Packaging structure
Patent Information
- Application Number
- CN202521847806.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-28
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-08-28
AI Technical Summary
[0002]图1示出了现有技术的封装结构，现有技术通常在衬底2的焊盘(pad)4上刷焊料层6，然后将导电柱8通过表面安装技术(surface mounti ng techno logy，SMT)接合在焊盘4上，因导电柱8为直立状态，不易进行固定，当配重比例不良时，容易有歪斜或倾倒现象的发生
[0025]The embodiments of this application form cavities in a first substrate and/or a second substrate, embed conductive pillars in the cavities and/or cavities, and use an insulating layer to fix a plurality of conductive pillars, thereby improving the skewness of the conductive pillars, enhancing the stability of the conductive pillars, making the first substrate, the second substrate, and the conductive pillars more stable, and improving the production yield.
Smart Images
Figure CN224775416U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a packaging structure. Background Technology
[0002] Figure 1 The diagram illustrates a prior art packaging structure. In this technology, a solder layer 6 is typically applied to the pads 4 of a substrate 2, and then conductive pillars 8 are bonded to the pads 4 using surface mounting technology (SMT). Because the conductive pillars 8 are upright, they are difficult to fix, and when the weight distribution is incorrect, they are prone to tilting or tipping. Furthermore, during the molding process, the upright conductive pillars 8 may be knocked over by the molding flow. While using thicker conductive pillars 8 can solve the tipping problem, it will occupy space on the substrate 2, reducing the number of electronic components 9 that can be accommodated. Utility Model Content
[0003] In view of the problems existing in the related technologies, the purpose of this utility model is to provide a packaging structure to at least improve the yield of the packaging structure.
[0004] To achieve the above objectives, the present invention provides a packaging structure comprising: a first substrate; a second substrate spaced apart from the first substrate; a plurality of conductive pillars connected between the first substrate and the second substrate, and embedded in at least one of the first substrate and the second substrate; and an insulating layer disposed between the plurality of conductive pillars, such that the plurality of conductive pillars are spaced apart from each other.
[0005] In some embodiments, the plurality of conductive pillars are embedded in the first substrate and the second substrate.
[0006] In some embodiments, there is a space between the insulating layer and the first substrate.
[0007] In some embodiments, the packaging structure further includes a first electronic component disposed between the first substrate and the second substrate, and connected to the first substrate.
[0008] In some embodiments, the upper surfaces of the plurality of conductive pillars extend into the first substrate.
[0009] In some embodiments, the packaging structure further includes a second electronic component disposed between the first substrate and the second substrate, and connected to the second substrate.
[0010] In some embodiments, the first electronic component is also connected to the second substrate.
[0011] In some embodiments, the packaging structure further includes a second electronic component disposed between the first substrate and the second substrate, and connecting the first substrate and the second substrate.
[0012] In some embodiments, the conductive pillar is a copper pillar.
[0013] In some embodiments, the insulating layer is a bottom filler layer.
[0014] In some embodiments, there is a space between the insulating layer and the second substrate.
[0015] In some embodiments, at least one of the first substrate and the second substrate has a plurality of cavities, and the ends of the plurality of conductive pillars are embedded in the plurality of cavities in a one-to-one correspondence.
[0016] In some embodiments, the first electronic component is spaced apart from the insulating layer.
[0017] In some embodiments, the extension direction of the plurality of conductive pillars is substantially perpendicular to the extension plane of the insulating layer.
[0018] In some embodiments, the plurality of cavities expose a circuit layer in at least one of the first substrate and the second substrate.
[0019] In some embodiments, the first electronic component is a capacitor.
[0020] Embodiments of this application also provide a packaging structure, including: a first substrate; a second substrate spaced apart from the first substrate; a plurality of conductive pillars and an insulating layer for fixing the plurality of conductive pillars, disposed between the first substrate and the second substrate, wherein at least one of the first substrate and the second substrate has a plurality of cavities, the ends of the plurality of conductive pillars are respectively accommodated in the plurality of cavities, and the plurality of conductive pillars are spaced apart from each other.
