Wafer detection device with composite rotary lifting structure

Abstract

The utility model provides a kind of wafer detection equipment with composite rotary lifting structure, the equipment includes external support component, internal support component, transverse transfer component, rotary lifting component, wafer carrier component and scanning detection component, the wafer detection equipment adopts rotary motor to drive rotary inner cylinder by gear transmission structure to drive spline cylinder rotation, while lifting motor drives lifting connecting plate by screw nut pair to drive support core tube lifting, realize composite motion, transverse stage is guided by crossed roller guide rail and is driven by linear motor, cooperate grating ruler to realize accurate movement;Carrier suction cup is fixed wafer by vacuum adsorption, complete composite motion with support core tube;Detection probe in scanning support detects wafer passing through scanning gap, with high motion precision, detection covers full, strong adaptability, stable operation and the like.

Description

Technical Field

[0001] This utility model relates to integrated circuit manufacturing technology, and in particular to a wafer inspection device with a composite rotary lifting structure. Background Technology

[0002] Patent document CN117451733A discloses a wafer inspection device, which is equipped with a clamping device that can be adjusted horizontally and vertically. After adjusting the position, it can be easily moved to the bottom of the wafer inspection head for inspection. The clamping device is equipped with movable wafer chucks and clamping mechanisms, which can adapt to wafers of different sizes. Pressure sensors and position sensors are set on the clamping mechanism, so that the wafer can be clamped more accurately, improving the accuracy of wafer inspection. A light source is set at the wafer inspection position, which greatly improves the image imaging effect. In addition, by setting up an air float and air float ring with an air float module, the wafers of different sizes and the wafer parallel angle can be adjusted respectively, and multiple wafer chucks and clamping mechanisms can move synchronously together. Utility Model Content

[0003] The purpose of this invention is to provide a wafer inspection device with a composite rotary lifting structure.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A wafer inspection device with a composite rotary lifting structure, comprising:

[0006] An external support assembly having an external assembly space;

[0007] An internal support assembly, which is installed within an external support assembly and has internal assembly space;

[0008] A lateral transfer assembly, which is installed in an internal support assembly via a guide structure, can move laterally within the internal support assembly, and has a load-bearing space inside;

[0009] A rotary lifting assembly is installed in a transverse transfer assembly. It can move laterally together with the transverse transfer assembly and can rotate and lift vertically independently within the transverse transfer assembly.

[0010] A wafer carrier assembly is installed in a rotary lifting assembly, can move together with the rotary lifting assembly, and can position and carry the wafer to be tested.

[0011] The scanning and detection component is installed in the external support component and corresponds to the position of the wafer carrier component. The transverse transfer component and the rotating lifting component move the wafer carrier component and the wafer it carries closer to or away from the scanning and detection component, and the scanning and detection component detects it.

[0012] Specifically, the external support components include:

[0013] The outer frame is formed by enclosing plates and rods, and has a clearance opening at the top. The clearance opening is long and vertical, running through the inner and outer sides of the outer frame and is adapted to the shape of the wafer carrier assembly. Its length direction is consistent with the moving direction of the transverse transfer assembly, so that the wafer carrier assembly can move in the clearance opening. The top surface of the outer frame has a positioning recess for placing wafers. The positioning recess is located at the edge of the clearance opening, and the wafer carrier assembly can carry the wafer in the positioning recess to move.

[0014] Internal support components include:

[0015] An internal frame, which is formed by enclosing panels, is installed inside the external frame and corresponds to the position of the clearance opening. Lateral transfer components are installed in the internal frame.

[0016] Lateral transfer components include:

[0017] A transverse platform is located within the internal frame. Both ends of the platform are connected to the internal frame via transverse guide rails, allowing it to move along these rails within the frame. The transverse guide rails are parallel to the length of the clearance opening. One end of the platform is connected to the internal frame via a linear motor, and the other end via a grating ruler. Both the linear motor and the grating ruler are parallel to the transverse guide rails. The linear motor drives the platform to move, while the grating ruler monitors the movement and feeds the data back to the linear motor, providing soft limits for the platform's movement.

[0018] In one embodiment of this utility model, each transverse guide rail is composed of a pair of mutually parallel crossed roller guide rails.

[0019] The rotating lifting assembly includes:

[0020] A rotating outer cylinder is installed in a transverse platform and arranged vertically, and can move together with the transverse platform.

[0021] A rotating inner cylinder is mounted in a rotating outer cylinder via bearings and can rotate within the rotating outer cylinder. Splined cylinders are installed at both ends of the inner cylinder.

[0022] A rotary motor is installed in a transverse platform and can move with the transverse platform and operate in the transverse platform. Its power output shaft is connected to the rotating inner cylinder through a gear transmission structure, and the rotary motor drives the rotating inner cylinder to rotate.

