Photovoltaic solder strip preparation apparatus and photovoltaic solder strip

Abstract

The application relates to a photovoltaic welding strip preparation device and a photovoltaic welding strip. The photovoltaic welding strip preparation device comprises a glue dipping device, a curing device, a glue cleaning device and a tinning device. The glue dipping device is used for dipping glue on a welding strip base material. The curing device is arranged downstream of the glue dipping device and is used for curing the glue on the non-welding surface of the welding strip base material. The glue cleaning device is arranged downstream of the curing device and is used for removing the uncured glue on the welding strip base material. The tinning device is arranged downstream of the glue cleaning device and is used for tinning the welding strip base material with the cured glue on the non-welding surface. The photovoltaic welding strip preparation device can quickly process the glue layer on the non-welding surface of the welding strip base material. By using the characteristic that the glue layer does not adhere to the tin material, tinning is only realized on the welding surface of the welding strip base material, the preparation efficiency of the single-sided tinned photovoltaic welding strip is improved, and the tin material is saved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic processing technology, and in particular to photovoltaic ribbon preparation equipment and photovoltaic ribbon. Background Technology

[0002] Solar photovoltaic power generation, as a highly efficient and clean power generation method, has materials and technologies that are currently a hot research topic. Photovoltaic ribbon, as one of the important raw materials in solar cell encapsulation, has a significant impact on the performance and manufacturing cost of solar modules due to its performance and cost.

[0003] The most widely used photovoltaic solder ribbon is the copper-based tin-coated solder ribbon, which uses copper as the substrate and a layer of tin alloy solder as the welding layer. However, the tin layer in non-soldering areas can affect the reflectivity of the solder ribbon and cause material waste. Therefore, how to locally tin-plate the solder joints of photovoltaic solder ribbons has attracted much attention in the field. Traditional locally tin-plated photovoltaic solder ribbons have a relatively complicated manufacturing process and high production costs. Utility Model Content

[0004] Therefore, it is necessary to provide a photovoltaic solder ribbon preparation equipment and a photovoltaic solder ribbon that can quickly process an adhesive layer on the non-soldering surface of the solder ribbon substrate. By utilizing the characteristic that the adhesive layer does not stick to solder, tin plating can be achieved only on the soldering surface of the solder ribbon substrate, which improves the preparation efficiency of single-sided tin-plated photovoltaic solder ribbon and saves solder.

[0005] In a first aspect, this application provides a photovoltaic ribbon preparation apparatus, comprising:

[0006] Adhesive dipping device for dipping adhesive onto a solder strip substrate;

[0007] A curing device is located downstream of the adhesive dipping device; the curing device is used to cure the adhesive on the non-welding surface of the solder ribbon substrate.

[0008] An adhesive cleaning device is located downstream of the curing device; the adhesive cleaning device is used to remove uncured adhesive from the solder ribbon substrate;

[0009] A tin plating device is located downstream of the adhesive cleaning device; the tin plating device is used to perform tin plating on the solder strip substrate on the non-soldering surface where the adhesive is cured.

[0010] In one embodiment, the adhesive dipping apparatus includes:

[0011] An immersion coating tank is disposed on the moving path of the solder ribbon substrate. The immersion coating tank contains the adhesive, and the solder ribbon substrate passes through the inside of the immersion coating tank to immerse the entire surface of the solder ribbon substrate in the adhesive.

[0012] In one embodiment, the curing apparatus includes:

[0013] A UV curing lamp is disposed on the non-welding surface of the solder ribbon substrate. The UV curing lamp is used to irradiate the non-welding surface to cure the adhesive on the non-welding surface.

[0014] In one embodiment, the curing apparatus further includes:

[0015] A correction mechanism is disposed on the moving path of the solder strip substrate to adjust the posture of the solder strip substrate so that the non-welding surface faces the UV curing lamp.

[0016] In one embodiment, the correction mechanism includes:

[0017] At least one limiting mold is provided with a contour hole for the welding strip substrate to pass through, and the shape of the contour hole matches the cross-sectional shape of the welding strip substrate.

[0018] In one embodiment, two limiting molds are provided, with the two limiting molds spaced apart, and the UV curing lamp is disposed between the two limiting molds.

