On-chip ultrasound integrated module and interventional and wearable devices

Abstract

The utility model provides a kind of on-chip ultrasonic integrated module and intervention type and wearable device, comprising: substrate;PMUT transducer, the PMUT transducer is integrated on the substrate, the PMUT transducer is used to convert received pulse electric signal into ultrasonic wave and emit or convert received ultrasonic wave echo into echo electric signal;Form ultrasonic control integrated circuit on the substrate, the ultrasonic control integrated circuit includes pulse emission circuit and echo receiving circuit, the pulse emission circuit is used to emit pulse electric signal, to drive the PMUT transducer emit ultrasonic wave;The echo receiving circuit is used to receive and process the echo electric signal.The utility model significantly reduces medical ultrasonic chip cost and volume by integrated design, avoids the cutting separation of transducer, improves the performance consistency of transducer, and then improves the overall performance of ultrasonic chip.

Description

Technical Field

[0001] This utility model relates to ultrasound chips, specifically to an on-chip ultrasound integrated module and interventional and wearable devices. Background Technology

[0002] A piezoelectric micromachined ultrasonic transducer (PMUT) is a core device based on MEMS technology. Its working principle is based on the direct and inverse piezoelectric effects of piezoelectric materials. It achieves efficient transmission and reception of ultrasonic signals through the periodic vibration of a piezoelectric thin film. When the PMUT acts as a transmitter, it essentially converts electrical signals into mechanical vibration energy. Under the action of a driving voltage, the piezoelectric thin film deforms due to the inverse piezoelectric effect, causing the multilayer film structure to bend and vibrate, radiating ultrasonic waves into the medium. When acting as a receiver, it becomes a sensor that captures mechanical vibration energy. External ultrasonic waves cause the thin film to vibrate, resulting in strain in the piezoelectric thin film. Through the direct piezoelectric effect, the acoustic signal is converted into an electrical signal for subsequent processing.

[0003] Complementary Metal Oxide Semiconductor (CMOS) technology, as a core technology in the semiconductor field, is widely used in integrated circuit manufacturing and many other areas. It can integrate a large number of transistors onto a small chip, continuously developing in accordance with Moore's Law, and driving the evolution of semiconductors towards miniaturization and high performance.

[0004] The integration of PMUT with CMOS technology represents a revolutionary breakthrough in the field of ultrasound. Integrated design addresses the limitations of traditional probes in terms of size, cost, and performance, and holds immense promise in the medical, industrial, and consumer electronics sectors. With the synergistic advancements in MEMS and semiconductor technologies, PMUT-on-CMOS integrated chips are expected to become the core engine of next-generation ultrasound systems, driving the widespread adoption of "chip-level ultrasound." Summary of the Invention

[0005] In view of the problems in the prior art, the purpose of this utility model is to provide an on-chip ultrasound integrated module and interventional and wearable devices.

[0006] The on-chip ultrasonic integrated module provided by this utility model includes: Substrate; Multiple PMUT transducers are formed on this substrate; An ultrasonic control integrated circuit formed on a substrate, the ultrasonic control integrated circuit being coupled to multiple PMUT transducers.

[0007] Preferably, the ultrasonic control integrated circuit includes a pulse transmitting circuit and an echo receiving circuit; The pulse transmitting circuit is used to transmit pulse electrical signals to drive the PMUT transducer to emit ultrasonic waves; The echo receiving circuit is used to receive and process the echo electrical signal generated by the PMUT transducer; A switching switch is used to switch the PMUT transducer connected to or disconnected from the pulse transmitting circuit or the echo receiving circuit.

[0008] Preferably, the PMUT transducer includes: An insulating layer formed on the substrate; The cavity formed in the insulating layer; A piezoelectric layer and an elastic layer are formed on the upper side of the cavity; Bottom and top electrodes for receiving electrical signals are formed on both sides of the piezoelectric layer.

[0009] Preferably, the echo receiving circuit includes a signal amplifier; The signal amplifier is used to reduce noise and amplify the echo electrical signal.

[0010] Preferably, the signal amplifier is a low-noise amplifier or a transimpedance amplifier.

