Drip-proof refrigeration assembly
Patent Information
- Application Number
- CN202522263607.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-27
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-27
AI Technical Summary
[0003]本实用新型要解决的技术问题是提供一种防滴水制冷组件,该防滴水制冷组件可以从根源上解决了点胶过程中对胶液进行制冷时制冷本体以及邻近部件上产生滴落的冷凝水影响产品品质的问题
本实用新型防滴水制冷组件,其制冷片相背于制冷本体的一侧设置有一散热板,制冷片的散热面与该散热板接触连接,制冷本体的外侧罩设有一导热壳体,导热壳体与散热板接触连接,从而使得与制冷本体间隔设置的导热壳体的内壁与制冷本体、散热板之间围成一隔热腔,将散热板上的热量传导至与制冷本体间隔设置的导热壳体,既可以提高散热板的散热效率且节约能耗,又可以在保证制冷效果的基础上减小制冷本体与周围环境之间的温差以及避免导热壳体受到制冷本体上低温的影响导致与环境温度温差较大的情况,从根源上解决了点胶过程中对胶液进行制冷时制冷本体以及邻近部件上产生滴落的冷凝水影响产品品质的问题。
Smart Images

Figure CN224778482U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of dispensing technology, and in particular to a drip-proof cooling component. Background Technology
[0002] With advancements in technology, dispensing processes are now widely used in product manufacturing. Dispensing primarily consists of adhesive, dispensing equipment, and dispensing valves. Some adhesives used in dispensing tend to cure at room temperature, making dispensing difficult. Cooling devices are often used in these cases, but the low temperature and large temperature difference with the surrounding environment can cause condensation to form on the surface. This condensation dripping onto the product can damage or cause defects. Current cooling devices typically collect condensation to prevent dripping, or add insulation layers to the outside of the cooling components to delay condensation. However, these methods do not address the root cause of condensation problems within the cooling device itself. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a drip-proof cooling component, which can fundamentally solve the problem of condensation dripping from the cooling body and adjacent components during the dispensing process, which affects product quality.
[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a drip-proof cooling component, comprising: a cooling body that is in contact with the cooling surface of a cooling chip, a heat dissipation plate disposed on the side of the cooling chip opposite to the cooling body, the heat dissipation surface of the cooling chip being in contact with the heat dissipation plate, and a heat-conducting shell disposed on the outer side of the cooling body, the heat-conducting shell being in contact with the heat dissipation plate, thereby forming a heat insulation cavity between the inner wall of the heat-conducting shell, which is spaced apart from the cooling body, the cooling body, and the heat dissipation plate.
[0005] The following are further improvements to the above technical solution: 1. In the above scheme, the edges of the heat-conducting shell are in contact with the heat sink surface.
[0006] 2. In the above scheme, the refrigeration body and the heat-conducting shell are each fixedly installed on the heat dissipation plate by bolts, and the two side surfaces of the refrigeration chip located between the refrigeration body and the heat dissipation plate are in close contact with the refrigeration body and the heat dissipation plate respectively.
[0007] 3. In the above scheme, the cooling body is connected to the heat sink through mounting blocks respectively disposed on the upper and lower sides of the cooling chip.
[0008] 4. In the above scheme, the refrigeration body, the heat-conducting shell and the heat sink are all metal bodies with high thermal conductivity.
[0009] 5. In the above scheme, the refrigeration body is a copper refrigeration body, an aluminum refrigeration body, or a brass refrigeration body, the heat-conducting shell is a copper shell or an aluminum shell, and the heat sink is a copper plate or an aluminum plate.
[0010] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: This utility model relates to a drip-proof cooling component. A heat sink is positioned on the side of the cooling element opposite to the cooling body, with the heat dissipation surface of the cooling element in contact with the heat sink. A heat-conducting shell is provided on the outer side of the cooling body, and this shell is in contact with the heat sink. This creates a heat-insulating cavity between the inner wall of the heat-conducting shell, spaced apart from the cooling body, the cooling body, and the heat sink. This transfers heat from the heat sink to the heat-conducting shell, improving the heat dissipation efficiency of the heat sink and saving energy. Furthermore, it reduces the temperature difference between the cooling body and the surrounding environment while maintaining cooling performance, and prevents the heat-conducting shell from being affected by the low temperature of the cooling body, thus avoiding a large temperature difference between the shell and the environment. This fundamentally solves the problem of condensation dripping from the cooling body and adjacent components during the dispensing process, which affects product quality. Attached Figure Description
[0011] Appendix Figure 1 This is a schematic diagram of the overall structure of the anti-drip cooling component of this utility model; Appendix Figure 2 For the appendix Figure 1 A schematic cross-sectional view along the middle AA section; Appendix Figure 3 This is a partial structural disassembly diagram of the anti-drip cooling component of this utility model.
