Chip fixing glue coating device for LED package

Abstract

The utility model relates to LED chip gluing technology field, and disclose a kind of chip fixing glue smearing equipment for LED packaging, including top plate, bottom plate is equipped in the lower of top plate, the both sides top of bottom plate is vertically installed with side plate, the top of side plate is connected with top plate, the top fixed mounting of top plate has abutment;Placing mould is set at the top of abutment, the upper of placing mould is equipped with quadrilateral frame.The utility model can avoid the deviation, inclination etc. of LED chip in the process of gluing;Through drive assembly, lifting assembly, glue gun can reach different positions above placing mould, facilitate the performance of LED chip fixing glue smearing work;Through heat preservation component, the glue inside the bottom end glue nozzle of glue gun can always be in a relatively constant temperature, so as to avoid the slender glue nozzle of glue gun exposed in external environment to cause fixing glue fluidity reduction.

Description

Technical Field

[0001] This utility model relates to the field of LED chip coating technology, specifically to a chip fixing adhesive coating device for LED packaging. Background Technology

[0002] An LED chip is a solid-state semiconductor device. Its core consists of P-type and N-type semiconductors. It emits light by generating photons through the recombination of electrons and holes. As the core component of LED lights, during the production and processing of LED chips, adhesive is usually applied to the LED chip using adhesive application equipment such as glue guns. After being coated with adhesive, the LED chip is not only protected from external environmental damage, but also significantly improves the luminous flux and durability of LED products.

[0003] In order to achieve precise glue dispensing, existing LED packaging chip fixing adhesive application equipment typically uses a long and thin nozzle design for the glue gun. However, since most glue gun nozzles are exposed to the external environment and lack heat insulation protection, the glue inside the nozzle can easily solidify and become blocked due to temperature drop during the LED chip loading and unloading process. This is detrimental to the normal application of the fixing adhesive. Utility Model Content

[0004] The purpose of this invention is to provide a chip fixing adhesive application device for LED packaging, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a chip fixing adhesive application device for LED packaging, comprising: A top plate is provided below the top plate, and side plates are vertically installed on the top of both sides of the bottom plate. The top of the side plates is connected to the top plate, and a base is fixedly installed on the top of the top plate. A placement mold is set on top of the base. A quadrilateral frame is provided above the placement mold. A movable block is provided inside the quadrilateral frame. A glue gun is fixedly installed at the bottom of the movable block. A drive assembly is located on the outside of the quadrilateral frame. A limiting plate is provided below the moving block, and a heat-insulating component is provided at the bottom of the limiting plate to prevent the glue gun nozzle from clogging. A clamping assembly is located on the outside of the base. A column is vertically installed on the top of one side of the base plate. A guide groove is provided inside the column. A guide block is provided inside the guide groove. A lifting assembly for adjusting the height of the glue gun is provided on the outside of the guide groove.

[0006] Preferably, the clamping assembly includes a first strip plate fixed to the top of both ends of the base, and a second strip plate provided on the side of each of the two first strip plates that are close to each other. One side of the second strip plate is in contact with the mold. A first guide post is vertically installed at both ends of the second strip plate. One end of the first guide post extends through to the outside of the first strip plate. An adjusting stud is spirally connected inside the first strip plate, and one end of the adjusting stud is rotatably connected to the second strip plate.

[0007] Preferably, the lifting assembly includes support seats fixed to both ends of the guide groove, a first hydraulic cylinder is fixedly installed at the bottom of the lower support seat, the top of the first hydraulic cylinder passes through the support seat and is connected to the guide block, a second guide column is fixedly installed inside the guide groove, one side of the guide block is slidably connected to the second guide column, and a support frame is provided between the guide block and the quadrilateral frame, the support frame being connected to the guide block and the quadrilateral frame respectively.

[0008] Preferably, the drive assembly includes a ball screw disposed inside a quadrilateral frame. The ball screw is rotatably connected to both sides of the inner wall of the quadrilateral frame via bearings. The moving block is helically connected to the ball screw via a nut. A first motor is fixedly installed on one side of the quadrilateral frame. One end of the ball screw passes through the quadrilateral frame and is connected to the output end of the first motor.

[0009] Preferably, the heat preservation component includes a positioning cylinder fixed to the bottom end of the limiting plate. The positioning cylinder has an internal cavity, and the inner wall of the cavity is provided with a heat insulation layer. The heat insulation layer has a heat conducting layer inside it. A spiral heating wire is provided between the heat conducting layer and the heat insulation layer. A control compartment is provided on one side of the positioning cylinder. A temperature controller is fixedly installed inside the control compartment. The spiral heating wire is connected to the terminal of the temperature controller through a wire.

