Chip from bottom to top bonding system

Abstract

The utility model belongs to semiconductor material processing equipment technical field discloses a kind of chip from bottom to top bonding system, it includes cavity, vacuumizing device, wafer fixed platform, chip fixed platform and driving device. Cavity includes first chamber and second chamber being side by side along first direction and being interconnected, the top of first chamber along second direction is equipped with air inlet, vacuumizing device includes the vacuumizing main body and vacuumizing pipeline being connected, vacuumizing main body is set to cavity outside, vacuumizing pipeline passes through cavity and extends into second chamber, and vacuumizing pipeline is close to the bottom of second chamber setting. Wafer fixed platform is set to the top of second chamber. Chip fixed platform is set to the bottom of second chamber. Driving device is connected to wafer fixed platform and / or chip fixed platform. The utility model can reduce the risk that wafer is bonded surface falls into particle, guarantee bonding effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing equipment technology, and in particular to a chip bonding system from bottom to top. Background Technology

[0002] The bonding process between a chip and a bonding material refers to the process of tightly bonding a chip to a bonding material using physical or chemical means. This process involves the picking up and transporting of the chip.

[0003] In the existing chip-wafer bonding process, the wafer is usually placed at the bottom with the bonding surface facing upwards, and the chip is bonded to the wafer from top to bottom. Placing the bonding surface of the wafer facing upwards for a long time increases the risk of particles falling in, introducing voids at the bonding interface, and thus affecting the bonding effect. Utility Model Content

[0004] The purpose of this invention is to provide a chip bonding system from bottom to top, which can reduce the risk of chips falling into the bonding surface of the wafer and ensure bonding effect.

[0005] To achieve this objective, the present invention adopts the following technical solution: This utility model provides a chip bonding system from bottom to top, comprising: The cavity includes a first chamber and a second chamber arranged side by side and interconnected along a first direction. The first chamber has an air inlet at its top along a second direction, and the first direction intersects the second direction. A vacuum pumping device includes a vacuum pumping body and a vacuum pumping pipeline connected to each other. The vacuum pumping body is disposed outside the cavity, and the vacuum pumping pipeline extends through the cavity into the second cavity. The vacuum pumping pipeline is disposed near the bottom of the second cavity along the second direction. A wafer fixing platform is disposed at the top of the second chamber along the second direction. The wafer fixing platform is used to selectively fix the wafer so that the bonding surface of the wafer faces downward. A chip fixing platform is disposed at the bottom of the second chamber along the second direction. The chip fixing platform is used to selectively fix the chip so that the bonding surface of the chip faces upward. A driving device, connected to the wafer fixing platform and / or the chip fixing platform, is used to drive the wafer fixing platform and the chip fixing platform to move relative to each other.

[0006] As an optional technical solution for a bottom-up chip bonding system, the vacuum pipeline includes a suction port, which is arranged around the periphery of the chip fixing platform.

[0007] As an optional technical solution for a bottom-up chip bonding system, along the second direction, the projection of the suction hole and the projection of the wafer fixing platform overlap.

[0008] As an optional technical solution for a bottom-up chip bonding system, the second chamber has a through hole at the bottom along the second direction, and the vacuum tube extends into the second chamber through the through hole.

[0009] As an optional technical solution for a bottom-up chip bonding system, the first chamber is provided with an air outlet at the bottom along the second direction, and the opening area of ​​the air outlet is smaller than the opening area of ​​the air inlet.

[0010] As an optional technical solution for a bottom-up chip bonding system, the air outlet includes multiple air holes, and at least a portion of the projections of the air holes along the second direction overlap with at least a portion of the projections of the air inlet along the second direction.

[0011] As an optional technical solution for a bottom-up chip bonding system, it also includes a loading platform, which is disposed in the first chamber. Along the second direction, the projection of the loading platform and the projection of the air inlet at least partially overlap.

[0012] As an optional technical solution for a bottom-up chip bonding system, the cavity further includes a feed port, the opening direction of which intersects with the opening direction of the air inlet, and the feed port is used to pass wafers and / or chips.

