Anti-sticking tin paste stirring device
Patent Information
- Application Number
- CN202522165726.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-14
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-14
AI Technical Summary
这不仅造成了宝贵的锡膏原料的直接浪费,更严重的是,这些粘附在部件表面的锡膏会暴露于空气中,水分会快速蒸发,助焊剂会氧化变质
[0018]总体而言,通过本实用新型所构思的以上技术方案与现有技术相比,具有的有益效果包括:
Smart Images

Figure CN224777876U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of solder paste preparation equipment, specifically relating to an anti-sticking solder paste mixing device. Background Technology
[0002] In the SMT (Surface Mount Technology) process of electronic manufacturing, solder paste, a paste-like soldering material composed of solder powder and flux, directly determines the quality and reliability of subsequent circuit board soldering due to its uniform mixing and impurity-free state. However, due to the high viscosity of solder paste, a long-standing and difficult-to-solve core problem in the operation of traditional mixing devices is that the solder paste easily adheres to the inner wall of the mixing tank and the mixing components. This adhesion phenomenon stems primarily from the physical properties of solder paste. During mixing, it is subjected to centrifugal force, causing the solder powder and flux to easily separate and splash onto the inner wall of the tank, the mixing rod, and the blade surface, forming a stubborn adhesion layer. This not only results in a direct waste of valuable solder paste material, but more seriously, this solder paste adhering to the component surface is exposed to air, causing rapid evaporation of moisture and oxidation and deterioration of the flux. When these deteriorated solder pastes fall off during subsequent mixing or production batches and mix into new solder paste, they significantly reduce the activity of the mixture, leading to various defects during soldering such as poor wettability, cold solder joints, and bridging, which seriously affect the soldering strength of electronic components and the reliability of circuit connections.
[0003] Existing technologies have attempted to address this issue using methods such as mechanical scrapers or high-intensity fan purging. However, mechanical scrapers, when removing adhering materials, generate wear debris due to the hard friction between themselves and the can wall, introducing new contamination risks, and long-term use can damage the equipment. Fan purging solutions, while effective at stripping, often require high-powered fans, resulting in high energy consumption and limited effectiveness on high-viscosity solder paste, failing to completely solve the problem and potentially causing noise and temperature fluctuations. These limitations lead to high post-mixing cleaning and maintenance costs, hindering further improvements in production efficiency and product quality.
[0004] This invention attempts to solve or at least alleviate such problems by providing a solder paste preparation apparatus that uses vibration to prevent sticking. Utility Model Content
[0005] In view of one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides an anti-stick solder paste mixing device, which has the advantage of preventing solder paste from sticking.
[0006] To achieve the above objectives, this utility model provides an anti-stick solder paste mixing device, comprising: a mixer body, wherein the mixer body integrates a vertical lifting mechanism on the side and a mixing motor on the top;
[0007] An integrated feeding mechanism is fixed to the top and bottom surface of the mixer body, and a stirring paddle installed on the motor shaft of the top motor is provided inside the integrated feeding mechanism;
[0008] The transport slider is vertically and flexibly mounted on the lifting mechanism;
[0009] A material holding device includes an outer material container and an inner container fixed inside it, the outer diameter of which is smaller than the inner diameter of the outer material container. The outer material container is provided with multiple side wall ultrasonic generators on its side and multiple bottom wall ultrasonic generators on its bottom surface. The inner container is provided with multiple side wall ultrasonic transducers on its outer side and multiple bottom wall ultrasonic transducers on its bottom surface.
[0010] The sidewall ultrasonic generators are all electrically connected to the sidewall ultrasonic transducers, and the bottom wall ultrasonic generators are all electrically connected to the bottom wall ultrasonic transducers.
[0011] The control box contains a control unit that is connected to the ultrasonic generators on the side wall and the bottom wall.
[0012] As a further improvement of this utility model, a sandwich is formed between the outer barrel and the inner barrel of the material, and the sandwich is filled with a heat-conducting medium.
[0013] As a further improvement of this utility model, the side wall ultrasonic generator is arranged in a circumferential array of 4-6 units, and the bottom wall ultrasonic generator is arranged in a circumferential array of 2-4 units.
[0014] As a further improvement of this utility model, the outer wall of the material outer barrel is also provided with support legs, and there are 3-4 support legs in a circumferential array.