[0019] In one embodiment, the photovoltaic ribbon fabrication equipment further includes:

[0020] The first drying unit is located between the glue cleaning device and the tin plating device, and is used to dry the cleaned solder strip substrate.

[0021] In one embodiment, the photovoltaic ribbon fabrication equipment further includes:

[0022] A de-adhesive device is located downstream of the tin plating device, and the de-adhesive device is used to remove the adhesive that has been cured on the non-soldering surface of the solder strip substrate.

[0023] In one embodiment, the photovoltaic ribbon fabrication equipment further includes:

[0024] A coating device, disposed between the adhesive cleaning device and the tin plating device, is used to coat the solder ribbon substrate with flux.

[0025] Secondly, this application provides a photovoltaic solder ribbon, which is prepared based on the photovoltaic solder ribbon preparation equipment provided in any of the above embodiments. The photovoltaic solder ribbon includes a solder ribbon substrate, a transparent adhesive film layer, and a solder layer.

[0026] The solder strip substrate includes a soldering surface and a non-soldering surface. The soldering surface is provided with the solder layer, and the non-soldering surface is provided with the transparent adhesive film layer.

[0027] The aforementioned photovoltaic solder ribbon preparation equipment, through the inclusion of an adhesive dipping device, a curing device, an adhesive cleaning device, and a tin plating device, sequentially applies adhesive to the solder ribbon substrate, performs partial adhesive curing, removes uncured adhesive, and performs partial tin plating. During processing, the adhesive dipping device first applies adhesive to the entire surface of the solder ribbon substrate. Then, the curing device cures the adhesive on the non-soldering surfaces of the solder ribbon substrate. Next, the adhesive cleaning device removes the uncured adhesive from the soldering surfaces of the solder ribbon substrate, exposing the soldering surfaces. Finally, the tin plating device tin-plats the solder ribbon substrate with the cured adhesive on the non-soldering surfaces and the exposed soldering surfaces. Due to the protective effect of the cured adhesive, the non-soldering surfaces are not tin-plated, thus enabling tin plating only on the soldering surfaces of the solder ribbon substrate, saving tin and reducing the production cost of photovoltaic solder ribbons. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the photovoltaic ribbon preparation equipment provided in Embodiment 1 of this application;

[0029] Figure 2 This is a schematic diagram of the adhesive dipping apparatus provided in Embodiment 1 of this application;

[0030] Figure 3 This is a schematic diagram of the structure of the limiting mold provided in Embodiment 1 of this application;

[0031] Figure 4 A schematic diagram of a photovoltaic solder strip provided in Embodiment 1 of this application Figure 1 ;

[0032] Figure 5 A schematic diagram of a photovoltaic solder strip provided in Embodiment 1 of this application Figure 2 ;

[0033] Figure 6 This is a schematic diagram of another photovoltaic ribbon structure provided in Embodiment 1 of this application. Figure 1 ;

[0034] Figure 7 This is a schematic diagram of another photovoltaic ribbon structure provided in Embodiment 1 of this application. Figure 2 ;

[0035] Figure 8 This is a schematic diagram of the photovoltaic ribbon preparation equipment provided in Embodiment 2 of this application.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100. Photovoltaic solder ribbon; 110. Solder ribbon substrate; 120. Transparent adhesive film layer; 130. Solder layer; 200. Adhesive;

[0038] 1. Adhesive dipping device; 11. Dipping tank; 12. Guiding mechanism;

[0039] 2. Curing device; 21. UV curing lamp; 22. UV lamp box; 23. Correction mechanism; 231. Limiting mold; 2310. Contouring hole;

[0040] 3. Glue cleaning device;

[0041] 4. Tin plating equipment;

[0042] 51. First drying mechanism; 52. Second drying mechanism;

[0043] 6. Degumming device;

[0044] 7. Coating device;

[0045] 81. Feeding roller; 82. Receiving roller;

[0046] 9. First guide roller. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0053] Example 1:

[0054] In the field of solar photovoltaic (PV) systems, photovoltaic (PV) modules are the core component of solar power generation systems. Their function is to convert solar energy into electrical energy, which is then stored in batteries or used to power loads. A PV module consists of multiple solar cells, which need to be connected in series and parallel according to a design to form a stable electrical performance structure.

