A silicon carbide power module

Abstract

The utility model relates to power semiconductor device packaging technical field, specifically, a kind of silicon carbide power module is related to a kind of silicon carbide power module.The silicon carbide power module includes shell body, energy storage plate 7, main circuit layer, silicon carbide power module and electric control integrated unit;Electric control integrated unit includes power supply and electric control circuit board, and power supply and electric control circuit board are integrally arranged;Main circuit layer is arranged on energy storage plate 7, silicon carbide power module is arranged on main circuit layer, and energy storage plate 7, main circuit layer and silicon carbide power module are all arranged in shell body;Electric control integrated unit is arranged on the side wall inside shell body.The utility model is by integrating power supply and electric control circuit board to form electric control integrated unit, and it is arranged on the side wall inside shell body, simultaneously, energy storage plate 7, main circuit layer and silicon carbide power module are arranged in shell body in laminated arrangement, realize the high compactness of structure, effectively reduce overall size to improve power density.

Description

Technical Field

[0001] This utility model relates to the field of power semiconductor device packaging technology, and more specifically, to a silicon carbide power module. Background Technology

[0002] Achieving high power density requires a highly compact structure, but compactness often brings problems such as heat dissipation bottlenecks and increased manufacturing complexity. Simply reducing size leads to increased thermal resistance and difficulty in heat dissipation; increasing parasitic inductance / capacitance can easily lead to increased switching oscillations and losses, reducing reliability; complex multilayer substrates are costly and have complex processes; single-function optimization that only optimizes heat dissipation or only optimizes electrical connections is difficult to achieve simultaneously. How to achieve the ultimate compactness of SiC power module structures while ensuring excellent electrical performance, good heat dissipation, and high reliability is a technical problem that urgently needs to be solved by existing technologies. Utility Model Content

[0003] The purpose of this invention is to provide a silicon carbide power module that can solve the above-mentioned technical problems.

[0004] This utility model provides a silicon carbide power module, including a housing, an energy storage board, a main circuit layer, a silicon carbide power module, and an electronic control integrated unit; The integrated electronic control unit includes a power supply and an electronic control circuit board, wherein the power supply and the electronic control circuit board are integrated together. The main circuit layer is disposed on the energy storage board, the silicon carbide power module is disposed on the main circuit layer, and the energy storage board, the main circuit layer and the silicon carbide power module are all disposed within the outer casing; The electronic control integrated unit is disposed on the side wall inside the housing.

[0005] In an optional embodiment, a first heat dissipation component is provided inside the housing. The first heat dissipation component is disposed on the side of the silicon carbide power module and is used to dissipate heat from the silicon carbide power module.

[0006] In an optional implementation, the first heat dissipation component includes a first heat dissipation channel and a heat sink; One end of the first heat dissipation channel is located on one side of the silicon carbide power module, and the other end is located on the side wall of the housing. The outer casing has heat dissipation holes on the side wall corresponding to the first heat dissipation channel; The heat sink is installed in the first heat dissipation channel, which can send the heat of the silicon carbide power module out of the housing through the first heat dissipation channel and the heat dissipation hole.

[0007] In an optional implementation, the first heat dissipation channel is a Z-shaped plate structure.

[0008] In an optional embodiment, a filter screen is provided on the outer casing, and the filter screen is disposed on the side wall of the outer casing opposite to the first heat dissipation component.

[0009] In an optional embodiment, the outer casing includes a bottom plate, a left side plate, a right side plate, a front plate, a rear plate, and a top cover plate; The bottom plate, the left side plate, the right side plate, the front plate, the rear plate, and the top cover plate together form a box structure; The electronic control integrated unit is disposed on the left side plate or the right side plate, and the energy storage plate is disposed on the bottom plate.

[0010] In an optional embodiment, a second heat dissipation component is provided on the upper cover plate; The upper cover plate has a second heat dissipation channel; The second heat dissipation component includes a heat pipe, which is disposed within the second heat dissipation channel.

