Heating disc and food processor

Abstract

The application relates to a heating disc and a food processor. The heating disc comprises a disc body, a heat-conducting plate, a heating element and a heat-conducting sheet. The disc body comprises a food material contact surface. The heat-conducting plate is arranged on the side of the disc body away from the food material contact surface. The heating element is arranged on the side of the heat-conducting plate away from the disc body, the heating element can generate heat when electrified, the heating element comprises a first heating area and a second heating area, the heat generation of the first heating area is higher than that of the second heating area. The heat-conducting sheet is arranged between the heat-conducting plate and the heating element, the longitudinal thermal conductivity of the heat-conducting sheet is smaller than that of the heat-conducting plate, in the orthographic projection along the thickness direction of the disc body, the orthographic projection of the heat-conducting sheet covers at least the orthographic projection of the first heating area, and the heat-conducting sheet and the heat-conducting plate are assembled into a composite module through a connecting piece. The heating disc can reduce the risk of paste bottoming.

Description

Technical Field

[0001] This application relates to the field of small household appliance technology, and more specifically, to a heating plate and a food processor. Background Technology

[0002] Some food processors have a heating element consisting of a stainless steel plate, a heat-conducting aluminum plate, and a heating element. When powered on, the heating element generates heat, which is transferred to the stainless steel plate via the heat-conducting aluminum plate, thus heating the food. However, because the heat-conducting aluminum plate is relatively thin, the area where it is in close contact with the heating element can generate localized high temperatures, causing food to easily burn and become difficult to clean. Summary of the Invention

[0003] This application provides a heating plate and a food processor that can reduce the risk of food burning.

[0004] A heating plate, comprising: The plate body, including the food contact surface for contacting food; A heat-conducting plate is located on the side of the plate that faces away from the food contact surface; A heating element is disposed on the side of the heat-conducting plate facing away from the disk. The heating element can generate heat when energized. The heating element includes a first heating area and a second heating area. The heat output of the first heating area is higher than that of the second heating area. A heat-conducting sheet is disposed between the heat-conducting plate and the heating element. The longitudinal thermal conductivity of the heat-conducting sheet is less than that of the heat-conducting plate. In the orthographic projection along the thickness direction of the disk, the orthographic projection of the heat-conducting sheet at least covers the orthographic projection of the first heating area. The heat-conducting sheet and the heat-conducting plate are assembled together by a connector to form a composite heat-conducting module.

[0005] The heating plate provided in this application has a heat-conducting sheet disposed between the heat-conducting plate and the first heating area, and at least covers the first heating area. The heat generated by the first heating area is first transferred to the heat-conducting sheet. Since the longitudinal thermal conductivity of the heat-conducting sheet is low, some of the heat is first transferred laterally on the heat-conducting sheet, and then transferred to the plate body through the heat-conducting plate, so as to slow down the heat transfer and reduce the risk of burning.

[0006] Optionally, in the orthographic projection formed along the thickness direction of the disk, the outer contour of the heat-conducting sheet extends beyond the outer contour of the first heating zone, and the inner contour of the heat-conducting sheet is closer to the center of the disk than the inner contour of the first heating zone. With this configuration, the heat-conducting sheet is closer to the center of the disk; therefore, the heat transferred from the first heating zone to the heat-conducting sheet will first be transferred and dispersed radially along the heat-conducting sheet, and further transferred to the heat-conducting plate. A larger heat transfer area results in a larger heated area of ​​the disk and more even heating.

[0007] Optionally, the heat-conducting plate is arc-shaped or semi-circular in shape and is positioned corresponding to the first heating zone. In this way, by using the heat-conducting plate to block heat from the first heating zone, the heat transfer rate of the first heating zone can be slowed down, preventing localized overheating of the plate. This balances the heat from the first and second heating zones, resulting in uniform heating of the plate, good anti-sticking effect, and guaranteed heat transfer efficiency.

[0008] Optionally, the heat-conducting sheet is annular, and in the orthographic projection formed along the thickness direction of the disk, the orthographic projection of the heat-conducting sheet at least covers the orthographic projection of the heating element. This increases the contact surface between the heat-conducting sheet and the heating element, allowing the heat-conducting sheet to simultaneously transfer heat from both the first and second heating areas. The heat generated by the heating element is evenly distributed on the heat-conducting sheet before being transferred to the heat-conducting plate, resulting in uniform heating of the disk and reducing the risk of burnt bottom.

