A glue-free single-sided copper-clad plate coating gasket and coating die

Abstract

The utility model provides a kind of single-sided copper-clad plate coating gasket without glue, including gasket body, gasket body includes main plate and two side plates respectively arranged in the left and right ends of main plate and with main plate in same plane, the inside of the junction of main plate and side plate is equipped with fillet, the inside top of two side plates opposite is equipped with chamfer structure, the both ends of gasket body are also equipped with heating plate.The coating gasket passes through special structure design and heating function, makes glue output more uniform, effectively solve the edge fat and bubble problem in coating process, to improve coating size uniformity and appearance quality.The utility model further provides a kind of coating die including single-sided copper-clad plate coating gasket without glue, the coating die also includes upper die and lower die, gasket body is located between upper die and lower die, and heating plate is exposed to upper die and lower die.

Description

Technical Field

[0001] This utility model belongs to the technical field of copper clad laminate coating equipment, and in particular relates to a glue-free single-sided copper clad laminate coating pad and coating die. Background Technology

[0002] Adhesive-free single-sided copper-clad laminates are copper-clad laminates made by directly laminating flexible insulating materials such as polyester film or polyimide film with a single layer of copper foil. They are mainly used in the manufacture of flexible printed circuit boards (FPCs). This structure eliminates the epoxy resin or acrylic adhesive layer in traditional copper-clad laminates, and has advantages such as light weight, good dimensional stability, and environmental friendliness.

[0003] However, the viscosity of the adhesive used in adhesive-free single-sided copper-clad laminates typically ranges from 1.5 cps to 3.5 cps. This high-viscosity adhesive exhibits poor flowability and difficulty in leveling during coating, easily leading to air bubble defects. Furthermore, high-viscosity adhesives display viscoelastic fluid properties, which can cause excessively thick coating edges ("fat edges") when a large single coating thickness is applied. This can result in wavy edge defects during subsequent slitting processes, significantly reducing product yield. Currently, coating thick polyimide (PI) adhesive-free single-sided copper-clad laminates often requires a two-coating process, but its production efficiency and yield are lower than a single-coating process. Therefore, there is an urgent need to develop a coating gasket that can effectively solve the problems of fat edges and air bubbles. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a glue-free single-sided copper-clad laminate coating pad and coating die. This coating pad, through its special structural design and heating function, ensures more uniform glue dispensing, effectively solving the problems of edge thickening and air bubbles during the coating process, thereby improving coating dimensional uniformity and appearance quality.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] This utility model discloses a glue-free single-sided copper-clad laminate coating pad, comprising a pad body, the pad body comprising a main board and two side plates respectively disposed at the left and right ends of the main board and on the same plane as the main board, the inner side of the connection between the main board and the side plates is provided with rounded corners, the top of the inner sides of the two side plates opposite each other is provided with chamfered structure, and heating plates are also provided at both ends of the pad body.

[0007] As described above, the adhesive-free single-sided copper-clad laminate pad has a mainboard and side panel that are integrated into one piece.

[0008] As described above, the adhesive-free single-sided copper-clad laminate pad has multiple mounting holes extending through its thickness direction on the motherboard.

[0009] As described above, the adhesive-free single-sided copper-clad laminate pad has two side plates symmetrically arranged at both ends of the motherboard and extending upward along the vertical direction of the motherboard.

[0010] As described above, in the adhesive-free single-sided copper-clad laminate coated pad, two heating plates are placed on the upper surface of the pad body, and a heat-conducting layer is provided between the heating plates and the pad body.

[0011] The diameter of the rounded corners in the adhesive-free single-sided copper-clad laminate coated pads described above is 2-3 mm.

[0012] As described above, the chamfer in the adhesive-free single-sided copper-clad laminate pad is an outwardly inclined chamfer with a length of 2-3 mm.

[0013] A coating die head includes a glue-free single-sided copper clad laminate coating pad, an upper die head and a lower die head, the pad body is disposed between the upper die head and the lower die head, and the heating plate is exposed between the upper die head and the lower die head.

[0014] As described above, the coating die head has a cavity and an injection hole communicating with the cavity on the lower die head, and the gasket body is placed on the outer periphery of the cavity.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] 1. By setting rounded corners and chamfered corners, this utility model ensures that the glue flows without slowing down when passing through corners, effectively dispersing mechanical stress, avoiding local accumulation of filler, and thus reducing edge thickening.

[0017] 2. The heating plate of this utility model heats the edge of the gasket, which increases the temperature and decreases the viscosity of the adhesive in the edge area, improves the leveling property, and at the same time reduces the pressure in the edge cavity, making the overall adhesive dispensing more uniform.

[0018] 3. This utility model has a simple structure and is easy to install. It is suitable for one-time thick coating process of high viscosity adhesive, which significantly improves coating quality and production efficiency. It is also suitable for the industrial production of adhesive-free single-sided copper-clad laminates for flexible circuit boards. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the adhesive-free single-sided copper-clad laminate coated gasket of this utility model.

[0020] Figure 2 This is a cross-sectional schematic diagram of the coating die head of this utility model.

[0021] Figure 3 This is a schematic diagram of the installation of the coated gasket of this utility model. Detailed Implementation

[0022] The present invention will be further described below with reference to specific embodiments, but is not limited thereto.

[0023] like Figure 1-3 As shown, the present invention provides a glue-free single-sided copper clad laminate coating pad, including a pad body 1. The pad body 1 includes a main board 11 and two side plates 12 respectively disposed at the left and right ends of the main board 11 and on the same plane as the main board 11. The inner side of the connection between the main board 11 and the side plate 12 is provided with a rounded corner 13. The top of the inner side of the two side plates 12 is provided with a chamfer 14. The two ends of the pad body 1 are also provided with heating plates 2 for heating the edge area of ​​the pad body 1.