[0011] In an optional embodiment, the top cover is made of metal.

[0012] In an optional embodiment, the second heat dissipation component is disposed on the upper cover plate at a position corresponding to the silicon carbide power module.

[0013] In an optional embodiment, an inductor is provided on the energy storage plate.

[0014] The beneficial effects of this utility model embodiment are: By integrating the power supply and the control circuit board to form an integrated control unit, which is then located on the inner side wall of the housing, and simultaneously stacking the energy storage board 7, the main circuit layer, and the silicon carbide power module within the housing, a highly compact structure is achieved, effectively reducing the overall size to increase power density. This layout, through integrated design, reduces redundant space between components, shortens electrical connection paths, helps reduce parasitic inductance and capacitance, reduces switching oscillations and losses, and ensures excellent electrical performance. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of the silicon carbide power module provided in an embodiment of this utility model (with the top cover removed). Figure 2 An exploded view of a silicon carbide power module provided in an embodiment of this utility model.

[0017] Icons: 1-Outer casing; 2-Fan; 3-Silicon carbide power module; 4-Capacitor; 5-First heat dissipation channel; 6-Inductor; 7-Energy storage board; 8-Filter; 9-Electronic control integrated unit; 10-Bottom plate; 11-Right side plate; 12-Rear plate; 13-Front plate; 14-Top cover. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The following is combined with Figure 1 and Figure 2 The following describes some embodiments of the present invention in detail. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0025] This utility model provides a silicon carbide power module, including a housing 1, an energy storage board 7, a main circuit layer, a silicon carbide power module 3, and an electronic control integrated unit 9; the electronic control integrated unit 9 includes a power supply and an electronic control circuit board, which are integrated; the main circuit layer is disposed on the energy storage board 7, and the silicon carbide power module is disposed on the main circuit layer, and the energy storage board 7, the main circuit layer, and the silicon carbide power module are all disposed inside the housing 1; the electronic control integrated unit 9 is disposed on the side wall inside the housing 1.

[0026] In this embodiment, the silicon carbide power module consists of an outer casing 1, an energy storage board 7, a main circuit layer, a silicon carbide power module 3, and an electronic control integrated unit 9.

[0027] Specifically, in this embodiment, the silicon carbide power module 3 is placed above the main circuit layer, and the electronic control integrated unit 9 forms an integrated structure with the electronic control circuit board through the integrated power supply, and is fixed to the side wall inside the outer casing 1, such as the left side wall or the rear side wall.

[0028] In this embodiment, this layout eliminates redundant space in traditional distributed layouts, achieving a compact structure.

[0029] During assembly, the main circuit layer is first integrated on the energy storage board 7, and then the silicon carbide power module 3 is flip-chipped or soldered onto the main circuit layer to form a core stack and placed on the base plate 10 of the outer casing 1. Subsequently, the integrated electronic control unit 9 is fixed to the side wall of the outer casing 1 by bolts or clips, and the electronic control circuit board is connected to the main circuit layer by short wire harnesses. Finally, the outer casing 1 is encapsulated.

[0030] During operation, the main circuit layer transmits power, the silicon carbide power module 3 completes the power conversion, and the electronic control integration unit 9 provides real-time regulation. The overall structure achieves high power density operation within a limited space.

[0031] In an optional embodiment, a first heat dissipation component is provided inside the housing 1. The first heat dissipation component is located on the side of the silicon carbide power module 3 and is used to dissipate heat from the silicon carbide power module 3.

[0032] In this embodiment, the first heat dissipation component is disposed on the side of the silicon carbide power module 3, maintaining a preset distance from the silicon carbide power module 3 to form a heat dissipation gap.

[0033] Specifically, in this embodiment, the first heat dissipation component, together with the inner sidewall of the outer casing 1 and the side of the silicon carbide power module 3, constitutes an independent heat dissipation area, which neither occupies the stacking space of the core stack body, but can also absorb the heat generated by the silicon carbide power module 3 during operation at close range.