[0009] Optionally, the heating plate further includes a heat-conducting plate base disposed between the heating element and the heat-conducting plate. The thermal conductivity of the heat-conducting plate base is greater than that of the heat-conducting plate. The heat-conducting plate base is provided with a receiving groove, in which the heat-conducting plate and the heat-conducting plate are received. The heat-conducting plate base, the heat-conducting plate, and the heat-conducting plate are assembled together by connectors to form a composite heat-conducting module. In this way, the heat-conducting plate base is in direct contact with the heating element. Due to the low longitudinal thermal conductivity of the heat-conducting plate, the heat-conducting plate base can accelerate heat transfer and avoid excessive heat loss. The heat is then dispersed or slowed down by the heat-conducting plate, and finally, it is transferred to the plate body after being uniformly heated again by the heat-conducting plate, making the plate body more evenly heated. At the same time, the three components are assembled into a composite heat-conducting module by connectors, which has good structural strength and avoids the risk of cracking during use.

[0010] Optionally, the heat-conducting plate base, the heat-conducting plate, and the heat-conducting plate are riveted together. The riveting process is simple and highly reliable.

[0011] Optionally, the heat-conducting plate is at least partially housed within the receiving groove, and the heat-conducting sheet base includes an annular rib surrounding the receiving groove. The heat-conducting sheet and the heat-conducting plate abut against the annular rib radially within the receiving groove. Thus, the annular rib forms a limiting rib, and the heat-conducting sheet and the heat-conducting plate are positioned and engaged with the annular rib at their outer rings.

[0012] Optionally, the outer surface of the annular rib is chamfered. The chamfer reduces the contact area between the heat-conducting plate base and the disk, thus having less impact on the longitudinal heat transfer of the heating element.

[0013] Optionally, the heating plate is provided with blade holes for the stirring blade to pass through. These blade holes include a base blade hole in the heat-conducting plate base, a heat-conducting sheet blade hole in the heat-conducting sheet, and a heat-conducting plate blade hole in the heat-conducting plate. The heat-conducting sheet base also includes a positioning boss surrounding the base blade holes. Both the heat-conducting sheet blade holes and the heat-conducting plate blade holes are positioned and engaged with the positioning boss. Thus, the positioning boss can define the installation positions of both the heat-conducting sheet and the heat-conducting plate, improving installation accuracy.

[0014] Optionally, the heat-conducting sheet and the heat-conducting plate abut against the positioning boss radially within the receiving groove. In this way, the heat-conducting sheet and the heat-conducting plate are tightly engaged with the positioning boss at the inner wall of their respective holes to achieve positioning.

[0015] Optionally, the heat-conducting plate has a groove on its surface opposite to the disk body. The groove is configured as a blind groove with a depth smaller than the thickness of the heat-conducting plate, and the heat-conducting sheet is also accommodated in the groove. In this way, the heat-conducting sheet is embedded in the groove, making the composite structure after the heat-conducting sheet and the heat-conducting plate are assembled more compact.

[0016] Optionally, the heat-conducting plate includes a first heat-conducting plate and a second heat-conducting plate that are separately arranged. The second heat-conducting plate has a mounting groove corresponding to the first heating area. The mounting groove extends through the second heat-conducting plate along its thickness direction. Both the first heat-conducting plate and the heat-conducting sheet are disposed in the mounting groove and are stacked on top of each other. The sum of the thicknesses of the heat-conducting sheet and the first heat-conducting plate is equal to the thickness of the second heat-conducting plate. This facilitates manufacturing and assembly.

[0017] Optionally, the lateral thermal conductivity of the heat-conducting sheet is greater than or equal to that of the heat-conducting plate. Higher lateral thermal conductivity accelerates lateral heat transfer, resulting in better heat distribution from the heat-conducting sheet.

[0018] Optionally, the heat-conducting sheet is a graphite sheet. Graphite sheets have high lateral thermal conductivity and poor longitudinal thermal conductivity, resulting in good heat uniformity.

[0019] Optionally, the heat-conducting sheet is a stainless steel sheet, and the heat-conducting plate is a graphite plate or an aluminum plate. The stainless steel sheet has poor longitudinal thermal conductivity, which is beneficial for blocking and dispersing heat. The graphite plate has good transverse heat transfer effect, which is beneficial for the even heating of the plate. The aluminum plate has good thermal conductivity, which can ensure heat transfer efficiency.

[0020] Optionally, the food contact surface is formed with a dense, pitted layer. This dense layer not only increases the hardness of the food contact surface but also enhances food flow, reduces food embedding, and helps prevent food from sticking to the plate.

