A new pet sofa

Abstract

The utility model relates to pet sofa technical field, more particularly to a new pet sofa, this sofa inside is provided with semiconductor refrigeration plant, and effectively solved the problem of heat dissipation and condensate. It includes sofa body, the inside of sofa body is provided with semiconductor refrigeration plant, still includes water pad, water circulating device, heat abstractor and water pan, the water pad is laid on the position of the cushion in sofa body, water circulating device is connected with the water inlet and water outlet of water pad, is used for circulating the medium in water pad, the semiconductor refrigeration plant sets up on the pipeline of water circulating device, is used for the medium in the pipeline inside refrigeration, heat abstractor can heat dissipation of semiconductor refrigeration plant's heating end, is provided with water pan in the slot of the side of sofa body and draws, the water pan is located the below of semiconductor refrigeration plant.

Description

Technical Field

[0001] This utility model relates to the field of pet sofa technology, and more specifically, to a novel pet sofa. Background Technology

[0002] Pet sofas are a very common type of pet furniture. Most existing pet sofas are modeled after human sofas, but are scaled down to fit the size of pets and provide them with a place to rest. However, there is little innovation in the structure of existing pet sofas. For example, most existing pet sofas do not have a heat dissipation function. Therefore, in the hot summer, long-haired creatures such as cats and dogs are unwilling to sit on the sofa. As a result, some pet sofas are equipped with heat dissipation devices to make it more comfortable for pets to sit or lie on.

[0003] Among existing heat dissipation devices, semiconductor cooling devices are one of the more effective ones. However, semiconductor cooling devices also have some usage problems, such as heat dissipation and condensation. Therefore, how to integrate this device into the interior of a pet sofa is a problem that needs to be solved. Utility Model Content

[0004] The purpose of this invention is to provide a novel pet sofa, which is equipped with a semiconductor cooling device inside, and effectively solves the problems of heat dissipation and condensation.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: A novel pet sofa includes a sofa body with a semiconductor cooling device inside. It also includes a water mat, a water circulation device, a heat dissipation device, and a water tray. The water mat is placed on the sofa body at the seat position. The water circulation device is connected to the inlet and outlet of the water mat to circulate the medium within it. The semiconductor cooling device is located on the pipes of the water circulation device to cool the medium inside the pipes. The heat dissipation device dissipates heat from the heat-generating end of the semiconductor cooling device. A slot is provided on the side of the sofa body, and a water tray is pulled out of the slot, located below the semiconductor cooling device.

[0006] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention solves the problems of heat dissipation and condensation in the application of semiconductor refrigeration devices by setting up a heat dissipation device and a water collection tray. The heat dissipation device dissipates the heat from the heating end of the semiconductor refrigeration device, while the condensation is collected by the water collection tray. The pull-out design is simple and convenient, making it easy to use in practice.

[0007] As a preferred technical solution of this application, the water circulation device includes a first water pump and a first water pipe, wherein the inlet and outlet of the first water pump are connected to the inlet and outlet of the water pad through the first water pipe, respectively.

[0008] As a preferred technical solution of this application, a first heat exchanger is connected in series on the first water pipe. The first heat exchanger is made of metal material and is in contact with the cooling end of the semiconductor refrigeration device.

[0009] As a preferred technical solution of this application, the heat dissipation device is a water-cooled radiator, which consists of a radiator, a fan, a cold head, and a second water pipe. The inlet and outlet of the cold head are connected to the radiator through the second water pipe, respectively. A fan is fixed to the side of the radiator, and the cold head abuts against the heating end of the semiconductor refrigeration device.

[0010] As a preferred technical solution of this application, a second water pump is connected in series on the second water pipe.

[0011] As a preferred technical solution of this application, air inlets and air outlets are provided on the front and rear sides of the sofa body. The radiator is fixed inside the air outlet, and the fan is fixed inside the radiator for exhausting air outward.

[0012] As a preferred technical solution in this application, both the air inlet and the air outlet are equipped with filters.

[0013] As a preferred technical solution of this application, it also includes a heat exchange chamber for tightly fitting the semiconductor cooling device, the heat dissipation device and the water circulation device together. The heat exchange chamber includes a base and a top cover. The heat exchange parts of the water circulation device, the semiconductor cooling device and the heat dissipation device are arranged sequentially in the heat exchange chamber. The side of the base is provided with a slot for inserting a water tray. The heat exchange parts of the water circulation device and the heat dissipation device abut against the heating end and cooling end of the semiconductor cooling device, respectively.

