Automatic loading and film coating integrated machine for semiconductor wafer

Abstract

The utility model provides a kind of semiconductor chip automation feeding and coating integrated machine, including machine body, vacuum pump and movable assembly, the movable assembly includes movable rack, the side of machine body is connected with vacuum pump, the top of machine body is fixedly connected with workbench, the machine body is also provided with control panel, movable assembly is movably installed between the machine body and workbench. The present application is provided with digital display ruler, spring, scraper, handle and the mutual cooperation between movable rod, by overturning handle can make mounting bracket drive movable rod slide along the inside of movable rack, the bottom of scraper can be contacted with the top of workbench, by rotating the adjusting knob of digital display ruler top can make digital display ruler shorten, by the tensile action of spring can make scraper move upwards, the reading of digital display ruler can be directly observed the distance between the bottom of scraper and workbench, so that the process of coating can be more intuitive.

Description

Technical Field

[0001] This utility model relates to the field of coating machines, and in particular to an integrated machine for automated feeding and coating of semiconductor wafers. Background Technology

[0002] A coating machine is a continuous machine that evenly applies coatings to materials. Due to its high degree of automation and uniform application, coating machines are very common in material coating processes. Automatic coating machines use a precisely controlled wire bar or various coating devices to prepare coatings at a selected speed. Because the shear rate and the weight added to the application tools remain constant when the test plate is placed flat on the glass plate, the reproducibility of the coating is greatly improved, resulting in a uniform coating with consistent physical, appearance, and chemical properties. A search revealed Chinese patent publication number CN213287525U, which discloses a novel automated coating machine. By employing a discharge mechanism design in conjunction with a positioning device, the motor synchronously rotates with the working slider during coating operations, ensuring uniform discharge of coating material. Furthermore, the positioning device ensures the material remains centered within the coating machine, solving the problems of coating misalignment, cumbersome feeding, and uneven coating application common in traditional devices. This demonstrates the practicality and feasibility of this device. Existing coating machines suffer from several drawbacks. The thickness of the coating is crucial, yet it's difficult to adjust precisely, leading to uneven thickness and fluctuations. Furthermore, operational complexity is a factor; manual adjustment relies on operator experience, resulting in low automation and making the process time-consuming and labor-intensive. Inconsistencies also exist between operators. These problems not only affect coating quality but also reduce production efficiency. To address this, an integrated automated semiconductor wafer feeding and coating machine is proposed. Summary of the Invention

[0003] In view of this, the present invention provides an integrated automated semiconductor wafer feeding and coating machine to solve or alleviate the technical problems existing in the prior art, and at least provides a beneficial option.

[0004] The technical solution of this utility model is as follows: an integrated automated semiconductor wafer feeding and coating machine, comprising: a machine body, a vacuum pump, and a movable component. The movable component includes a movable frame. A vacuum pump is connected to one side of the machine body. A worktable is fixedly connected to the top of the machine body. A control panel is also provided on the machine body. The movable component is movably installed between the machine body and the worktable. The movable component is driven by a power device. A scraper is movably installed at the bottom of the movable component, and the scraper is located directly above the worktable. A digital display scale is fixedly installed at the top of the movable component. An automatic feeding device is fixedly installed on one side of the movable component.

[0005] More preferably, the automatic feeding device includes a feeding hopper, a feeding port is provided at the top of the feeding hopper, a semiconductor nozzle is provided at the bottom of the feeding hopper, and a flow controller is provided between the feeding hopper and the semiconductor nozzle.

[0006] More preferably, the movable component includes a movable frame and a movable plate.

[0007] More preferably, the power unit includes a motor fixedly installed at one end of the machine body, the output end of the motor being fixedly connected to a threaded rod, the threaded rod being rotatably installed on the inner side of the machine body, and the movable frame being threadedly installed with the threaded rod.

[0008] More preferably, a movable rod extending from the movable frame is fixedly installed on the top of the movable plate, a connecting frame is movably installed on the outside of the movable rod, a mounting frame is movably installed on one side of the connecting frame, and a handle is fixedly installed on the top of the mounting frame.