[0013] As an optional technical solution for a bottom-up chip bonding system, the cavity also includes an inspection port, the opening direction of which, the opening direction of the feed port, and the opening direction of the air inlet intersect each other.

[0014] As an optional technical solution for a bottom-up chip bonding system, the wafer fixing platform includes a marble base and an adsorption component disposed on the top of the marble base facing away from the second chamber. The adsorption component is used to selectively fix the wafer.

[0015] Beneficial effects: This invention provides a bottom-up chip bonding system, comprising a cavity, a vacuum device, a wafer fixing platform, a chip fixing platform, and a driving device. The cavity includes a first chamber and a second chamber arranged side-by-side and interconnected along a first direction. The first chamber has an air inlet at its top along a second direction. The vacuum device includes a vacuum body and a vacuum pipeline connected to each other. The vacuum body is located outside the cavity, and the vacuum pipeline extends through the cavity into the second chamber, positioned near the bottom of the second chamber along the second direction. The wafer fixing platform is located at the top of the second chamber along the second direction and is used to selectively fix the wafer with the bonding surface facing down. The chip fixing platform is located at the bottom of the second chamber and is used to selectively fix the chip with the bonding surface facing up. The driving device is connected to the wafer fixing platform and / or the chip fixing platform and is used to drive the wafer fixing platform and the chip fixing platform to move relative to each other. By using the above system, the introduction of particles at the bonding interface during chip-wafer bonding can be reduced, improving bonding quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the internal structure of the chip bonding system from bottom to top provided in this embodiment of the utility model; Figure 2 This is a top view of the chip bonding system from bottom to top provided in this embodiment of the utility model; Figure 3 This is a top view of another chip bonding system from bottom to top provided in this embodiment of the utility model; Figure 4 This is a front view structural diagram of the chip bonding system from bottom to top provided in this embodiment of the utility model; Figure 5 This is a side view of the chip bonding system from bottom to top provided in this embodiment of the utility model.

[0017] In the picture: 10. Cavity; 11. First chamber; 12. Second chamber; 13. Air inlet; 14. Air outlet; 141. Air outlet hole; 15. Through hole; 16. Feed inlet; 17. Inspection port; 20. Vacuum pumping device; 21. Vacuum pumping body; 22. Vacuum pumping pipeline; 221. Suction port; 30. Wafer holding platform; 31. Marble base; 32. Adsorption assembly; 40. Chip mounting platform; 50. Drive unit; 60. Loading platform; X, first direction; Z, second direction; Y, third direction. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0019] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0021] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0022] Figure 1 This is a schematic diagram of the internal structure of the chip bonding system from bottom to top provided in this embodiment of the utility model. Figure 2 This is a top view of the chip bonding system provided in this embodiment of the present invention. Figure 3 This is a top view of another chip bonding system from bottom to top provided in this embodiment of the utility model. Figure 4 This is a front view structural diagram of the chip bonding system from bottom to top provided in this embodiment of the utility model. Figure 5 This is a side view of the chip bonding system from bottom to top provided in this embodiment of the utility model.

[0023] like Figures 1 to 5 As shown, this embodiment provides a bottom-up chip bonding system, which includes a cavity 10, a vacuum device 20, a wafer fixing platform 30, a chip fixing platform 40, and a driving device 50. The cavity 10 includes a first chamber 11 and a second chamber 12 arranged side-by-side and interconnected along a first direction X. The first chamber 11 has an air inlet 13 at its top along a second direction Z, where the first direction X intersects the second direction Z. The vacuum device 20 includes a vacuum body 21 and a vacuum pipeline 22 connected together. The vacuum body 21 is disposed outside the cavity 10, and the vacuum pipeline 22 extends through the cavity 10 into the second chamber 12, located near the bottom of the second chamber 12 along the second direction. The wafer fixing platform 30 is disposed at the top of the second chamber 12 along the second direction, and is used to selectively fix the wafer with the bonding surface facing downwards. A chip fixing platform 40 is disposed at the bottom of the second chamber 12 along the second direction. The chip fixing platform 40 is used to selectively fix the chip with the bonding surface of the chip facing upward. A driving device 50 is connected to the wafer fixing platform 30 and / or the chip fixing platform 40 and is used to drive the wafer fixing platform 30 and the chip fixing platform 40 to move relative to each other.