[0021] In some embodiments, both the first substrate and the second substrate have the plurality of cavities, which respectively accommodate the two ends of the plurality of conductive pillars.
[0022] In some embodiments, the first substrate and the second substrate are printed circuit boards.
[0023] In some embodiments, the distance between the insulating layer and the first substrate and the distance between the insulating layer and the second substrate are different.
[0024] The beneficial technical effects of this utility model are as follows:
[0025] The embodiments of this application form cavities in a first substrate and / or a second substrate, embed conductive pillars in the cavities and / or cavities, and use an insulating layer to fix a plurality of conductive pillars, thereby improving the skewness of the conductive pillars, enhancing the stability of the conductive pillars, making the first substrate, the second substrate, and the conductive pillars more stable, and improving the production yield. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It is worth noting that, according to industry standard practice, the components are not drawn to scale and are only used for illustrative purposes. In fact, for clarity of discussion, the dimensions of the components can be arbitrarily increased or decreased.
[0027] Figure 1 The packaging structure of the prior art is shown.
[0028] Figure 2 The second substrate, the second solder resist layer, and the second solder layer are shown.
[0029] Figure 3 It shows Figure 2 A magnified detail of a portion of the structure shown.
[0030] Figure 4 The formation of conductive pillars is shown.
[0031] Figure 5 It shows Figure 4 A magnified detail of a portion of the structure shown.
[0032] Figure 6 The packaging structure according to an embodiment of this application is shown.
[0033] Figure 7 The packaging structure according to the second embodiment of this application is shown.
[0034] Figure 8 The formation of an adhesive layer on a carrier is shown.
[0035] Figure 9 The formation of an insulating layer is shown.
[0036] Figure 10 The conductive pillar module is shown.
[0037] Figure 11 This illustrates the bonding of the conductive post module to... Figure 2 On the second solder layer of the structure shown.
[0038] Figure 12 The packaging structure according to the third embodiment of this application is shown.
[0039] Figure 13 The packaging structure according to the fourth embodiment of this application is shown. Detailed Implementation
[0040] To better understand the spirit of the embodiments of this application, the following description is based on some preferred embodiments of this application.
[0041] Embodiments of this application will be described in detail below. Throughout this specification, identical or similar components and components having identical or similar functions are indicated by similar reference numerals. The embodiments described herein with reference to the accompanying drawings are illustrative and diagrammatic in nature and are intended to provide a basic understanding of this application. The embodiments of this application should not be construed as limiting this application.
[0042] The terms “approximately,” “generally,” “substantial,” “substantial,” “about,” and “approximately” used herein are used to indicate and explain minor variations. For example, when used in conjunction with numerical values, the above terms may refer to a range of variation less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another embodiment, the thickness of a film or layer being “substantially uniform” may refer to the average thickness of the film or layer being less than or equal to ±10% of the standard deviation, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces that are within 50 μm along the same plane (such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane). If, for example, two components overlap or overlap within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm, then the two components can be considered "substantially aligned." If the angle between two surfaces or components is, for example, 90° ± 10° (such as ± 5°, ± 4°, ± 3°, ± 2°, ± 1°, ± 0.5°, ± 0.1°, or ± 0.05°), then the two surfaces or components can be considered "substantially perpendicular." When used in conjunction with an event or situation, the terms "approximately," "generally," "substantially," "materially," "about," and "approximately" can refer to the exact occurrence of the event or situation as well as the very close approximation of its occurrence.
[0043] In this specification, unless otherwise specified or limited, relative terms such as “central,” “longitudinal,” “lateral,” “front,” “rear,” “right,” “left,” “inner,” “outer,” “lower,” “higher,” “horizontal,” “vertical,” “above,” “below,” “above,” “below,” “top,” “bottom,” and their derivatives (e.g., “horizontally,” “downward,” “upward,” etc.) should be interpreted as referring to the directions described in the discussion or depicted in the accompanying drawings. These relative terms are used for descriptive convenience only and do not require that this application be constructed or operated in a particular orientation.