[0009] More preferably, the interior of the workbench is hollow, and the top of the workbench is uniformly provided with small through holes.

[0010] More preferably, sliding rods are fixedly installed inside the machine body on both sides of the threaded rod. The sliding rods pass through the interior of the movable frame, and the movable frame is respectively provided with threaded grooves and sliding sleeves that cooperate with the threaded rod and the sliding rod.

[0011] More preferably, the movable plate and the scraper are movably connected by a spring, and both the movable plate and the scraper are provided with mounting grooves for installing the spring.

[0012] More preferably, a linkage rod is fixedly installed on the outside of the movable rod, and the outer side of the linkage rod is movably installed between the connecting frame and the outer side of the linkage rod.

[0013] More preferably, the inside of the workbench is connected to the vacuum pump via a pressure-drawing pipe, and the top of the vacuum pump is provided with an air outlet.

[0014] The present invention has the following advantages due to the adoption of the above technical solution: 1. This utility model utilizes a combination of a digital display ruler, a spring, a scraper, a handle, and a movable rod. By flipping the handle, the mounting frame can slide the movable rod along the inner side of the movable frame, allowing the bottom of the scraper to contact the top of the worktable. Rotating the adjustment knob on the top of the digital display ruler shortens the ruler, and the spring tension allows the scraper to move upwards. The reading on the digital display ruler allows for a direct observation of the distance between the bottom of the scraper and the worktable, making the coating process more intuitive. The feeding port on the top of the hopper allows the required film material to be introduced into the hopper. The semiconductor nozzle allows for adjustment of the semiconductor components to control the width of the sprayed film. A flow meter controls the film thickness, and changing the nozzle opening controls the width and thickness of the spray, thus achieving precise control of the spraying process.

[0015] 2. This utility model, through the interaction of a motor, a threaded rod, a sliding rod, a threaded groove, and a sliding sleeve, allows the threaded rod to rotate inside the machine body due to the rotational action of the motor output end. The threaded engagement between the threaded rod and the threaded groove enables the entire movable frame to move along the thread direction outside the threaded rod. During the movement of the movable frame, the sliding sleeve slides along the outside of the sliding rod, making the movable frame more stable during movement and increasing the stability effect of the movable frame during movement.

[0016] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of the appearance of this utility model; Figure 2 This is a structural diagram of the body and worktable of this utility model; Figure 3 This is a three-dimensional structural diagram of the threaded rod and movable frame of this utility model. Figure 4 This is a three-dimensional structural diagram of the movable plate and scraper of this utility model. Figure 5For the present utility model Figure 4 Enlarged 3D structural diagram of part A in the middle; Figure 6 This is a three-dimensional structural diagram of the feed hopper of this utility model.

[0019] Reference numerals: 1. Body; 101. Workbench; 102. Control panel; 103. Vacuum pump; 104. Air outlet; 105. Pressure extraction pipe; 2. Movable frame; 201. Threaded rod; 202. Motor; 203. Sliding rod; 204. Sliding sleeve; 205. Threaded groove; 3. Movable plate; 301. Scraper; 302. Spring; 303. Mounting slot; 304. Digital display scale; 305. Movable rod; 306. Mounting frame; 307. Handle; 308. Linkage rod; 309. Connecting frame; 4. Feed hopper; 401. Feed port; 402. Flow meter; 403. Semiconductor nozzle. Detailed Implementation

[0020] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0021] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0022] like Figure 1 - Figure 6 As shown, this utility model embodiment provides an integrated automated semiconductor wafer feeding and coating machine, including: a machine body 1, a vacuum pump 103, and a movable component. The movable component includes a movable frame 2. The vacuum pump 103 is connected to one side of the machine body 1, and a worktable 101 is fixedly connected to the top of the machine body 1. A control panel 102 is also provided on the machine body 1. The movable component is movably installed between the machine body 1 and the worktable 101. The movable component is driven by a power device. A scraper 301 is movably installed at the bottom of the movable component. The scraper 301 is located directly above the worktable 101. A digital display ruler 304 is fixedly installed at the top of the movable component. An automatic feeding device is fixedly installed on one side of the movable component. The automatic feeding device includes a hopper 4. A feeding port 401 is provided at the top of the hopper 4. A semiconductor nozzle 403 is provided at the bottom of the hopper 4. A flow controller 402 is provided between the hopper 4 and the semiconductor nozzle 403. The movable component includes a movable frame 2 and a movable plate 3.