[0011] Preferably, the pulse transmitting circuit includes a transmitting beamformer and a pulse generating unit; The transmitting beamformer is used to delay and adjust the phase of the electrical pulse, synthesize a beam pointing towards the target area, so that the pulse generating unit transmits pulse electrical signals according to the delay and phase of the electrical pulse.

[0012] Preferably, the echo receiving circuit includes a receiving beamformer; The receiving beamformer is used to superimpose multiple echo signals to enhance the echo signals.

[0013] Preferably, it further includes an analog-to-digital converter; the analog-to-digital converter is used to convert the echo electrical signal and the echo electrical signal of the enhancement target from analog signals into echo digital electrical signals.

[0014] Preferably, it also includes a time gain compensator; The time gain compensator is used to adjust the gain of the echo electrical signal according to the propagation time of the ultrasonic wave; The time gain compensator is located between the switching switch and the signal amplifier, between the signal amplifier and the receiving beamformer, between the receiving beamformer and the analog-to-digital converter, or downstream of the circuit of the analog-to-digital converter.

[0015] The on-chip ultrasonic integrated module provided by this utility model includes: Multiple interconnected or spliced ​​substrates; Multiple PMUT transducers are formed on each of the substrates; An ultrasonic control integrated circuit is formed on the substrate and coupled to the plurality of PMUT transducers.

[0016] According to the interventional device provided by this utility model, the interventional device includes the on-chip ultrasound integrated module.

[0017] According to the wearable device provided by this utility model, the wearable device includes the on-chip ultrasonic integrated module.

[0018] Compared with the prior art, the present invention has the following beneficial effects: In this invention, a PMUT transducer is directly integrated onto the substrate. The PMUT transducer is used to convert received pulse electrical signals into ultrasonic waves and transmit them, or to convert received ultrasonic echoes into echo electrical signals. An ultrasonic control integrated circuit is formed on the substrate. The ultrasonic control integrated circuit includes a pulse transmitting circuit and an echo receiving circuit. The pulse transmitting circuit is used to transmit pulse electrical signals to drive the PMUT transducer to transmit ultrasonic waves. The echo receiving circuit is used to receive and process the echo electrical signals. This integrated design significantly reduces the cost and size of the medical ultrasound chip, reduces the complexity of circuit connections, avoids the cutting and separation of the transducer, improves the performance consistency of the transducer, and thus improves the overall performance of the ultrasound chip. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort. Other features, objects, and advantages of this utility model will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of an interventional ultrasound application scenario for the on-chip ultrasound integrated module in this embodiment of the present invention; Figure 2 This is a schematic diagram of a wearable ultrasound application scenario for the on-chip ultrasound integrated module in this utility model embodiment; Figure 3 This is a schematic diagram of the structure of the on-chip ultrasonic integrated module in an embodiment of this utility model; Figure 4This is a schematic diagram of the electrical connections of the on-chip ultrasonic integrated module in an embodiment of this utility model; Figure 5 This is an example of the shape of the cavity in the transducer in an embodiment of the present invention; Figure 6 This is a schematic diagram of the first circuit system used in the on-chip ultrasonic integrated module in an embodiment of this utility model; Figure 7 This is a schematic diagram of the second circuit system used in the on-chip ultrasonic integrated module in an embodiment of this utility model; Figure 8 This is a schematic diagram of the third circuit system used in the on-chip ultrasonic integrated module in an embodiment of this utility model; Figure 9 This is a schematic diagram of the fourth circuit system used in the on-chip ultrasonic integrated module in this embodiment of the present invention; Figure 10 This is a schematic diagram of the fifth circuit system used in the on-chip ultrasonic integrated module in this embodiment of the present invention; Figure 11 This is a schematic diagram showing the connection between the on-chip ultrasound chip and the imaging system in an embodiment of this utility model; Figure 12 This is a schematic diagram of applying pulse electrical signals with opposite phase polarities to both ends of the PMUT transducer in a variation of this utility model. Figure 13 This is a circuit diagram showing the application of pulse electrical signals to both ends of the PMUT transducer in a variation of this utility model. Figure 14 This is a schematic diagram of the on-chip ultrasonic integrated module in a variation of this utility model.