[0010] Preferably, a U-shaped seat is fixedly connected to the bottom of the movable block, a rotating shaft is rotatably connected inside the U-shaped seat, a U-shaped frame is fixedly installed on the outside of the rotating shaft, a second motor is fixedly installed on one side of the U-shaped seat, one end of the rotating shaft passes through the U-shaped seat and is connected to the output end of the second motor, a second hydraulic cylinder is fixedly installed inside the U-shaped frame, the bottom end of the second hydraulic cylinder passes through to the outside of the U-shaped frame and is fixedly connected to a push-pull plate, one side of the push-pull plate is connected to a limiting plate, a slider is fixedly installed on one side of the limiting plate, a groove corresponding to the slider is opened on one side of the U-shaped frame, and the slider is located inside the groove.

[0011] Preferably, a fixed glue storage tank is fixedly installed on the top of the base plate, a glue injection port is provided on one side of the top of the fixed glue storage tank, a glue pump is fixedly installed on one side of the fixed glue storage tank, the inlet of the glue pump is connected to the inside of the fixed glue storage tank, the outlet of the glue pump is connected to a glue dispensing bend, the top end of the glue dispensing bend is connected to a telescopic hose, and one end of the telescopic hose is connected to a glue gun.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention uses a clamping component to prevent LED chips from shifting or tilting during the adhesive application process. The driving and lifting components allow the glue gun at the bottom of the moving block to move horizontally and vertically, enabling it to reach different positions above the mold, facilitating the application of adhesive to fix the LED chips. The heat-insulating component keeps the adhesive inside the nozzle at a relatively constant temperature, preventing the thin nozzle from being exposed to the external environment and reducing the fluidity of the adhesive, thus preventing the adhesive from solidifying and clogging the nozzle due to temperature drops. Attached Figure Description

[0013] Figure 1 A schematic diagram of the main structure of the LED packaging chip fixing adhesive application device provided by this utility model; Figure 2 A schematic diagram of the rear view structure provided for this utility model; Figure 3 A schematic diagram of the specific structure of the fixed adhesive storage tank provided by this utility model; Figure 4 A schematic diagram of the drive component structure provided by this utility model; Figure 5 A schematic diagram of the specific structure of the limiting plate provided by this utility model; Figure 6 A schematic diagram of the specific structure of the U-shaped frame provided by this utility model; Figure 7 A schematic diagram of the thermal insulation component provided by this utility model.

[0014] In the diagram: 1. Top plate; 2. Bottom plate; 3. Side plate; 4. Base; 5. Mold placement assembly; 6. Clamping assembly; 61. First strip plate; 62. Adjusting stud; 63. Second strip plate; 64. First guide post; 7. Column; 8. Guide groove; 9. Guide block; 10. Lifting assembly; 101. Support base; 102. First hydraulic cylinder; 103. Second guide post; 104. Support frame; 11. Glue gun; 12. Quadrilateral frame; 13. Moving block; 14. Drive assembly; 141. First motor; 142. 15. Ball screw; 16. U-shaped frame; 17. Limiting plate; 18. Insulation component; 19. Positioning cylinder; 10. Receiving cavity; 11. Insulation layer; 12. Spiral heating wire; 13. Heat-conducting layer; 14. Control compartment; 15. Temperature controller; 16. U-shaped seat; 17. Rotating shaft; 28. Second hydraulic cylinder; 29. ​​Push-pull plate; 20. Slider; 21. Slide rail; 22. Slide groove; 23. Second motor; 24. Glue pump; 25. Glue outlet bend; 26. Glue inlet; 27. Fixed glue storage tank; 28. Telescopic hose. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figure 1-7As shown, an LED chip fixing adhesive application device includes a top plate 1, a bottom plate 2 below the top plate 1, side plates 3 vertically mounted on the top of both sides of the bottom plate 2, the top of the side plates 3 connected to the top plate 1, and a base 4 fixedly mounted on the top of the top plate 1; a placement mold 5 is set on top of the base 4, a quadrilateral frame 12 is provided above the placement mold 5, a movable block 13 is provided inside the quadrilateral frame 12, and a glue gun 11 is fixedly mounted on the bottom of the movable block 13. By setting up the placement mold 5, it is convenient for the staff to place the LED chips to be coated in an orderly manner, and then the staff can place the glue gun 11 on the LED chip. The mold 5 is placed on the base 4, and the glue gun 11 above the base 4 is used to apply the fixing glue. After the LED chip inside the mold 5 is glued, the operator can remove the mold 5 and put it in an oven to accelerate the drying of the fixing glue. Then, another assembled mold 5 is placed on the base 4, and this process is repeated to continuously apply glue to the LED chip. The drive component 14 is set on the outside of the quadrilateral frame 12. By setting the drive component 14, the glue gun 11 at the bottom of the moving block 13 can be moved horizontally, thereby allowing the glue gun 11 to reach different positions above the mold 5. A limiting plate 16 is provided below the moving block 13. The bottom end of the limiting plate 16 is equipped with a heat-insulating component 17 to prevent clogging of the glue gun 11 nozzle. By setting the heat-insulating component 17, the glue inside the nozzle at the bottom of the glue gun 11 can be kept at a relatively constant temperature during the loading and unloading of LED chips in the placement mold 5. This prevents the slender nozzle of the glue gun 11 from being exposed to the external environment, thus reducing the fluidity of the fixing glue and preventing the fixing glue from solidifying and clogging the glue gun 11 nozzle due to temperature drop. A clamping component 6 is provided on the outside of the base 4. By setting the clamping component 6, it is convenient for workers to hold the placement mold 5 in place. The body is fixed on the top of the base 4 to prevent the LED chip from shifting or tilting during the glue application process, which helps to improve the stability of the LED chip fixing glue application. A column 7 is vertically installed on the top of one side of the base plate 2. The column 7 has a guide groove 8 inside, and a guide block 9 inside the guide groove 8. A lifting component 10 for adjusting the height of the glue gun 11 is provided on the outside of the guide groove 8. By setting the lifting component 10, the glue gun 11 at the bottom of the moving block 13 can be driven to the top of the placement mold 5, which, together with the drive component 14, facilitates the LED chip fixing glue application.