[0015] As a further improvement of this utility model, the inner wall of the inner barrel is provided with an anti-stick coating.
[0016] As a further improvement of this utility model, the gap between the stirring paddle and the inner wall of the inner barrel is not less than 2mm.
[0017] As a further improvement of this utility model, a handle is provided on the side of the outer barrel of the material.
[0018] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:
[0019] This invention discloses an anti-stick solder paste mixing device. Through a sandwich structure formed between the outer and inner drums, filled with a heat-conducting medium, it effectively manages the heat generated during the operation of the ultrasonic transducer, ensuring system thermal stability. Side-wall and bottom-wall ultrasonic generators work together to drive ultrasonic transducers installed on the corresponding outer and bottom surfaces of the inner drum, causing uniform high-frequency vibrations on the inner drum wall. This vibration induces cavitation and acoustic radiation at the interface between the solder paste and the drum wall, actively preventing solder paste adhesion at a physical level. The design of maintaining a specific gap between the stirring paddle and the inner drum wall completely avoids contact between the mechanical stirring components and the drum wall. The anti-stick coating on the inner drum wall and the ultrasonic anti-stick system form a dual protection mechanism, further reducing the possibility of solder paste residue. Handles on the side of the outer drum and support legs at the bottom provide stable support and convenient handling. The control unit inside the control box is connected to the ultrasonic generator for precise control of the anti-sticking process. The stirring paddle inside the integrated feeding mechanism, driven by the top stirring motor, works in conjunction with the ultrasonic vibration to achieve thorough mixing of the materials. The synergistic operation of these specific structures achieves a comprehensive effect of preventing solder paste adhesion, reducing material residue, avoiding mechanical wear and contamination, improving mixing uniformity, and facilitating equipment operation and maintenance. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the anti-stick solder paste mixing device of this utility model from a certain angle;
[0021] Figure 2 This is another schematic diagram of the anti-stick solder paste mixing device of this utility model;
[0022] Figure 3 This is a schematic diagram of the side structure of the outer material container of this utility model;
[0023] Figure 4 This is a schematic diagram of the bottom structure of the outer material container of this utility model;
[0024] Figure 5 This is a schematic diagram of the inner barrel structure of this utility model.
[0025] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:
[0026] 1. Mixer body; 11. Carrying slider; 12. Integrated feeding mechanism; 13. Mixing paddle; 14. Control box;
[0027] 15. Water pump; 16. Support leg; 17. Slide rail; 18. Pressure gauge; 2. Outer material container;
[0028] Side wall ultrasonic generator 21; outer wall through hole 22; bottom wall ultrasonic generator 23; bottom wall through hole 24; support leg 25;
[0029] Handle 26; Inner tub 27; Side wall ultrasonic transducer 271; Bottom wall ultrasonic transducer 272; Interlayer 28. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0031] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.
[0032] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.
[0033] In the embodiments, by Figure 1-5 Provided is an anti-stick solder paste mixing device, comprising: a mixer body 1, wherein the mixer body 1 integrates a side vertical lifting mechanism and a top stirring motor; an integrated feeding mechanism 12, fixedly mounted on the top and bottom surfaces of the mixer body 1, wherein the integrated feeding mechanism 12 has a stirring paddle 13 installed on the motor shaft of the top motor, and its outer surface is also provided with a water inlet, a material feeding inlet, a detector, etc. (all of which are prior art); a transport slider 11, which can move up and down in a slide rail 17 opened on the side and is vertically mounted on the lifting mechanism; and a material receiving device, including a material outer bucket 2 and a material receiving device fixed inside it. An inner barrel 27 with a diameter smaller than the inner diameter of the outer barrel 2 of the material container has multiple sidewall ultrasonic generators 21 on its side and multiple bottomwall ultrasonic generators 23 on its bottom surface. The outer barrel 27 has multiple sidewall ultrasonic transducers 271 on its outer side and multiple bottomwall ultrasonic transducers 272 on its bottom surface. Each sidewall ultrasonic generator 21 is electrically connected to a sidewall ultrasonic transducer 271, and each bottomwall ultrasonic generator 23 is electrically connected to a bottomwall ultrasonic transducer 272. An operation box 14 contains a control unit that is signal-connected to the sidewall ultrasonic generators 21 and the bottomwall ultrasonic generators 23.