[0012] In the attached diagrams: 100, mixing tube; 200, dispensing head; 1, refrigeration body; 2, refrigeration element; 3, heat-conducting shell; 31, clearance hole; 4, insulation cavity; 5, mounting block; 6, receiving groove; 7, heat sink; 71, mounting groove; 8, temperature sensor; 9, liquid inlet channel; 10, liquid outlet channel. Detailed Implementation
[0013] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.
[0014] Example 1: A drip-proof cooling assembly includes: a cooling body 1 that is in contact with the cooling surface of a cooling chip 2; a heat sink 7 is disposed on the side of the cooling chip 2 opposite to the cooling body 1; the heat dissipation surface of the cooling chip 2 is in contact with the heat sink 7; a heat-conducting shell 3 is disposed on the outer side of the cooling body 1; the heat-conducting shell 3 is in contact with the heat sink 7; thereby, the inner wall of the heat-conducting shell 3, which is spaced apart from the cooling body 1, forms a heat insulation cavity 4 between the cooling body 1 and the heat sink 7.
[0015] The edges of the aforementioned heat-conducting housing 3 are in contact with the surface of the heat sink 7; the aforementioned refrigeration body 1 and heat-conducting housing 3 are each fixedly installed on the heat sink 7 by bolts, and the two side surfaces of the refrigeration chip 2 located between the refrigeration body 1 and the heat sink 7 are in close contact with the refrigeration body 1 and the heat sink 7 respectively.
[0016] The aforementioned refrigeration body 1 is connected to the heat sink 7 via mounting blocks 5 respectively disposed on the upper and lower sides of the refrigeration chip 2; the aforementioned refrigeration body 1, heat-conducting shell 3 and heat sink 7 are all metal bodies with high thermal conductivity.
[0017] The aforementioned refrigeration body 1 is a copper refrigeration body, the heat-conducting shell 3 is a copper shell, and the heat dissipation plate 7 is a copper plate; the aforementioned heat dissipation plate 7 has an installation groove 71 for embedding the refrigeration chip 2.
[0018] At least one temperature sensor 8 is embedded in the aforementioned refrigeration body 1, which can acquire the temperature of the refrigeration body in real time and control and adjust it as needed to maintain the stability of the refrigeration temperature. The specific control and adjustment methods can be adopted using existing technologies, and will not be elaborated here.
[0019] The aforementioned refrigeration body 1 has at least one receiving groove 6 for embedding a mixing tube 100 and a dispensing head 200, and the heat-conducting housing 3 has a clearance through hole 31 for the mixing tube 100 and the dispensing head 200 to pass through.
[0020] Example 2: A drip-proof cooling assembly includes: a cooling body 1 that is in contact with the cooling surface of a cooling chip 2; a heat sink 7 is disposed on the side of the cooling chip 2 opposite to the cooling body 1; the heat dissipation surface of the cooling chip 2 is in contact with the heat sink 7; a heat-conducting shell 3 is disposed on the outer side of the cooling body 1; the heat-conducting shell 3 is in contact with the heat sink 7; thereby, the inner wall of the heat-conducting shell 3, which is spaced apart from the cooling body 1, forms a heat insulation cavity 4 between the cooling body 1 and the heat sink 7.
[0021] The edges of the aforementioned heat-conducting shell 3 are all in contact with the surface of the heat sink 7; the aforementioned refrigeration body 1, heat-conducting shell 3 and heat sink 7 are all metal bodies with high thermal conductivity; the aforementioned refrigeration body 1 is a brass refrigeration body, the aforementioned heat-conducting shell 3 is an aluminum shell, and the aforementioned heat sink 7 is an aluminum plate.
[0022] The aforementioned refrigeration body 1 has at least one receiving groove 6 for embedding a mixing tube 100 or a dispensing head 200, and the heat-conducting housing 3 has a clearance through hole 31 for the mixing tube 100 or the dispensing head 200 to pass through.
[0023] The aforementioned heat insulation cavity 4 is filled with heat insulation material to further prevent heat conduction between the refrigeration body and the heat-conducting shell, ensuring that the temperature difference between the two and the surrounding environment is small, and preventing the generation of condensation. The aforementioned heat insulation material is foamed thermal insulation adhesive.