[0020] In the picture: 100 is the probe; 200 is the interventional catheter; 300 is the body surface patch; 101 is the substrate; 102 is the PMUT transducer array; 103 is the ultrasound chip; 104 is the flexible substrate; 105 is the outer membrane layer; 106 is the lumen; 1011 is the CMOS substrate; 1012 is the insulating layer; 1013 is the first metal layer; 1014 is the second metal layer; 1015 is the transducer interface; 1016 is the input / output pad; 1017 is the ultrasound control integrated circuit; 1018 is the plastic encapsulation structure; 1021 is the cavity; 1022 is the bottom electrode; 1023 is the top electrode; 1024 is the elastic layer; 1025 is the piezoelectric layer. Detailed Implementation

[0021] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0022] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the utility model described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0023] The technical solution of this utility model will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0024] The technical solutions of this utility model and this application solve the above-mentioned technical problems in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this utility model will now be described with reference to the accompanying drawings.

[0025] Figure 1 This is a schematic diagram illustrating the application scenario of the on-chip ultrasonic integrated module in this embodiment of the present invention, such as... Figure 1As shown, during intracardiac ultrasound, a transceiver probe 100 is placed inside the heart via a blood vessel to perform real-time, high-quality imaging or hemodynamic measurements of the heart and adjacent tissues. It is primarily used in interventional cardiac procedures such as atrial fibrillation radiofrequency ablation, mitral valve repair, left atrial appendage closure, and closure of atrial septal defects and patent foramen ovale. It enables real-time monitoring of catheter position and surgical outcomes, assessment of cardiac structure and function, guidance of surgical procedures, and reduction of surgical risks. The probe 100 has a diameter of approximately 3-10F (1-3.3 mm) and is integrated into the tip of the interventional catheter 200, inserted into the heart chamber via a vascular pathway (such as the femoral vein). The probe 100 typically operates at a frequency of 5-20 MHz, offering extremely high resolution, but with limited penetration depth, covering only local structures within the heart chambers. Given that the heart rate is approximately 60-100 beats per minute and the valve opening and closing cycle is only a few hundred milliseconds, a high imaging frame rate, such as a 4D imaging rate of 50 volumes / s, is required.

[0026] Figure 2 This is a schematic diagram of a wearable ultrasound application scenario for the on-chip ultrasound integrated module in this embodiment of the present invention, such as... Figure 2 As shown, when the on-chip ultrasound integrated module in this embodiment is applied to wearable scenarios, the battery-powered ultrasound imaging patch enables long-term, non-invasive, and real-time health monitoring. For example, by attaching the ultrasound imaging patch 300 to the chest, the PMUT transducer array continuously monitors the structure and function of the heart. Combined with long-term battery power, this provides continuous home monitoring for patients with hypertension and heart failure, replacing the traditional "regular ultrasound visits to the hospital" model and assisting doctors in adjusting treatment plans promptly. When applied to the abdomen, it monitors liver fatty infiltration (judged by ultrasound echo characteristics) and acoustic changes in the pancreas, helping patients with diabetes and fatty liver track disease progression. Combined with the signal processing capabilities of the ultrasound ASIC, it analyzes data in real time and provides risk feedback. Data is automatically collected and wirelessly transmitted to a mobile phone, replacing the traditional "queueing at the hospital for ultrasound" model.

[0027] Figure 3 This is a schematic diagram of the on-chip ultrasonic integrated module in an embodiment of the present invention, as shown below. Figure 3 As shown, a PMUT transducer array 102 is integrated on the substrate 101. The PMUT transducer array 102 is used to convert received pulse electrical signals into ultrasonic waves and transmit them, or to convert received ultrasonic echoes into echo electrical signals. An ultrasonic control integrated circuit 1017 is formed on the substrate 101. The ultrasonic control integrated circuit 1017 includes a pulse transmitting circuit and an echo receiving circuit. The pulse transmitting circuit includes a transmitting beamformer and a pulse generating unit for transmitting pulse electrical signals to drive the PMUT transducer array 102 to transmit ultrasonic waves. The echo receiving circuit includes a signal amplifier and a receiving beamformer for receiving and processing the echo electrical signals.

