A semiconductor packaging structure

Abstract

This utility model discloses a semiconductor packaging structure, including: a package shell, pins, a protective mechanism, and a moving mechanism; the protective mechanism is disposed at both ends of the package shell, and includes a protective part and a rotating part. The protective part is sleeved with the outer wall of the pin, and the rotating part is fixedly connected to the end of the protective part near the package shell. The rotating part is used to drive the protective part to rotate. This utility model provides protective mechanisms at both ends of the package shell, fixes the package shell to the circuit board through the pins, rotates the protective shell to sleeve the outer wall of the pin, and drives the rotating rod to rotate through the movement of the protective shell. The rotating rod drives the moving rod to move one end of the moving rod to the position of the fixed block. The spring force pushes the push plate to move, and the push plate drives the fixed block to move, so that the fixed block and the moving rod are interlocked and connected, thereby fixing the position of the protective shell and protecting the pins to prevent damage.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging structure. Background Technology

[0002] Semiconductor packaging structure refers to the structure that isolates a semiconductor chip from the external environment and provides functions such as mechanical support, thermal management, and signal connection. The packaging structure plays a crucial role in the performance, reliability, and application of semiconductor devices.

[0003] Existing semiconductor packaging structures protect the semiconductor from external environmental influences during use by using a package shell. The packaged semiconductor is then fixed to the circuit board via pins. However, since the package shell does not protect the pins, they are easily deformed or damaged by collisions and friction when other components are installed, which affects the use of the semiconductor. In view of this, this solution proposes a semiconductor packaging structure to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor packaging structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor packaging structure, comprising: The encapsulation shell has rotating grooves at each of its end corners; Pins, wherein multiple pins are respectively inserted and connected to both ends of the package housing; A protective mechanism is provided at both ends of the packaging shell. The protective mechanism includes a protective part and a rotating part. The protective part is sleeved with the outer wall of the pin. The rotating part is fixedly connected to the end of the protective part near the packaging shell. The rotating part is used to drive the protective part to rotate. A moving mechanism is disposed within a housing. The moving mechanism includes a moving part and a fixed part. One end of the moving part is hinged to the end of the rotating part away from the protective part. The fixed part is inserted and connected to the end of the moving part away from the rotating part. The fixed part is used to fix the moving part.

[0006] Preferably, the protective part includes a protective shell, and a plurality of the protective shells are respectively disposed at both ends of the encapsulation shell. The plurality of the protective shells are respectively sleeved on the outer wall of a plurality of pins, and the end of the plurality of protective shells near the encapsulation shell is fixedly connected to the rotating part.

[0007] Preferably, the rotating part includes: A connecting rod, one end of which is fixedly connected to the end of the protective shell near the encapsulation shell, and the other end of which is inserted into the rotating groove; A rotating rod, one end of which is fixedly connected to the end of a connecting rod away from the protective shell, and the other end of which passes through the encapsulation shell and is hinged to the moving part.

[0008] Preferably, the movable part includes a movable rod disposed within the encapsulation shell, one end of the movable rod being hinged to the end of the rotating rod away from the connecting rod, and the end of the movable rod away from the rotating rod being inserted and connected to the fixed part.

[0009] Preferably, the fixing part includes: A pusher plate is disposed inside the encapsulation shell, and the outer wall of the pusher plate is slidably inserted into the inner wall of the encapsulation shell; A fixing block, one end of which is fixedly connected to the end of the push plate near the outer wall of the encapsulation shell, and the other end of which is inserted and connected to the end of the moving rod away from the rotating rod.

[0010] Preferably, the outer wall of the encapsulation shell is provided with a pressing groove, a button is fixedly installed at one end of the push plate near the fixing block, the end of the button away from the push plate extends out of the pressing groove, a spring is provided inside the encapsulation shell, one end of the spring is fixedly connected to the inner wall of the encapsulation shell, and the other end of the spring is fixedly connected to the end of the push plate away from the fixing block.