[0024] The aforementioned heat sink 7 is located on the side of the cooling chip 2 opposite to the cooling body 1 and has interconnected liquid inlet channel 9 and liquid outlet channel 10. Water circulation in the channels is achieved through external components such as pump body to cool the heat dissipation surface of the cooling chip. Compared with directly using external heat dissipation equipment to dissipate heat from the cooling chip, the combination of water circulation and large-area heat sink provides a larger heat dissipation area and is more convenient to install.
[0025] The cooling chip has two sides, a hot side and a cold side. The hot side of the cooling chip carries away some of the heat through the water flow in the heat sink. While ensuring the cooling effect, the heat sink itself still has a relatively hot and stable temperature close to room temperature. This heat is reused to heat the heat-conducting shell. The cold side of the cooling chip is used to cool the adhesive in the mixing tube. In existing technologies, plastic insulation material is wrapped around the outside of the refrigeration unit, but water droplets will still form on the surface of the insulation material over time. The mixing tube is wrapped with a brass refrigeration body to ensure uniform cooling and improve the uniformity of cooling of the adhesive liquid. The heat sink plate that is in contact with the hot surface of the cooling chip is made of aluminum plate and is connected to the heat-conducting shell, which is also made of aluminum. The heat sink plate, which is close to room temperature, is transferred to the heat-conducting shell and wraps the cooling body. The heat-conducting shell remains hot and will not change due to the low temperature of the internal cooling unit, preventing the temperature of the heat-conducting shell from becoming too low. When air comes into contact with the surface of the heat-conducting shell, water molecules will not condense due to excessive temperature difference. The insulation cavity is filled with heat-insulating cotton or filled with foam insulation adhesive, forming a structure similar to a refrigerator. In principle, this avoids the formation of condensate, making it more stable and durable than adding a water collection device.
[0026] The aforementioned cooling chip and external pump body are all purchased externally and fall within the scope of existing technology, so they will not be elaborated here. The cooling chip can be a semiconductor cooling chip.
[0027] When the above-mentioned anti-drip cooling component is used, it conducts the heat on the heat sink to the heat-conducting shell spaced apart from the cooling body. This can improve the heat dissipation efficiency of the heat sink and save energy. It can also reduce the temperature difference between the cooling body and the surrounding environment while ensuring the cooling effect, and avoid the large temperature difference between the heat-conducting shell and the environment caused by the low temperature of the cooling body. This fundamentally solves the problem of condensation dripping from the cooling body and adjacent components during the dispensing process, which affects product quality.
[0028] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.
Claims
1. A drip-proof cooling component, comprising: The refrigeration body (1) is connected in contact with the refrigeration surface of the refrigeration chip (2), characterized in that: a heat sink (7) is provided on the side of the refrigeration chip (2) opposite to the refrigeration body (1), the heat dissipation surface of the refrigeration chip (2) is connected in contact with the heat sink (7), a heat-conducting shell (3) is provided on the outer side of the refrigeration body (1), and the heat-conducting shell (3) is connected in contact with the heat sink (7), so that the inner wall of the heat-conducting shell (3) which is spaced apart from the refrigeration body (1) forms a heat insulation cavity (4) between the refrigeration body (1) and the heat sink (7).
2. The anti-drip cooling component according to claim 1, characterized in that: The edges of the heat-conducting shell (3) are in contact with the surface of the heat sink (7).
3. The anti-drip cooling component according to claim 1, characterized in that: The refrigeration body (1) and the heat-conducting shell (3) are each fixedly installed on the heat sink (7) by bolts. The two sides of the refrigeration chip (2) located between the refrigeration body (1) and the heat sink (7) are in close contact with the refrigeration body (1) and the heat sink (7), respectively.
4. The anti-drip cooling component according to claim 3, characterized in that: The cooling body (1) is connected to the heat sink (7) through mounting blocks (5) respectively set on the upper and lower sides of the cooling plate (2).
5. The anti-drip cooling component according to claim 1, characterized in that: The refrigeration body (1), the heat-conducting shell (3), and the heat sink (7) are all metal bodies with high thermal conductivity.
6. The anti-drip cooling component according to claim 5, characterized in that: The refrigeration body (1) is a copper refrigeration body, an aluminum refrigeration body or a brass refrigeration body, the heat-conducting shell (3) is a copper shell or an aluminum shell, and the heat sink (7) is a copper plate or an aluminum plate.