Dense array hole type semiconductor device dedicated air cooling heat sink

Abstract

The utility model discloses a kind of dense array hole type semiconductor device special air-cooled radiator, it is related to the technical field of radiator, the utility model aims at solving the problem that only linear hole can be processed in shell, the utility model includes shell and heat dissipation hole, the heat dissipation hole is distributed on shell, positioning bolt hole is set up on the shell, the shell includes the upper shell for installing heat dissipation fan and the lower shell for sticking semiconductor device, cavity is set up in the center of the lower shell, the lower of the upper shell is provided with the second-order boss that can be inserted into cavity. The scheme is processed by split type shell design and the innovation of complex structure air duct, solve the limitation of traditional dense array hole radiator in the processing complex structure air duct. According to the length of exhaust air duct corresponding setting accelerated airflow structure and increase coverage structure, significantly improve the heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of heat sinks, specifically a dense array perforated semiconductor device-specific air-cooled heat sink. Background Technology

[0002] Existing air-cooled radiator housings can typically only be machined with straight holes, which cannot accommodate the needs of complex airflow structures, thus limiting the improvement of heat dissipation performance. Furthermore, the design of airflow layouts for radiators often faces challenges such as high machining difficulty and uneven heat dissipation. Utility Model Content

[0003] To address the aforementioned problems, specifically those raised in the background section, this invention proposes a dense array perforated semiconductor device-specific air-cooled heat sink, comprising a housing and heat dissipation holes distributed on the housing. The housing also has positioning bolt holes. The housing includes an upper housing for mounting a cooling fan and a lower housing for attaching to the semiconductor device. A cavity is formed at the center of the lower housing. A second-order boss, insertable into the cavity, is located below the upper housing. The first-order diameter of the second-order boss is smaller than the inner diameter of the cavity, and the second-order diameter is equal to the inner diameter of the cavity. The upper housing is mounted on the lower housing via the positioning bolt holes and bolts. The heat dissipation holes include upper housing air passages distributed on the upper housing and exhaust air passages distributed on the lower housing. The upper housing air passages include heat dissipation air passages and impact air passages. The impact air passages are distributed at the center of the upper housing and extend from the upper surface of the upper housing to the lower surface of the second-order boss. The impact air passages point towards the cavity. The exhaust duct extends from the cavity to the periphery of the lower housing and is located on the mating surface of the lower housing and the upper housing. There are at least six exhaust ducts, which are evenly distributed on the lower housing with the cavity as the center.

[0004] A further feature of this invention is that at least one ring of drainage channels is provided around the impact airway, and the drainage channels point towards the exhaust airway.

[0005] A further feature of this invention is that a siphonic airway for increasing the intake volume is provided on one side of the airflow channel, and the siphonic airway extends obliquely from the upper surface of the upper shell to the middle section of the airflow channel.

[0006] A further feature of this invention is that the exhaust duct includes a long duct and a short duct, the long duct is configured as a Tesla valve structure capable of increasing the airflow velocity, and the short duct has at least two branch ducts for increasing the coverage area of ​​the duct.

[0007] A further feature of this invention is that a groove for applying fluorine-based heat-dissipating grease is provided at the lower part of the housing where it contacts the semiconductor device.

[0008] The beneficial technical effects of this utility model are as follows: This solution overcomes the limitations of traditional dense array heat sinks in processing complex air channels through a split shell design and an innovative processing method for complex air channels. Accelerating airflow structures and structures that increase coverage are designed according to the length of the exhaust air channel, significantly improving heat dissipation efficiency. The integrated design of the impact air channel, the guiding air channel, and the siphon air channel achieves rapid cooling and effective heat dissipation of high-temperature areas, avoiding the problem of excessively high exhaust airflow temperature. The concave texture enhances the thermal conductivity between the semiconductor device and the lower shell, further improving heat dissipation performance. Attached Figure Description

[0009] Figure 1 A schematic diagram of the overall structure of this solution is shown.

[0010] Figure 2 A top view of the upper shell structure is shown.

[0011] Figure 3 A top view of the lower shell structure is shown.

[0012] Figure 4 A schematic diagram of the lower shell structure from below is shown.

[0013] The attached diagram shows the following reference numerals: 1. Upper housing; 2. Lower housing; 3. Cavity; 4. Heat dissipation duct; 5. Impact duct; 6. Drainage duct; 7. Siphon duct; 8. Exhaust duct; 9. Corrugated pattern. Detailed Implementation

[0014] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0015] This utility model proposes a dense array perforated type air-cooled heat sink for semiconductor devices. The shell is made of thermally conductive material and consists of two modules: an upper shell 1 and a lower shell 2. The lower shell 2 is mounted on the motherboard through positioning bolt holes and bolts, so that the center of the lower shell 2 is in contact with the semiconductor components to achieve heat conduction. The upper shell 1 is used to install the cooling fan. The two shells are quickly connected by a second-order boss with an arc-shaped chamfer, and then installed together with bolts and positioning bolt holes. Different shapes of the lower shell 2 and upper shell 1 can be selected according to different semiconductor components and different models of cooling fans.