[0023] The support core tube passes through both ends of the rotating inner cylinder. Its outer wall is provided with a spline groove. The rotating inner cylinder cooperates with the support core tube through the spline tube, so that the support core tube can rotate together with the rotating inner cylinder and can rise or fall independently in the rotating inner cylinder.

[0024] A lifting motor is installed in the horizontal platform, which can move together with the horizontal platform and operate in the horizontal platform;

[0025] The lifting connecting plate has one end connected to the power output shaft of the lifting motor via a screw and nut pair, and the other end connected to the bottom of the support core tube via a bearing. The lifting motor drives the lifting connecting plate to rise or fall, and the support core tube rises or falls accordingly.

[0026] Wafer carrier components include:

[0027] The carrier suction cup is installed on the top of the support core tube and can rise, fall and rotate together with the support core tube. It is connected to the vacuum equipment through the pipeline and can carry and position the wafer.

[0028] The scanning and detection components include:

[0029] The scanning support is installed on the top of the outer frame, perpendicular to the clearance opening and spanning across the clearance opening. The scanning support has a scanning slot that runs horizontally through both sides of the scanning support and is adapted to the shape of the wafer. The wafer carried by the carrier chuck can move in the scanning slot.

[0030] The detection probe consists of a pair, each installed in the scanning support and positioned above and below the scanning aperture. The detection probes are used to inspect the wafer carried by the carrier chuck.

[0031] In one embodiment of this invention, the detection probe is a high-precision capacitive sensor.

[0032] The advantages of this utility model are:

[0033] This wafer inspection equipment employs a splined cylinder and a support core tube with a combined structure to achieve independent control of rotation and lifting movements, avoiding motion interference. It achieves comprehensive wafer inspection through a two-stage inspection method combining a detection probe with helical scanning and oscillation compensation. A rotary motor drives the inner rotating cylinder via a gear transmission structure, causing the splined cylinder to rotate. Simultaneously, a lifting motor drives a lifting connecting plate via a lead screw and nut pair, causing the support core tube to rise and fall, achieving a composite motion. The transverse stage is guided by cross roller guides and driven by a linear motor, with precise movement achieved in conjunction with a grating ruler. The support chuck fixes the wafer through vacuum adsorption, completing the composite motion with the support core tube. The detection probe in the scanning support inspects the wafer passing through the scanning gap, offering advantages such as high motion accuracy, comprehensive inspection coverage, strong adaptability, and stable operation. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the external structure of the wafer inspection equipment with a composite rotary lifting structure proposed in this utility model;

[0035] Figure 2 This is one of the schematic diagrams of the internal structure of the wafer inspection equipment;

[0036] Figure 3 This is the second schematic diagram of the internal structure of the wafer inspection equipment;

[0037] Figure 4 This is the third schematic diagram of the internal structure of the wafer inspection equipment;

[0038] Figure 5 This is the fourth schematic diagram of the internal structure of the wafer inspection equipment;

[0039] Figure 6 This is the fifth schematic diagram of the internal structure of the wafer inspection equipment;

[0040] Figure 7 This is the sixth schematic diagram of the internal structure of the wafer inspection equipment. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0042] like Figures 1 to 7 As shown, the wafer inspection equipment with a composite rotary lifting structure proposed in this utility model includes an external support assembly, an internal support assembly, a lateral transfer assembly, a rotary lifting assembly, a wafer carrier assembly, and a scanning inspection assembly. The external support assembly has an external assembly space, the internal support assembly is installed in the external support assembly and has an internal assembly space, the lateral transfer assembly is installed in the internal support assembly through a guide structure and can move laterally in the internal support assembly, and has a bearing space inside, the rotary lifting assembly is installed in the lateral transfer assembly and can move laterally with the lateral transfer assembly, and can rotate independently and move vertically in the lateral transfer assembly, the wafer carrier assembly is installed in the rotary lifting assembly and can move with the rotary lifting assembly, and can carry and position the wafer to be inspected, the scanning inspection assembly is installed in the external support assembly and corresponds to the position of the wafer carrier assembly, the lateral transfer assembly and the rotary lifting assembly drive the wafer carrier assembly and the wafer it carries to approach or move away from the scanning inspection assembly, and the scanning inspection assembly inspects it.

[0043] In this embodiment, the external support component includes an external frame 100, which is formed by enclosing plates and rods. A clearance opening 110 is provided on the top of the external frame. The clearance opening is elongated and extends vertically through the inner and outer sides of the external frame. It is adapted to the shape of the wafer carrier assembly. Its length direction is consistent with the moving direction of the transverse transfer assembly, so that the wafer carrier assembly can move in the clearance opening. A positioning recess 120 for placing wafers is provided on the top surface of the external frame. The positioning recess is located at the edge of the clearance opening, and the wafer carrier assembly can carry the wafer in the positioning recess to move.

