Transistor dispensing processing device

Abstract

The utility model discloses a transistor point gum processing device, including base and point gum mechanism, the bottom fixedly connected with motor of base, and the output of motor is fixedly connected with the rotating disc through base, and the circumference of rotating disc is equipped with a plurality of bayonet, and the bayonet is provided with silica gel cover, one side fixedly connected with feed box of base, and the bottom outer wall of feed box is fixedly connected with first electric push rod, and the top fixedly connected with feeding push plate of first electric push rod, and feeding push plate slides in feed box, one side outer wall fixedly connected with second electric push rod of feed box. The utility model discloses through first electric push rod, the wafer transistor of uppermost layer is gradually pushed to the preheating station of feed box inside, again through second electric push rod and sucking disc, wafer transistor is pushed to the feeding station, then, through motor, wafer transistor is pushed to point gum station, drying station, unloading station, and the degree of automation is high, and it is time -saving and laborsaving.

Description

Technical Field

[0001] This utility model relates to the field of transistor processing technology, and in particular to a transistor dispensing processing device. Background Technology

[0002] A wafer transistor is a transistor that exists in the form of a wafer. It is usually a circular thin wafer structure. In the process of transistor assembly, dispensing is a necessary step. Dispensing is essentially applying glue or other fluid materials to the surface of the component.

[0003] Currently, when using dispensing equipment to dispense adhesive to transistors, manual feeding and dispensing are often required, followed by manual preheating and curing. This process is time-consuming and labor-intensive, affecting the work efficiency of workers and reducing the processing efficiency of transistors. Therefore, in order to improve the processing efficiency of transistors and to promote technological progress in the industry and enhance core technological competitiveness, this application proposes a new implementation scheme that differs from the existing transistor dispensing processing equipment and application methods. Utility Model Content

[0004] The purpose of this invention is to solve the problem that existing dispensing devices for transistors often require manual feeding and dispensing of the transistors, followed by manual preheating and curing, which is time-consuming, labor-intensive, affects the work efficiency of workers, and reduces the processing efficiency of transistors. Therefore, this invention proposes a transistor dispensing processing device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A transistor dispensing processing device includes a base and a dispensing mechanism. A motor is fixedly connected to the bottom of the base, and a rotating disk is fixedly connected to the output end of the motor through the base. The rotating disk has multiple slots around its circumference, and silicone sleeves are engaged in the slots. A feeding box is fixedly connected to one side of the base. A first electric push rod is fixedly connected to the bottom outer wall of the feeding box, and a feeding push plate is fixedly connected to the top of the first electric push rod. The feeding push plate slides inside the feeding box. A second electric push rod is fixedly connected to one side outer wall of the feeding box, and a suction cup is fixedly connected to one end of the second electric push rod. A connecting air pipe is sealed and inserted into one side of the suction cup. A preheater is fixedly connected between the two inner walls of the feeding box, and the suction cup is located between the preheater and the feeding push plate. A small oven is fixedly connected to the top of the base, and the rotating disk passes through the small oven.

[0007] Furthermore, a notch is provided on one side of the feed box, and the connecting air pipe slides within the notch.

[0008] Furthermore, a discharge gate is snapped onto one side of the feed box.

[0009] Furthermore, the dispensing mechanism includes an X-axis electric cylinder, two support frames are fixedly connected to the top of the base, an X-axis electric cylinder is fixedly connected between the two support frames, and an X-axis slider is slidably connected to the X-axis electric cylinder.

[0010] Furthermore, a Y-axis electric cylinder is fixedly connected to one side of the X-axis slider, and a Y-axis slider is slidably connected to the Y-axis electric cylinder.

[0011] Furthermore, a Z-axis electric cylinder is fixedly connected to one side of the Y-axis slider, and a Z-axis slider is slidably connected to the Z-axis electric cylinder. A dispensing device is fixedly connected to one side of the Z-axis slider, and a connecting tube is sealed and inserted into one side of the dispensing device.