[0021] A food processor, comprising: Host; A cup assembly, assembled to the main unit, includes a cup body forming a cavity, the cup body including a heating plate as described in any of the preceding claims. This food processor has a low risk of food burning at the bottom. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a food processor shown in an exemplary embodiment of this application; Figure 2 yes Figure 1 An exploded view of the cup assembly shown in the image; Figure 3 yes Figure 1 The cross-sectional view of the cup assembly shown in the image; Figure 4 This is an exploded view of the heating element; Figure 5 This is a top view of the heating element; Figure 6 This is an exploded view of yet another embodiment of the heating plate; Figure 7 This is a schematic diagram of a composite heat-conducting plate and a heat-conducting sheet; Figure 8 This is another schematic diagram of a composite heat-conducting plate and heat-conducting sheet; Figure 9 This is an exploded view of yet another embodiment of the heating plate; Figure 10 It is a cross-sectional view of the heat-conducting plate base, heat-conducting plate and heat-conducting plate assembled together; Figure 11 This is a cross-sectional view of the heating plate and stirring blade in their assembled state; Figure 12 yes Figure 11 An enlarged view of part A in the middle; Figure 13 This is an exploded view of the heat-conducting plate base, the heat-conducting plate, and the heat-conducting plate. Figure 14 yes Figure 13 The image shows a front view of the heat-conducting plate base, the heat-conducting plate, and the heat-conducting plate. Figure 15 This is a front view of the food contact surface of the plate; Figure 16 This is a cross-sectional view of the heating element; Figures 17 to 19 This is a force analysis diagram of the food at the contact surface. Detailed Implementation

[0023] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0024] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movement of the components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0025] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a food processor 100 shown as an exemplary embodiment of this application.

[0026] This application provides a food processor 100, which includes a main unit 10 and a cup assembly 20. The cup assembly 20 is assembled to the main unit 10, and the assembly method includes, but is not limited to, detachable assembly. In the illustrated embodiment, the main unit 10 is located below the cup assembly 20, forming a base-type main unit 10. In other embodiments, the main unit 10 may also be located above the cup assembly 20.

[0027] Please refer to Figure 2 and Figure 3 , Figure 2 for Figure 1 An exploded view of the cup component 20 shown in the figure. Figure 3 yes Figure 1 The image shows a cross-sectional view of the cup assembly 20.

[0028] The cup assembly 20 includes a cup body 21 and a cup base 22 disposed at the bottom of the cup body 21. The cup body 21 includes a cup body 210 and a heating plate 212 connected to the bottom of the cup body 210. The cup body 210 and the heating plate 212 together form a cup cavity 200, which can hold food. The cup body 210 and the heating plate 212 can be sealed by a sealing ring 213 to prevent food leakage from the cup cavity 200. The cup body 210 may be provided with a handle 214 for easy handling. The cup body 210 includes, but is not limited to, a glass cup.

[0029] The cup holder 22 includes a cup holder housing 220 and a cup holder cover 222 disposed within the cup holder housing 220. The cup holder cover 222 is connected to the bottom of the cup holder housing 220 and is used to seal the opening at the bottom of the cup holder housing 220. The cup holder cover 222 is provided with a cup body coupler. The cup assembly 20 also includes a cup lid 23, which covers the top of the cup body 21. The cup lid 23 can be configured to screw onto the cup body 21, but is not limited to this configuration.

[0030] exist Figure 2 and Figure 3 In the embodiment shown, the cup assembly 20 also includes a stirring blade 26, which is rotatably mounted on the heating plate 212. The rotation axis of the stirring blade 26 is aligned with the height direction of the cup body 21. The blades of the stirring blade 26 are located inside the cup cavity 200 and are used to stir and crush food. The blade shaft of the stirring blade 26 is connected to a motor inside the main unit 10 to drive the stirring blade 26 to rotate.

[0031] Please refer to Figure 4 and Figure 5 , Figure 4 This is an exploded view of the heating plate 212. Figure 5 This is a top view of the heating plate 212.

[0032] The heating plate 212 includes a plate body 2120, a heat-conducting plate 2122, a heating element 2124, and a heat-conducting sheet 2126. The plate body 2120 includes a food contact surface 2120a for contacting food. The plate body 2120 is made of, but is not limited to, food-grade stainless steel, and a temperature sensor can be installed on the plate body 2120 to detect its temperature. The heat-conducting plate 2122 is located on the side of the plate body 2120 opposite to the food contact surface 2120a, and may be, but is not limited to, an aluminum plate. The heat-conducting plate 2122 is used to transfer heat to the plate body 2120.