[0034] More specifically, in this embodiment, the silicon carbide power module 3 generates a large amount of heat during high-frequency switching. If the heat accumulates, it can lead to increased device temperature, performance degradation, or even failure. The first heat dissipation component, arranged on the side, can directly absorb the heat emitted from the side of the module and conduct the heat out through cooperation with the housing 1, thus compensating for the insufficient heat dissipation space in the compact layout and ensuring the stable operation of the module in high-temperature environments.

[0035] The close proximity (side-to-side) arrangement of the silicon carbide power module 3 and the first heat dissipation component reduces thermal resistance, allowing heat to be quickly transferred from the high-temperature module to the heat dissipation component. Compared to the traditional module design where the heat dissipation structure is far from the heat source, the side-mounted layout in this embodiment shortens the heat transfer path, solves the "heat accumulation" problem caused by compactness, and achieves a balance between heat dissipation efficiency and structural compactness.

[0036] During assembly, a mounting position is reserved on the side of the silicon carbide power module 3. The first heat dissipation component is fixed inside the housing 1 at the corresponding position by the bracket, ensuring that it is parallel to the side of the module and the spacing is uniform. During operation, the heat generated by the silicon carbide power module 3 is transferred to the first heat dissipation component through air convection and thermal radiation. The heat dissipation component then conducts the heat to the housing 1 and dissipates it to the external environment, keeping the module temperature within the safe threshold.

[0037] The first heat dissipation component can be replaced with a flexible heat dissipation pad, which achieves heat conduction by adhering to the side of the silicon carbide power module 3, and is suitable for space-constrained scenarios; alternatively, a heat dissipation fin array can be used to increase the heat dissipation area and improve heat dissipation efficiency, which is suitable for high-power scenarios.

[0038] In an alternative embodiment, the first heat dissipation assembly includes a first heat dissipation channel 5 and a heat sink; one end of the first heat dissipation channel 5 is disposed on one side of the silicon carbide power module 3, and the other end is disposed on the side wall of the outer housing 1; the side wall of the outer housing 1 corresponding to the first heat dissipation channel 5 is provided with heat dissipation holes; the heat sink is disposed in the first heat dissipation channel 5, and can transfer the heat of the silicon carbide power module 3 out of the outer housing 1 through the first heat dissipation channel 5 and the heat dissipation holes.

[0039] In this embodiment, the first heat dissipation assembly specifically includes the first heat dissipation channel 5 and the heat sink. One end of the first heat dissipation channel 5 is closely attached to the side surface of the silicon carbide power module 3, and the other end communicates with the side wall of the outer housing 1; a heat dissipation hole is opened at a corresponding position of the outer housing 1, and is butted to the other end of the channel; the heat sink is embedded inside the first heat dissipation channel 5, and the surface of the heat sink is in close contact with the inner wall of the channel.

[0040] Specifically, in this embodiment, the number of the heat dissipation holes is large and the aperture is small, so that heat dissipation inside the outer housing 1 can be achieved, and a certain filtering effect can be achieved, preventing external impurities from entering the interior and affecting internal components.

[0041] In this embodiment, the first heat dissipation channel 5 guides heat to flow directionally, preventing heat from diffusing to other components inside the module; the heat dissipation holes serve as heat outlets, discharging the heat led out by the heat sink to the outside of the outer housing 1. The three cooperate to improve heat dissipation efficiency and meet the heat dissipation requirements of high power density modules.

[0042] Specifically, in this embodiment, the heat sink is a fan 2.

[0043] It can be understood that the heat sink is the fan 2, but it is not limited to the fan 2. It can also be a heat pipe, which improves heat transfer efficiency through phase change heat transfer; the first heat dissipation channel 5 can adopt a corrugated pipe structure, which has certain flexibility and is convenient for adapting to installation requirements at different positions.