[0012] Furthermore, a dispensing control box is fixedly connected to the top of the X-axis slider, and the other end of the connecting tube is sealed and plugged into the dispensing control box.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. The top layer of wafer transistors is gradually pushed to the preheating station inside the feeding box by the first electric push rod, and then pushed to the loading station by the second electric push rod and suction cup. Then, the wafer transistors are pushed to the dispensing station, drying station and unloading station by the motor. The automation level is high and time and labor are saved.

[0015] 2. The transistor surface is uniformly preheated by a preheater to remove trace amounts of moisture from the transistor surface. At the same time, the temperature of the transistor substrate is increased to ensure stronger adhesion between the adhesive and the transistor surface during subsequent dispensing, thus avoiding problems such as adhesive detachment or air bubbles. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of a transistor dispensing processing device proposed in this utility model;

[0017] Figure 2 This is a rear view structural diagram of a transistor dispensing processing device proposed in this utility model;

[0018] Figure 3 This is a partial cross-sectional view of a transistor dispensing device proposed in this utility model.

[0019] In the diagram: 1. Base; 2. Rotating disc; 3. Motor; 4. Silicone sleeve; 5. Feed box; 6. First electric push rod; 7. Feeding push plate; 8. Second electric push rod; 9. Suction cup; 10. Connecting air pipe; 11. Preheater; 12. Notch slot; 13. Discharge gate; 14. Support frame; 15. X-axis electric cylinder; 16. Y-axis electric cylinder; 17. Z-axis electric cylinder; 18. Dispenser; 19. Connecting pipe; 20. Dispensing control box; 21. Small drying oven. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figures 1-3 A transistor dispensing processing device includes a base 1, a dispensing mechanism, a control panel, and a processor. The processor and the control panel are connected by wires. A motor 3 is fixed to the bottom of the base 1 by bolts. The output end of the motor 3 passes through the base 1 and is fixed to a rotating disk 2 by bolts. Driven by the motor 3, the rotating disk 2 rotates, thereby driving the wafer transistor to rotate and thus rotating the wafer transistor to the processing position. The circumference of the rotating disk 2 is provided with multiple slots, and a silicone sleeve 4 is engaged in the slots. The silicone sleeve 4 is elastic and can flexibly fix the transistor to prevent displacement or collision damage during rotation.

[0022] A feeding box 5 is fixed to one side of the base 1 by bolts. A first electric push rod 6 is fixed to the bottom outer wall of the feeding box 5 by bolts. A feeding push plate 7 is fixed to the top of the first electric push rod 6 by bolts. The feeding push plate 7 slides inside the feeding box 5. Under the stretching of the first electric push rod 6, the feeding push plate 7 moves upward, so that the uppermost wafer transistor is gradually pushed to the preheating station inside the feeding box 5.

[0023] A second electric push rod 8 is fixed to one side of the outer wall of the feed box 5 by bolts. A suction cup 9 is fixed to one end of the second electric push rod 8 by bolts. The suction cup 9 moves under the drive of the second electric push rod 8 so as to push the wafer transistor to the loading station.

[0024] A connecting air pipe 10 is sealed and inserted into one side of the suction cup 9. A preheater 11 is fixed between the inner walls of both sides of the feed box 5 by bolts. The model of the preheater 11 is PW300-II. It preheats the transistor surface evenly. The core function of preheating is to remove trace amounts of moisture from the transistor surface and increase the temperature of the transistor substrate to ensure stronger adhesion between the adhesive and the transistor surface during subsequent dispensing, thus avoiding adhesive detachment or bubble problems.

[0025] The suction cup 9 is located between the preheater 11 and the feeding pusher 7. The gas between the suction cup 9 and the wafer transistor is extracted from the connecting air pipe 10 by the air pump, thereby using the pressure difference between the inside and outside to adsorb the wafer transistor.

[0026] A small oven 21 is fixed to the top of the base 1 by bolts. The rotating disk 2 passes through the small oven 21, and the transistors that have completed the dispensing are transported into the small oven 21 as the rotating disk 2 continues to rotate.