[0033] A heating element 2124 is disposed on the side of the heat-conducting plate 2122 facing away from the disk body 2120. The heating element 2124 generates heat when energized. In this embodiment, the heating element 2124 is approximately annular and includes a first terminal (L terminal) and a second terminal (N terminal). The L terminal is used to connect to the live wire, and the N terminal is used to connect to the neutral wire. The heating element 2124 includes a first heating area 2124a and a second heating area 2124b. The heat generated by the first heating area 2124a is greater than that generated by the second heating area 2124b. The areas at both ends of the heating element 2124 closest to the L terminal and the N terminal, respectively, are the second heating area 2124b, and the middle area of ​​the heating element 2124 is the first heating area 2124a. A gap is left between the two terminals of the heating element 2124. Therefore, the area of ​​the heating element 2124 near the L and N terminals is conducive to heat dissipation, and the heat in this area is relatively smaller than that in the middle area. This results in the heating element 2124 forming a first heating area 2124a and a second heating area 2124b with uneven heat distribution. It should be noted that the first heating area 2124a and the second heating area 2124b may differ depending on the structural form of the heating element 2124.

[0034] A heat-conducting sheet 2126 is disposed between the heat-conducting plate 2122 and the heating element 2124, and is thermally connected to both the heat-conducting plate 2122 and the heating element 2124. The heat-conducting sheet 2126 can be riveted to the heat-conducting plate 2122, but is not limited to this. The longitudinal thermal conductivity of the heat-conducting sheet 2126 is less than that of the heat-conducting plate 2122. In the orthographic projection along the thickness direction of the disk 2120, the orthographic projection of the heat-conducting sheet 2126 covers the orthographic projection of the first heating area 2124a. The heat-conducting sheet 2126 and the heat-conducting plate 2122 are assembled together by a connector to form a composite heat-conducting module. The "longitudinal thermal conductivity" mentioned here refers to the thermal conductivity in the thickness direction of the heat-conducting sheet 2126.

[0035] As described above, the heat-conducting plate 2126 is located between the heat-conducting plate 2122 and the first heating area 2124a, and at least covers the first heating area 2124a. The heat generated in the first heating area 2124a is first transferred to the heat-conducting plate 2126. Due to the low longitudinal thermal conductivity of the heat-conducting plate 2126, some of the heat is first transferred and dispersed laterally on the heat-conducting plate 2126. Therefore, the heat-conducting plate 2126 can achieve uniform heating. Then, the heat is transferred to the disk body 2120 via the heat-conducting plate 2122 to slow down heat transfer and reduce the risk of burnt bottom. The heat-conducting plate 2126 can be made of stainless steel, graphite, etc., which have low longitudinal thermal conductivity, but is not limited to these.

[0036] In one embodiment, such as Figure 5 As shown, in the orthographic projection along the thickness direction of the disk 2120, the outer contour 2126a of the heat-conducting plate 2126 extends beyond the outer contour 2124aa of the first heating zone 2124a, and is closer to the center of the disk 2120 than the first heating zone. Thus, because the heat-conducting plate 2126 is closer to the center of the disk 2120, the heat transferred from the first heating zone 2124a to the heat-conducting plate 2126 will first be transferred and dispersed radially along the heat-conducting plate 2126, and further transferred to the heat-conducting plate 2122. Since the heat-conducting plate 2122 has a large heating area, the disk 2120 has a large heating area, resulting in more even heating.

[0037] exist Figure 5In the illustrated embodiment, the heat-conducting sheet 2126 is annular, and in its orthographic projection along the thickness direction of the disk body 2120, the orthographic projection of the heat-conducting sheet 2126 at least covers the orthographic projection of the heating element 2124. That is, the heat-conducting sheet 2126 is thermally connected to both the first heating area 2124a and the second heating area 2124b. Thus, the heat-conducting sheet 2126 is in contact not only with the first heating area 2124a but also with the second heating area 2124b, allowing it to simultaneously transfer heat from both areas. The heat generated by the heating element 2124 is evenly distributed on the heat-conducting sheet 2126 before being transferred to the heat-conducting plate 2122, resulting in uniform heating of the disk body 2120 and reducing the risk of burnt bottom.

[0038] Please refer to Figure 6 , Figure 6 This is an exploded view of yet another embodiment of the heating plate 212.