[0044] For ease of description, "first," "second," "third," etc., can be used in this article to distinguish different components of a figure or a series of figures. "First," "second," "third," etc., are not intended to describe the corresponding components.
[0045] Figures 2 to 6 The manufacturing process of the packaging structure 100 according to the first embodiment of this application is shown.
[0046] Figure 2 The illustration shows a second substrate 20, on which a second solder mask layer 28 is formed, and a cavity 22 is formed on the surface of the second substrate 20, for example by an etching process, to expose a circuit layer 24 in the second substrate 20, and a second solder layer 26 (e.g., made of tin) is formed on the circuit layer 24. Figure 3 It shows Figure 2 A magnified detail view of a portion of the structure shown. In some embodiments, the second substrate 20 is a printed circuit board (PCB).
[0047] Figure 4 The diagram shows a conductive post 30 formed on the second solder layer 26, for example by surface mount technology, with the lower end of the conductive post 30 extending into the cavity 22 and forming a second electronic component 52 bonded to the second substrate 20. Figure 5 It shows Figure 4 A magnified detail of a portion of the structure shown. In some embodiments, the conductive pillar 30 is a copper pillar.
[0048] Figure 6The diagram illustrates an inverted bonding of a first substrate 10 to a conductive post 30, resulting in a package structure 100 according to an embodiment of this application. A first electronic component 50 is bonded to the first substrate 10. In some embodiments, the first substrate 10 is the same as or similar to a second substrate 20, and the first substrate 10 also includes a cavity 12 exposing a wiring layer 14 therein, and the wiring layer 14 of the first substrate 10 is bonded to the conductive post 30 via a first solder layer 16, the upper end of the conductive post 30 extending into the cavity 12 of the first substrate 10.
[0049] In embodiments of this application, cavities 22 and 12 are formed in the second substrate 20 / first substrate 10, and the conductive pillar 30 is fixed by a recessed design. Compared with the prior art, this improves the stability of surface mount technology components with conductive pillar 30 and increases production yield.
[0050] Figure 7 The packaging structure 100 according to the second embodiment of this application is shown. Figure 6 In the first embodiment shown, the first electronic component 50 is directly connected to the first substrate 10 and electrically connected to the second substrate 20 through the first substrate 10 and the conductive pillar 30; the second electronic component 52 is directly connected to the second substrate 20 and electrically connected to the first electronic component 50 through the second substrate 20 and the conductive pillar 30. Figure 7 In the second embodiment shown, the first electronic component 50 and the second electronic component 52 are both directly connected to the first substrate 10 and the second substrate 20.
[0051] Figures 8 to 12 The manufacturing process of the packaging structure 100 according to the third embodiment of this application is shown.
[0052] Figure 8 The illustration shows an adhesive layer 62 formed on a carrier 60, and a plurality of upright conductive pillars 30 formed on the adhesive layer 62, the conductive pillars 30 being recessed within the adhesive layer 62. In some embodiments, the adhesive layer 62 is a hydrosol.
[0053] Figure 9 An insulating layer 40 is shown to hold a plurality of conductive posts 30 in a spaced-apart state. The insulating layer 40 can be formed directly on the adhesive layer 62, or it can be formed at a location separated from the adhesive layer 62 as shown by the dashed outline (e.g., through a specific mold). That is, the position of the insulating layer 40 is not limited, as long as the conductive posts 30 can be fixed.
[0054] Figure 10 The diagram shows the removal of the carrier 60 and adhesive layer 62, resulting in a conductive pillar module comprising conductive pillar 30 and insulating layer 40.
