High-precision temperature sensor temperature sensing probe vacuum glue filling and packaging equipment

Abstract

The utility model discloses high accuracy temperature sensor temperature sensing probe vacuum glue filling packaging equipment belongs to temperature sensor packaging technical field, including sealing equipment, adjusting mechanism, fixed ring and glue head, the limiting block of glue head outer wall is connected with the limiting groove of fixed ring inner wall rotationally, and the connecting block is fixed on the sealing equipment, and the sliding groove three in it is slidably connected with the sliding column, and the sliding column clamping strip realizes axial locking, is used for fixing glue head, and adjusting mechanism includes brake box, is equipped with fan, fixed column, sliding block, fixed block and spring in brake box, and sliding sliding block compression spring starts fan, and the clamping block of sliding setting is connected fixed block to control fan rotating speed. The utility model solves the problem that glue head replacement is complex and lacks the heat dissipation mechanism, realizes the quick disassembly and controllable heat dissipation of glue head, and improves work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of temperature sensor packaging technology, and in particular to a vacuum potting packaging device for a high-precision temperature sensor probe. Background Technology

[0002] High-precision temperature sensors are key components in various precision instruments and industrial control systems. Their performance stability and reliability are of paramount importance. In the manufacturing process of temperature sensors, the encapsulation of the temperature probe is one of the processes that determines its long-term stability and measurement accuracy. Vacuum potting encapsulation is a widely used advanced process. This process precisely injects adhesives such as epoxy resin into the probe housing containing the sensing chip to achieve effective protection, insulation, and fixation of the internal chip.

[0003] Equipment that performs the dispensing process typically includes a dispensing head that precisely controls the amount of dispensing material. In actual production, in order to adapt to different models or specifications of temperature sensors, it is necessary to frequently change dispensing heads of different sizes. However, most existing packaging equipment uses threaded connections or multiple bolts to fix the dispensing head. This disassembly and assembly method is not only cumbersome and time-consuming, but also often requires the use of special tools, which greatly reduces the flexibility of production line switching and overall production efficiency.

[0004] In addition, the dispensing process is usually carried out at a certain temperature to ensure the fluidity of the adhesive, and the continuous operation of the equipment for a long time will also generate a lot of heat, causing the temperature of the dispensing head and its surrounding components to rise significantly. If the heat cannot be dissipated in a timely and effective manner, it will affect the curing characteristics of the adhesive and lead to a decrease in the encapsulation quality. On the other hand, it will accelerate the aging and damage of equipment components, increase maintenance costs and the risk of equipment failure. Existing heat dissipation methods are mostly natural cooling or simple external air cooling, lacking a dedicated heat dissipation structure that is integrated with the main body of the equipment and can be adjusted as needed.

[0005] Therefore, this invention proposes a high-precision temperature sensor probe vacuum potting and encapsulation device to address the shortcomings of existing technologies. Utility Model Content

[0006] In view of the problems of complex and time-consuming potting head replacement process and lack of effective and adjustable heat dissipation and cooling mechanism in the existing high-precision temperature sensor temperature probe vacuum potting and encapsulation equipment, this utility model aims to provide a high-precision temperature sensor temperature probe vacuum potting and encapsulation equipment with improved structure that can effectively solve the above problems.

[0007] This utility model provides a high-precision temperature sensor probe vacuum potting and encapsulation device, including a sealing device, an adjustment mechanism and a fixing ring, the fixing ring being fixed to the lower end of the sealing device, and the inner wall of the fixing ring being connected to a delivery pipe; as well as a potting head, a connecting block, a sliding column and a retaining strip.

[0008] The outer wall of the dispensing head is equipped with a limit block.

[0009] Furthermore, the inner wall of the fixed ring is provided with a limiting groove for rotating engagement with the limiting block. The connecting block is fixed on the sealing device. The inner wall of the connecting block is provided with a sliding groove three. The upper end of the sliding column is slidably disposed in the sliding groove three. The lower end of the sliding column is fixedly connected to the fixed ring. The outer wall of the sliding column is provided with a slot. The locking strip is detachably inserted into the slot to axially lock the sliding column relative to the connecting block.