[0024] The rounded corners 13 and chamfers 14 on the coating pad of this utility model ensure that the adhesive flows without deceleration at the corners during coating, which can disperse mechanical stress and avoid local accumulation of filler. The heating plate 2 can transfer temperature to the pad body 1, thereby increasing the temperature of the adhesive at the edge of the pad body 1, reducing viscosity, improving leveling, reducing cavity pressure of adhesive at the edge of the pad body 1, making the adhesive output more uniform, reducing the edge thickness of the adhesive-free single-sided copper clad laminate, solving the problem of edge thickening and air bubbles during coating of adhesive-free single-sided copper clad laminate, and improving the dimensional uniformity and appearance of the coating.

[0025] Furthermore, in this embodiment, the main board 11 and the side plate 12 are an integral structure. An integral structure is more robust and simpler to manufacture. The main board 11 of this invention has multiple mounting holes 111 extending along its thickness direction, used to install gaskets into the mold head using bolts or other fasteners.

[0026] In this embodiment, two side plates 12 are symmetrically arranged at both ends of the main board 11 and extend upward along the vertical direction of the main board 11. Two heating plates 2 are placed on the upper surface of the pad body 1, and a heat-conducting layer 21 is provided between the heating plates 2 and the pad body 1. Typically, the heating plates 2 are fixed to both ends of the pad body 1 by adhesive. The heat-conducting layer 21 is a silicone grease layer. Silicone grease is a highly efficient thermally conductive material that can squeeze out the air between the heating plates 2 and the pad body 1, and can transfer the heat generated by the heating plates 2 to the edge of the pad body 1 more quickly.

[0027] In this embodiment, the diameter of the fillet 13 is preferably 2 to 3 mm; the chamfer 5 is preferably a chamfer that is inclined outward at 45° and has a slope length of 2 to 3 mm.

[0028] like Figure 2-3As shown, the coating die head includes the adhesive-free single-sided copper-clad laminate coating gasket in this embodiment of the invention, and also includes an upper die head 3 and a lower die head 4. The gasket body 1 is disposed between the upper die head 3 and the lower die head 4, and the heating plate 2 is exposed outside the upper die head 3 and the lower die head 4. The heating plate 2 is exposed outside the die head, which facilitates heat transfer and also prevents the heating plate 2 from being damaged by the pressure of the upper and lower die heads during the installation of the gasket body 1.

[0029] like Figure 2 As shown, in this embodiment, the lower die head 4 has a cavity 5 and an injection hole 6 communicating with the cavity 5. Glue enters the cavity 5 through the injection hole 6, and the gasket body 1 is placed on the outer periphery of the cavity 5. In use, the gasket body 1 is installed between the upper die head 3 and the lower die head 4 through the mounting hole 111. During the actual coating process, the glue enters the cavity 5 formed by the upper and lower die heads and the gasket through the injection hole 6. The structural design of the rounded corners 13 and chamfers 14 allows the glue to flow smoothly through the corners, avoiding local accumulation. The heating plate 2 heats the edge area, reducing the viscosity of the glue and improving the leveling properties, thereby effectively suppressing the generation of thick edges and air bubbles, and achieving uniform glue dispensing.

Claims

1. A non-adhesive single-sided copper-clad laminate coated pad, comprising a pad body (1), wherein the pad body (1) comprises a main board (11) and two side plates (12) respectively disposed at the left and right ends of the main board (11) and on the same plane as the main board (11), characterized in that The inner side of the connection between the main board (11) and the side plate (12) is provided with rounded corners (13), and the top of the inner sides of the two side plates (12) are provided with chamfers (14). The two ends of the gasket body (1) are also provided with heating plates (2).

2. The adhesive-free single-sided copper-clad laminate coated gasket according to claim 1, characterized in that... The motherboard (11) and side panel (12) are an integrated structure.

3. The adhesive-free single-sided copper-clad laminate coated gasket according to claim 1, characterized in that... The motherboard (11) is provided with a plurality of mounting holes (111) that extend through its thickness.

4. The adhesive-free single-sided copper-clad laminate coated gasket according to claim 1, characterized in that... The two side plates (12) are symmetrically arranged at both ends of the main board (11) and extend upward along the vertical direction of the main board (11).

5. The adhesive-free single-sided copper-clad laminate coated pad according to claim 1 or 4, characterized in that... The two heating plates (2) are placed on the upper surface of the gasket body (1), and a heat-conducting layer (21) is provided between the heating plates (2) and the gasket body (1).

6. The adhesive-free single-sided copper-clad laminate coated gasket according to claim 1, characterized in that... The diameter of the fillet (13) is 2-3 mm.

7. The adhesive-free single-sided copper-clad laminate coated gasket according to claim 1, characterized in that... The chamfer (14) is an outwardly inclined chamfer with a slope length of 2-3 mm and a 45° outward inclination.

8. A coating die head, characterized in that... The adhesive-free single-sided copper clad laminate coating pad according to any one of claims 1-7 further includes an upper mold head (3) and a lower mold head (4), wherein the pad body (1) is disposed between the upper mold head (3) and the lower mold head (4), and the heating plate (2) is exposed between the upper mold head (3) and the lower mold head (4).

9. The coating die head according to claim 8, characterized in that, The lower die head (4) has a cavity (5) and an injection hole (6) communicating with the cavity (5), and the gasket body (1) is placed on the outer periphery of the cavity (5).

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