A press plate structure and a lead frame press structure

Abstract

The utility model provides a kind of pressing plate structure and lead frame compression structure, for extruding lead frame in semiconductor packaging process, especially applicable to the soldering process of QFN long pin product. The pressing plate structure mainly includes substrate and the pressing plate of being set to the substrate. Main groove and accommodating groove are equipped on the pressing plate, main groove is used to avoid the main part of lead frame, accommodating groove is used to accommodate the connecting rib on lead frame, to avoid the bruise or deformation to connecting rib in compression process. In this way, by setting accommodating groove, the direct contact and pressure of connecting rib by pressing plate in compression process are effectively avoided, to prevent the deformation or scratch of connecting rib, improve product yield and signal transmission performance, solve the technical problem of low packaging efficiency when semiconductor product is manufactured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a pressure plate structure and a lead frame pressing structure. Background Technology

[0002] In Quad Flat No-Leader (QFN) package manufacturing, the connecting ribs (also known as "dams") of long leadframes are typically designed with a fully etched back side due to process requirements. Traditional wire bonding plates have a completely flat surface in contact with the leadframe. With this design, when the platen closes with the leadframe, the platen exerts a downward force on the connecting ribs, causing upward or downward deformation or scratches, affecting product yield and signal conduction performance.

[0003] Especially in long-lead quad flat no-lead (QFN) packages, the deformation of the connecting ribs is more prominent, which limits the further extension of the connecting ribs and leads, thereby limiting the reduction of the wire bonding distance and the improvement of chip signal conduction performance. Utility Model Content

[0004] The purpose of this invention is to overcome the above-mentioned technical deficiencies and provide a pressure plate structure and a lead frame pressing structure to solve the technical problem of low packaging efficiency in semiconductor product manufacturing.

[0005] To achieve the above technical objectives, the present invention adopts the following technical solution: a pressure plate structure is provided for extruding a lead frame, the pressure plate structure comprising: a base plate; a pressure plate protruding from the base plate; a main groove on the pressure plate for avoiding the lead frame; the main groove penetrating the pressure plate; and a receiving groove recessed on the surface of the pressure plate. When the pressure plate and the lead frame are closed, the connecting rib is located in the receiving groove to avoid the pressure plate applying pressure to the connecting rib.

[0006] Furthermore, the cross-sectional shape of the receiving groove matches the cross-sectional shape of the connecting rib.

[0007] Furthermore, one end of the receiving groove is connected to the main groove; the other end of the receiving groove is connected to the outside of the pressure plate.

[0008] Furthermore, there are multiple main slots; the multiple main slots are distributed at intervals; there are multiple receiving slots; each main slot is surrounded by a corresponding receiving slot; the receiving slots corresponding to two adjacent main slots are interconnected.

[0009] Furthermore, the pressure plate has a pressing surface for abutting against the conductor frame; along a direction perpendicular to the pressing surface, the depth H of the receiving groove is greater than the height h of the connecting rib.

[0010] Furthermore, the difference between the depth H of the receiving groove and the height h of the connecting rib is less than 1 / 5 of the height h of the connecting rib.

[0011] Furthermore, the pressure plate structure has a preset direction, which is parallel to the pressing surface; the preset direction is perpendicular to the extension direction of the receiving groove; along the preset direction, the width L of the receiving groove is greater than the width l of the connecting rib.

[0012] Furthermore, the difference between the width L of the receiving groove and the width l of the connecting rib is less than 1 / 10 of the width l of the connecting rib.

[0013] A conductor frame pressing structure includes a pressure plate structure and a conductor frame, wherein the pressure plate structure is the aforementioned pressure plate structure.