[0039] In one embodiment, the heat-conducting plate 2126 is arc-shaped or semi-circular, and is correspondingly disposed with respect to the first heating area 2124a. Thus, the heat-conducting plate 2126 can block heat from the first heating area 2124a, slowing down the heat transfer rate and preventing localized overheating of the plate 2120.

[0040] Please refer to Figure 7 , Figure 7 This is a schematic diagram of the composite of heat-conducting plate 2122 and heat-conducting sheet 2126.

[0041] In one embodiment, the heat-conducting plate 2122 has a groove 21222 on its surface opposite to the disk body 2120. The groove 21222 is configured as a blind groove with a depth smaller than the thickness of the heat-conducting plate 2122, and the heat-conducting sheet 2126 is also accommodated within the groove 21222. Thus, the heat-conducting sheet 2126 is embedded within the groove 21222, making the composite structure of the heat-conducting sheet 2126 and the heat-conducting plate 2122 more compact. Figure 7 In the embodiment shown, the heat-conducting sheet 2126 is arc-shaped, matching the shape of the groove 21222.

[0042] Please refer to Figure 8 , Figure 8 This is another schematic diagram of the composite of heat-conducting plate 2122 and heat-conducting sheet 2126.

[0043] In some embodiments, the heat-conducting plate 2122 includes a first heat-conducting plate 2122a and a second heat-conducting plate 2122b, which are separately disposed. The second heat-conducting plate 2122b has a mounting groove corresponding to the first heating area 2124a. The mounting groove extends through the second heat-conducting plate 2122b along its thickness direction. The heat-conducting sheet 2126 is stacked on top of the first heat-conducting plate 2122a, and the sum of the thicknesses of the heat-conducting sheet 2126 and the first heat-conducting plate 2122a is equal to the thickness of the second heat-conducting plate 2122b. Thus, the assembled structure of the heat-conducting sheet 2126 and the heat-conducting plate 2122 is more compact, facilitating manufacturing and assembly.

[0044] exist Figure 8 In the illustrated embodiment, the mounting slot is a space that accommodates the first heat-conducting plate 2122a and the heat-conducting sheet 2126. In other embodiments, the mounting slot may be a closed slot, notch, etc., provided on the second heat-conducting plate 2122b.

[0045] Please refer to Figure 9 , Figure 9 This is an exploded view of yet another embodiment of the heating plate 212.

[0046] In one embodiment, the heating plate 212 further includes a heat-conducting plate base 2128 disposed between the heating element 2124 and the heat-conducting plate 2126. The thermal conductivity of the heat-conducting plate base 2128 is greater than that of the heat-conducting plate 2126. The heat-conducting plate base 2128 is provided with a receiving groove 21280. The heat-conducting plate 2126 and the heat-conducting plate 2122 are received in the receiving groove 21280. The heat-conducting plate base 2128, the heat-conducting plate 2126 and the heat-conducting plate 2122 are assembled into a composite heat-conducting module by means of a connector. In this configuration, the heat-conducting plate base 2128 is in direct contact with the heating element 2124. Due to the low longitudinal thermal conductivity of the heat-conducting plate 2126, the heat-conducting plate base 2128 can accelerate heat transfer and prevent excessive heat loss. The heat is then dispersed or slowed down by the heat-conducting plate 2126, and finally, after being uniformly heated again by the heat-conducting plate 2122, it is transferred to the disk 2120, making the disk 2120 more evenly heated. Simultaneously, the three components are assembled into a composite heat-conducting module via connectors, resulting in a strong structure and preventing the risk of cracking during use.

[0047] In an alternative embodiment, the heat-conducting plate base 2128, the heat-conducting plate 2126, and the heat-conducting plate 2122 are riveted together. The riveting process is simple and highly reliable.

[0048] Please refer to Figure 10 , Figure 10 This is a cross-sectional view of the heat-conducting base 2128, heat-conducting plate 2126, and heat-conducting plate 2122 after assembly.