[0024] For example, the cavity 10 has a hollow structure and includes a first chamber 11 and a second chamber 12. The first chamber 11 and the second chamber 12 are arranged side by side along a first direction X. A connecting channel may be provided between the first chamber 11 and the second chamber 12, or no obstruction structure may be provided between them. Optionally, the shell may be a frame structure, such as a sheet metal frame.

[0025] The top and bottom of the first chamber 11 along the second direction Z can be understood as the ends of the first chamber 11 on both sides along the second direction Z. Optionally, the second direction Z is parallel to the vertical direction. The top and bottom of the second chamber 12 along the second direction Z can be understood as the ends of the second chamber 12 on both sides along the second direction Z.

[0026] The air inlet 13 can be connected to an external air supply system, such as an equipment fan filter unit (EFU). The air supply system continuously delivers clean air through the air inlet 13 into the first chamber 11. The clean air then enters the second chamber from the first chamber and is discharged by the vacuum device 20.

[0027] Optionally, the vacuuming unit 21 includes a vacuum pump, plant vacuum equipment, etc.

[0028] Optionally, the vacuum line 22 includes two ports, one of which is connected to the vacuum body 21, and the other port is located in the second chamber and is used to extract the gas in the second chamber.

[0029] Exemplarily, both the wafer fixing platform 30 and the chip fixing platform 40 are installed within the second chamber 12. The top of the second chamber 12 may have a mounting structure for mounting the wafer fixing platform 30 on top of the second chamber 12. The bottom of the second chamber 12 may have a mounting structure for mounting the chip fixing platform 40 on the bottom of the second chamber 12. It is understood that when the wafer fixing platform 30 is located at the top of the second chamber 12, the wafer-fixing suction device for fixing the wafer is located on the side of the wafer fixing platform 30 facing away from the top of the second chamber 12, so that the bonding surface of the wafer faces downwards when the suction device fixes the wafer. When the chip fixing platform 40 is located at the bottom of the second chamber 12, the chip-fixing structure of the chip fixing platform 40 is located on the side of the chip fixing platform 40 facing the wafer fixing platform 30, so that the bonding surface of the chip and the bonding surface of the wafer are positioned opposite each other. The driving device 50 can be connected to only one of the wafer mounting platform 30 and the chip mounting platform 40, driving one to move towards the other, so that the wafer and the chip are brought closer together for bonding. Alternatively, the driving device 50 can be connected to both the wafer mounting platform 30 and the chip mounting platform 40, allowing them to move towards each other, thereby shortening the travel distance. For ease of understanding, in this embodiment, "downward" refers to vertically downward, and "upward" refers to vertically upward.

[0030] In this embodiment, by placing the wafer fixing platform 30 at the top, the wafer's bonding surface faces downwards, reducing the possibility of particles or impurities falling onto the bonding surface. Furthermore, the air inlet 13 on the cavity 10 delivers clean air into the cavity. Blowing the wafer surface from the side removes particles or impurities adhering to the bonding surface, thereby reducing the introduction of particles into the bonding interface during chip-wafer bonding and improving bonding quality.

[0031] In some optional embodiments, the vacuum line 22 includes a suction port 221, which is located on the periphery of the chip fixing platform. This helps to guide the cleaning gas to uniformly cover the wafer bonding surface, improve the cleaning ability of the wafer, reduce airflow eddies, and prevent particles or impurities from being re-attached to the bonding surface of the wafer or chip.

[0032] Optionally, the number of air intake holes 221 may include one or more.

[0033] In some alternative embodiments, along the second direction Z, the end face of the suction port 221 is lower than the chip mounting platform 40, so that cleaning gas can pass through the chip mounting platform 40 and clean the chip, thereby improving the bonding effect. Here, "end face" refers to the suction end face of the suction port 221, into which gas enters from the port. "Lower than" means that the distance between the end face of the suction port 221 and the wafer mounting platform 30 along the second direction Z is greater than the distance between the chip mounting platform 40 and the wafer mounting platform 30 along the second direction Z.