[0017] The clamping assembly 6 includes first strip plates 61 fixed to the top of both ends of the base 4. A second strip plate 63 is provided on each side of the two first strip plates 61 that are close to each other. One side of the second strip plate 63 contacts the placement mold 5. First guide posts 64 are vertically mounted on both ends of the second strip plate 63. One end of the first guide post 64 extends through to the outside of the first strip plate 61. An adjusting stud 62 is spirally connected inside the first strip plate 61. One end of the adjusting stud 62 is rotatably connected to the second strip plate 63. Figure 1 , Figure 2 As shown, after the placement mold 5 equipped with LED chips is placed on the top of the base 4, the first strip plate 61 can be used to clamp and position the LED chips from both ends of the placement mold 5 by adjusting the stud 62, so as to avoid the LED chips from shifting or tilting during the glue application process.

[0018] The lifting assembly 10 includes support seats 101 fixed to both ends of the guide groove 8. A first hydraulic cylinder 102 is fixedly installed at the bottom of the lower support seat 101. The top end of the first hydraulic cylinder 102 passes through the support seat 101 and connects to the guide block 9. A second guide post 103 is fixedly installed inside the guide groove 8. One side of the guide block 9 is slidably connected to the second guide post 103. A support frame 104 is provided between the guide block 9 and the quadrilateral frame 12. The support frame 104 is connected to both the guide block 9 and the quadrilateral frame 12. Figure 2 , Figure 3 As shown, the first hydraulic cylinder 102 can drive the guide block 9 to move vertically up and down along the axis of the second guide column 103, thereby driving the glue gun 11 at the bottom of the moving block 13 to the top of the placement mold 5, so as to facilitate the application of LED chip fixing glue.

[0019] The drive assembly 14 includes a ball screw 142 disposed inside the quadrilateral frame 12. The ball screw 142 is rotatably connected to both sides of the inner wall of the quadrilateral frame 12 via bearings. The moving block 13 is helically connected to the ball screw 142 via a nut. A first motor 141 is fixedly mounted on one side of the quadrilateral frame 12. One end of the ball screw 142 passes through the quadrilateral frame 12 and is connected to the output end of the first motor 141. Figure 3 , Figure 4 As shown, the first motor 141 can drive the moving block 13 to slide horizontally back and forth along the axis of the ball screw 142, thereby driving the glue gun 11 at the bottom of the moving block 13 to different positions above the placement mold 5.