[0023] By flipping the handle 307, the mounting bracket 306 can drive the movable rod 305 to slide along the inner side of the movable frame 2, allowing the bottom of the scraper 301 to contact the top of the worktable 101. By rotating the adjustment knob on the top of the digital display scale 304, the digital display scale 304 can be shortened. The stretching action of the spring 302 can move the scraper 301 upward, making it more convenient to adjust the coating thickness. The semiconductor nozzle 403 can adjust the specific spacing between the semiconductors according to the needs of use to control the width of the sprayed film. The flow controller 402 controls the thickness of the film. By changing the opening of the nozzle, the width and thickness of the spray can be controlled, thereby achieving precise control of the spraying process.

[0024] Reference Figure 2 - Figure 4 The power unit includes a motor 202 fixedly installed at one end of the body 1. The output end of the motor 202 is fixedly connected to a threaded rod 201. The threaded rod 201 is rotatably installed inside the body 1. The movable frame 2 is threadedly installed with the threaded rod 201. The top of the movable plate 3 is fixedly installed with a movable rod 305 extending out of the movable frame 2. A connecting frame 309 is movably installed on the outside of the movable rod 305. A mounting frame 306 is movably installed on one side of the connecting frame 309. A handle 307 is fixedly installed on the top of the mounting frame 306. The interior of the worktable 101 is hollow. Small through holes are evenly arranged on the top of the worktable 101.

[0025] The rotation of the output end of the motor 202 enables the threaded rod 201 to rotate inside the machine body 1. The threaded engagement between the threaded rod 201 and the threaded groove 205 allows the movable frame 2 to move along the threaded direction of the threaded rod 201. The scraper 301 can be used for adjustment during the coating process.

[0026] Reference Figure 3 - Figure 5 A sliding rod 203 is fixedly installed inside the body 1 on both sides of the threaded rod 201. The sliding rod 203 passes through the interior of the movable frame 2. The movable frame 2 is provided with a threaded groove 205 and a sliding sleeve 204 that cooperate with the threaded rod 201 and the sliding rod 203, respectively. The movable plate 3 and the scraper 301 are movably connected by a spring 302. Both the movable plate 3 and the scraper 301 are provided with a mounting groove 303 for the spring 302 to be installed. A linkage rod 308 is fixedly installed on the outside of the movable rod 305. The outside of the linkage rod 308 is movably installed between the connecting frame 309 and the inside of the workbench 101. One side of the workbench 101 is connected to the vacuum pump 103 through a suction pipe 105. An air outlet 104 is provided on the top of the vacuum pump 103.

[0027] By flipping the handle 307, the mounting bracket 306 can drive the movable rod 305 to slide along the inner side of the movable frame 2, so that the bottom of the scraper 301 can contact the top of the worktable 101, allowing the digital display ruler 304 to be easily zeroed and the reading can be directly displayed during subsequent rotation, making the adjustment process more convenient.