[0034] Optionally, along the second direction Z, the projection of the suction hole 221 and the projection of the wafer fixing platform 30 are arranged to overlap.

[0035] In some examples, the projection of the suction port 221 along the second direction Z and a portion of the projection of the wafer fixing platform 30 along the second direction Z are arranged to overlap.

[0036] In these alternative embodiments, the above-described arrangement helps to shorten the distance between the suction port 221 and the wafer fixing platform 30, improves the adsorption capacity of the vacuum device 20 on the wafer fixing platform 30, and further enhances the cleaning ability of the wafer bonding surface.

[0037] In some alternative embodiments, the second chamber 12 has a through hole 15 at its bottom along the second direction, through which the vacuum tube 22 extends into the second chamber. Extending into the second chamber through the bottom through hole reduces the bending structure of the vacuum tube 22, reducing the possibility of impurities depositing at the bends, and also reduces the size of the vacuum tube 22 extending into the second chamber, reducing the possibility of interference between the vacuum tube 22 and other structures.

[0038] In some optional embodiments, the bottom of the first chamber 11 along the second direction Z is provided with an air outlet 14. The opening area of ​​the air outlet 14 is smaller than the opening area of ​​the air inlet 13. The air inlet can carry particles and impurities in the first chamber out of the chamber to ensure the cleanliness of the first chamber, thereby ensuring the cleanliness of the air entering the second chamber from the first chamber. The above arrangement can increase the adaptability of the air outlet resistance, thereby enclosing the static pressure in the first chamber and reducing vibration, noise or equipment damage caused by pressure fluctuations.

[0039] Understandably, clean air enters the first chamber through the air inlet, a portion of the clean air is discharged through the air outlet 14, and the remaining portion is discharged through the vacuum device 20, thus forming a first gas cleaning channel between the air inlet 13 and the air outlet 14, and a second gas cleaning channel between the air inlet 13 and the vacuum device 20. The first gas cleaning channel cleans the first chamber 11 to reduce particulate matter and impurities within it. The second gas cleaning channel cleans the second chamber 12 to reduce particulate matter and impurities within it.

[0040] It is understandable that the path of the second gas cleaning channel is as follows: it enters through the air inlet 13, passes through the connection between the first chamber 11 and the second chamber 12, enters the second chamber 12, passes through the side of the wafer fixing platform 30, then through the fixed side of the wafer fixing platform 30, and finally exits through the vacuum device 20. It is also understandable that the process of the cleaning gas passing through the side of the wafer fixing platform 30 is the process of the cleaning gas blowing the wafer's bonding surface from the side of the wafer.

[0041] In some alternative embodiments, the air outlet 14 includes a plurality of air outlet holes 141, and at least a portion of the air outlet holes 141 are arranged to overlap with the projection of the air inlet 13 along the second direction Z.

[0042] For example, a plurality of air outlets 141 are arranged at intervals along a single direction or multiple directions. In some examples, the projections of all air outlets 141 along the second direction Z at least partially overlap with the projections of the air inlet 13 along the second direction Z. Here, "at least partially overlap" means that a portion of the projections of the two along the second direction Z overlaps, or that the projections of the air outlets 141 along the second direction Z are completely within the projections of the air inlet 13 along the second direction Z. In other examples, the projections of some of the plurality of air outlets 141 along the second direction Z at least partially overlap with the projections of the air inlet 13 along the second direction Z, while the projections of other air outlets 141 along the second direction Z are spaced apart from the projections of the air inlet 13 along the second direction Z.

[0043] In these alternative embodiments, by providing multiple air outlets 141, it is beneficial to improve the airflow uniformity in the first chamber 11 and the pressure balance in the first chamber 11. In conjunction with the vacuum pumping device 20, the airflow circulation of the entire system can be made more stable.

[0044] In some alternative embodiments, the chip bonding system from bottom to top further includes a loading platform 60 disposed in the first chamber 11, which is used to pick up and transfer the chip.