[0049] In one embodiment, the heat-conducting plate base 2128, the heat-conducting plate 2126, and the heat-conducting plate 2122 can be assembled together by press fitting. Specifically, the heat-conducting plate base 2128 can be formed by turning or stamping, the depth L1 of the receiving groove 21280 is not less than 0.5mm, the sum of the thicknesses L2 of the heat-conducting plate 2126 and the heat-conducting plate 2122 is greater than L1, L2-L1 is between 0.05 and 0.15, and after press fitting, L2 equals L1. Furthermore, the radial dimension D1 of the heat-conducting plate base 2128 is larger than the radial dimension D2 of the heat-conducting plate 2122, and the radial dimension D2 of the heat-conducting plate 2122 is larger than the radial dimension D3 of the heat-conducting plate 2126, facilitating insertion into the receiving groove 21280. During press-fitting, the heat-conducting plate 2122 and the heat-conducting plate 2126 extend and deform radially outwards, especially when the heat-conducting plate 2122 is made of aluminum, resulting in a larger deformation. After extension, they can fit snugly against the heat-conducting plate base 2128. For example, 0≤D1-D2≤0.1mm and 0.05≤D2-D3≤0.2mm can be set. After press-fitting, the heat-conducting plate base 2128, the heat-conducting plate 2126, and the heat-conducting plate 2122 can be riveted together to further strengthen the connection and reduce the risk of cracking during use. One or more rivets can be used.

[0050] Please refer to Figure 11 and Figure 12 , Figure 11 This is a cross-sectional view of the heating plate 212 and the stirring blade 26 in their assembled state. Figure 12 yes Figure 9 A magnified view of part A in the middle.

[0051] In one embodiment, the heat-conducting plate 2122 is at least partially housed within the receiving groove 21280, and the heat-conducting sheet base 2128 includes an annular rib 21282 surrounding the receiving groove 21280. The heat-conducting sheet 2126 and the heat-conducting plate 2122 abut against the annular rib 21282 radially within the receiving groove 21280. Thus, the annular rib 21282 forms a limiting rib, and the heat-conducting sheet 2126 and the heat-conducting plate 2122 are limited and fitted against the annular rib 21282 on their outer ring. The heat-conducting sheet 2126 and the heat-conducting plate 2122 may abut against the annular rib 21282 after press-fitting, or the abutment may be achieved through a transition fit or an interference fit.

[0052] In one embodiment, the outer surface of the annular rib 21282 is provided with a chamfer 21283. This chamfer 21283 can reduce the contact area between the heat-conducting plate base 2128 and the disk 2120, and has a smaller impact on the longitudinal heat transfer of the heating element 2124. For example, the chamfer can be set to 0.3~0.8.

[0053] Please refer to Figure 13 and Figure 14 , Figure 13 This is an exploded view of the heat-conducting plate base 2128, the heat-conducting plate 2126, and the heat-conducting plate 2122. Figure 14 yes Figure 13 The image shows a front view of the heat-conducting plate base 2128, the heat-conducting plate 2126, and the heat-conducting plate 2122.

[0054] In one embodiment, the heating plate 212 has a blade hole 212a through which the stirring blade 26 passes. The blade hole 212a penetrates the heat-conducting plate base 2128, the heat-conducting plate 2126, and the heat-conducting plate 2122, forming a base blade hole 21285, a heat-conducting plate blade hole 21260, and a heat-conducting plate blade hole 21220, respectively. The heat-conducting plate base 2128 also includes a positioning boss 21286 surrounding the base blade hole 21285. The heat-conducting plate blade hole 21260 and the heat-conducting plate blade hole 21220 are respectively positioned by engaging with the positioning boss 21286. Thus, the positioning boss 21286 can limit the installation position of both the heat-conducting plate 2126 and the heat-conducting plate 2122, improving installation accuracy.

[0055] In one specific embodiment, the heat-conducting sheet 2126 and the heat-conducting plate 2122 abut against the positioning boss 21286 radially within the receiving groove 21280. Thus, the heat-conducting sheet 2126 and the heat-conducting plate 2122 are in close contact with the positioning boss 21286 on their inner rings for positioning. The heat-conducting sheet 2126 and the heat-conducting plate 2122 can abut against the positioning boss 21286 after press-fitting, or they can achieve abutmentation through a transition fit or an interference fit.

[0056] For example, such as Figure 13 As shown, the radial width D1 of the receiving groove 21280 of the heat-conducting plate base 2128 can be set to be greater than or equal to the radial width D2 of the heat-conducting plate 2122 and greater than or equal to the radial width D3 of the heat-conducting plate 2126, where 0≤D1-D2≤0.1mm, thus facilitating the placement of the heat-conducting plate 2126 into the receiving groove 21280. 0.05mm≤D2-D3≤0.2mm allows the heat-conducting plate 2122 to extend radially and be pressed and fixed during stamping, improving the bonding strength. It also acts as an expansion buffer, preventing the composite plate from splitting due to differences in the material's expansion coefficient caused by rapid heating and cooling, thus achieving press-fit composite.