[0010] Preferably, the adjustment mechanism includes a brake box, inside which a fixed column and a fan are fixed, and the fan is used to provide forced air cooling for the key components of the equipment.

[0011] Preferably, the adjustment mechanism further includes a sliding block and a fixed block, both of which are slidably sleeved on the fixed column to realize the start and control of the heat dissipation mechanism.

[0012] Preferably, the adjusting mechanism further includes a spring, which is a compression spring, with its two ends abutting between the sliding block and the inner wall of the brake box, for resetting the sliding block when not in operation.

[0013] Preferably, the inner wall of the brake box is provided with a sliding groove, and the side wall of the fixing block is slidably fitted inside the sliding groove to provide guidance and limit for the sliding of the fixing block.

[0014] Preferably, the inner wall of the brake box is also provided with a sliding groove 2, and the adjustment mechanism also includes a locking block, which is slidably disposed in the sliding groove 2 and is used to selectively engage the fixing block, thereby fixing the heat dissipation intensity of the fan at a specific level.

[0015] Preferably, the delivery pipe passes through the interior of the sealing device and communicates with the inner wall of the retaining ring to ensure that the dispensing material can be smoothly delivered to the dispensing head.

[0016] Preferably, the connecting block has a through hole at the position corresponding to the card slot for the card strip to pass through, which facilitates the insertion and removal of the card strip and further simplifies the disassembly and assembly steps.

[0017] This utility model has the following beneficial effects:

[0018] 1. This utility model is equipped with a rotating snap-fit ​​structure consisting of a limiting block and a limiting groove, and a sliding locking component consisting of a sliding column, a connecting block and a locking strip. This solves the problem of complex and time-consuming dispensing head replacement process in the prior art, and achieves the technical effect of quick disassembly and replacement of dispensing heads of different sizes, which significantly improves work efficiency and makes operation more convenient and faster.

[0019] 2. This utility model adds an adjustment mechanism that integrates a fan, a sliding start mechanism, and a locking mechanism, which solves the problem that the dispensing head is prone to performance degradation or damage due to high temperature accumulation after continuous operation of existing equipment. It achieves the technical effect of active and controllable heat dissipation of key components of the equipment, effectively preventing components from being damaged due to overheating and reducing the cost of use. Attached Figure Description

[0020] Figure 1 This is a perspective view of the front of the sealing device of the vacuum potting and encapsulation equipment for the high-precision temperature sensor probe proposed in this utility model.

[0021] Figure 2 This is a partial structural diagram of the sealing device of the vacuum potting and encapsulation equipment for the high-precision temperature sensor probe proposed in this utility model.

[0022] Figure 3 for Figure 2 Enlarged view at point A in this utility model; High-precision temperature sensor probe vacuum potting and encapsulation equipment proposed in this utility model.

[0023] Figure 4 This is an exploded view of the brake box of the vacuum potting and encapsulation device for the high-precision temperature sensor probe proposed in this utility model.

[0024] Legend:

[0025] 1. Sealing equipment; 2. Adjustment mechanism; 201. Brake box; 202. Sliding groove one; 203. Fixed column; 204. Spring; 205. Sliding block; 206. Fixed block; 207. Sliding groove two; 208. Locking block; 209. Fan; 3. Conveying pipe; 4. Fixed ring; 5. Limiting groove; 6. Limiting block; 7. Dispensing head; 8. Connecting block; 9. Sliding groove three; 10. Sliding column; 11. Locking groove; 12. Locking strip. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0027] Example:

[0028] Please refer to Figures 1 to 4The high-precision temperature sensor probe vacuum potting and encapsulation equipment includes a sealing device 1 and an adjustment mechanism 2 fixedly connected to the sealing device 1. The sealing device 1 serves as the mounting base for the entire device, while the adjustment mechanism 2 is used to dissipate heat and cool the device.