[0045] Optionally, along the second direction Z, the projection of the loading platform 60 and the projection of the air inlet 13 are at least partially overlapped.

[0046] Optionally, the loading platform 60 can be a chip loading platform 60, that is, the chip is transferred from other workstations to the chip loading platform 60, and then the chip loading platform 60 transfers the chip to the chip fixing platform 40.

[0047] In some examples, the projections of the loading platform 60 along the second direction Z and the air inlet 13 along the second direction Z partially overlap. In other examples, the projections of the loading platform 60 along the second direction Z and the air inlet 13 along the second direction Z coincide. In still other examples, one of the projections of the loading platform 60 along the second direction Z and the air inlet 13 along the second direction Z is located within the other.

[0048] The embodiments of this application, through the above-described arrangement, enable the cleaning gas to clean the materials carried on the loading platform 60, thereby improving the cleanliness of materials transferred from other external workstations to the loading platform 60.

[0049] In some alternative embodiments, the pick-and-transfer chip includes: pick-and-transfer chips at different stations in the first chamber 11, and transfer chips between the first chamber 11 and the second chamber 12.

[0050] For example, the first chamber 11 may be equipped with multiple different workstations, such as a chip loading workstation and a cleaning workstation. The transport mechanism on the loading platform 60 can pick up chips at the workstations, and the transport mechanism can also transfer chips between different workstations. The transport mechanism on the loading platform 60 can also transfer chips from the first chamber 11 to the second chamber 12. Of course, chips can also be transferred from the second chamber 12 to the first chamber 11.

[0051] In some alternative embodiments, the cavity 10 further includes a feed port 16 disposed on the second chamber 12 as an inlet for conveying wafers into the second chamber 12.

[0052] Optionally, the opening direction of the feed inlet 16 intersects with the opening direction of the air inlet 13.

[0053] Optionally, the feed port 16 is positioned opposite to the wafer holding platform 30.

[0054] In these alternative embodiments, the opening direction of the feed port 16 intersects with the opening direction of the air inlet 13, so that the clean air can continuously clean the material (wafer or chip) as it enters the chamber through the feed port 16, reducing the particles and impurities brought into the chamber from outside the feed port 16, and improving the cleanliness of the first chamber 11 and the second chamber 12.

[0055] In some alternative embodiments, the cavity 10 also includes a docking robot for picking up chips or wafers and performing pick-and-place operations on the chip holding platform 40 or the wafer holding platform 30.

[0056] Optionally, the docking robot can pick up both chips and wafers; or, the docking robot can only pick up chips; or, the docking robot can only pick up wafers. The docking robot can remove chips from the chip holding platform 40 or place chips on the chip holding platform 40. The docking robot can remove wafers from the wafer holding platform 30 or place wafers on the wafer holding platform 30.

[0057] In some alternative embodiments, the cavity 10 further includes an inspection port 17, the opening direction of the inspection port 17, the opening direction of the feed port 16, and the opening direction of the air inlet 13 intersect each other.

[0058] The inspection port 17 can be used for manual or machine maintenance of the devices inside the chamber. Setting the opening direction of the inspection port 17 to intersect with the opening direction of the feed inlet 16 facilitates maintenance personnel or machines in maintaining the devices opposite to the feed inlet 16, while also increasing the opening space of the inspection port 17 and thus increasing the maintenance space. Aligning the opening direction of the inspection port 17 with the opening direction of the air inlet 13 allows clean gas to clean impurities or contaminants entering the first chamber 11 and second chamber 12 during maintenance, thereby shortening the time required to clean the chambers after maintenance, improving maintenance efficiency, and increasing production efficiency.

[0059] Optionally, the access port 17 may be located on the side wall of the first chamber 11, and / or the access port 17 may also be located on the side wall of the second chamber 12.

[0060] Optionally, the opening direction of the air inlet 13 is parallel to the second direction Z.

[0061] Optionally, the opening direction of the inspection port 17 is parallel to the first direction X.

[0062] Optionally, the opening direction of the feed inlet 16 is parallel to the third direction Y, and the third direction Y, the first direction X, and the second direction Z are perpendicular to each other.

