A recycling ball-planting device

Abstract

The utility model relates to printing ball planting, specifically discloses a recycling type ball planting device, which comprises: a lifting recycling cover, which forms an open downward cover inner chamber; an air extraction system, which is connected to the cover inner chamber; a ball planting head, which is inserted into the cover inner chamber at the lower part and is provided with a ball planting cavity with an open downward bottom surface and connected to the cover inner chamber; a linear driving mechanism, which is connected to the lifting recycling cover at the driving end; wherein the lifting recycling cover is positively driven by the linear driving mechanism to move upward relative to the ball planting head until the bottom surface of the lifting recycling cover is flush with or higher than the bottom surface of the ball planting head in the lifting state; and the lifting recycling cover is reversely driven by the linear driving mechanism to move downward relative to the ball planting head until the bottom surface of the lifting recycling cover is lower than the bottom surface of the ball planting head in the lowering state. The recycling type ball planting device can effectively solve the problem that the existing ball planting device cannot recycle excess solder balls.

Description

Technical Field

[0001] This utility model relates to printed ball planting, and more particularly to a recyclable ball planting device. Background Technology

[0002] In the semiconductor packaging field, ball mounting is a key manufacturing process for package types such as BGA (Ball Grid Array) and CSP (Chip Scale Package). It is mainly used to deliver multiple solder balls to various pads for subsequent soldering operations.

[0003] In actual production, in order to ensure that every hole on the stencil has a solder ball, solder balls exceeding the number of holes on the stencil are usually placed in the ball-planting cavity. Therefore, after ball planting, the excess solder balls need to be recycled.

[0004] However, existing solder ball loading devices do not have a solder ball recycling function. Therefore, excess solder balls can only be discarded directly or recycled manually, resulting in a waste of materials and manpower.

[0005] This invention aims to improve existing solder ball loading devices to solve the problem that they cannot recycle excess solder balls.

[0006] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0007] One objective of this invention is to provide a recycling-type solder ball replanting device that can effectively solve the problem that existing solder ball replanting devices cannot recycle excess solder balls.

[0008] To achieve the above objectives, this utility model provides a recycling-type bulb-planting device, comprising:

[0009] A lifting and recovery hood, which encloses an inner cavity with its opening facing downwards;

[0010] An air extraction system, the air extraction system being connected to the inner chamber of the cover;

[0011] The ball-planting head has its lower part extending into the inner cavity of the cover, and the bottom surface of the ball-planting head has a ball-planting cavity with an opening facing downward and communicating with the inner cavity of the cover.

[0012] A linear drive mechanism is mounted on the ball-planting head, and the drive end of the linear drive mechanism is connected to the lifting and recovery cover.

[0013] in,

[0014] The lifting and recovery cover has a raised state in which it is driven forward by the linear drive mechanism to move upward relative to the planting head until the bottom surface of the lifting and recovery cover is level with or higher than the bottom surface of the planting head; and a lowered state in which it is driven backward by the linear drive mechanism to move downward relative to the planting head until the bottom surface of the lifting and recovery cover is lower than the bottom surface of the planting head.

[0015] Optionally, the inner cavity of the cover includes a cylindrical sealing wall for the up and down movement of the implanting head, and a conical clearance wall located below the cylindrical sealing wall;

[0016] The diameter of the conical clearance wall gradually increases downwards.

[0017] Optionally, the lower circumferential surface of the bulb head is a conical concave surface with a diameter that gradually decreases downwards.

[0018] Optionally, the conical clearance wall is provided with a recycling hole for the solder ball to pass through.

[0019] Optionally, the ball-planting head and the cylindrical sealing wall are connected in a sliding sealing connection.

[0020] Optionally, a sealing ring or a sealed sliding bearing may be provided between the ball-planting head and the cylindrical sealing wall.

[0021] Optionally, the top of the lifting recovery hood is provided with an air pipe connector that connects to the recovery hole.