[0011] Preferably, a limiting groove is provided inside the encapsulation shell, and a sliding rod is slidably inserted into the limiting groove. The end of the sliding rod away from the limiting groove is fixedly connected to the outer wall of the moving rod.

[0012] The technical effects and advantages of this utility model are as follows: This invention features protective mechanisms at both ends of the encapsulation box. The encapsulation box is fixed to the circuit board via pins. Rotating the protective shell causes it to engage with the outer wall of the pins. The movement of the protective shell drives a rotating rod, which in turn moves a movable rod, one end of which moves to a fixed block. A spring force then pushes a push plate, which in turn moves a fixed block, connecting it to the movable rod. This fixes the protective shell in place, protecting the pins and preventing damage. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a cross-sectional view of the entire utility model.

[0015] Figure 3 This is a cross-sectional view of the movable rod of this utility model.

[0016] Figure 4 This is a cross-sectional view of the fixing part of this utility model.

[0017] Figure 5 This is a cross-sectional view of the protective mechanism of this utility model.

[0018] In the diagram: 1. Encapsulation shell; 2. Pin; 3. Protective shell; 4. Button; 5. Connecting rod; 6. Rotating rod; 7. Moving rod; 8. Push plate; 9. Fixing block; 10. Sliding rod; 11. Spring. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] refer to Figure 1-5 As shown: Example 1: This utility model provides a semiconductor packaging structure, including: The encapsulation shell 1 has rotating grooves at each of its end corners; Pin 2, multiple pins 2 are respectively inserted and connected to both ends of the package shell 1; It should be noted that pin 2 is inserted and connected to both ends of the package shell 1. The semiconductor is placed inside the package shell 1 and is fixedly connected to pin 2. The package shell 1 encapsulates and protects the semiconductor. The package shell 1 is placed on the circuit board. The semiconductor inside the package shell 1 is connected to the circuit board through pin 2. The protective part protects pin 2 to prevent damage to pin 2. In embodiment two, the present invention provides a protective mechanism applied to a semiconductor packaging structure in embodiment one. The protective mechanism is disposed at both ends of the packaging shell 1. The protective mechanism includes a protective part and a rotating part. The protective part is sleeved with the outer wall of the pin 2. The rotating part is fixedly connected to the end of the protective part near the packaging shell 1. The rotating part is used to drive the protective part to rotate.