[0016] The heat dissipation air passage is divided into an upper housing air passage and an exhaust air passage. Since the lower surface of the housing is in contact with the semiconductor device, the exhaust air passage can only be set in a horizontal direction. Therefore, the housing is divided into upper and lower housings. The horizontal air passage is set on the upper surface of the lower housing 2. It only needs to be processed into an open air passage. Then, the upper housing 1 is covered on the upper surface of the lower housing 2 to form a horizontal air passage for exhaust. This is suitable for processing complex structure air passages and changes the status quo that can only be processed into straight air passages.

[0017] The long air passage on the lower housing 2 is processed into a Tesla valve structure to increase the flow rate of the exhaust air and prevent the airflow from slowly passing through the long air passage and affecting the heat dissipation effect. Since the short air passage is shorter and the airflow is discharged faster, branch air passages are opened on both sides of the short air passage to increase the coverage area and ensure the heat dissipation effect.

[0018] The impact air duct 5, located at the center of the upper housing 1, points directly into the cavity 3. The cavity 3 is situated at the junction of the lower housing 2 and the semiconductor device, where the temperature of the lower housing 2 is highest. The impact of the direct airflow enables rapid cooling. The guide air duct 6 points towards the exhaust air duct 8. The airflow flows through the cavity 3 into the exhaust air duct 8, and according to Bernoulli's principle, it can quickly carry away the high-temperature gas after heat exchange. The impact air duct 5 and the guide air duct 6 form the main working area covered by the cooling fan. A siphon air duct 7 is opened on one side of the guide air duct 6 to increase the airflow of the low-temperature airflow and prevent the airflow temperature from dropping too high after passing through the exhaust air duct 8 and transferring the temperature back into the lower housing 2, thus affecting the heat dissipation effect. At the same time, the heat dissipation air ducts 4 are evenly distributed on the upper housing 1. Some of the heat dissipation air ducts 4 are connected to the exhaust air duct 8, and the low-temperature airflow is introduced through the siphon effect to enhance the heat dissipation effect. The remaining part is blocked by the lower housing 2 to form blind holes, which increases the surface area of ​​the upper housing 1 for natural heat dissipation.

[0019] By creating grooves at the contact point between the lower housing 2 and the semiconductor device, the amount of thermal grease at the contact gap can be increased after applying thermal grease. This also increases the contact area between the thermal grease and the lower housing 2, ensuring the thermal conductivity between the semiconductor device and the lower housing 2.

[0020] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0021] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0024] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A dense array hole type semiconductor device special air-cooled radiator, comprising a shell and a heat dissipation hole, the heat dissipation hole is distributed on the shell, and a positioning bolt hole is formed on the shell, characterized in that: The housing includes an upper housing (1) for mounting a cooling fan and a lower housing (2) for attaching semiconductor devices. A cavity (3) is provided at the center of the lower housing (2). A second-order boss with an arc-shaped chamfer is provided below the upper housing (1) and can be inserted into the cavity (3). The first-order diameter of the second-order boss is smaller than the inner diameter of the cavity (3), and the second-order diameter of the second-order boss is equal to the inner diameter of the cavity (3). The upper housing (1) is mounted on the lower housing (2) through positioning bolt holes and bolts. ​ The heat dissipation holes include upper housing air passages distributed on the upper housing (1) and exhaust air passages (8) distributed on the lower housing (2). The upper housing air passages include heat dissipation air passages (4) and impact air passages (5). The impact air passages (5) are distributed at the center of the upper housing (1) and extend from the upper surface of the upper housing (1) to the lower surface of the second-order boss. The impact air passages (5) point towards the cavity (3). The exhaust duct (8) extends from the cavity (3) to the periphery of the lower housing (2), and the exhaust duct (8) is opened on the mating surface of the lower housing (2) and the upper housing (1). The exhaust duct (8) is configured to be at least six, and the exhaust ducts (8) are evenly distributed on the lower housing (2) with the cavity (3) as the center.

2. A dense array hole type semiconductor device dedicated air-cooled heat sink according to claim 1, characterized in that: At least one drainage airway (6) is provided around the impact airway (5), and the drainage airway (6) points to the exhaust airway (8).

3. A dense array hole type semiconductor device dedicated air-cooled heat sink according to claim 2, characterized in that: A siphonic airway (7) for increasing the intake air volume is provided on one side of the air intake duct (6). The siphonic airway (7) extends obliquely from the upper surface of the upper shell (1) to the middle section of the air intake duct (6).

4. The air-cooled heat sink for dense array hole type semiconductor devices according to claim 1, characterized in that: The exhaust duct (8) includes a long duct and a short duct. The long duct is configured with a Tesla valve structure that can increase the airflow velocity. The short duct has at least two branch ducts for increasing the coverage of the duct.

5. A dense array of holes type semiconductor device dedicated air-cooled heat sink according to any of claims 1-4, characterized in that: The lower housing (2) has grooves (9) at the point where it contacts the semiconductor device for applying fluorine-based heat dissipation grease.

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