[0044] In an alternative embodiment, the first heat dissipation channel 5 is of a gate-shaped plate structure.

[0045] In this embodiment, the first heat dissipation channel 5 is of a gate-shaped plate structure, that is, the channel is formed by bending a metal plate into a gate shape, forming a hollow structure with the upper side, the left side and the right side closed, and the front and rear ends open.

[0046] Specifically, in this embodiment, the gate-shaped arrangement can reduce processing requirements and improve processing efficiency.

[0047] It can be understood that in this embodiment, the first heat dissipation channel 5 is gate-shaped, but it is not limited to the gate shape. It can also be of other types, such as a cylindrical shape, as long as it allows heat to pass through.

[0048] In an optional embodiment, a filter screen 8 is provided on the outer casing 1, and the filter screen 8 is disposed on the side wall of the outer casing 1 opposite to the first heat dissipation component.

[0049] In this embodiment, a filter screen 8 is added to the side wall of the outer casing 1 opposite to the first heat dissipation component. The filter screen 8 has a porous mesh structure, covers the air inlet on the side wall, and can form a convection path with the heat dissipation holes of the first heat dissipation component. Its edge is fixed to the outer casing 1 by a slot or bolt, and remains flush with the inner wall of the outer casing 1.

[0050] Specifically, in this embodiment, when the first heat dissipation component is working, a negative pressure is formed inside the outer casing 1, and external air enters the module through the filter screen 8. The filter screen 8 can block dust, particulate matter, and other impurities in the air, preventing them from adhering to the surface of components such as the silicon carbide power module 3 and the heat sink. If impurities accumulate, it will reduce the thermal conductivity of the heat dissipation components and may even cause short circuits in electrical components. Therefore, the filter screen 8 plays a role in protecting the cleanliness of the module's interior and maintaining its heat dissipation performance.

[0051] More specifically, in this embodiment, the filter screen 8 can be replaced with an electrostatic adsorption screen, which adsorbs tiny particles through electrostatic action to improve filtration efficiency; alternatively, replaceable filter cotton can be used, which is suitable for industrial environments with a lot of dust and reduces maintenance costs.

[0052] In an optional embodiment, the outer casing 1 includes a bottom plate 10, a left side plate, a right side plate 11, a front plate 13, a rear plate 12, and a top cover plate 14; the bottom plate 10, the left side plate, the right side plate 11, the front plate 13, the rear plate 12, and the top cover plate 14 together form a box structure; the electronic control integrated unit 9 is disposed on the left side plate or the right side plate, and the energy storage plate 7 is disposed on the bottom plate 10.

[0053] In this embodiment, the outer casing 1 consists of a base plate 10, a left side plate, a right side plate 11, a front plate 13, a rear plate 12, and a top cover plate 14. These six components are connected by bolts, welding, or other fixing methods to form a closed enclosure. The energy storage plate 7 is placed horizontally and fixed on the base plate 10, forming the bottom support of the module. The electronic control integrated unit 9 is fixed to the inner wall of the left side plate or the rear plate 12 by a bracket, forming a vertical spatial distribution with the energy storage plate 7 and the main circuit layer.

[0054] In this embodiment, the enclosure structure provides mechanical protection for the internal components, resisting external impacts and vibrations; the bottom plate 10 serves as a load-bearing foundation, ensuring the stable installation of heavy components such as the energy storage board 7 and the main circuit layer; the side walls such as the left side plate and the rear plate 12 provide an installation carrier for the electronic control integration unit 9, realizing the spatial separation and collaborative work of functional components; the front plate 13 can reserve interface positions to facilitate the connection of the module with external devices.

[0055] In an optional embodiment, a second heat dissipation component is provided on the upper cover plate 14; the upper cover plate 14 has a second heat dissipation channel; the second heat dissipation component includes a heat pipe, which is disposed in the second heat dissipation channel.