[0021] Specifically, the protective part includes a protective shell 3, multiple protective shells 3 are respectively disposed at both ends of the encapsulation shell 1, multiple protective shells 3 are respectively sleeved on the outer wall of multiple pins 2, and the end of multiple protective shells 3 near the encapsulation shell 1 is fixedly connected to the rotating part. Specifically, the rotating part includes: Connecting rod 5, one end of which is fixedly connected to the end of the protective shell 3 near the encapsulation shell 1, and the other end of the connecting rod 5 is inserted into the rotating groove; Rotating rod 6, one end of which is fixedly connected to the end of connecting rod 5 away from protective shell 3, and the other end of rotating rod 6 is inserted into encapsulation shell 1 and hinged to moving part; It should be noted that the protective shell 3 is set at both ends of the encapsulation shell 1. The end of the protective shell 3 closer to the encapsulation shell 1 is fixedly connected to the connecting rod 5, and the end of the connecting rod 5 away from the protective shell 3 is fixedly connected to the rotating rod 6. The end of the protective shell 3 away from the connecting rod 5 is sleeved on the outer wall of the pin 2. The encapsulation shell 1 is placed on the circuit board, and the semiconductor in the encapsulation shell 1 is connected to the circuit board through the pin 2. The protective shell 3 is rotated and pushed so that the protective shell 3 is sleeved on the outer wall of the pin 2. The protective shell 3 protects the pin 2 and prevents the pin 2 from being damaged. The moving mechanism is housed within the enclosure 1. The moving mechanism includes a moving part and a fixed part. One end of the moving part is hinged to the end of the rotating part furthest from the protective part. The fixed part is inserted into the end of the moving part furthest from the rotating part and is used to fix the moving part. Specifically, the movable part includes a movable rod 7, which is disposed inside the encapsulation shell 1. One end of the movable rod 7 is hinged to the end of the rotating rod 6 away from the connecting rod 5, and the end of the movable rod 7 away from the rotating rod 6 is inserted and connected to the fixed part. Specifically, the fixing part includes: A pusher plate 8 is disposed inside the encapsulation shell 1, and the outer wall of the pusher plate 8 is slidably inserted into the inner wall of the encapsulation shell 1. The fixing block 9 has one end fixedly connected to the end of the push plate 8 near the outer wall of the encapsulation shell 1, and the other end of the fixing block 9 is inserted and connected to the end of the moving rod 7 away from the rotating rod 6. Furthermore, a limiting groove is provided inside the encapsulation shell 1, and a sliding rod 10 is slidably inserted into the limiting groove. The end of the sliding rod 10 away from the limiting groove is fixedly connected to the outer wall of the moving rod 7. It should be noted that the movable rod 7 is located inside the encapsulation shell 1. One end of the movable rod 7 is hinged to the end of the rotating rod 6 away from the connecting rod 5, and the other end of the movable rod 7 is inserted into the fixing block 9. The end of the fixing block 9 away from the movable rod 7 is fixedly connected to the push plate 8. The outer wall of the push plate 8 is slidably inserted into the inner wall of the encapsulation shell 1. One end of the sliding rod 10 is inserted into the limiting groove, and the other end of the sliding rod 10 is fixedly connected to the outer wall of the movable rod 7 near the fixing block 9. The encapsulation shell 1 is placed on the circuit board, and the semiconductor inside the encapsulation shell 1 is connected to the circuit board through the pin 2. The protective shell 3 is rotated, and the rotation of the protective shell 3 drives the circuit board to rotate. The connecting rod 5 rotates, which drives the rotating rod 6 to rotate, making the rotating rod 6 and the moving rod 7 parallel to each other. This pushes the protective shell 3, causing the protective shell 3 to fit onto the outer wall of the pin 2. The movement of the protective shell 3 pushes the rotating rod 6 to move, which in turn drives the moving rod 7 to move. The end of the moving rod 7 away from the rotating rod 6 moves to the fixed block 9, pushing the push plate 8. The movement of the push plate 8 drives the fixed block 9 to move, allowing the fixed block 9 to interlock with the moving rod 7. The fixed block 9 fixes the moving rod 7, and the protective shell 3 protects the pin 2, preventing it from being deformed or damaged due to collision and friction. Specifically, a pressing groove is provided on the outer wall of the encapsulation shell 1, a button 4 is fixedly installed on one end of the push plate 8 near the fixing block 9, and the end of the button 4 away from the push plate 8 protrudes from the pressing groove. A spring 11 is provided inside the encapsulation shell 1, one end of the spring 11 is fixedly connected to the inner wall of the encapsulation shell 1, and the other end of the spring 11 is fixedly connected to the end of the push plate 8 away from the fixing block 9. It should be noted that the end of the push plate 8 near the fixing block 9 is fixedly connected to one end of the button 4, and the end of the button 4 away from the push plate 8 protrudes from the pressing groove. The spring 11 is set inside the encapsulation shell 1, with one end of the spring 11 fixedly connected to the end of the push plate 8 away from the button 4, and the other end of the spring 11 fixedly connected to the inner wall of the encapsulation shell 1. Pressing the button 4 moves the push plate 8, which in turn moves the fixing block 9, moving it away from the outer wall of the encapsulation shell 1. This places the encapsulation shell 1 on the circuit board, and the semiconductor inside the encapsulation shell 1 is connected to the circuit board through the pin 2. Rotating the protective shell 3 rotates the connecting rod 5. Rotating the connecting rod 5 causes the rotating rod 6 to rotate, making the rotating rod 6 and the moving rod 7 parallel to each other. This pushes the protective shell 3, causing the protective shell 3 to fit onto the outer wall of the pin 2. The movement of the protective shell 3 pushes the rotating rod 6 to move, which in turn moves the moving rod 7, causing the end of the moving rod 7 away from the rotating rod 6 to move to the fixed block 9. Releasing the button 4 causes the spring 11 to push the push plate 8 to move, which in turn moves the fixed block 9, causing the fixed block 9 to interlock with the moving rod 7. The fixed block 9 fixes the moving rod 7, and the protective shell 3 protects the pin 2, preventing it from being deformed or damaged due to collision and friction.