[0063] In some alternative embodiments, the wafer holding platform 30 includes a marble base 31 and an adsorption assembly 32 disposed on the top of the marble base 31 facing away from the second chamber 12. The adsorption assembly 32 is used to selectively hold the wafer. The overall structure of the marble base 31 is stable and not easily affected by ambient temperature, which helps to improve its service life.

[0064] In some alternative embodiments, the adsorption assembly 32 includes a motion mechanism and an adsorption element connected to each other, the motion mechanism driving the adsorption element to move, and the adsorption element being used to adsorb wafers.

[0065] For example, the motion mechanism can drive the adsorption element to move in one or more directions, which is beneficial for adjusting the position of the wafer, thereby improving the alignment accuracy of the wafer and the chip. Optionally, the motion mechanism can be mounted on the marble base 31.

[0066] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A bottom-up chip bonding system, characterized in that, include: The cavity (10) includes a first chamber (11) and a second chamber (12) arranged side by side and communicating with each other along a first direction. The first chamber (11) has an air inlet (13) at the top along a second direction. The first direction intersects the second direction. The vacuum device (20) includes a vacuum body (21) and a vacuum pipeline (22) connected to each other. The vacuum body (21) is disposed outside the cavity (10). The vacuum pipeline (22) passes through the cavity (10) and extends into the second chamber (12). The vacuum pipeline (22) is disposed near the bottom of the second chamber (12) along the second direction. A wafer fixing platform (30) is disposed at the top of the second chamber (12) along the second direction. The wafer fixing platform (30) is used to selectively fix the wafer and make the bonding surface of the wafer face downward. A chip fixing platform (40) is disposed at the bottom of the second chamber (12) along the second direction. The chip fixing platform (40) is used to selectively fix the chip and make the bonding surface of the chip face upward. A driving device (50) is connected to the wafer fixing platform (30) and / or the chip fixing platform (40) for driving the wafer fixing platform (30) and the chip fixing platform (40) to move relative to each other.

2. The chip bonding system from bottom to top according to claim 1, characterized in that, The vacuum pipeline (22) includes a suction port (221), which is located on the periphery of the chip fixing platform (40).

3. The chip bonding system from bottom to top according to claim 2, characterized in that, Along the second direction, the end face of the air intake (221) is lower than the chip fixing platform (40).

4. The chip bonding system from bottom to top according to claim 1, characterized in that, The second chamber (12) has a through hole (15) at the bottom along the second direction, and the vacuum pipe extends into the second chamber through the through hole.

5. The chip bonding system from bottom to top according to claim 1, characterized in that, The first chamber (11) is provided with an air outlet (14) at the bottom along the second direction. The opening area of ​​the air outlet (14) is smaller than the opening area of ​​the air inlet (13). The air outlet (14) includes a plurality of air holes (141). At least a portion of the projections of the air holes (141) along the second direction overlap with at least a portion of the projections of the air inlet (13) along the second direction.

6. The chip bonding system from bottom to top according to claim 1, characterized in that, It also includes a loading platform (60), which is disposed in the first chamber (11) and is used to pick up and transfer chips.

7. The chip bonding system from bottom to top according to claim 6, characterized in that, The pickup and transfer chip includes: pickup and transfer chips at different stations in the first chamber (11), and transfer chips between the first chamber (11) and the second chamber (12).

8. The chip bonding system from bottom to top according to claim 7, characterized in that, The cavity (10) also includes a feed port (16), which is disposed on the second chamber (12) as an inlet for conveying wafers into the second chamber (12).

9. The chip bonding system from bottom to top according to claim 7, characterized in that, The cavity (10) also includes a docking robot for picking up chips or wafers and performing pick-up and drop-off of the chips or wafers on the chip fixing platform (40) or the wafer fixing platform (30).

10. The chip bonding system from bottom to top according to claim 1, characterized in that, The wafer fixing platform (30) includes a marble base (31) and an adsorption assembly (32) disposed on the top of the marble base (31) facing away from the second chamber (12), the adsorption assembly (32) being used to selectively fix the wafer.

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