[0028] Figure 4 This is a schematic diagram of the on-chip ultrasonic integrated module in an embodiment of the present invention, as shown below. Figure 4 As shown, the on-chip ultrasound integrated module provided by this utility model includes: Substrate 101; PMUT transducer, which is integrated on the substrate 101, is used to convert received pulse electrical signals into ultrasonic waves and transmit them, or to convert received ultrasonic echoes into echo electrical signals. An ultrasonic control integrated circuit 1017 is formed on the substrate 101. The ultrasonic control integrated circuit 1017 includes a pulse transmitting circuit and an echo receiving circuit. The pulse transmitting circuit is used to transmit pulse electrical signals to drive the PMUT transducer to transmit ultrasonic waves. The echo receiving circuit is used to receive and process the echo electrical signals.

[0029] The ultrasonic control integrated circuit 1017 is used for ultrasonic transceiver control and echo signal processing, including signal amplification, filtering, gain control, beamforming, feature extraction, etc. The ultrasonic control integrated circuit 1017 formed on the substrate 101 forms an ultrasonic ASIC.

[0030] In this embodiment of the invention, each PMUT transducer can be connected to the pulse transmitting circuit and the echo receiving circuit respectively via a switching switch.

[0031] In one embodiment of this utility model, the substrate 101 includes: The ultrasonic control integrated circuit 1017 is formed in the CMOS substrate 1011. An insulating layer 1012 is located above the substrate and is used to electrically isolate the CMOS substrate 1011 from the PMUT transducer. An electrical connection channel is formed in the insulating layer 1012, and the PMUT transducer is connected to the ultrasonic control integrated circuit 1017 through the electrical connection channel.

[0032] The insulating layer 1012 is made of silicon dioxide or silicon nitride and is used to isolate the CMOS integrated circuit from the upper PMUT transducer structure to prevent leakage.

[0033] In one embodiment of this utility model, the PMUT transducer includes: Cavity 1021 formed in insulating layer 1012; A piezoelectric layer 1025 is formed on the upper side of the cavity 1021; And an elastic layer 1024 formed on the piezoelectric layer 1025; wherein, a bottom electrode 1022 and a top electrode 1023 for applying electrical signals are formed on both sides of the piezoelectric layer 1025.

[0034] In this embodiment of the invention, the vibrating membrane comprises a composite suspension structure consisting of a top electrode, a piezoelectric thin film layer, a bottom electrode, and an elastic layer; under the drive of an external differential electric field, the membrane generates flexural vibration, thereby exciting ultrasonic waves.

[0035] The cavity, formed by etching grooves into the insulating layer, releases the constraint beneath the diaphragm, allowing the vibrating diaphragm to flex freely under drive. A lower electrode is deposited above the insulating layer and above the cavity; a piezoelectric layer is deposited on the lower electrode, with its polarization direction perpendicular to the diaphragm plane; strain is generated under the influence of the electric field, driving the vibrating diaphragm to produce displacement.

[0036] The upper electrode covers the surface of the piezoelectric layer. An elastic layer, which can be made of materials such as SiO2 or SiN, is deposited on top of the upper electrode to provide additional mechanical support and stress regulation, thereby improving the resonant frequency and reliability of the film.

[0037] Figure 5 This is an example of the shape of the cavity in the transducer in an embodiment of the present invention, such as... Figure 5 The cavity 1021 shown can have various shapes, and in the case of multiple cavities, not all cavities need to have the same shape or size. For example, Figure 5 a to Figure 5 Figure d illustrates various possible shapes for cavity 1021 and other cavities described in embodiments of the present invention. Specifically, Figure 5 a to Figure 5 Image d shows a top view of cavities 1021 with various shapes formed in the substrate. Figure 5 a shows that the cavity 1021 can have a circular aperture. Figure 5 b shows that the cavity 1021 can have a square aperture. Figure 5 c shows that cavity 1021 can have a circular aperture, but... Figure 5 a has specific and different arrangements. Figure 5 Figure d shows that cavity 1021 can have a hexagonal aperture.

[0038] In some embodiments of the present invention, a single substrate (e.g., a single substrate) may have tens, hundreds, thousands, tens of thousands or hundreds of thousands of transducers formed therein and corresponding cavities 1021.