[0020] The insulation component 17 includes a positioning cylinder 171 fixed to the bottom of the limiting plate 16. The positioning cylinder 171 has an internal cavity 172. An insulation layer 173 is provided on the inner wall of the cavity 172. A heat-conducting layer 175 is provided inside the insulation layer 173. A spiral heating wire 174 is provided between the heat-conducting layer 175 and the insulation layer 173. A control compartment 176 is provided on one side of the positioning cylinder 171. A temperature controller 177 is fixedly installed inside the control compartment 176. The spiral heating wire 174 is connected to the terminal of the temperature controller 177 via a wire. Figure 5 , Figure 6 and Figure 7As shown, during the time when the staff is loading and unloading LED chips into the mold 5, the heat-conducting layer 175 inside the receiving cavity 172 can conduct the heat of the spiral heating wire 174 to the nozzle of the glue gun 11. The temperature controller 177 controls the heating of the spiral heating wire 174 to remain constant, thereby keeping the glue inside the nozzle of the glue gun 11 at a relatively constant temperature. At the same time, the heat insulation layer 173 can reduce the interference of the external environment on the fixing glue. This can prevent the thin nozzle of the glue gun 11 from being exposed to the external environment, which would reduce the flowability of the fixing glue and prevent the fixing glue from solidifying and clogging the nozzle of the glue gun 11 due to the temperature drop. It should be noted that the heat-conducting layer 175 can be made of heat-conducting carbon fiber material, and the heat insulation layer 173 can be made of polyurethane material.

[0021] A U-shaped base 18 is fixedly connected to the bottom of the movable block 13. A rotating shaft 19 is rotatably connected inside the U-shaped base 18. A U-shaped frame 15 is fixedly installed on the outside of the rotating shaft 19. A second motor 24 is fixedly installed on one side of the U-shaped base 18. One end of the rotating shaft 19 passes through the U-shaped base 18 and is connected to the output end of the second motor 24. A second hydraulic cylinder 20 is fixedly installed inside the U-shaped frame 15. The bottom end of the second hydraulic cylinder 20 passes through to the outside of the U-shaped frame 15 and is fixedly connected to a push-pull plate 21. One side of the push-pull plate 21 is connected to a limiting plate 16. A slider 22 is fixedly installed on one side of the limiting plate 16. A groove 23 corresponding to the slider 22 is opened on one side of the U-shaped frame 15. The slider 22 is located inside the groove 23. Figure 5 , Figure 6 and Figure 7 As shown, after the LED chip loading and unloading work in the placement mold 5 is completed, the second oil cylinder 20 and the push-pull plate 21 can drive the positioning cylinder 171 away from the glue gun 11 nozzle. Then, the second motor 24 and the rotating shaft 19 drive the positioning cylinder 171 to swing. At this time, the positioning cylinder 171 is completely away from the glue gun 11 nozzle, and the glue application work of the glue gun 11 will not be affected.

[0022] A glue storage tank 28 is fixedly installed on the top of the base plate 2. A glue inlet 27 is located on one side of the top of the glue storage tank 28. A glue pump 25 is fixedly installed on one side of the glue storage tank 28. The inlet of the glue pump 25 is connected to the inside of the glue storage tank 28. The outlet of the glue pump 25 is connected to a glue outlet bend 26. A telescopic hose 29 is connected to the top of the glue outlet bend 26. One end of the telescopic hose 29 is connected to the glue gun 11. Figure 2 , Figure 3 As shown, the glue pump 25 can sequentially input the glue liquid inside the fixed glue tank 28 into the glue gun 11 through the glue outlet bend 26 and the telescopic hose 29. When the glue liquid inside the fixed glue tank 28 is insufficient, it can be replenished through the glue injection port 27.

[0023] Working principle: First, the operator places the placement mold 5, which is equipped with LED chips, on the base 4. Then, the clamping component 6 prevents the LED chips from shifting or tilting during the glue application process. The drive component 14 and the lifting component 10 drive the glue gun 11 at the bottom of the moving block 13 to move horizontally and vertically, so that the glue gun 11 can reach different positions above the placement mold 5, which facilitates the application of the LED chip fixing glue. During the process of loading and unloading LED chips in the placement mold 5, the heat preservation component 17 keeps the glue inside the nozzle at the bottom of the glue gun 11 at a relatively constant temperature. This prevents the thin nozzle of the glue gun 11 from being exposed to the external environment, which would reduce the fluidity of the fixing glue and prevent the fixing glue from solidifying and clogging the nozzle of the glue gun 11 due to the temperature drop.

[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip fixing adhesive application device for LED packaging, characterized in that, include: A top plate (1) is provided below the top plate (1), and a bottom plate (2) is provided below the bottom plate (2). Side plates (3) are vertically installed on the top of both sides of the bottom plate (2). The top of the side plates (3) is connected to the top plate (1). A base (4) is fixedly installed on the top of the top plate (1). A placement mold (5) is set on top of a base (4). A quadrilateral frame (12) is provided above the placement mold (5). A movable block (13) is provided inside the quadrilateral frame (12). A glue gun (11) is fixedly installed at the bottom of the movable block (13). The drive assembly (14) is located on the outside of the quadrilateral frame (12). A limiting plate (16) is provided below the moving block (13). A heat-insulating assembly (17) is provided at the bottom of the limiting plate (16) to prevent the glue gun (11) nozzle from being blocked. The clamping assembly (6) is located on the outside of the base (4). A column (7) is vertically installed on the top of one side of the base plate (2). The column (7) has a guide groove (8) inside. The guide groove (8) has a guide block (9) inside. The outside of the guide groove (8) has a lifting assembly (10) for adjusting the height of the glue gun (11).