[0056] In this embodiment, a second heat dissipation component is provided on the upper cover plate 14. Through the cooperation of the first heat dissipation component and the second heat dissipation component, double-sided heat dissipation is formed, thereby improving the overall heat dissipation efficiency.

[0057] Specifically, in this embodiment, the second heat dissipation component includes a second heat dissipation channel and a heat pipe.

[0058] The second heat dissipation channel is a groove formed by the recess on the surface of the upper cover plate 14, which extends along the length of the upper cover plate 14; the heat pipe is embedded in the groove, with its bottom in contact with the inner wall of the upper cover plate 14 and its top in contact with the inner wall of the groove, forming a composite heat dissipation structure of "cover plate-heat pipe".

[0059] The heat generated by the silicon carbide power module 3 during operation is conducted to the upper cover plate 14 through the air. The second heat dissipation component quickly dissipates the heat absorbed by the upper cover plate 14 through heat pipes. The high thermal conductivity of the heat pipes accelerates the transfer of heat from the cover plate to the external environment, forming a bidirectional heat dissipation system with the first heat dissipation component, thereby improving the overall heat dissipation capacity.

[0060] In this embodiment, the second heat-conducting component can be a heat dissipation fin array, which can improve heat dissipation efficiency by increasing the contact area with air; it can also be a through hole through the upper cover plate 14, which can be used in conjunction with the fan 2 for forced ventilation and is suitable for high-power scenarios.

[0061] In an optional embodiment, the top cover 14 is made of metal.

[0062] In this embodiment, the top cover plate 14 is made of a metal material (such as aluminum alloy or copper alloy), with uniform thickness, and its surface can be anodized to form a protective film. The metal top cover plate 14 is rigidly connected to the left side plate, right side plate 11, and rear plate 12 of the outer casing 1 by bolts, the inner sidewall remains flat, and the vertical distance between it and the silicon carbide power module 3 does not exceed a preset value.

[0063] In this embodiment, the metal material has a high thermal conductivity, which can quickly absorb the heat transferred by the silicon carbide power module 3 through air radiation or convection, and become the "heat dissipation carrier" on the top of the module; at the same time, the high strength of the metal can enhance the overall rigidity of the outer shell 1 and protect the internal components from external pressure damage.

[0064] According to the law of thermal conductivity, the higher the thermal conductivity of a material, the faster the heat transfer rate. Compared to insulating materials such as plastic, the metal top cover 14 can more efficiently conduct the heat generated by the module from the inside to the outer surface, and then dissipate it into the environment through natural convection or radiation. In addition, metal has good ductility and machinability, making it easy to process structures such as second heat dissipation channels to accommodate the installation of heat dissipation components.

[0065] In this embodiment, the upper cover plate 14 can also be made of metal-ceramic composite material, which combines the high thermal conductivity of metal and the insulation of ceramic, making it suitable for scenarios requiring electromagnetic shielding; it can also be made of magnesium alloy, which reduces the overall weight of the module while ensuring thermal conductivity.

[0066] In an optional embodiment, the second heat dissipation component is disposed on the upper cover plate 14 at a position corresponding to the silicon carbide power module 3.

[0067] In this embodiment, the second heat dissipation component is positioned on the upper cover plate 14 at a location corresponding to the silicon carbide power module 3. Specifically, the projection areas of the second heat dissipation channel and the heat pipe overlap with or partially cover the projection area of ​​the silicon carbide power module 3 on the horizontal plane. The bottom of the heat pipe contacts the inner wall of the upper cover plate 14 via a heat-conducting pad, corresponding to the core heat-generating area of ​​the module.

[0068] The heat of the silicon carbide power module 3 is concentrated in its chip area. The second heat dissipation component is arranged in the corresponding area, which can directly absorb the most concentrated heat, reduce the diffusion of heat to the non-core area of ​​the cover plate, reduce heat loss in the transfer process, improve the energy utilization efficiency of the heat dissipation component, and make the limited heat dissipation structure play its maximum role.