[0027] The processor sends a drying command to the small oven 21. The heating element inside the oven starts and heats up to the preset drying temperature to heat and cure the colloid on the surface of the transistor. During the drying process, the processor monitors the temperature in real time through the temperature sensor inside the oven. If the temperature is too high, the heating power is reduced; if it is too low, the power is increased.

[0028] The feed box 5 has a notch 12 on one side, and the connecting air pipe 10 slides in the notch 12 so that the connecting air pipe 10 can move.

[0029] A discharge door 13 is snapped onto one side of the feed box 5. The operator opens the discharge door 13 snapped onto one side of the feed box 5 and puts the transistors to be processed into the feed box 5 in batches.

[0030] The dispensing mechanism includes an X-axis electric cylinder 15. Two support frames 14 are bolted to the top of the base 1. The X-axis electric cylinder 15 is bolted between the two support frames 14. An X-axis slider is slidably connected to the X-axis electric cylinder 15. A Y-axis electric cylinder 16 is bolted to one side of the X-axis slider. A Y-axis slider is slidably connected to the Y-axis electric cylinder 16. A Z-axis electric cylinder 17 is bolted to one side of the Y-axis slider. A Z-axis slider is slidably connected to the Z-axis electric cylinder 17. A dispensing device 18 is bolted to one side of the Z-axis slider.

[0031] The processor controls the start of X-axis electric cylinder 15, Y-axis electric cylinder 16, Z-axis electric cylinder 17, and dispensing device 18. X-axis electric cylinder 15 drives dispensing device 18 to move along the X-axis, and Y-axis electric cylinder 16 drives dispensing device 18 to move along the Y-axis so that dispensing device 18 can be accurately aligned with the wafer transistor. Then, Z-axis electric cylinder 17 drives dispensing device 18 to move along the Z-axis so that dispensing device 18 contacts the top of wafer transistor.

[0032] A connecting tube 19 is sealed and inserted into one side of the dispensing device 18. The top of the X-axis slider is fixed with a dispensing control box 20 by bolts. The other end of the connecting tube 19 is sealed and connected to the dispensing control box 20. The glue in the dispensing control box 20 is input into the dispensing device 18 through the connecting tube 19, and then the dispensing device 18 dispenses glue to the wafer transistor.

[0033] The processor is connected to the motor 3, the first electric push rod 6, the second electric push rod 8, the preheater 11, the X-axis electric cylinder 15, the Y-axis electric cylinder 16, the Z-axis electric cylinder 17, the dispensing device 18, and the small oven 21 via wires. The processor model is ARM9TDMI.

[0034] The working principle of this embodiment is as follows: The base 1 and the feed box 5 are fixed in the air. When in use, after the device is started, the operator inputs the processing parameters to the ARM9TDMI processor through the control panel, including the preheating temperature, dispensing amount, dispensing position coordinates, rotation angle of motor 3, and drying temperature and time of small oven 21.

[0035] Connect the air pipe 10 to the air pump. First, open the discharge door 13 and place the wafer transistor on the feeding push plate 7. Then, close the discharge door 13. Then, the processor controls the first electric push rod 6 to start. Under the stretching of the first electric push rod 6, the feeding push plate 7 is moved upward, so that the uppermost wafer transistor is gradually pushed to the preheating station inside the feeding box 5. Then, the processor controls the preheater 11 to start. The preheater 11 preheats the wafer transistor to a temperature of 60-70 degrees Celsius.

[0036] Next, the processor controls the second electric push rod 8 to start. Driven by the second electric push rod 8, the suction cup 9 moves, so that the suction cup 9 contacts the top of the top layer of the wafer transistor. Then, the air pump extracts the gas between the suction cup 9 and the wafer transistor from the connecting air pipe 10, thereby using the pressure difference between the inside and outside to attract the wafer transistor. Then, the second electric push rod 8 continues to stretch and drive the wafer transistor to move, thereby pushing the wafer transistor into the silicone sleeve 4 of the loading position.