[0055] Currently, the mainstream connection method is to use photovoltaic solder ribbon to connect the silver paste busbars printed on the positive and negative electrodes of the solar cells through welding. Photovoltaic solder ribbon is generally a tin-plated metal wire. The commonly used tin plating process is hot-dip plating, which involves immersing the surface-treated metal substrate into high-temperature molten tin in a tin bath, then vertically pulling it out of the tin bath, and cooling and solidifying it with an air knife to form a tin alloy plating layer on the surface of the metal substrate.

[0056] However, in practical applications, photovoltaic solder ribbons only require soldering on the side that contacts the solar cell (hereinafter referred to as the soldering surface). The tin alloy plating on the non-soldering surface serves no purpose, resulting in a waste of tin alloy solder and increased material costs. Furthermore, tin alloy itself has low reflectivity; the tin alloy on the non-soldering surface reduces the reflectivity of the photovoltaic solder ribbon, affecting the light utilization rate of the photovoltaic module's light-receiving area. Therefore, it is necessary to develop a photovoltaic solder ribbon that is tin-plated only on the soldering surface.

[0057] Based on the above processing requirements for photovoltaic ribbons, Embodiment 1 of this application provides a photovoltaic ribbon preparation device. (See also...) Figure 1 , Figure 1 A schematic diagram of the structure of the photovoltaic ribbon preparation equipment provided in Embodiment 1 of this application is shown.

[0058] The photovoltaic solder ribbon preparation equipment includes an adhesive dipping device 1, a curing device 2, an adhesive cleaning device 3, and a tin plating device 4. The adhesive dipping device 1 is used to dip and coat the solder ribbon substrate 110 with adhesive 200. The curing device 2 is located downstream of the adhesive dipping device 1 and is used to cure the adhesive 200 on the non-soldering surfaces of the solder ribbon substrate 110. The adhesive cleaning device 3 is located downstream of the curing device 2 and is used to remove any uncured adhesive 200 from the solder ribbon substrate 110. The tin plating device 4 is located downstream of the adhesive cleaning device 3 and is used to tin-plat the solder ribbon substrate 110 with the cured adhesive 200 on the non-soldering surfaces. Optionally, the tin plating device 4 uses a hot-dip tin plating process to tin-plat the entire surface of the solder ribbon substrate 110.

[0059] The photovoltaic solder ribbon preparation equipment provided in this application embodiment includes an adhesive dipping device 1, a curing device 2, an adhesive cleaning device 3, and a tin plating device 4. These devices sequentially apply adhesive 200 to the solder ribbon substrate 110, partially cure the adhesive 200, remove uncured adhesive 200, and perform partial tin plating. During processing, the adhesive 200 is first applied to the entire surface of the solder ribbon substrate 110 using the adhesive dipping device 1. Then, the adhesive 200 on the non-soldering surfaces of the solder ribbon substrate 110 is cured using the curing device 2. Next, the uncured adhesive 200 on the solder ribbon substrate 110 is removed using the adhesive cleaning device 3, specifically the adhesive 200 on the soldering surfaces of the solder ribbon substrate 110, exposing the soldering surfaces. Finally, the solder ribbon substrate 110, with the cured adhesive 200 on the non-soldering surfaces and the exposed soldering surfaces, is tin-plated using the tin plating device 4. Due to the protection of the cured adhesive 200, the non-soldering surface will not be plated with tin, thus enabling tin plating only on the soldering surface of the solder ribbon substrate 110, saving tin and helping to reduce the manufacturing cost of the photovoltaic solder ribbon 100.

[0060] In this embodiment, the adhesive 200 can be a highly transparent adhesive. The cured film has good transparency, with a light transmittance greater than 95%, minimizing its impact on the incidence and subsequent reflection of sunlight. This fully leverages the high reflectivity of the solder ribbon substrate 110, which is beneficial for maintaining the light utilization rate of the photovoltaic module. The cured film does not need to be removed, saving processing steps and making the entire preparation process of the photovoltaic solder ribbon 100 relatively quick. Furthermore, the cured film provides protection on the surface of the solder ribbon substrate 110, reducing surface scratches on the photovoltaic solder ribbon 100 during transportation and use.