[0014] As a preferred technical solution of this application, the base and the top cover are fixedly connected by screws. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of a novel pet sofa according to the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a schematic diagram of the heat exchange chamber in this utility model; Figure 4 This is a schematic diagram of the structure of the first heat exchanger in this utility model.

[0016] Figure 5 This is a rear view of the present invention.

[0017] Attached diagram descriptions: 1. Sofa body, 2. Water mat, 3. Water tray, 4. Second water pump, 5. First water pump, 6. First water pipe, 7. First heat exchanger, 8. Radiator, 9. Fan, 10. Cooling head, 11. Second water pipe, 12. Semiconductor refrigeration device, 13. Air inlet, 14. Air outlet, 15. Filter, 16. Base, 17. Top cover, 18. Heat exchange chamber. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model.

[0019] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0020] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] This invention provides a novel pet sofa, comprising a sofa body 1, with a semiconductor cooling device 12 internally housed within the sofa body 1. It also includes a water mat 2, a water circulation device, a heat dissipation device, and a water tray 3. The water mat 2 is laid on the sofa body 1 at the seat position. The water circulation device is connected to the inlet and outlet of the water mat 2 to circulate the medium within it. The semiconductor cooling device 12 is located on the pipes of the water circulation device to cool the medium within the pipes. The heat dissipation device dissipates heat from the heating end of the semiconductor cooling device 12. A slot is provided on the side of the sofa body, into which the water tray 3 is pulled out and positioned below the semiconductor cooling device 12. This invention solves the heat dissipation and condensation problems of the semiconductor cooling device 12 during use by incorporating the heat dissipation device and the water tray 3. The heat dissipation device dissipates heat from the heating end of the semiconductor cooling device 12, while the condensation is collected by the water tray 3. The pull-out design is simple, convenient, and easy to use.

[0024] In this embodiment, the water circulation device includes a first water pump 5 and a first water pipe 6. The inlet and outlet of the first water pump 5 are connected to the inlet and outlet of the water pad 2 through the first water pipe 6, respectively. In this way, the medium in the water pad 2 is circulated by the first water pump 5, so that the semiconductor cooling device 12 can continuously deliver the cooled medium into the water pad 2 to provide a cooling sensation.

[0025] In this embodiment, a first heat exchanger 7 is connected in series on the first water pipe 6. The first heat exchanger 7 is made of metal and is in contact with the cooling end of the semiconductor refrigeration device 12. In this way, by setting the first heat exchanger 7, the contact area with the cooling end of the semiconductor refrigeration device 12 can be increased, thereby improving the refrigeration efficiency. The first heat exchanger 7 is a cuboid structure made of metal and is hollow inside. An inlet and an outlet are respectively opened at both ends of the first heat exchanger 7 and are connected in series with the first water pipe 6 through the inlet and outlet.

[0026] In this embodiment, the heat dissipation device is a water-cooled radiator, which consists of a radiator 8, a fan 9, a cold head 10, and a second water pipe 11. The inlet and outlet of the cold head 10 are connected to the radiator 8 through the second water pipe 11. The fan 9 is fixed to the side of the radiator 8. The cold head 10 is in contact with the heating end of the semiconductor cooling device 12. In this way, the structure is simple and the water-cooled design can continuously dissipate the heat generated by the semiconductor cooling device 12 during operation. The radiator 8 is made of metal and has a hollow internal structure. Several circulation pipes are set on the radiator 8. The air outlet 14 of the fan 9 faces the circulation pipes and continuously blows air outward to remove the heat emitted from the circulation pipes. For specific water-cooled radiators, you can refer to the Leilicool DP all-in-one water-cooled radiator or the Cooler Master B360core series.

[0027] In this embodiment, a second water pump 4 is connected in series on the second water pipe 11, which can improve the water circulation efficiency and accelerate heat dissipation.

[0028] In this embodiment, air inlets 13 and air outlets 14 are provided on the front and rear sides of the sofa body 1. The radiator 8 is fixed inside the air outlet 14, and the fan 9 is fixed inside the radiator 8 for exhausting air outward. This causes the air inside the sofa body 1 to flow and carry away heat.

[0029] In this embodiment, both the air inlet 13 and the air outlet 14 are equipped with filters 15, which can prevent pet hair or large particles from entering the sofa and affecting the operation of the internal components.

[0030] In this embodiment, the first water pump 5 and the second water pump 4 can be Xinrui SC-400T water pumps, the semiconductor cooling device 12 can be TEC1-19908SR semiconductor cooling chip, and the water pad 2 is a conventional circulating water pad 2 available on the market. For specific structure, you can refer to the TB-zpppp model of the Mi Xiaoshu brand. In actual use, a controller is also required to control the unified start and stop of each component. The controller is electrically connected to the first water pump 5, the second water pump 4, the semiconductor cooling device 12, and the fan 9 through wires.