[0037] Then, the processor controls the motor 3, which drives the rotating disk 2 to rotate, thereby rotating the wafer transistor and moving it below the dispensing mechanism. Next, the processor controls the X-axis electric cylinder 15, Y-axis electric cylinder 16, Z-axis electric cylinder 17, and dispensing device 18 to start. The X-axis electric cylinder 15 drives the dispensing device 18 to move along the X-axis, and the Y-axis electric cylinder 16 drives the dispensing device 18 to move along the Y-axis so that the dispensing device 18 is accurately aligned with the wafer transistor. Then, the Z-axis electric cylinder 17 drives the dispensing device 18 to move along the Z-axis so that the dispensing device 18 contacts the top of the wafer transistor.

[0038] Next, the glue in the dispensing control box 20 is input into the dispensing device 18 through the connecting pipe 19, and then the dispensing device 18 dispenses the glue onto the wafer transistor. After the dispensing is completed, the wafer transistor is rotated to the drying station by the motor 3. Then, the small drying oven 21 is started by the processor and the wafer transistor is dried by the small drying oven 21. The drying time is controlled to achieve the drying purpose. Then, the wafer transistor is rotated to the unloading station by the motor 3 and then manually removed from the wafer. Then, the remaining wafer transistors are processed according to the above steps.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A transistor dispensing processing apparatus, comprising a base (1) and a dispensing mechanism, characterized in that, A motor (3) is fixedly connected to the bottom of the base (1). The output end of the motor (3) passes through the base (1) and is fixedly connected to a rotating disk (2). The circumference of the rotating disk (2) is provided with multiple slots, and a silicone sleeve (4) is inserted into the slots. A feeding box (5) is fixedly connected to one side of the base (1). A first electric push rod (6) is fixedly connected to the bottom outer wall of the feeding box (5). A feeding push plate (7) is fixedly connected to the top of the first electric push rod (6). The feeding push plate (7) slides inside the feeding box (5). A second electric push rod (8) is fixedly connected to one side of the outer wall of the feeding box (5). A suction cup (9) is fixedly connected to one end of the second electric push rod (8). A connecting air pipe (10) is sealed and inserted into one side of the suction cup (9). A preheater (11) is fixedly connected between the two inner walls of the feeding box (5). The suction cup (9) is located between the preheater (11) and the feeding push plate (7). A small oven (21) is fixedly connected to the top of the base (1). The rotating plate (2) passes through the small oven (21).

2. The transistor dispensing apparatus according to claim 1, characterized in that, The feed box (5) has a notch (12) on one side, and the connecting air pipe (10) slides in the notch (12).

3. The transistor dispensing apparatus according to claim 1, characterized in that, The feed box (5) is fitted with a discharge door (13) on one side.

4. The transistor dispensing apparatus according to claim 1, characterized in that, The dispensing mechanism includes an X-axis electric cylinder (15), and two support frames (14) are fixedly connected to the top of the base (1). An X-axis electric cylinder (15) is fixedly connected between the two support frames (14), and an X-axis slider is slidably connected to the X-axis electric cylinder (15).

5. The transistor dispensing apparatus according to claim 4, characterized in that, A Y-axis electric cylinder (16) is fixedly connected to one side of the X-axis slider, and a Y-axis slider is slidably connected to the Y-axis electric cylinder (16).

6. The transistor dispensing apparatus according to claim 5, characterized in that, A Z-axis electric cylinder (17) is fixedly connected to one side of the Y-axis slider, and a Z-axis slider is slidably connected to the Z-axis electric cylinder (17). A dispensing device (18) is fixedly connected to one side of the Z-axis slider, and a connecting tube (19) is sealed and inserted into one side of the dispensing device (18).

7. The transistor dispensing apparatus according to claim 6, characterized in that, The top of the X-axis slider is fixedly connected to a dispensing control box (20), and the other end of the connecting tube (19) is sealed and connected to the dispensing control box (20).

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