2. The LED packaging chip fixing adhesive coating equipment according to claim 1, characterized in that: The clamping assembly (6) includes a first strip plate (61) fixed to the top of both ends of the base (4). A second strip plate (63) is provided on the side of the two first strip plates (61) that are close to each other. One side of the second strip plate (63) is in contact with the placement mold (5). A first guide post (64) is vertically installed at both ends of the second strip plate (63). One end of the first guide post (64) extends through to the outside of the first strip plate (61). An adjusting stud (62) is spirally connected inside the first strip plate (61). One end of the adjusting stud (62) is rotatably connected to the second strip plate (63).

3. The LED packaging chip fixing adhesive application equipment according to claim 1, characterized in that: The lifting assembly (10) includes a support base (101) fixed at both ends of the guide groove (8). A first hydraulic cylinder (102) is fixedly installed at the bottom of the support base (101) located below. The top of the first hydraulic cylinder (102) passes through the support base (101) and is connected to the guide block (9). A second guide column (103) is fixedly installed inside the guide groove (8). One side of the guide block (9) is slidably connected to the second guide column (103). A support frame (104) is provided between the guide block (9) and the quadrilateral frame (12). The support frame (104) is connected to the guide block (9) and the quadrilateral frame (12) respectively.

4. The LED packaging chip fixing adhesive coating equipment according to claim 1, characterized in that: The drive assembly (14) includes a ball screw (142) disposed inside the quadrilateral frame (12). The ball screw (142) is rotatably connected to both sides of the inner wall of the quadrilateral frame (12) via bearings. The moving block (13) is helically connected to the ball screw (142) via a nut. A first motor (141) is fixedly installed on one side of the quadrilateral frame (12). One end of the ball screw (142) passes through the quadrilateral frame (12) and is connected to the output end of the first motor (141).

5. The LED packaging chip fixing adhesive coating equipment according to claim 1, characterized in that: The heat preservation component (17) includes a positioning cylinder (171) fixed to the bottom of the limiting plate (16). The positioning cylinder (171) has an internal cavity (172). The inner wall of the cavity (172) is provided with a heat insulation layer (173). The heat insulation layer (173) has a heat conduction layer (175) inside. A spiral heating wire (174) is provided between the heat conduction layer (175) and the heat insulation layer (173). A control compartment (176) is provided on one side of the positioning cylinder (171). A thermostat (177) is fixedly installed inside the control compartment (176). The spiral heating wire (174) is connected to the terminal of the thermostat (177) through a wire.

6. The LED packaging chip fixing adhesive application equipment according to claim 1, characterized in that: The bottom of the movable block (13) is fixedly connected to a U-shaped seat (18), and a rotating shaft (19) is rotatably connected inside the U-shaped seat (18). A U-shaped frame (15) is fixedly installed on the outside of the rotating shaft (19). A second motor (24) is fixedly installed on one side of the U-shaped seat (18). One end of the rotating shaft (19) passes through the U-shaped seat (18) and is connected to the output end of the second motor (24). A second oil cylinder (20) is fixedly installed inside the U-shaped frame (15). The bottom end of the second oil cylinder (20) passes through to the outside of the U-shaped frame (15) and is fixedly connected to a push-pull plate (21). One side of the push-pull plate (21) is connected to a limiting plate (16). A slider (22) is fixedly installed on one side of the limiting plate (16). A groove (23) corresponding to the slider (22) is opened on one side of the U-shaped frame (15). The slider (22) is located inside the groove (23).

7. The LED packaging chip fixing adhesive coating equipment according to claim 1, characterized in that: A fixed glue tank (28) is fixedly installed on the top of the base plate (2). A glue injection port (27) is provided on the top of one side of the fixed glue tank (28). A glue pump (25) is fixedly installed on one side of the fixed glue tank (28). The inlet of the glue pump (25) is connected to the inside of the fixed glue tank (28). The outlet of the glue pump (25) is connected to a glue outlet bend (26). The top end of the glue outlet bend (26) is connected to a telescopic hose (29). One end of the telescopic hose (29) is connected to a glue gun (11).

Images