[0057] In one embodiment, the lateral thermal conductivity of the heat-conducting sheet 2126 is greater than or equal to the lateral thermal conductivity of the heat-conducting plate 2122. This improves the lateral thermal conductivity of the heat-conducting plate 2122, allowing heat to be quickly dispersed laterally and achieving a uniform heat distribution.

[0058] In one embodiment, the heat-conducting sheet 2126 is a stainless steel sheet or a graphite sheet. The stainless steel sheet has a lower longitudinal thermal conductivity than the aluminum heat-conducting plate 2122, resulting in better lateral heat transfer. The graphite sheet exhibits significant anisotropy, with poor longitudinal thermal conductivity but excellent lateral thermal conductivity, leading to good lateral heat transfer.

[0059] In one alternative embodiment, the heat-conducting sheet 2126 and the heat-conducting plate 2122 are combined using different materials. For example, the heat-conducting sheet 2126 can be a graphite sheet, and the heat-conducting plate 2122 can be an aluminum plate. Alternatively, the heat-conducting sheet 2126 can be a stainless steel sheet, and the heat-conducting plate 2122 can be a graphite plate or an aluminum plate.

[0060] Please refer to Figure 15 and Figure 16 , Figure 15 This is a front view of the food contact surface 2120a of the plate body 2120. Figure 16 This is a cross-sectional view of the heating plate 212.

[0061] In one embodiment, the food contact surface 2120a is formed with a dense, pitted layer. This dense layer can be formed by shot peening. For example, 0.2-0.6 mm ceramic balls can be used, and shot peening can be performed at a pressure of 0.3-0.6 MPa. The ceramic balls include, but are not limited to, zirconium oxide, zirconium silicate, silicon nitride, glass spheres, or stainless steel spheres. This creates continuous, rounded pits on the food contact surface 2120a, which not only increases the hardness of the surface but also enhances food flow and reduces food embedding. The surface roughness Ra after shot peening is approximately 2.5-5 μm. Alternatively, a two-stage shot peening process can be used, with the first stage using 0.5-1 mm stainless steel spheres and the second stage using 0.1-0.4 mm ceramic or glass spheres, resulting in even better surface density and an Ra of approximately 0.8-3.2 μm. Of course, the methods for forming a dense layer on the food contact surface 2120a are not limited to these.

[0062] Please refer to Figures 17 to 19 , Figures 17 to 19 This is a force analysis diagram of the food at the food contact surface 2120a.

[0063] The depth H of the indentation formed on the food contact surface 2120a ranges from 0.03 to 0.15 mm, and the projected width D between consecutive indentations is 0.1 to 0.4 mm. The circular indentations can generate a sufficiently large shear force from the flowing water to wash away the rice grains.

[0064] The food accumulated at the contact point is subjected to the upward tension of the water film in the pit, which can prevent large sticky surfaces and reduce sticking force. When stirring, the water flow into the pit provides shear force to the food, which can wash away the sticky food in time and prevent the food from being heated repeatedly and burning at the bottom.

[0065] The shot peening parameters are shown in Tables 1 and 2.

[0066] Table 1 Table 2 The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heating plate, characterized in that, include: The plate body (2120) includes a food contact surface (2120a) for contacting food. A heat-conducting plate (2122) is disposed on the side of the plate (2120) opposite to the food contact surface; A heating element (2124) is disposed on the side of the heat-conducting plate (2122) facing away from the disk body (2120). The heating element (2124) can generate heat when energized. The heating element (2124) includes a first heating area (2124a) and a second heating area (2124b). The heat generation of the first heating area (2124a) is higher than that of the second heating area (2124b). A heat-conducting sheet (2126) is disposed between the heat-conducting plate (2122) and the heating element (2124). The longitudinal thermal conductivity of the heat-conducting sheet (2126) is less than that of the heat-conducting plate (2122). In the orthographic projection formed along the thickness direction of the disk (2120), the orthographic projection of the heat-conducting sheet (2126) at least covers the orthographic projection of the first heating area (2124a). The heat-conducting sheet (2126) and the heat-conducting plate (2122) are assembled into a composite heat-conducting module by means of a connector.

2. The heating plate according to claim 1, characterized in that, In the orthographic projection formed along the thickness direction of the disk (2120), the outer contour of the heat-conducting sheet (2126) extends beyond the outer contour of the first heating area (2124a), and the inner contour of the heat-conducting sheet is closer to the center of the disk (2120) than the inner contour of the first heating area (2124a).