[0031] In this embodiment, the sofa body 1 includes an inner frame and a covering layer covering the outside of the frame. The water pad 2 can be placed on the inner layer of the covering layer or fixed on the outer layer of the covering layer.

[0032] In this embodiment, a heat exchange chamber 18 is also included for tightly fitting the semiconductor cooling device 12, the heat dissipation device, and the water circulation device together. The heat exchange chamber 18 includes a base 16 and a top cover 17. The heat exchange parts of the water circulation device, the semiconductor cooling device 12, and the heat dissipation device are sequentially arranged in the heat exchange chamber 18. The side of the base 16 is provided with a slot for inserting a water tray 3. The heat exchange parts of the water circulation device and the heat dissipation device abut against the heating end and cooling end of the semiconductor cooling device 12, respectively.

[0033] In this embodiment, the base 16 and the top cover 17 are fixedly connected by screws. The base 16 is provided with connecting ears, which can fix the heat exchange chamber 18 to the sofa body 1 by screws.

[0034] In this embodiment, the first water pump 5 and the second water pump 4 are respectively fixed to the side of the inner frame of the sofa.

[0035] In practical use, the semiconductor cooling device 12 can also be reversed, with the heating end of the semiconductor cooling device 12 connected to the water circulation device. The heat generated by the heating end heats the medium in the pipeline, causing the water pad 2 to heat up and produce a heating effect. The cooling end of the semiconductor cooling device 12 is connected to the heat dissipation device, allowing the cold air generated by the cooling end to evaporate and be discharged to the outside through the fan 9. In this way, the product can be heated or cooled, improving its performance.

[0036] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, the present utility model is not limited to the specific embodiments described above. Therefore, any modifications or equivalent substitutions to the present utility model, and all technical solutions and improvements that do not depart from the spirit and scope of the utility model, are covered within the scope of the claims of the present utility model.

Claims

1. A novel pet sofa, comprising a sofa body, wherein a semiconductor cooling device is disposed inside the sofa body, characterized in that, It also includes a water mat, a water circulation device, a heat dissipation device, and a water tray. The water mat is laid on the sofa body at the position of the seat cushion. The water circulation device is connected to the water inlet and outlet of the water mat to circulate the medium inside the water mat. The semiconductor cooling device is installed on the pipeline of the water circulation device to cool the medium inside the pipeline. The heat dissipation device can dissipate heat from the heat-generating end of the semiconductor cooling device. A slot is opened on the side of the sofa body, and a water tray is pulled out of the slot. The water tray is located below the semiconductor cooling device.

2. The novel pet sofa according to claim 1, characterized in that, The water circulation device includes a first water pump and a first water pipe. The inlet and outlet of the first water pump are connected to the inlet and outlet of the water pad, respectively, through the first water pipe.

3. A novel pet sofa according to claim 2, characterized in that, A first heat exchanger is connected in series on the first water pipe. The first heat exchanger is made of metal material and is in contact with the cooling end of the semiconductor refrigeration device.

4. A novel pet sofa according to claim 1, characterized in that, The heat dissipation device is a water-cooled radiator, which consists of a radiator, a fan, a cold head, and a second water pipe. The inlet and outlet of the cold head are connected to the radiator through the second water pipe. A fan is fixed to the side of the radiator, and the cold head is in contact with the heating end of the semiconductor refrigeration device.

5. A novel pet sofa according to claim 4, characterized in that, A second water pump is connected in series with the second water pipe.

6. A novel pet sofa according to claim 4, characterized in that, The sofa body has air inlets and air outlets on the front and rear sides. The radiator is fixed inside the air outlet, and the fan is fixed inside the radiator for exhausting air outward.

7. A novel pet sofa according to claim 6, characterized in that, Both the air inlet and the air outlet are equipped with filters.

8. A novel pet sofa according to claim 4, characterized in that, It also includes a heat exchange chamber for tightly fitting a semiconductor cooling device, a heat dissipation device, and a water circulation device together. The heat exchange chamber includes a base and a top cover. The heat exchange parts of the water circulation device, the semiconductor cooling device, and the heat dissipation device are sequentially arranged in the heat exchange chamber. The side of the base has a slot for inserting a water tray. The heat exchange parts of the water circulation device and the heat dissipation device abut against the heating end and cooling end of the semiconductor cooling device, respectively.

9. A novel pet sofa according to claim 8, characterized in that, The base and the top cover are fixed together with screws.

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