[0022] Optionally, the air extraction system includes a solder ball recovery tank with an internal space and a recovery hose connecting the internal space to the air pipe connector.

[0023] Optionally, the solder ball recycling tank includes a recycling tank body with an upward-facing internal space, a tank cover plate detachably installed at the opening of the recycling tank body to seal the internal space, and a cover plate exhaust connector installed on the tank cover plate.

[0024] Optionally, the bottom surface of the lifting and recovery hood is provided with a sealing pad.

[0025] The beneficial effects of this utility model are as follows: It provides a recycling-type ball-planting device, the working process of which is as follows:

[0026] S10: Standard bulb planting stage

[0027] Initial state: The lifting and recovery hood is in a high position (bottom surface is higher than the bottom surface of the ball-planting head), and the ball-planting head descends to above the printed steel mesh.

[0028] Ball placement operation: The opening at the bottom of the ball placement cavity contacts the stencil, and the solder balls fall into the opening of the stencil by gravity or auxiliary pressure, completing the ball placement of the solder pads.

[0029] Residual Issues: After ball placement, a large number of unused solder balls will remain in the ball placement cavity (due to the limited number of openings in the stencil).

[0030] S20: Solder Ball Recycling Stage

[0031] Ball planting head lifting: After completing the ball planting, the ball planting head moves upward and detaches from the steel mesh surface.

[0032] The recovery hood is pressed down: The linear drive mechanism drives the lifting recovery hood to move down, so that its bottom surface is tightly attached to the top surface of the steel mesh, forming a closed recovery space (the inner cavity of the hood covers the ball planting cavity and the surface of the steel mesh).

[0033] Negative pressure recovery: When the air extraction system is activated, the negative pressure inside the shroud will suck up and recover all the solder balls remaining in the ball-planting chamber and the solder balls scattered on the surface of the steel mesh, thus preventing the solder balls from scattering or being wasted.

[0034] S30: Reset Phase

[0035] Recovery cover reset: After recovery is completed, the lifting recovery cover moves up to the high position to prepare for the next ball planting cycle.

[0036] Therefore, the recycling ball-planting device provided by this utility model can effectively solve the problem that existing ball-planting devices cannot recycle excess solder balls. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the top structure of the recycling-type ball-planting device provided in the embodiment;

[0039] Figure 2 This is a schematic diagram of the bottom structure of the recycling-type ball-planting device provided in the embodiment;

[0040] Figure 3 A schematic diagram of the recyclable ball-planting device provided in the embodiment, in its raised state;

[0041] Figure 4 This is a cross-sectional schematic diagram of the recycling-type ball-planting device provided in the embodiment.

[0042] In the picture:

[0043] 1. Lifting and recovery hood; 101. Inner chamber of the hood; 1011. Cylindrical sealing wall; 1012. Conical clearance wall; 102. Recovery hole; 103. Air pipe connector;

[0044] 2. Exhaust system; 201. Solder ball recycling tank; 2011. Recycling tank body; 2012. Tank cover; 2013. Cover exhaust connector; 202. Recycling hose;

[0045] 3. Ball-planting head; 301. Ball-planting cavity; 302. Conical closing surface;

[0046] 4. Linear drive mechanism. Detailed Implementation

[0047] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0048] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0049] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0050] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0051] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0052] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0053] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0054] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0055] See Figures 1-4 This utility model provides a recycling-type bulb planting device, comprising:

[0056] A lifting and recovery cover 1 is provided, which encloses an inner cavity 101 with its opening facing downwards.

[0057] An air extraction system 2 is connected to the inner chamber 101 of the cover.

[0058] The ball-planting head 3 has its lower part extending into the inner cavity 101 of the cover, and the bottom surface of the ball-planting head 3 has a ball-planting cavity 301 with an opening facing downward and communicating with the inner cavity 101 of the cover.