3. The heating plate according to claim 1, characterized in that, The heat-conducting sheet (2126) is arc-shaped or semi-circular in shape and is arranged corresponding to the first heating area (2124a); or The heat-conducting sheet (2126) is ring-shaped, and in the orthographic projection along the thickness direction of the disk (2120), the orthographic projection of the heat-conducting sheet (2126) at least covers the orthographic projection of the heating element.

4. The heating plate according to any one of claims 1 to 3, characterized in that, The heating plate (212) also includes a heat-conducting plate base (2128) disposed between the heating element (2124) and the heat-conducting plate (2126). The thermal conductivity of the heat-conducting plate base (2128) is greater than that of the heat-conducting plate (2126). The heat-conducting plate base (2128) is provided with a receiving groove (21280). The heat-conducting plate (2126) is received in the receiving groove (21280). The heat-conducting plate base (2128), the heat-conducting plate (2126), and the heat-conducting plate (2122) are assembled into a composite heat-conducting module by means of connectors.

5. The heating plate according to claim 4, characterized in that, The heat-conducting plate base (2128), the heat-conducting plate (2126), and the heat-conducting plate (2122) are riveted together.

6. The heating plate according to claim 5, characterized in that, The heat-conducting plate (2122) is at least partially housed within the receiving groove (21280), and the heat-conducting plate base (2128) includes an annular rib (21282) surrounding the receiving groove (21280). The heat-conducting plate (2126) and the heat-conducting plate (2122) abut against the annular rib (21282) radially within the receiving groove (21280).

7. The heating plate according to claim 6, characterized in that, The outer surface of the annular rib (21282) is provided with a chamfer (21283).

8. The heating plate according to claim 6, characterized in that, The heating plate (212) is provided with a knife hole (212a) for the stirring blade (26) to pass through. The knife hole (212a) includes a base knife hole (21285) provided on the heat-conducting plate base (2128), a heat-conducting plate knife hole (21260) provided on the heat-conducting plate (2126), and a heat-conducting plate knife hole (21220) provided on the heat-conducting plate (2122). The heat-conducting plate base (2128) also includes a positioning boss (21286) provided around the base knife hole (21285). The heat-conducting plate knife hole (21260) and the heat-conducting plate knife hole (21220) are both positioned and engaged with the positioning boss (21286).

9. The heating plate according to claim 8, characterized in that, The heat-conducting sheet (2126) and the heat-conducting plate (2122) abut against the positioning boss (21286) radially inside the receiving groove (21280).

10. The heating plate according to claim 5, characterized in that, The heat-conducting plate (2122) has a groove (21222) on the side surface opposite to the disk body (2120). The groove (21222) is configured as a blind groove with a depth dimension smaller than the thickness dimension of the heat-conducting plate (2122). The heat-conducting sheet (2126) is also accommodated in the groove (21222).

11. The heating plate according to claim 5, characterized in that, The heat-conducting plate (2122) includes a first heat-conducting plate (2122a) and a second heat-conducting plate (2122b) that are separately arranged. The second heat-conducting plate (2122b) is provided with a mounting groove corresponding to the first heating area (2124a). The mounting groove extends through the second heat-conducting plate (2122b) along the thickness direction. The heat-conducting sheet (2126) and the first heat-conducting plate (2122a) are both provided in the mounting groove and are stacked. The sum of the thicknesses of the heat-conducting sheet (2126) and the first heat-conducting plate (2122a) is equal to the thickness of the second heat-conducting plate (2122b).

12. The heating plate according to any one of claims 1 to 3, 5 to 10, characterized in that, The lateral thermal conductivity of the heat-conducting sheet (2126) is greater than or equal to the lateral thermal conductivity of the heat-conducting plate (2122).

13. The heating plate according to claim 12, characterized in that, The heat-conducting sheet (2126) is a graphite sheet.

14. The heating plate according to any one of claims 1 to 3, 5 to 11, characterized in that, The heat-conducting sheet (2126) is a stainless steel sheet, and the heat-conducting plate (2122) is a graphite plate or an aluminum plate.

15. The heating plate according to any one of claims 1 to 3, 5 to 11, characterized in that, The food contact surface (2120a) has a pitted dense layer.

16. A food processor, characterized in that, include: Host (10); A cup assembly (20) is assembled to the host (10), the cup assembly (20) including a cup body (21) having a cup cavity (200) and the cup body (21) including a heating plate (212) as claimed in any one of claims 1 to 15.

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