[0029] The vacuum potting and encapsulation equipment using a high-precision temperature sensor and temperature probe also includes a potting head 7. The potting head 7 and the sealing device 1 form a specific, quick-release structural fit and connection relationship. Meanwhile, the adjustment mechanism 2 is equipped with a controllable heat dissipation component.

[0030] A fixing ring 4 is fixedly connected to the lower end of the sealing device 1. The inner wall of the fixing ring 4 is connected to a delivery pipe 3, which passes through the interior of the sealing device 1. The device also includes a dispensing head 7. A limit block 6 is provided on the outer wall of the dispensing head 7. A limit groove 5 is provided on the inner wall of the fixing ring 4 for rotating and engaging with the limit block 6. A connecting block 8 is also fixed on the sealing device 1. A sliding groove 9 is provided on the inner wall of the connecting block 8. The upper end of the sliding column 10 is slidably disposed in the sliding groove 9, and its lower end is fixedly connected to the fixing ring 4. A slot 11 is provided on the outer wall of the sliding column 10. A through hole for the locking strip 12 to pass through is provided on the connecting block 8 at the position corresponding to the slot 11. The device also includes a locking strip 12, which is detachably inserted into the slot 11 to axially lock the sliding column 10 relative to the connecting block 8. This structural combination ensures that the dispensing head 7 can be quickly installed or removed.

[0031] Please refer to Figures 2 to 4 The adjustment mechanism 2 includes a brake box 201, inside which a fixed column 203 and a fan 209 are fixed. The sliding block 205 and the fixed block 206 are slidably sleeved on the fixed column 203. The adjustment mechanism 2 also includes a spring 204, whose two ends abut against the sliding block 205 and the inner wall of the brake box 201 respectively. The inner wall of the brake box 201 is provided with a sliding groove 202. The side wall of the fixed block 206 is slidably engaged with the sliding groove 202. The inner wall of the brake box 201 is also provided with a sliding groove 207. The adjustment mechanism 2 also includes a locking block 208, which is slidably disposed in the sliding groove 207 and is used to selectively engage the fixed block 206. This structure allows pressing the sliding block 205 to activate the fan 209 for heat dissipation, and operating the locking block 208 to fix the heat dissipation intensity.

[0032] As a preferred embodiment, please refer to Figure 2 and Figure 4To achieve controllable heat dissipation of the dispensing head 7, the adjustment mechanism 2 includes a brake box 201, inside which a fixing post 203 and a fan 209 are fixed. The adjustment mechanism 2 also includes a sliding block 205 and a fixing block 206, both of which are slidably sleeved on the fixing post 203. The adjustment mechanism 2 also includes a spring 204, whose two ends abut against the inner wall of the sliding block 205 and the brake box 201, respectively. The inner wall of the brake box 201 has a sliding groove 202, and the side wall of the fixing block 206 is slidably fitted inside the sliding groove 202. The inner wall of the brake box 201 also has a sliding groove 207. The adjustment mechanism 2 also includes a locking block 208, which is slidably disposed in the sliding groove 207 and is used to selectively engage the fixing block 206.

[0033] As another preferred embodiment, please refer to Figure 1 To ensure stable delivery of the adhesive material, the delivery pipe 3 passes through the interior of the sealing device 1 and connects with the inner wall of the fixing ring 4.

[0034] As another preferred embodiment, please refer to Figure 1 and Figure 3 To facilitate the insertion and removal of the card strip, a through hole is provided on the connecting block 8 at the position corresponding to the card slot 11 for the card strip 12 to pass through.

[0035] Working principle: When it is necessary to replace and repair the internal structure of the sealing device 1, firstly, you can grasp the outer wall of the clip 12 and pull it outward along the inner wall of the groove 11 opened on the inner wall of the connecting block 8 and the sliding column 10. Then, you can grasp the outer wall of the sliding column 10 and pull it upward along the sliding groove 9 opened on the inner wall of the connecting block 8. Then, you can grasp the outer wall of the dispensing head 7 and rotate it, which will cause the limiting block 6 to rotate along the inner wall of the limiting groove 5 opened on the inner wall of the fixing ring 4. Therefore, the dispensing head 7 can be quickly removed. The conveying pipe 3 is connected to the inner wall of the fixing ring 4 to ensure stability during operation. This allows for the quick replacement of dispensing heads 7 of different sizes, improves work efficiency, and makes the operation more convenient and faster.