[0059] A linear drive mechanism 4 is mounted on the ball-planting head 3, and the drive end of the linear drive mechanism 4 is connected to the lifting and recovery cover 1.

[0060] in,

[0061] The lifting and recovery cover 1 has a raised state in which it is driven in the forward direction by the linear drive mechanism 4 to move upward relative to the planting head 3 until the bottom surface of the lifting and recovery cover 1 is level with or higher than the bottom surface of the planting head 3; and a lowered state in which it is driven in the reverse direction by the linear drive mechanism 4 to move downward relative to the planting head 3 until the bottom surface of the lifting and recovery cover 1 is lower than the bottom surface of the planting head 3.

[0062] The working process of the recycling-type pelleting device provided in this embodiment is as follows:

[0063] S10: Standard bulb planting stage

[0064] Initial state: The lifting and recovery cover 1 is in a high position (the bottom surface is higher than the bottom surface of the ball planting head 3), and the ball planting head 3 is lowered to above the printing steel mesh.

[0065] Ball placement operation: The opening at the bottom of the ball placement cavity 301 contacts the stencil, and the solder balls fall into the opening of the stencil by gravity or auxiliary pressure, thus completing the ball placement of the solder pads.

[0066] Residual Issues: After ball placement, a large number of unused solder balls will remain in the ball placement cavity 301 (due to the limited number of openings in the stencil).

[0067] S20: Solder Ball Recycling Stage

[0068] Ball planting head 3 is lifted: After completing the ball planting, the ball planting head 3 moves upward and detaches from the steel mesh surface.

[0069] The recovery cover is pressed down: The linear drive mechanism 4 drives the lifting recovery cover 1 to move down, so that its bottom surface is tightly attached to the top surface of the steel mesh, forming a closed recovery space (the inner cavity 101 of the cover covers the ball-planting cavity 301 and the surface of the steel mesh). Optionally, the bottom surface of the lifting recovery cover 1 is provided with a sealing pad to improve the airtightness between the lifting recovery cover 1 and the steel mesh, thereby improving the solder ball recovery efficiency.

[0070] Negative pressure recovery: When the air extraction system 2 is activated, the negative pressure in the inner chamber 101 of the cover will be used to extract and recover all the solder balls remaining in the ball-planting chamber 301 and the solder balls scattered on the surface of the steel mesh, so as to avoid the solder balls flying away or being wasted.

[0071] S30: Reset Phase

[0072] Recovery cover reset: After recovery is completed, the lifting recovery cover 1 moves up to reset to the high position, ready for the next ball planting cycle.

[0073] In this embodiment, the inner cavity 101 includes a cylindrical sealing wall 1011 for the up-and-down movement of the ball-planting head 3, and a conical clearance wall 1012 located below the cylindrical sealing wall 1011; wherein the diameter of the conical clearance wall 1012 gradually increases downwards. Further, the lower circumferential surface of the ball-planting head 3 is a conical constriction surface 302 with a diameter that gradually decreases downwards.

[0074] The conical clearance wall 1012 is provided with a recycling hole 102 for solder balls to pass through, and the top of the lifting recycling hood 1 is provided with an air pipe connector 103 connected to the recycling hole 102.

[0075] The design of the conical clearance wall 1012 and the conical closing surface 302 provides sufficient isolation space between the conical clearance wall 1012 and the ball planting head 3. Setting the recycling hole 102 on the conical clearance wall 1012 can effectively prevent the ball planting head 3 from blocking the recycling hole 102.

[0076] In this embodiment, the ball-planting head 3 and the cylindrical sealing wall surface 1011 are connected in a sliding and sealing connection. Optionally, a sealing ring or a sealed sliding bearing is provided between the ball-planting head 3 and the cylindrical sealing wall surface 1011.

[0077] In this embodiment, the air extraction system 2 includes a solder ball recovery tank 201 with an internal space and a recovery hose 202 that connects the internal space to the air pipe connector 103.