[0039] In one embodiment of this utility model, the piezoelectric layer 1025 is made of any one or more of the following materials: Aluminum nitride; Scandium aluminum nitride; Lead zirconate titanate (PZT); Zinc oxide; Polyvinylidene fluoride (PVDF); Potassium sodium niobate (KNN) of lithium niobate (LiNbO3); A mixture of lead magnesium niobate (PMN) and lead titanate (PT).

[0040] In one embodiment of this utility model, the elastic layer 1024 is made of any one or more of the following materials: Silicon (single crystal, polycrystalline or amorphous); silicon dioxide; silicon nitride; silicon carbide; metal nitride; bimetallic nitride; metal oxide.

[0041] In some embodiments of this utility model, the bottom electrode 1022 and the top electrode 1023 are made of any one or more of the following materials: Titanium; titanium nitride; aluminum; gold; platinum; and molybdenum.

[0042] In some embodiments of this utility model, the thickness of the elastic layer 1024 is any value between 1 and 10 μm; the thickness of the piezoelectric layer 1025 is any value between 0.5 and 1 μm.

[0043] In one embodiment of this invention, a protective layer is formed on the outer side of the elastic layer 1024 or the piezoelectric layer 1025, i.e., a protective layer is provided on the outermost side of the PMUT transducer. The protective layer can be made of PDMS (polydimethylsiloxane), a poly(p-xylene) series polymer material, or synthetic rubber. The acoustic impedance of the PDMS layer is well-matched with common media such as biological tissues. When the PMUT transducer is used in biomedical detection and other fields, it helps the ultrasound signal to be better transmitted between the device and the external medium, reducing reflection and energy loss caused by acoustic impedance mismatch.

[0044] Electrode vias are formed on the piezoelectric layer 1025; The top electrode 1023 extends to the wall of the electrode via; the bottom layer of the piezoelectric layer 1025 forms a transfer electrode; The top electrode 1023 is connected to the ultrasonic control integrated circuit 1017 via the intermediate electrode.

[0045] The number of the PMUT transducer, the pulse transmitting circuit, and the echo receiving circuit is multiple; The PMUT transducer is connected to the pulse transmitting circuit and the echo receiving circuit respectively.

[0046] Multiple PMUT transducers are divided into multiple PMUT transducer subarrays; A plurality of first metal layers 1013 and second metal layers 1014 are formed within the insulating layer 1012; The top electrodes 1023 of the multiple PMUT transducers in the same subarray are connected to the corresponding first metal layer 1013, and the bottom electrodes 1022 of the multiple PMUT transducers in the same subarray are connected to the corresponding second metal layer 1014. The first metal layer 1013 and the second metal layer 1014 are connected to the ultrasonic control integrated circuit 1017 through the electrical connection channel.

[0047] Figure 6 This is a schematic diagram of the connection of the first circuit system for the on-chip ultrasonic integrated module in an embodiment of this utility model, as shown below. Figure 9 As shown, the present invention provides a circuit system for an on-chip ultrasonic integrated module, a PMUT transducer, which is used to convert received pulse electrical signals into ultrasonic waves and transmit them, or to convert received ultrasonic echoes into echo electrical signals. An ultrasonic control integrated circuit 1017 includes a pulse transmitting circuit and an echo receiving circuit; the pulse transmitting circuit is used to transmit pulse electrical signals to drive the PMUT transducer to transmit ultrasonic waves; the echo receiving circuit is used to receive and process the echo electrical signals.

[0048] In this embodiment of the invention, each PMUT transducer can be connected to the pulse transmitting circuit and the echo receiving circuit respectively via a switching switch.

[0049] In this embodiment of the invention, the echo receiving circuit includes a time gain compensator, a signal amplification device, and a receiving beamformer. The signal amplification device can be a low-noise amplifier (LNA) or a transimpedance amplifier (TIA). The signal amplification device reduces noise and amplifies the weak electrical signal output by the PMUT transducer, improving the signal-to-noise ratio. The receiving beamformer performs phase compensation on the electrical signals received by each array element, superimposing and enhancing the target echo. The target echo is transmitted to the ultrasound control console through the output channel, thereby realizing image reconstruction and real-time display. The time gain compensator is used to adjust the gain of the echo electrical signal according to the propagation time of the ultrasound wave; the longer the propagation time, the greater the gain.