[0061] In some embodiments, the solder ribbon substrate 110 moves continuously through the aforementioned adhesive dipping device 1, curing device 2, adhesive cleaning device 3, and tin plating device 4 for continuous processing. To achieve continuous movement of the solder ribbon substrate 110, it is wound onto the unloading roller 81, released from the unloading roller 81, and sequentially passes through the adhesive dipping device 1, curing device 2, adhesive cleaning device 3, and tin plating device 4 before being wound onto the take-up roller 82. Further, the photovoltaic solder ribbon preparation equipment also includes multiple first guide rollers 9, spaced apart between the unloading roller 81 and the take-up roller 82, around which the solder ribbon substrate 110 passes. The multiple first guide rollers 9 guide and tension the solder ribbon substrate 110, causing it to pass through the adhesive dipping device 1, curing device 2, adhesive cleaning device 3, and tin plating device 4 in a specific direction.

[0062] Please see Figure 2 , Figure 2 A schematic diagram of the adhesive dipping apparatus 1 provided in Embodiment 1 of this application is shown.

[0063] In some embodiments, the adhesive dipping apparatus 1 includes a dipping tank 11 disposed on the moving path of the solder ribbon substrate 110. The dipping tank 11 contains adhesive 200, and the solder ribbon substrate 110 passes through the inside of the dipping tank 11 to dip the entire surface of the solder ribbon substrate 110 with adhesive 200.

[0064] Specifically, the dip coating tank 11 has an inlet and an outlet on its two opposite side walls. The solder strip substrate 110 enters the dip coating tank 11 through the inlet, is impregnated with the adhesive 200, and then exits through the outlet. The level of the adhesive 200 in the dip coating tank 11 is set lower than the height of the inlet and outlet to prevent the adhesive 200 from overflowing from the inlet and outlet.

[0065] In some embodiments, the adhesive dipping apparatus 1 further includes a guide mechanism 12 disposed in the dipping tank 11 for adjusting the movement path of the solder ribbon substrate 110 so that the solder ribbon substrate 110 is at least partially immersed in the adhesive 200, thereby ensuring that the solder ribbon substrate 110 is always fully coated with adhesive 200 when moving in the dipping tank 11.

[0066] Specifically, the guiding mechanism 12 includes a plurality of second guide rollers for adjusting the movement path of the solder ribbon substrate 110. At least one of the second guide rollers has its lowest position below the level of the adhesive 200, and the solder ribbon substrate 110 passes around the bottom side of the second guide roller so that the solder ribbon substrate 110 near the second guide roller is immersed in the adhesive 200.

[0067] In some embodiments, please refer to Figure 1 The curing device 2 includes a UV curing lamp 21, which is positioned on the non-welding side of the solder ribbon substrate 110. The UV curing lamp 21 is used to irradiate the non-welding side to cure the adhesive 200 on the non-welding side. The UV curing lamp 21 cures the adhesive quickly, completing the curing process in a few seconds or tens of seconds, which is beneficial for adapting to assembly line production and improving production efficiency.

[0068] Optionally, the curing device 2 also includes a UV lamp box 22 through which the solder ribbon substrate 110 passes with its non-soldering side facing upward. A UV curing lamp 21 is disposed on the inner side of the top of the UV lamp box 22 to irradiate the non-soldering side of the solder ribbon substrate 110, thereby accelerating the curing of the adhesive 200.

[0069] In some embodiments, please refer to Figure 1 The curing device 2 also includes a correction mechanism 23, which is set on the moving path of the solder ribbon substrate 110 and is used to adjust the posture of the solder ribbon substrate 110 so that the non-welding surface faces the UV curing lamp 21 to prevent the solder ribbon substrate 110 from flipping over and to avoid curing the glue 200 on the welding surface.

[0070] Specifically, please refer to Figure 1 and Figure 3 , Figure 3 A schematic diagram of the limiting mold 231 provided in one embodiment of the application is shown. The correction mechanism 23 includes at least one limiting mold 231, which is provided with a contour hole 2310 for the solder ribbon substrate 110 to pass through, and the shape of the contour hole 2310 matches the cross-sectional shape of the solder ribbon substrate 110. The solder ribbon substrate 110 is limited by the contour hole 2310, so that the solder ribbon substrate 110 passes through the UV curing lamp 21 with the non-welding surface facing the UV curing lamp 21, thereby ensuring that the UV curing lamp 21 irradiates only the adhesive 200 on the non-welding surface.