[0078] Optionally, the solder ball recycling tank 201 includes a recycling tank body 2011 with an upward-facing internal space, a tank cover 2012 detachably installed at the opening of the recycling tank body 2011 to seal the internal space, and a cover plate exhaust connector 2013 installed on the tank cover 2012.

[0079] Connect the vacuum pump's suction port to the cover plate suction connector 2013, and then sequentially connect the recovery tank 2011, recovery hose 202, air pipe connector 103, and recovery hole 102 to the inner chamber 101 of the cover, thereby recovering the solder balls in the inner chamber 101 of the cover into the tank space.

[0080] It should be noted that the linear drive mechanism mentioned in this utility model can be a cylinder, hydraulic cylinder, electric cylinder, or motor lead screw linear module, etc., and the rotary drive mechanism mentioned can be a brushed motor, brushless motor, or rotary cylinder, etc. This utility model does not limit the specific structural form of the linear drive mechanism and the rotary drive mechanism.

[0081] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A recycling ball implantation device, characterized by, include: A lifting and recovery cover (1) is provided, which encloses an inner cavity (101) with the opening facing downward. An air extraction system (2) is connected to the inner chamber (101) of the cover. The lower part of the bulb implantation head (3) extends into the inner cavity (101) of the cover, and the bottom surface of the bulb implantation head (3) is provided with a bulb implantation cavity (301) with the opening facing downward and connected to the inner cavity (101) of the cover. A linear drive mechanism (4) is installed on the ball planting head (3), and the drive end of the linear drive mechanism (4) is connected to the lifting and recovery cover (1). in, The lifting and recovery cover (1) has a raised state in which it is driven upward relative to the planting head (3) by the linear drive mechanism (4) in the forward direction until the bottom surface of the lifting and recovery cover (1) is level with or higher than the bottom surface of the planting head (3); and a lowered state in which it is driven downward relative to the planting head (3) by the linear drive mechanism (4) in the reverse direction until the bottom surface of the lifting and recovery cover (1) is lower than the bottom surface of the planting head (3).

2. The recycled-type ball implanting device according to claim 1, wherein The inner chamber (101) includes a cylindrical sealing wall (1011) for the up and down movement of the ball-planting head (3) and a conical clearance wall (1012) located below the cylindrical sealing wall (1011). The diameter of the conical clearance wall (1012) gradually increases downwards.

3. The recycled-type ball implanting device according to claim 2, wherein The lower circumferential surface of the bulb head (3) is a conical concave surface (302) with a diameter that gradually decreases downwards.

4. The recycled-type ball implanting device according to claim 2, wherein The conical clearance wall (1012) is provided with a recycling hole (102) for the solder ball to pass through.

5. The recycled-type ball implanting device according to claim 2, wherein The ball-planting head (3) and the cylindrical sealing wall (1011) are connected in a sliding seal.

6. The recycled-type ball implanting device according to claim 5, wherein A sealing ring or a sealed sliding bearing is provided between the ball-planting head (3) and the cylindrical sealing wall surface (1011).

7. The recycled-type ball implanting device according to claim 4, wherein The top of the lifting recovery hood (1) is provided with an air pipe connector (103) that connects to the recovery hole (102).

8. The recycled-type ball implanting device according to claim 7, wherein The air extraction system (2) includes a tin ball recycling tank (201) with an internal space, and a recycling hose (202) connecting the internal space to the air pipe connector (103).

9. The recycled-type ball implanting device according to claim 8, wherein The solder ball recycling tank (201) includes a recycling tank body (2011) with an upward-facing internal space, a tank cover plate (2012) detachably installed at the opening of the recycling tank body (2011) to seal the internal space, and a cover plate exhaust connector (2013) installed on the tank cover plate (2012).

10. The recycled-type ball implanting device according to claim 1, wherein The bottom surface of the lifting and recovery cover (1) is provided with a sealing pad.

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