[0044] The internal support components include an internal frame 200, which is formed by enclosing plates and is installed inside the external frame, corresponding to the position of the clearance opening. The lateral transfer components are installed in the internal frame.

[0045] The lateral transfer assembly includes a lateral platform 300, which is located in the inner frame. Both ends of the lateral platform are connected to the inner frame via lateral guide rails, allowing it to move along the lateral guide rails within the inner frame. The lateral guide rails are parallel to the length direction of the clearance opening. One end of the lateral platform is connected to the inner frame via a linear motor, and the other end is connected to the inner frame via a grating ruler. The linear motor and the grating ruler are parallel to the lateral guide rails. The linear motor drives the lateral platform to move, while the grating ruler monitors the movement of the lateral platform and feeds the data back to the linear motor, providing soft limits for the movement of the lateral platform.

[0046] In this embodiment, each transverse guide rail is composed of a pair of parallel cross roller guide rails.

[0047] The rotary lifting assembly includes a rotary outer cylinder 410, a rotary inner cylinder 420, a rotary motor 430, a support core tube 440, a lifting motor 450, and a lifting connecting plate 460. The rotary outer cylinder is installed in a transverse platform and arranged vertically, and can move together with the transverse platform. The rotary inner cylinder is installed in the rotary outer cylinder through bearings and can rotate within the rotary outer cylinder. Splined cylinders are installed at both ends of the inner cylinder. The rotary motor is installed in the transverse platform and can move together with the transverse platform and operate within the transverse platform. Its power output shaft is engaged with the rotary inner cylinder through a gear transmission structure, and the rotary motor drives the rotary inner cylinder. The rotating inner cylinder has a support core tube that passes through both ends of the rotating inner cylinder. Its outer wall has a spline groove 441. The rotating inner cylinder is connected to the support core tube through a spline tube 421, so that the support core tube can rotate with the rotating inner cylinder and can rise or fall independently in the rotating inner cylinder. The lifting motor is installed in the transverse platform and can move with the transverse platform and can operate in the transverse platform. One end of the lifting connecting plate is connected to the power output shaft of the lifting motor through a screw and nut pair, and the other end is connected to the bottom of the support core tube through a bearing. The lifting motor drives the lifting connecting plate to rise or fall, and the support core tube rises or falls with it.

[0048] The wafer carrier assembly includes a carrier chuck 500, which is mounted on the top of the support core tube and can rise, fall and rotate together with the support core tube. It is connected to a vacuum device through a pipeline and can carry and position the wafer.

[0049] The scanning and inspection assembly includes a scanning support 610 and an inspection probe 620. The scanning support is installed on the top of the outer frame, perpendicular to the clearance opening and spanning across the clearance opening. A scanning slot 611 is provided in the scanning support, which extends laterally through both sides of the scanning support and is adapted to the shape of the wafer. The wafer carried by the carrier chuck can move in the scanning slot. A pair of inspection probes are provided, each of which is installed in the scanning support and arranged on the upper and lower sides of the scanning slot. The inspection probes inspect the wafer carried by the carrier chuck.

[0050] In this embodiment, a high-precision capacitive sensor is used as the detection probe.

[0051] The method for wafer inspection using the aforementioned wafer inspection equipment includes the following steps:

[0052] (1) Place the wafer to be tested in the positioning recess of the external support assembly, ensuring that the wafer is concentric with the positioning recess;

[0053] (2) The lifting motor of the control rotation lifting assembly drives the support core tube to rise, so that the carrier suction cup of the wafer carrier assembly contacts the wafer and vacuum adsorbs it.

[0054] (3) The linear motor of the transverse transfer component drives the transverse stage to move so that the edge of the wafer is aligned with the detection probe of the scanning detection component. At the same time, the rotary motor of the rotary lifting component is started to drive the support core tube and the wafer to rotate at a constant speed through the spline cylinder. Simultaneously, the linear motor is controlled to push the transverse stage so that the wafer passes through the scanning gap in a spiral motion trajectory. The upper and lower detection probes complete the detection of the outer area. The grating ruler of the transverse transfer component monitors the position of the transverse stage in real time and adjusts the operation of the linear motor through closed-loop control.

[0055] (4) When the spiral scan detects an area not covered by the center of the wafer, the horizontal stage is controlled to return to the initial position, the carrier suction cup releases the wafer, the lifting motor drives the support core tube to descend, the horizontal stage moves in the opposite direction to the preset position, and the carrier suction cup re-adsorbs the wafer and rises.

[0056] (5) Control the rotary motor to switch to reciprocating swing mode so that the wafer swings left and right in the scanning gap, while controlling the linear motor to slowly advance so that the detection probe performs swing scanning on the central area of ​​the wafer. The swing angle and frequency of the wafer are precisely controlled by the rotary motor.