[0071] Optionally, two limiting molds 231 are provided, spaced apart, with the UV curing lamp 21 positioned between them. Between the two limiting molds 231, the non-welding surface of the solder ribbon substrate 110 faces the UV curing lamp 21. With the solder ribbon substrate 110 positioned between the two limiting molds 231, its posture is more accurately determined, which is beneficial for the precision of UV curing.

[0072] In some embodiments, please refer to Figure 1 The adhesive cleaning device 3 includes a solvent tank containing cleaning solvents such as ethanol. Utilizing the difference in solubility of the adhesive 200 in its uncured and cured states, uncured adhesive can be selectively cleaned and removed. The solvent in the solvent tank can be determined based on the specific type of adhesive 200 used, and is not limited to ethanol, as long as the solvent's solubility for uncured adhesive is significantly greater than its solubility for cured adhesive.

[0073] In some embodiments, please refer to Figure 1 The photovoltaic solder ribbon preparation equipment also includes a first drying mechanism 51, which is located between the adhesive cleaning device 3 and the tin plating device 4. This first drying mechanism 51 is used to dry the cleaned solder ribbon substrate 110. By setting up the first drying mechanism 51, the drying speed of the cleaning solvent on the surface of the solder ribbon substrate 110 is increased, allowing the solder ribbon substrate 110 to enter the downstream tin plating device 4 in a relatively dry state, thereby improving the tin plating effect.

[0074] Specifically, the first drying unit 51 includes a drying tunnel, which dries the cleaning solvent by heating the tunnel, thereby obtaining a dry solder strip substrate 110 with cured adhesive on the non-soldering surface.

[0075] Optionally, the first drying mechanism 51 may also include a blower mechanism to blow air onto the surface of the solder strip substrate 110 to accelerate the drying of the cleaning solvent. It is understood that the first drying mechanism 51 may also employ other structural forms, such as infrared lamp irradiation, as long as it achieves the purpose of increasing the drying speed of the cleaning solvent.

[0076] In some embodiments, please refer to Figure 1 The photovoltaic ribbon preparation equipment also includes a coating device 7, which is located between the adhesive cleaning device 3 and the tin plating device 4, and is used to coat the ribbon substrate 110 with flux. Specifically, the coating device 7 includes a flux tank, in which materials such as felt or sponge are placed, and the felt or sponge is impregnated with flux. When the ribbon substrate 110 passes through the flux tank, flux can adhere to the surface of the ribbon substrate 110.

[0077] Based on the photovoltaic ribbon preparation equipment described above, this application embodiment also provides a photovoltaic ribbon prepared using the photovoltaic ribbon preparation equipment described in any of the above embodiments. Specifically, the photovoltaic ribbon 100 includes a ribbon substrate 110, a transparent adhesive film layer 120, and a solder layer 130. The ribbon substrate 110 includes a welding surface and a non-welding surface. The solder layer 130 is disposed on the welding surface, and the transparent adhesive film layer 120 is disposed on the non-welding surface.

[0078] Please see Figure 4 and Figure 5 , Figure 4 This illustration shows a structural diagram of a photovoltaic solder ribbon 100 provided in Embodiment 1 of this application. Figure 1 ; Figure 5 This illustration shows a structural diagram of a photovoltaic solder ribbon 100 provided in Embodiment 1 of this application. Figure 2 The photovoltaic ribbon 100 has a triangular cross-sectional shape perpendicular to its length. The photovoltaic ribbon 100 includes a ribbon substrate 110, a transparent adhesive film layer 120, and a solder layer 130. The ribbon substrate 110 includes a welding surface and a non-welding surface. The solder layer 130 is disposed on the welding surface, and the transparent adhesive film layer 120 is disposed on the non-welding surface. The transparent adhesive film layer 120 has high light transmittance, has minimal impact on the incident and subsequent reflection of sunlight, and can fully utilize the high reflectivity of the ribbon substrate 110, which is beneficial for maintaining the light utilization rate of the photovoltaic module.

[0079] Specifically, the solder strip substrate 110 has a triangular cross-sectional shape perpendicular to its length direction and has three surfaces, one of which is provided with a solder layer 130 and the other two surfaces are provided with transparent adhesive film layers 120.