[0036] When the dispensing is finished, and it is necessary to cool down the heated dispensing head 7, the adjustment mechanism 2 has multiple internal structures. First, the fixed block 206 and the sliding block 205 can be held and slid to the left along the outer wall of the fixed column 203. At the same time, the outer wall of the fixed block 206 will also slide along the inner wall of the sliding groove 202 opened in the inner wall of the brake box 201. While sliding, the outer wall of the sliding block 205 will compress the spring 204. Then the brake box 201 will be activated and the fan 209 will be driven to rotate. When it is necessary to control the speed of the fan 209, the outer wall of the locking block 208 can be pressed and slid upward along the inner wall of the sliding groove 207 opened in the inner wall of the brake box 201, which can then lock the fixed block 206. This achieves heat dissipation of the internal components of the equipment to prevent overheating and damage to the components, reducing the cost of use and improving work efficiency.

Claims

1. A high-precision temperature sensor probe vacuum potting and encapsulation device, comprising a sealing device (1), an adjustment mechanism (2) and a fixing ring (4), wherein the fixing ring (4) is fixed to the lower end of the sealing device (1), and its inner wall is connected to a delivery pipe (3). Its features are, The equipment also includes: a dispensing head (7), which has a limiting block (6) on its outer wall, and a limiting groove (5) on the inner wall of the fixing ring (4) for rotating and engaging with the limiting block (6); The connecting block (8) is fixed on the sealing device (1), and the inner wall is provided with a sliding groove three (9). The upper end of the sliding column (10) is slidably disposed in the sliding groove three (9), and the lower end is fixedly connected to the fixing ring (4). The outer wall of the sliding column (10) is provided with a slot (11). And a locking strip (12), which is detachably inserted into the slot (11) to axially lock the sliding post (10) relative to the connecting block (8).

2. The high-precision temperature sensor probe vacuum potting and encapsulation equipment according to claim 1, characterized in that, The adjustment mechanism (2) includes a brake box (201), and a fixing column (203) and a fan (209) are fixed inside the brake box (201).

3. The high-precision temperature sensor probe vacuum potting and encapsulation equipment according to claim 2, characterized in that, The adjustment mechanism (2) further includes a sliding block (205) and a fixed block (206), both of which are slidably sleeved on the fixed column (203).

4. The high-precision temperature sensor probe vacuum potting and encapsulation equipment according to claim 3, characterized in that, The adjustment mechanism (2) also includes a spring (204), which is a compression spring with its two ends abutting against the inner wall of the sliding block (205) and the brake box (201).

5. The high-precision temperature sensor probe vacuum potting and encapsulation equipment according to claim 3, characterized in that, The inner wall of the brake box (201) is provided with a sliding groove (202), and the side wall of the fixing block (206) is slidably fitted inside the sliding groove (202).

6. The high-precision temperature sensor probe vacuum potting and encapsulation equipment according to claim 3, characterized in that, The inner wall of the brake box (201) is also provided with a sliding groove (207), and the adjustment mechanism (2) also includes a locking block (208). The locking block (208) is slidably disposed in the sliding groove (207) and is used to selectively engage the fixing block (206).

7. The high-precision temperature sensor probe vacuum potting and encapsulation equipment according to claim 1, characterized in that, The delivery pipe (3) passes through the interior of the sealing device (1) and communicates with the inner wall of the fixing ring (4).

8. The high-precision temperature sensor probe vacuum potting and encapsulation equipment according to claim 1, characterized in that, The connecting block (8) has a through hole at the position corresponding to the slot (11) for the card strip (12) to pass through.

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