[0034] This solution uses ultrasonic generators 21 and 23 to drive transducers 271 and 272 on the inner barrel 27. Wires pass through the outer wall through-hole 22 to connect the generators and transducers, achieving electrical connection. This causes high-frequency vibration on the inner barrel wall, utilizing cavitation effect and acoustic radiation force to actively prevent solder paste adhesion at a physical level. This achieves non-contact anti-sticking, fundamentally solving the problems of wear, high resistance, and potential contamination caused by traditional mechanical scrapers, and significantly improving mixing uniformity and product quality.
[0035] In a preferred embodiment of this invention, a sandwich 28 is formed between the outer material container 2 and the inner container 27, and the sandwich 28 is filled with a heat-conducting medium. The sandwich 28 structure filled with a heat-conducting medium can effectively transfer and dissipate the heat generated by the ultrasonic transducer during operation, preventing the solder paste performance from being affected or the equipment components from being damaged due to excessive temperature, thus ensuring the thermal stability and reliability of the system under long-term operation.
[0036] In a preferred embodiment of this invention, the sidewall ultrasonic generators 21 are arranged in a circumferential array of 4-6 units, and the bottomwall ultrasonic generators 23 are arranged in a circumferential array of 2-4 units. By optimizing the arrangement of a specific number of ultrasonic generators 21 and 23 on the sidewall and bottom of the outer barrel, they can work in conjunction with the corresponding transducers 271 and 272 on the inner barrel 27 to form a uniform, dead-angle-free ultrasonic energy field on the inner wall of the mixing tank, thereby comprehensively improving the uniformity and thoroughness of the anti-sticking effect.
[0037] In a preferred embodiment of this invention, the outer wall of the material outer barrel 2 is further provided with support legs 25, and there are 3-4 support legs 25 arranged in a circumferential array. The support legs 25 provide stable support for the entire material holding device, preventing it from moving or tipping over during the mixing process, while also facilitating the positioning and handling of the equipment and enhancing operational safety.
[0038] As a preferred embodiment of this utility model, the inner wall of the inner tub 27 is provided with an anti-stick coating. The addition of an anti-stick coating to the inner wall of the inner tub 27, together with the ultrasonic anti-stick system, forms a dual protection mechanism, further reducing the possibility of solder paste residue and making cleaning and maintenance more convenient and labor-saving.
[0039] As a preferred embodiment of this utility model, the gap between the stirring paddle 13 and the inner wall of the inner barrel 27 is not less than 2 mm. Ensuring a gap of not less than 2 mm between the stirring paddle 13 and the inner wall of the inner barrel 27, while effectively preventing sticking with ultrasonic waves, completely avoids contact between the mechanical stirring components and the barrel wall, thus completely eliminating frictional wear and the resulting risk of contamination.
[0040] As a preferred embodiment of this utility model, a handle 26 is provided on the side of the outer material container 2. The handle 26 greatly facilitates the handling and placement of the outer material container 2, improving operational convenience and work efficiency.
[0041] As a preferred embodiment of this utility model, a water pump 15 is also provided next to the mixer body 1, the operation box 14 is provided on the side of the mixer body 1, and a support leg 16 is also provided at the bottom front end of the mixer body 1 to achieve the balance of the mixer body 1; a pressure gauge 18 is provided on the top of the mixer body 1 to display the pressure in real time.
[0042] Working Principle: When the solder paste mixing device of this utility model is working, the operator loads the solder paste into the inner barrel 27 and starts the equipment. The control unit in the control box 14 first issues a command to start the side wall ultrasonic generator 21 and the bottom wall ultrasonic generator 23. The high-frequency electrical signals generated by these generators are transmitted through wires to the side wall ultrasonic transducers 271 and the bottom wall ultrasonic transducers 272, which are installed in the interlayer 28 between the outer barrel 2 and the inner barrel 27. The transducers convert electrical energy into high-frequency mechanical vibration and transmit it to the wall surface of the inner barrel 27, causing it to generate ultrasonic vibration. At the same time, the stirring motor at the top of the mixing machine body 1 starts, driving the stirring paddle 13 in the integrated feeding mechanism 12 to rotate. Under the combined action of mechanical stirring and ultrasonic vibration, the solder paste is fully mixed under the shear force of the stirring paddle 13 and the cavitation effect and sound radiation force generated by the ultrasonic waves, and cannot adhere to the surface of the inner barrel 27 due to the continuous vibration of the barrel wall. After stirring is completed, the transport slider 11 is lowered under the drive of the vertical lifting mechanism, making it easy to remove the material receiving device. The entire process achieves efficient, uniform, and non-adhesive mixing.