[0014] Beneficial effects: This invention relates to a pressure plate structure used for extruding leadframes during semiconductor packaging, particularly suitable for wire bonding processes in QFN long-lead products. The pressure plate structure mainly comprises a substrate and a pressure plate protruding from the substrate. The pressure plate has a main groove and a receiving groove. The main groove avoids the main body of the leadframe, while the receiving groove accommodates the connecting ribs on the leadframe, thus preventing damage or deformation to the connecting ribs during the pressing process. By providing the receiving groove, direct contact and pressure between the pressure plate and the connecting ribs during pressing are effectively avoided, preventing deformation or scratches to the connecting ribs, improving product yield and signal transmission performance, and solving the technical problem of low packaging efficiency in semiconductor product manufacturing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the pressure plate structure used in an embodiment of this utility model; Figure 2 This is a side view of the pressure plate structure used in this embodiment of the utility model; Figure 3 This is a schematic diagram of the receiving groove of the pressure plate structure used in the embodiment of this utility model; Figure 4 This is a schematic diagram of the conductor frame with the conductor frame pressing structure used in this embodiment of the utility model; Figure 5 This is a schematic cross-sectional view of the receiving groove of the pressure plate structure used in this embodiment of the utility model.

[0016] The above figures include the following reference numerals: 2. Conductor frame; 11. Substrate; 12. Pressure plate; 121. Main slot; 122. Receiving tank; 123. Pressing surface; 21. Connecting reinforcement bars. Detailed Implementation

[0017] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0018] See Figures 1 to 5 According to an embodiment of the present invention, a pressure plate structure is provided for pressing a lead frame 2. The pressure plate structure includes: a base plate 11; a pressure plate 12 protruding from the base plate 11; a main groove 121 for avoiding the lead frame 2 on the pressure plate 12; the main groove 121 penetrating the pressure plate 12; and a receiving groove 122 recessed on the surface of the pressure plate 12. When the pressure plate 12 is closed with the lead frame 2, the connecting rib 21 is located in the receiving groove 122 to avoid the pressure plate 12 applying pressure to the connecting rib 21.

[0019] Specifically, the pressure plate structure of this embodiment is used to compress the lead frame 2 during semiconductor packaging, and is particularly suitable for the wire bonding process of QFN long-lead products. The pressure plate structure mainly includes a substrate 11 and a pressure plate 12 protruding from the substrate 11. The pressure plate 12 is provided with a main groove 121 and a receiving groove 122. The main groove 121 is used to avoid the main body of the lead frame 2, and the receiving groove 122 is used to accommodate the connecting ribs 21 on the lead frame 2, thereby preventing damage or deformation of the connecting ribs 21 during the pressing process. Thus, by providing the receiving groove 122, direct contact and pressure between the pressure plate 12 and the connecting ribs 21 during the pressing process are effectively avoided, thereby preventing deformation or scratches of the connecting ribs 21, improving product yield and signal transmission performance, and solving the technical problem of low packaging efficiency in semiconductor product manufacturing.

[0020] See Figure 5 In the pressure plate structure of this embodiment, the cross-sectional shape of the receiving groove 122 matches the cross-sectional shape of the connecting rib 21.

[0021] The matching design of the cross-sectional shape allows the connecting rib 21 to fall more stably into the receiving groove 122, further reducing the risk of crushing caused by misalignment or shaking.

[0022] See Figure 3 In the pressure plate structure of this embodiment, one end of the receiving groove 122 is connected to the main groove 121; the other end of the receiving groove 122 extends to the outside of the pressure plate 12.

[0023] With the above configuration, the interconnected design makes it easy to set up multiple extrusion positions in a limited space, and the distribution of the main slot 121 will not be affected by the setting of the receiving slot 122, thus improving the space utilization rate.

[0024] See Figure 1 , Figure 3 In the pressure plate structure of this embodiment, there are multiple main slots 121; the multiple main slots 121 are distributed at intervals; there are multiple receiving slots 122; each main slot 121 is surrounded by a corresponding receiving slot 122; the receiving slots 122 corresponding to two adjacent main slots 121 are interconnected. This multi-slot interconnection design is suitable for multi-pin leadframes 2, improving pressing uniformity and structural stability, and is especially suitable for long-pin QFN products.

[0025] See Figure 5 In the pressure plate structure of this embodiment, the pressure plate 12 has a pressing surface 123 for abutting against the conductor frame 2; along the direction perpendicular to the pressing surface 123, the depth H of the receiving groove 122 is greater than the height h of the connecting rib 21. In this way, the depth difference ensures that the connecting rib 21 is completely contained in the groove, avoiding any part being exposed and causing pressure damage.

