the action of the pressing plate 601.

[0044] In one embodiment, for the extrusion plate 601, an extrusion groove 603 is provided on one side of the extrusion plate 601, the extrusion rod 602 is movably connected to the extrusion groove 603, and a ball bearing 604 is rotatably connected to one end of the extrusion rod 602.

[0045] The extrusion rod 602 can move inside the extrusion groove 603. This arrangement allows the extrusion plate 601 to guide the lifting tube 403 through the extrusion groove 603 and the extrusion rod 602, thereby ensuring the overall stability of the lifting tube 403 during lifting. At the same time, when the extrusion rod 602 extrudes the extrusion plate 601 through the extrusion groove 603, the ball bearings 604 can roll inside the extrusion groove 603 under the drive of the extrusion rod 602. The arrangement of the ball bearings 604 reduces the friction between the extrusion rod 602 and the extrusion groove 603, thereby preventing the extrusion rod 602 from wearing due to friction.

[0046] In one embodiment, the lifting assembly 7 includes a threaded cylinder 701, which is fixedly connected to the top of the inner wall of the lifting tube 403. A lifting threaded rod 702 is threadedly connected inside the threaded cylinder 701. The top end of the lifting threaded rod 702 passes through the connecting frame 401 and the mounting frame 3. A lifting motor 703 is fixedly installed inside the mounting frame 3. The output end of the lifting motor 703 is fixedly connected to the lifting threaded rod 702.

[0047] When the lifting tube 403 moves downward, the lifting motor 703 drives the lifting threaded rod 702. At this time, the extrusion rod 602 guides the lifting tube 403 through the extrusion groove 603, so that the rotating lifting threaded rod 702 drives the lifting tube 403 to move downward through the threaded cylinder 701, and the adsorption plate 404 at the bottom of the lifting tube 403 can normally contact the top of the semiconductor wafer.

[0048] Through the above technical solution, 1. The lifting component 7 causes the adsorption end to move upward, and as the adsorption end moves upward, the squeezing component 6 continuously reduces the squeezing force on the elastic support component 5, thereby causing the support end to continuously reset under the elastic force of the elastic end. When the semiconductor wafer moves to the predetermined position, the support end can support and clamp the semiconductor wafer. In the above setting, since the support end can lift and support the semiconductor wafer, the force when the support end clamps the semiconductor wafer is effectively reduced, so that the edge of the semiconductor wafer is not easy to break or be stress-deformed. At the same time, the semiconductor wafer will not be damaged during the transfer process. 1. The phenomenon of falling; 2. The lifting screw rod 702 is driven by the lifting motor 703, and when the lifting screw rod 702 moves the lifting tube 403 downward through the screw cylinder 701, the extrusion rod 602 on the surface of the lifting tube 403 can extrude the extrusion plate 601 outward through the extrusion groove 603; The above arrangement makes it so that when the lifting tube 403 completes the adsorption of the semiconductor wafer through the adsorption plate 404 and moves upward, the several C-shaped support plates 503 will not obstruct it. At the same time, when the semiconductor wafer moves to the predetermined height, the semiconductor wafer can be placed inside the several C-shaped support plates 503, so that the several C-shaped support plates 503 support and clamp the semiconductor wafer.

[0049] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0050] The preferred embodiments of the utility model disclosed above are merely illustrative of the utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the utility model, thereby enabling those skilled in the art to better understand and utilize it. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor wafer transfer clamping fixture, comprising a mounting base (1), characterized in that, A robotic arm (2) is fixedly mounted on the top of the mounting base (1), and a mounting frame (3) is fixedly connected to the end of the robotic arm (2). An adsorption component (4) is provided at the bottom of the mounting frame (3), and an elastic support component (5) is provided at the bottom of the adsorption component (4). A squeezing component (6) is provided between the adsorption component (4) and the elastic support component (5). A lifting component (7) is provided at the bottom of the mounting frame (3), and the lifting component (7) is poweredly connected to the adsorption component (4). After the adsorption of the semiconductor wafer is completed by the adsorption end of the adsorption component (4), the lifting component (7) drives the semiconductor wafer to move upward through the adsorption end. At the same time, the squeezing component (6) moves upward continuously under the drive of the adsorption end, so that the support end of the elastic support component (5) is continuously reset under the elastic force of the elastic end. When the semiconductor wafer moves to a predetermined height, the support end completes the support and clamping of the semiconductor wafer.

2. The semiconductor wafer transfer clamping fixture according to claim 1, characterized in that, The adsorption assembly (4) includes a connecting frame (401), which is fixedly installed at the bottom of the mounting frame (3). A fixing ring (402) is fixedly installed at the bottom of the connecting frame (401). A lifting tube (403) is movably connected inside the fixing ring (402). An adsorption plate (404) is fixedly connected to the bottom end of the lifting tube (403). A vacuum pump (405) is fixedly installed on the outer surface of the robotic arm (2). A connecting tube (406) is fixedly connected between the vacuum pump (405) and the lifting tube (403).

3. The semiconductor wafer transfer clamping fixture according to claim 2, characterized in that, The elastic support assembly (5) includes a fixing plate (501). Several fixing plates (501) are arranged in a circular array at the bottom of the fixing ring (402). Several fixing plates (501) are fixedly connected to the fixing ring (402). A guide rod (502) is fixedly connected to one side of the fixing plate (501). A U-shaped support plate (503) is movably connected to the outer surface of the guide rod (502). The top of the inner wall of the U-shaped support plate (503) is in contact with the top of the fixing ring (402).

4. The semiconductor wafer transfer clamping fixture according to claim 3, characterized in that, One end of the guide rod (502) is fixedly connected to a connecting plate (504), and a spring (505) is fixedly connected between the connecting plate (504) and the U-shaped support plate (503).

5. A semiconductor wafer transfer clamping fixture according to claim 3, characterized in that, The extrusion assembly (6) includes an extrusion plate (601), which is fixedly connected to the top of the U-shaped support plate (503). One side of the extrusion plate (601) is inclined, and an extrusion rod (602) is fixedly connected to the outer surface of the lifting tube (403) corresponding to the extrusion plate (601).

6. A semiconductor wafer transfer clamping fixture according to claim 5, characterized in that, An extrusion groove (603) is provided on one side of the extrusion plate (601), and the extrusion rod (602) is movably connected to the extrusion groove (603). A ball bearing (604) is rotatably connected to one end of the extrusion rod (602).

7. A semiconductor wafer transfer clamping fixture according to claim 2, characterized in that, The lifting assembly (7) includes a threaded cylinder (701), which is fixedly connected to the top of the inner wall of the lifting tube (403). The threaded cylinder (701) is internally threaded with a lifting threaded rod (702). The top end of the lifting threaded rod (702) passes through the connecting frame (401) and the mounting frame (3). The mounting frame (3) is internally fixedly installed with a lifting motor (703), and the output end of the lifting motor (703) is fixedly connected to the lifting threaded rod (702).

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