[0022] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor packaging structure, characterized in that, include: The encapsulation shell (1) has rotating grooves at each end corner; Pins (2), and multiple pins (2) are respectively inserted and connected to both ends of the package shell (1); The protective mechanism is disposed at both ends of the encapsulation shell (1). The protective mechanism includes a protective part and a rotating part. The protective part is sleeved with the outer wall of the pin (2). The rotating part is fixedly connected to the end of the protective part near the encapsulation shell (1). The rotating part is used to drive the protective part to rotate. The moving mechanism is disposed inside the encapsulation shell (1). The moving mechanism includes a moving part and a fixed part. One end of the moving part is hinged to the end of the rotating part away from the protective part. The fixed part is inserted and connected to the end of the moving part away from the rotating part. The fixed part is used to fix the moving part.

2. The semiconductor packaging structure according to claim 1, characterized in that, The protective part includes a protective shell (3), and multiple protective shells (3) are respectively disposed at both ends of the encapsulation shell (1). The multiple protective shells (3) are respectively sleeved on the outer wall of multiple pins (2). The end of the multiple protective shells (3) near the encapsulation shell (1) is fixedly connected to the rotating part.

3. A semiconductor packaging structure according to claim 2, characterized in that, The rotating part includes: Connecting rod (5), one end of which is fixedly connected to the end of the protective shell (3) near the encapsulation shell (1), and the other end of which is inserted into the rotating groove; Rotating rod (6), one end of which is fixedly connected to the end of connecting rod (5) away from protective shell (3), and the other end of rotating rod (6) is inserted into encapsulation shell (1) and hinged to moving part.

4. A semiconductor packaging structure according to claim 3, characterized in that, The movable part includes a movable rod (7), which is disposed inside the encapsulation shell (1). One end of the movable rod (7) is hinged to the end of the rotating rod (6) away from the connecting rod (5), and the end of the movable rod (7) away from the rotating rod (6) is inserted and connected to the fixed part.

5. A semiconductor packaging structure according to claim 4, characterized in that, The fixing part includes: A push plate (8) is disposed inside the encapsulation shell (1), and the outer wall of the push plate (8) is slidably inserted into the inner wall of the encapsulation shell (1); A fixing block (9) is fixedly connected at one end to the end of the push plate (8) near the outer wall of the encapsulation shell (1), and the other end of the fixing block (9) is inserted and connected to the end of the moving rod (7) away from the rotating rod (6).

6. A semiconductor packaging structure according to claim 5, characterized in that, The outer wall of the encapsulation shell (1) is provided with a pressing groove. A button (4) is fixedly installed on one end of the push plate (8) near the fixing block (9). The end of the button (4) away from the push plate (8) extends out of the pressing groove. A spring (11) is provided inside the encapsulation shell (1). One end of the spring (11) is fixedly connected to the inner wall of the encapsulation shell (1), and the other end of the spring (11) is fixedly connected to the end of the push plate (8) away from the fixing block (9).

7. A semiconductor packaging structure according to claim 4, characterized in that, The encapsulation shell (1) is provided with a limiting groove, and a sliding rod (10) is slidably inserted in the limiting groove. The end of the sliding rod (10) away from the limiting groove is fixedly connected to the outer wall of the moving rod (7).

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