[0057] (6) After the test is completed, the horizontal stage is reset to the initial position, the wafer is released by the carrier suction cup, and the wafer is taken away by the external robotic arm to complete the test process.

[0058] In the description of this utility model, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," and "right" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this utility model is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A wafer inspection device with a composite rotary lifting structure, characterized in that, include: An external support assembly having an external assembly space; An internal support assembly, which is installed within an external support assembly and has internal assembly space; A lateral transfer assembly, which is installed in an internal support assembly via a guide structure, can move laterally within the internal support assembly, and has a load-bearing space inside; A rotary lifting assembly is installed in a transverse transfer assembly. It can move laterally together with the transverse transfer assembly and can rotate and lift vertically independently within the transverse transfer assembly. A wafer carrier assembly is installed in a rotary lifting assembly, can move together with the rotary lifting assembly, and can position and carry the wafer to be tested. The scanning and detection component is installed in the external support component and corresponds to the position of the wafer carrier component. The transverse transfer component and the rotating lifting component move the wafer carrier component and the wafer it carries closer to or away from the scanning and detection component, and the scanning and detection component detects it.

2. The wafer inspection apparatus having a combined rotary-lifting structure according to claim 1, wherein External support components include: The outer frame is formed by enclosing plates and rods, and has a clearance opening at the top. The clearance opening is long and vertical, running through the inner and outer sides of the outer frame and is adapted to the shape of the wafer carrier assembly. Its length direction is consistent with the moving direction of the transverse transfer assembly, so that the wafer carrier assembly can move in the clearance opening. The top surface of the outer frame has a positioning recess for placing wafers. The positioning recess is located at the edge of the clearance opening, and the wafer carrier assembly can carry the wafer in the positioning recess to move.

3. The wafer inspection apparatus having a combined rotary-lifting structure according to claim 2, wherein Internal support components include: An internal frame, which is formed by enclosing panels, is installed inside the external frame and corresponds to the position of the clearance opening. Lateral transfer components are installed in the internal frame.

4. The wafer inspection apparatus having a combined rotary-lifting structure according to claim 3, wherein Lateral transfer components include: A transverse platform is located within the internal frame. Both ends of the platform are connected to the internal frame via transverse guide rails, allowing it to move along these rails within the frame. The transverse guide rails are parallel to the length of the clearance opening. One end of the platform is connected to the internal frame via a linear motor, and the other end via a grating ruler. Both the linear motor and the grating ruler are parallel to the transverse guide rails. The linear motor drives the platform to move, while the grating ruler monitors the movement and feeds the data back to the linear motor, providing soft limits for the platform's movement.

5. The wafer inspection apparatus having a combined rotary-lifting structure according to claim 4, wherein The rotating lifting assembly includes: A rotating outer cylinder is installed in a transverse platform and arranged vertically, and can move together with the transverse platform; A rotating inner cylinder is mounted in a rotating outer cylinder via bearings and can rotate within the rotating outer cylinder. Splined cylinders are installed at both ends of the inner cylinder. A rotary motor is installed in a transverse platform and can move with the transverse platform and operate in the transverse platform. Its power output shaft is connected to the rotating inner cylinder through a gear transmission structure, and the rotary motor drives the rotating inner cylinder to rotate. The support core tube passes through both ends of the rotating inner cylinder. Its outer wall is provided with a spline groove. The rotating inner cylinder cooperates with the support core tube through the spline tube, so that the support core tube can rotate together with the rotating inner cylinder and can rise or fall independently in the rotating inner cylinder. A lifting motor is installed in the horizontal platform, which can move together with the horizontal platform and operate in the horizontal platform; The lifting connecting plate has one end connected to the power output shaft of the lifting motor via a screw and nut pair, and the other end connected to the bottom of the support core tube via a bearing. The lifting motor drives the lifting connecting plate to rise or fall, and the support core tube rises or falls accordingly.

6. The wafer inspection apparatus having a combined rotary-lifting structure according to claim 5, wherein Wafer carrier components include: The carrier suction cup is installed on the top of the support core tube and can rise, fall and rotate together with the support core tube. It is connected to the vacuum equipment through the pipeline and can carry and position the wafer.

7. The wafer inspection apparatus having a combined rotary-lifting structure according to claim 6, wherein The scanning and detection components include: The scanning support is installed on the top of the outer frame, perpendicular to the clearance opening and spanning across the clearance opening. The scanning support has a scanning slot that runs horizontally through both sides of the scanning support and is adapted to the shape of the wafer. The wafer carried by the carrier chuck can move in the scanning slot. The detection probe consists of a pair, each installed in the scanning support and positioned above and below the scanning aperture. The detection probes are used to inspect the wafer carried by the carrier chuck.

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