[0080] Please see Figure 6 and Figure 7 , Figure 6 This illustration shows a structural schematic of another photovoltaic solder ribbon 100 provided in Embodiment 1 of this application. Figure 1 ; Figure 7 This illustration shows a structural schematic of another photovoltaic solder ribbon 100 provided in Embodiment 1 of this application. Figure 2 The photovoltaic solder ribbon 100 has a semi-circular cross-sectional shape perpendicular to its length. Specifically, the photovoltaic solder ribbon 100 includes a solder ribbon substrate 110, a transparent adhesive film layer 120, and a solder layer 130. The solder ribbon substrate 110 has a semi-circular cross-sectional shape perpendicular to its length and has two surfaces: a flat surface and a curved surface. The solder layer 130 is disposed on the flat surface, and the transparent adhesive film layer 120 is disposed on the curved surface.

[0081] The above presents two common photovoltaic solder ribbons 100. Of course, the photovoltaic solder ribbon 100 can also be any other shape, such as circular, flat, etc. All of the above-mentioned photovoltaic solder ribbons 100 can be designed with the above-mentioned solder ribbon substrate 110, transparent adhesive film layer 120 and solder layer 130.

[0082] The steps for processing the photovoltaic ribbon 100 using the photovoltaic ribbon preparation equipment provided in this application embodiment are as follows:

[0083] S1: Provide a solder strip substrate 110.

[0084] S2: Apply adhesive 200 to the entire surface of the welding strip substrate 110 by dip coating device 1.

[0085] S3: The correction mechanism 23 corrects the posture of the solder ribbon substrate 110 so that the non-welding surface of the solder ribbon substrate 110 faces the UV curing lamp 21; the UV curing lamp 21 irradiates the non-welding surface, so that the adhesive 200 on the non-welding surface is cured to form a transparent adhesive film layer 120, while the adhesive 200 on the welding surface remains in its original state and does not cure.

[0086] Specifically, the solder strip substrate 110 is passed sequentially through two spaced-apart limiting molds 231 to prevent the solder strip substrate 110 from flipping between the limiting molds 231.

[0087] S4: The glue cleaning device 3 cleans the cured welding strip substrate 110 to remove the uncured glue 200 from the welding surface.

[0088] S5: The first drying unit 51 dries the cleaned solder ribbon substrate 110 to remove the cleaning solvent from the surface of the solder ribbon substrate 110.

[0089] S6: The coating device 7 applies flux to the surface of the solder strip substrate 110.

[0090] S7: The tin plating apparatus 4 performs tin plating on the solder ribbon substrate 110 after flux coating. Since a transparent adhesive film layer 120 is formed on the non-soldering surface of the solder ribbon substrate 110, and the transparent adhesive film layer 120 has the property of not sticking to tin, after the tin plating treatment, a tin solder layer 130 is formed only on the soldering surface of the solder ribbon substrate 110, achieving the purpose of single-sided tin plating.

[0091] Example 2:

[0092] Please see Figure 8 , Figure 8 A schematic diagram of the structure of the photovoltaic ribbon preparation equipment provided in Embodiment 2 of this application is shown.

[0093] Embodiment 2 of this application provides a photovoltaic solder ribbon preparation device, which is a further improvement on the photovoltaic solder ribbon preparation device provided in Embodiment 1. Specifically, the photovoltaic solder ribbon preparation device further includes a de-adhesive device 6, which is located downstream of the tin plating device 4. The de-adhesive device 6 is used to remove the glue 200 that has been cured on the non-soldering surface of the solder ribbon substrate 110.

[0094] The photovoltaic ribbon 100 produced by this photovoltaic ribbon preparation equipment includes a ribbon substrate 110 and a solder layer 130. The ribbon substrate 110 includes a welding surface and a non-welding surface. The solder layer 130 is provided on the welding surface, and the non-welding surface is directly exposed, which can give full play to the high reflectivity of the ribbon substrate 110.

[0095] Specifically, the adhesive 200 is a removable adhesive that can be removed after curing, and can be removed from the surface of the solder strip substrate 110 under hot water conditions or other removal conditions after curing.

[0096] In some embodiments, the debonding device 6 includes a debonding tank containing a debonding agent, such as hot water. The tin-plated photovoltaic solder ribbon 100 is immersed in the debonding agent in the debonding tank so that the cured adhesive on the non-soldering surface is removed from the solder ribbon substrate 110 under the action of the debonding agent.