[0026] In the pressure plate structure of this embodiment, the difference between the depth H of the receiving groove 122 and the height h of the connecting rib 21 is less than 1 / 5 of the height h of the connecting rib 21.

[0027] Specifically, the depth difference Hh is less than 1 / 5 of the height h of the connecting rib 21. In this way, the depth difference is strictly controlled to ensure that the connecting rib 21 is fully accommodated, while avoiding excessive groove depth that would affect the structural strength of the pressure plate.

[0028] In the pressure plate structure of this embodiment, see Figure 3 , Figure 5 The pressure plate structure has a preset direction, the preset direction (see...) Figure 3 The predetermined direction is parallel to the pressing surface 123; the predetermined direction is perpendicular to the extension direction of the receiving groove 122; along the predetermined direction, the width L of the receiving groove 122 is greater than the width l of the connecting rib 21. In this way, the width difference ensures that the connecting rib 21 can also be fully accommodated in the width direction, avoiding pressure damage caused by positional deviation.

[0029] See Figure 3 , Figure 5 In the pressure plate structure of this embodiment, the difference between the width L of the receiving groove 122 and the width l of the connecting rib 21 is less than 1 / 10 of the width l of the connecting rib 21. Precisely controlling the width difference ensures both the receiving effect and avoids the groove width being too large, which would affect the structural integrity and pressing stability of the pressure plate.

[0030] Specifically, the width difference Ll is less than 1 / 10 of the width l of the connecting rib 21. This allows for precise control of the width difference, ensuring both adequate accommodating effect and preventing excessively wide grooves from affecting the structural integrity and pressing stability of the pressure plate.

[0031] The conductor frame pressing structure of this embodiment includes a pressure plate structure and a conductor frame 2, wherein the pressure plate structure is the pressure plate structure described above.

[0032] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0033] Optionally, specific examples in this embodiment can refer to the examples described in the above embodiments, and will not be repeated here.

[0034] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0035] In the above embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0036] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A press plate structure for pressing a lead frame (2), characterized by, The pressure plate structure includes: substrate(11); A pressure plate (12) protrudes from the substrate (11); the pressure plate (12) is provided with a main groove (121) for avoiding the lead frame (2); the main groove (121) penetrates the pressure plate (12); the pressure plate (12) is provided with a receiving groove (122) recessed into the surface of the pressure plate (12). When the pressure plate (12) is closed with the conductor frame (2), the connecting rib (21) is located in the receiving groove (122).

2. The pressure plate structure according to claim 1, characterized in that, The cross-sectional shape of the receiving groove (122) matches the cross-sectional shape of the connecting rib (21).

3. The platen structure of claim 1, wherein One end of the receiving groove (122) is connected to the main groove (121); the other end of the receiving groove (122) is connected to the outside of the pressure plate (12).

4. The platen structure of claim 1, wherein There are multiple main slots (121); the multiple main slots (121) are distributed at intervals; there are multiple receiving slots (122); each main slot (121) is surrounded by a corresponding receiving slot (122); the receiving slots (122) corresponding to two adjacent main slots (121) are interconnected.

5. The platen structure of claim 1, wherein The pressure plate (12) has a pressing surface (123) for abutting against the conductor frame (2); along the direction perpendicular to the pressing surface (123), the depth H of the receiving groove (122) is greater than the height h of the connecting rib (21).

6. The platen structure of claim 5, wherein The difference between the depth H of the receiving groove (122) and the height h of the connecting rib (21) is less than 1 / 5 of the height h of the connecting rib (21).

7. The platen structure of claim 5, wherein The pressure plate structure has a preset direction, which is parallel to the pressing surface (123); the preset direction is perpendicular to the extension direction of the receiving groove (122); along the preset direction, the width L of the receiving groove (122) is greater than the width l of the connecting rib (21).

8. The platen structure of claim 7, wherein The difference between the width L of the receiving groove (122) and the width l of the connecting rib (21) is less than 1 / 10 of the width l of the connecting rib (21).

9. A lead frame press structure comprising a press plate structure and a lead frame (2), characterized in that, The pressure plate structure is the pressure plate structure according to any one of claims 1 to 8.

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