[0043] In summary, this novel anti-stick solder paste mixing device effectively manages the heat generated during the operation of the ultrasonic transducer by using a sandwich structure formed between the outer and inner drums, filled with a heat-conducting medium, thus ensuring the system's thermal stability. The side-wall and bottom-wall ultrasonic generators work together to drive the ultrasonic transducers installed on the corresponding outer and bottom surfaces of the inner drum, causing uniform high-frequency vibrations on the inner drum wall. This vibration induces cavitation and acoustic radiation at the interface between the solder paste and the drum wall, actively preventing solder paste adhesion at a physical level. The design of maintaining a specific gap between the stirring paddle and the inner drum wall completely avoids contact between the mechanical stirring components and the drum wall. The anti-stick coating on the inner drum wall and the ultrasonic anti-stick system form a dual protection mechanism, further reducing the possibility of solder paste residue. The handle on the side of the outer drum and the support legs at the bottom provide stable support and convenient handling. The control unit inside the control box is connected to the ultrasonic generator for precise control of the anti-sticking process. The stirring paddle inside the integrated feeding mechanism, driven by the top stirring motor, works in conjunction with the ultrasonic vibration to achieve thorough mixing of the materials. The synergistic operation of these specific structures achieves a comprehensive effect of preventing solder paste adhesion, reducing material residue, avoiding mechanical wear and contamination, improving mixing uniformity, and facilitating equipment operation and maintenance.
[0044] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A non-stick solder paste mixing device, characterized in that, include: The mixer body (1) integrates a vertical lifting mechanism on the side and a stirring motor on the top. An integrated feeding mechanism (12) is fixed on the top and bottom surface of the mixer body (1), and a stirring paddle (13) installed on the motor shaft of the top motor is provided inside the integrated feeding mechanism (12). The transport slider (11) is vertically and flexibly mounted on the lifting mechanism; The material holding device includes an outer material container (2) and an inner container (27) fixed inside it with an outer diameter smaller than the inner diameter of the outer material container (2). The outer material container (2) is provided with multiple side wall ultrasonic generators (21) on its side and multiple bottom wall ultrasonic generators (23) on its bottom surface. The inner container (27) is provided with multiple side wall ultrasonic transducers (271) on its outer side and multiple bottom wall ultrasonic transducers (272) on its bottom surface. The sidewall ultrasonic generators (21) are all electrically connected to the sidewall ultrasonic transducers (271), and the bottom wall ultrasonic generators (23) are all electrically connected to the bottom wall ultrasonic transducers (272). The control box (14) is equipped with a control unit, which is connected to the side wall ultrasonic generator (21) and the bottom wall ultrasonic generator (23) via signal connection.
2. The solder paste mixing device according to claim 1, characterized in that, A sandwich (28) is formed between the outer barrel (2) and the inner barrel (27) of the material, and the sandwich (28) is filled with a heat-conducting medium.
3. The solder paste mixing device according to claim 1, characterized in that, The side wall ultrasonic generator (21) is arranged in a circumferential array of 4-6 units, and the bottom wall ultrasonic generator (23) is arranged in a circumferential array of 2-4 units.
4. The solder paste mixing device according to claim 1, characterized in that, The outer wall of the material outer barrel (2) is also provided with support legs (25), and there are 3-4 support legs (25) arranged in a circumferential array.
5. The solder paste mixing device according to claim 1, characterized in that, The inner wall of the inner barrel (27) is provided with an anti-stick coating.
6. The solder paste mixing device according to claim 1, characterized in that, The gap between the stirring paddle (13) and the inner wall of the inner barrel (27) is not less than 2 mm.
7. The solder paste mixing device according to claim 1, characterized in that, The outer barrel (2) of the material is provided with a handle (26) on its side.