[0097] In some embodiments, the photovoltaic ribbon preparation equipment further includes a second drying mechanism 52, which is located downstream of the degumming device 6 and is used to dry the degummed photovoltaic ribbon 100 to remove the degumming agent from the photovoltaic ribbon 100. The second drying mechanism 52 may have the same structure as the first drying mechanism 51, and will not be described in detail here.

[0098] After being dried by the second drying mechanism 52, the photovoltaic welding ribbon 100 is then wound onto the take-up roller 82. The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification.

[0099] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A photovoltaic ribbon preparation device, characterized in that, include: Adhesive dipping device (1) is used to dip adhesive (200) onto the solder strip substrate (110). A curing device (2) is disposed downstream of the adhesive dipping device (1); the curing device (2) is used to cure the adhesive (200) on the non-welding surface of the solder strip substrate (110). An adhesive cleaning device (3) is located downstream of the curing device (2); the adhesive cleaning device (3) is used to remove uncured adhesive (200) from the solder ribbon substrate (110). A tin plating device (4) is located downstream of the adhesive cleaning device (3); the tin plating device (4) is used to tin plating the solder strip substrate (110) on the non-soldering surface where the adhesive (200) is cured.

2. The photovoltaic ribbon preparation equipment according to claim 1, characterized in that, The adhesive dipping apparatus (1) includes: An immersion coating tank (11) is disposed on the moving path of the solder ribbon substrate (110). The immersion coating tank (11) contains the adhesive (200). The solder ribbon substrate (110) passes through the interior of the immersion coating tank (11) to immerse the entire surface of the solder ribbon substrate (110) in the adhesive (200).

3. The photovoltaic ribbon preparation equipment according to claim 1, characterized in that, The curing device (2) includes: A UV curing lamp (21) is disposed on the non-welding side of the solder ribbon substrate (110), and the UV curing lamp (21) is used to irradiate the non-welding side to cure the adhesive (200) on the non-welding side.

4. The photovoltaic ribbon preparation equipment according to claim 3, characterized in that, The curing device (2) further includes: The correction mechanism (23) is disposed on the moving path of the solder strip substrate (110) and is used to adjust the posture of the solder strip substrate (110) so that the non-welding surface faces the UV curing lamp (21).

5. The photovoltaic ribbon preparation equipment according to claim 4, characterized in that, The correction mechanism (23) includes: At least one limiting mold (231) is provided with a contour hole (2310) for the solder strip substrate (110) to pass through, and the shape of the contour hole (2310) matches the cross-sectional shape of the solder strip substrate (110).

6. The photovoltaic ribbon preparation equipment according to claim 5, characterized in that, Two limiting molds (231) are provided, and the two limiting molds (231) are arranged at intervals. The UV curing lamp (21) is arranged between the two limiting molds (231).

7. The photovoltaic ribbon preparation equipment according to any one of claims 1 to 6, characterized in that, The photovoltaic ribbon preparation equipment also includes: The first drying unit (51) is located between the glue cleaning device (3) and the tin plating device (4) for drying the cleaned solder strip substrate (110).

8. The photovoltaic ribbon preparation equipment according to any one of claims 1 to 6, characterized in that, The photovoltaic ribbon preparation equipment also includes: A de-adhesive device (6) is located downstream of the tin plating device (4) and is used to remove the adhesive (200) that has been cured on the non-soldering surface of the solder strip substrate (110).

9. The photovoltaic ribbon preparation equipment according to any one of claims 1 to 6, characterized in that, The photovoltaic ribbon preparation equipment also includes: A coating device (7) is disposed between the glue cleaning device (3) and the tin plating device (4) for coating flux onto the solder strip substrate (110).

10. A photovoltaic welding strip, characterized in that, The photovoltaic ribbon (100) is prepared using the photovoltaic ribbon preparation equipment as described in any one of claims 1 to 9, and includes a ribbon substrate (110), a transparent adhesive film layer (120), and a solder layer (130). The solder strip substrate (110) includes a soldering surface and a non-soldering surface. The soldering surface is provided with the solder layer (130), and the non-soldering surface is provided with the transparent adhesive film layer (120).

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