[0055] Figure 11 This illustrates the bonding of the conductive post module to... Figure 2The second solder layer 26 of the structure shown. It is understood that the number of conductive pillars 30 in the conductive pillar module is only an example; the number of conductive pillars 30 in the conductive pillar module can be designed and adjusted according to actual needs. Furthermore, conductive pillar modules comprising a plurality of conductive pillars 30 can be formed in batches, then divided according to the actual required number of conductive pillars 30, and then bonded to the second substrate 20.
[0056] Figure 12 The diagram shows a first substrate 10 bonded to a conductive pillar module to obtain a package structure 100 according to a third embodiment of the present application, wherein the upper end of the conductive pillar 30 extends into the cavity 12 of the first substrate 10.
[0057] In the third embodiment, when the conductive post 30 is long (e.g., greater than 5.6 mm), an insulating layer 40 is used to fix the conductive post 30 to further prevent the conductive post 30 from becoming skewed and to maintain the conductive posts 30 in a spaced-apart state. In some embodiments, the insulating layer 40 is a bottom fill layer or a molding layer. The insulating layer 40 does not contact the first substrate 10 and / or the second substrate 20. In the embodiments of this application, the cavities 12, 22 in the first substrate 10 and / or the second substrate 20 not only serve to fix the conductive post 30, but also assist in guidance, so that the first substrate 10 and / or the second substrate are aligned with the conductive post 30, avoiding the problem of electrical connection failure.
[0058] Figure 13 A packaging structure 100 according to a fourth embodiment of this application is shown, wherein, when the second substrate 20 includes a cavity 22 for fixing the conductive pillars 30 and a plurality of conductive pillars 30 are fixed together using an insulating layer 30, the first substrate 10 may not include the cavity 22, that is, the bottom surface of the first substrate 10 may be a plane, and the conductive pillars 30 are electrically connected to the pads 18 on the bottom surface of the first substrate 10 through a first solder layer 16.
[0059] The embodiments of this application can be used in data centers, artificial intelligence (AI) applications, servers, personal computers, etc. In some embodiments, the conductive pillar 30 / conductive pillar module can also be replaced by structures such as solder balls, intermediate components, and copper blocks.
[0060] Embodiments of this application provide a packaging structure 100, including: a first substrate 10; a second substrate 20 spaced apart from the first substrate 10; a plurality of conductive pillars 30 disposed between the first substrate 10 and the second substrate 20, and embedded in at least one of the first substrate 10 and the second substrate 20; and an insulating layer 40 disposed between the plurality of conductive pillars 30, such that the plurality of conductive pillars 30 are spaced apart from each other. Embodiments of this application improve the stability of the conductive pillars 30 by forming cavities 12 and 22 in the first substrate 10 and / or the second substrate 20, embedding the conductive pillars 30 within the cavities 12 and / or 22, and using the insulating layer 40 to fix the plurality of conductive pillars 30. This improves the stability of the conductive pillars 30, making the first substrate 10, the second substrate 20, and the conductive pillars 30 more stable, thereby increasing production yield.
[0061] In some embodiments, a plurality of conductive pillars 30 are embedded in a first substrate 10 and a second substrate 20.
[0062] In some embodiments, there is a space 42 between the insulating layer 40 and the first substrate 10, that is, the insulating layer 40 is separated from the first substrate 10.
[0063] In some embodiments, the packaging structure 100 further includes a first electronic component 50 disposed between the first substrate 10 and the second substrate 20, and connected to the first substrate 10.
[0064] In some embodiments, the upper surfaces of the plurality of conductive pillars 30 extend into the first substrate 10.
[0065] In some embodiments, the packaging structure 100 further includes a second electronic component 52 disposed between the first substrate 10 and the second substrate 20, and connected to the second substrate 20.
[0066] In some embodiments, the first electronic component 50 is also connected to the second substrate 20.
[0067] In some embodiments, the packaging structure 100 further includes a second electronic component 52 disposed between the first substrate 10 and the second substrate 20, and connecting the first substrate 10 and the second substrate 20.