[0028] In operation, this invention allows the following: Flipping the handle 307 causes the mounting bracket 306 to slide along the inner side of the movable frame 2, allowing the bottom of the scraper 301 to contact the top of the worktable 101. Rotating the adjustment knob on the top of the digital display scale 304 shortens the scale, and the tension of the spring 302 moves the scraper 301 upwards, making it easier to adjust the coating thickness. The reading on the digital display scale 304 provides a direct view of the distance between the bottom of the scraper 301 and the worktable 101, making the coating process more intuitive. The semiconductor nozzle 403 allows for adjustments to the specific distance between the semiconductors as needed. This controls the width of the sprayed film, and the thickness of the film is controlled by the flow controller 402. The width and thickness of the spray are controlled by changing the opening of the nozzle, thereby achieving precise control of the spraying process. The rotation of the output end of the motor 202 enables the threaded rod 201 to rotate inside the machine body 1. The threaded engagement between the threaded rod 201 and the threaded groove 205 allows the movable frame 2 to move along the thread direction outside the threaded rod 201. During the movement of the movable frame 2, the sliding sleeve 204 slides along the outside of the sliding rod 203, making the movable frame 2 more stable during movement and increasing the stability effect of the movable frame 2 during movement.

[0029] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A semiconductor wafer automated feeding and coating integrated machine, characterized in that: The device includes a body (1), a vacuum pump (103), and a movable component. The movable component includes a movable frame (2). The vacuum pump (103) is connected to one side of the body (1). A workbench (101) is fixedly connected to the top of the body (1). A control panel (102) is also provided on the body (1). The movable component is movably installed between the body (1) and the workbench (101). The movable component is driven by a power device. A scraper (301) is movably installed at the bottom of the movable component. The scraper (301) is located directly above the workbench (101). A digital display ruler (304) is fixedly installed at the top of the movable component. An automatic feeding device is fixedly installed on one side of the movable component.

2. The integrated automated semiconductor wafer feeding and coating machine according to claim 1, characterized in that: The automatic feeding device includes a feeding hopper (4), a feeding port (401) is provided at the top of the feeding hopper (4), a semiconductor nozzle (403) is provided at the bottom of the feeding hopper (4), and a flow controller (402) is provided between the feeding hopper (4) and the semiconductor nozzle (403).

3. The integrated automated semiconductor wafer feeding and coating machine according to claim 1, characterized in that: The movable components include a movable frame (2) and a movable plate (3).

4. The integrated automated semiconductor wafer feeding and coating machine according to claim 3, characterized in that: The power unit includes a motor (202) fixedly installed at one end of the body (1). The output end of the motor (202) is fixedly connected to a threaded rod (201). The threaded rod (201) is rotatably installed on the inner side of the body (1). The movable frame (2) is threadedly installed with the threaded rod (201).

5. The integrated automated semiconductor wafer feeding and coating machine according to claim 4, characterized in that: The top of the movable plate (3) is fixedly installed with a movable rod (305) extending out of the movable frame (2). A connecting frame (309) is movably installed on the outside of the movable rod (305). A mounting frame (306) is movably installed on one side of the connecting frame (309). A handle (307) is fixedly installed on the top of the mounting frame (306).

6. The integrated automated semiconductor wafer feeding and coating machine according to claim 1, characterized in that: The workbench (101) is hollow inside, and small through holes are evenly distributed on the top of the workbench (101).

7. The integrated automated semiconductor wafer feeding and coating machine according to claim 5, characterized in that: Sliding rods (203) are fixedly installed inside the body (1) on both sides of the threaded rod (201). The sliding rods (203) pass through the interior of the movable frame (2). The movable frame (2) is provided with threaded grooves (205) and sliding sleeves (204) that cooperate with the threaded rod (201) and the sliding rod (203).

8. The integrated automated semiconductor wafer feeding and coating machine according to claim 7, characterized in that: The movable plate (3) and the scraper (301) are movably connected by a spring (302), and both the movable plate (3) and the scraper (301) are provided with mounting grooves (303) for the spring (302) to be installed.

9. The integrated automated semiconductor wafer feeding and coating machine according to claim 8, characterized in that: A linkage rod (308) is fixedly installed on the outside of the movable rod (305), and the outer side of the linkage rod (308) is movably installed between the connecting frame (309).

10. The integrated automated semiconductor wafer feeding and coating machine according to claim 1, characterized in that: The workbench (101) is connected to the vacuum pump (103) via a pressure-drawing pipe (105) on one side, and the vacuum pump (103) is provided with an air outlet (104) on its top.

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