[0069] In an optional embodiment, an inductor 6 is provided on the energy storage plate 7.

[0070] In this embodiment, an inductor 6 is provided on the energy storage plate 7, and the inductor 6 is fixed on the energy storage plate 7 by a bracket or welding.

[0071] Inductor 6 serves as an energy storage and filtering element, used in the power conversion circuit to stabilize current and suppress harmonics. By directly placing it on the energy storage board 7, the electrical connection path with the main circuit layer and silicon carbide power module 3 can be shortened, reducing the parasitic inductance 6 of the line, avoiding voltage spikes and oscillations caused by parasitic parameters during switching, and improving the electrical performance of the module.

[0072] In this embodiment, a capacitor 4 is also provided on the energy storage plate 7, and the capacitor 4 is disposed between the silicon carbide power modules 3.

[0073] The beneficial effects of this utility model embodiment are: By integrating the power supply and the control circuit board to form an integrated control unit 9, which is then located on the inner side wall of the housing 1, and simultaneously stacking the energy storage board 7, the main circuit layer, and the silicon carbide power module 3 within the housing 1, a highly compact structure is achieved, effectively reducing the overall size to increase power density. This layout, through integrated design, reduces redundant space between components, shortens electrical connection paths, helps reduce parasitic inductance 6 and capacitance 4, reduces switching oscillations and losses, and ensures excellent electrical performance.

[0074] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A silicon carbide power module, characterized by, It includes the outer casing, energy storage board, main circuit layer, silicon carbide power module, and electronic control integrated unit; The integrated electronic control unit includes a power supply and an electronic control circuit board, wherein the power supply and the electronic control circuit board are integrated together. The main circuit layer is disposed on the energy storage board, the silicon carbide power module is disposed on the main circuit layer, and the energy storage board, the main circuit layer and the silicon carbide power module are all disposed within the outer casing; The electronic control integrated unit is disposed on the side wall inside the housing.

2. The silicon carbide power module of claim 1, wherein, A first heat dissipation component is provided inside the housing. The first heat dissipation component is located on the side of the silicon carbide power module and is used to dissipate heat from the silicon carbide power module.

3. The silicon carbide power module of claim 2, wherein, The first heat dissipation component includes a first heat dissipation channel and a heat sink; One end of the first heat dissipation channel is located on one side of the silicon carbide power module, and the other end is located on the side wall of the housing. The outer casing has heat dissipation holes on the side wall corresponding to the first heat dissipation channel; The heat sink is installed in the first heat dissipation channel, which can send the heat of the silicon carbide power module out of the housing through the first heat dissipation channel and the heat dissipation hole.

4. The silicon carbide power module of claim 3, wherein, The first heat dissipation channel has a U-shaped plate structure.

5. The silicon carbide power module of claim 2, wherein, A filter screen is provided on the outer casing, and the filter screen is located on the side wall of the outer casing opposite to the first heat dissipation component.

6. The silicon carbide power module of claim 1, wherein, The outer casing includes a bottom plate, a left side plate, a right side plate, a front plate, a rear plate, and a top cover plate; The bottom plate, the left side plate, the right side plate, the front plate, the rear plate, and the top cover plate together form a box structure; The electronic control integrated unit is disposed on the left side plate or the right side plate, and the energy storage plate is disposed on the bottom plate.

7. The silicon carbide power module of claim 6, wherein, A second heat dissipation component is provided on the upper cover plate; The upper cover plate has a second heat dissipation channel; The second heat dissipation component includes a heat pipe, which is disposed within the second heat dissipation channel.

8. The silicon carbide power module of claim 7, wherein, The top cover is made of metal.

9. The silicon carbide power module of claim 7, wherein, The second heat dissipation component is located on the upper cover plate at a position corresponding to the silicon carbide power module.

10. The silicon carbide power module of claim 1, wherein, An inductor is provided on the energy storage board.

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