[0068] In some embodiments, the conductive post 30 is a copper post.
[0069] In some embodiments, the insulating layer 40 is a bottom filler layer.
[0070] In some embodiments, there is a space between the insulating layer 40 and the second substrate 20, that is, the insulating layer 40 and the second substrate 20 are separated.
[0071] In some embodiments, at least one of the first substrate 10 and the second substrate 20 has a plurality of cavities 12, 22, and the ends of the plurality of conductive pillars 30 are embedded in the plurality of cavities 12, 22 in a corresponding manner.
[0072] In some embodiments, the first electronic component 50 is separated from the insulating layer 40 to prevent them from interfering with each other during installation.
[0073] In some embodiments, the extension direction of the plurality of conductive posts 30 is substantially perpendicular to the extension plane of the insulating layer 40, for example, the included angle between them is in the range of 90°±5°.
[0074] In some embodiments, the plurality of cavities 12, 22 expose the circuit layers 14, 24 in at least one of the first substrate 10 and the second substrate 20.
[0075] In some embodiments, the package structure 100 is a power supply device, and the first electronic component 50 and the second electronic component 52 are capacitor components. Embodiments of this application do not require thickening the conductive post 30, do not affect the number of the first electronic component 50 and the second electronic component 52, and do not affect the total capacitance value.
[0076] Embodiments of this application also provide a packaging structure 100, including: a first substrate 10; a second substrate 20, spaced apart from the first substrate 10; a plurality of conductive pillars 30 and an insulating layer 40 for fixing the plurality of conductive pillars 30, disposed between the first substrate 10 and the second substrate 20, wherein at least one of the first substrate 10 and the second substrate 20 has a plurality of cavities 12, 22, and the ends of the plurality of conductive pillars 30 are respectively accommodated in the plurality of cavities 12, 22, and the plurality of conductive pillars 30 are spaced apart from each other.
[0077] In some embodiments, the first substrate 10 and the second substrate 20 each have a plurality of cavities 12 and 22, which respectively accommodate the two ends of a plurality of conductive pillars 30.
[0078] In some embodiments, the first substrate 10 and the second substrate 20 are printed circuit boards.
[0079] In some embodiments, the distance between the insulating layer 40 and the first substrate 10 and the distance between the insulating layer 40 and the second substrate 20 are different.
[0080] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A packaging structure, characterized in that, include: First substrate; The second substrate is disposed at a distance from the first substrate; Multiple conductive pillars are connected and disposed between the first substrate and the second substrate, and at least one of the first substrate and the second substrate is embedded therein; as well as An insulating layer is disposed between the plurality of conductive pillars, such that the plurality of conductive pillars are spaced apart from each other.
2. The packaging structure according to claim 1, characterized in that, The plurality of conductive pillars are embedded in the first substrate and the second substrate.
3. The packaging structure according to claim 1, characterized in that, There is a space between the insulating layer and the first substrate.
4. The packaging structure according to claim 1, characterized in that, Also includes: A first electronic component is disposed between the first substrate and the second substrate, and is connected to the first substrate.
5. The packaging structure according to claim 1, characterized in that, The upper surfaces of the plurality of conductive pillars extend into the first substrate.
6. The packaging structure according to claim 4, characterized in that, Also includes: A second electronic component is disposed between the first substrate and the second substrate, and is connected to the second substrate.
7. The packaging structure according to claim 4, characterized in that, The first electronic component is also connected to the second substrate.
8. The packaging structure according to claim 7, characterized in that, Also includes: A second electronic component is disposed between the first substrate and the second substrate, and connects the first substrate and the second substrate.
9. The packaging structure according to claim 1, characterized in that, The insulating layer is a bottom filler layer.
10. The packaging structure according to claim 1, characterized in that, The extension direction of the plurality of conductive pillars is substantially perpendicular to the extension plane of the insulating layer.