[0050] The pulse transmitting circuit includes a pulse generating unit and a transmitting beamformer. The transmitting beamformer delays and adjusts the phase of the electrical pulse to make the synthesized beam point to the target area. The pulse generating unit generates a high-voltage pulse according to the delay and phase of the electrical pulse, and triggers the PMUT transducer to vibrate and emit ultrasonic waves through the high-voltage pulse.

[0051] In this embodiment of the invention, the pulse generating unit employs several pulse generators.

[0052] In one embodiment of this utility model, the number of the PMUT transducer, the pulse transmitting circuit, and the echo receiving circuit is multiple; Each PMUT transducer is connected to the corresponding pulse transmitting circuit and echo receiving circuit.

[0053] Multiple PMUT transducers are divided into multiple PMUT transducer subarrays; The multiple pulse transmitting circuits and the multiple echo receiving circuits are divided into multiple ultrasonic control subarrays; the PMUT transducer subarray is connected to the ultrasonic control subarray.

[0054] Figure 7 This is a schematic diagram of the second circuit system used in the on-chip ultrasonic integrated module in an embodiment of this utility model, as shown below. Figure 7 As shown, the echo receiving circuit further includes an analog-to-digital converter (ADC); the ADC is used to convert the echo electrical signal from an analog signal to an echo digital electrical signal. The pulse transmitting circuit further includes a digital-to-analog converter (DAC), which is used to convert the delay and phase adjustment information of the electrical pulse output by the transmitting beamformer into an analog electrical signal, so that the pulse generating unit generates a high-voltage pulse.

[0055] Figure 8 This is a schematic diagram of the third circuit system used in the on-chip ultrasonic integrated module in an embodiment of this utility model. Figure 9 This is a schematic diagram of the fourth circuit system used in the on-chip ultrasonic integrated module in an embodiment of this utility model. Figure 10 This is a schematic diagram of the fifth circuit system used in the on-chip ultrasonic integrated module in an embodiment of this utility model, as shown below. Figure 8 , Figure 9 , Figure 10 As shown The time gain compensator can be located between the switching switch and the signal amplifier, between the signal amplifier and the receiving beamformer, between the receiving beamformer and the analog-to-digital converter, or downstream of the circuit of the analog-to-digital converter.

[0056] like Figure 10As shown, the analog-to-digital converter is located downstream of the receiving beamformer and is used to convert the enhanced echo electrical signal from an analog signal to an echo digital electrical signal. The digital-to-analog converter is located upstream of the transmitting beamformer and is used to convert the received delay and phase adjustment digital information into an analog electrical signal, which is then sent to the transmitting beamformer.

[0057] Figure 11 This is a schematic diagram illustrating the connection between the on-chip ultrasound chip and the imaging system in an embodiment of this utility model, as shown below. Figure 11 As shown, the ultrasonic chip integrates an ultrasonic control integrated circuit and a PMUT transducer; as Figure 11 As shown in (a), the ultrasound chip is connected to the imaging system via an analog interface. The ultrasound chip sends the acquired echo electrical signals to the imaging system in the form of analog signals. The imaging system converts the analog signals into digital signals and then displays the ultrasound images in real time. Figure 11 As shown in (b), the ultrasound chip is connected to the imaging system via a digital interface. The ultrasound chip sends the acquired echo electrical signals to the imaging system in the form of a digital interface so that the imaging system can display ultrasound images in real time.

[0058] Figure 12 This is a schematic diagram illustrating the application of pulse electrical signals with opposite phase polarities to both ends of the PMUT transducer in a variation of this utility model, as shown below. Figure 12 As shown, The pulse generation unit includes a first pulse generator and a second pulse generator; A first pulse generator is connected to the first electrode of the PMUT transducer and is used to transmit a first pulse electrical signal to the PMUT transducer to drive the PMUT transducer to emit ultrasonic waves. The second pulse generator is connected to the second electrode of the PMUT transducer and is used to transmit a second pulse electrical signal to the PMUT transducer with a phase polarity opposite to that of the first pulse electrical signal to drive the PMUT transducer to emit ultrasonic waves. The first pulse electrical signal and the second pulse electrical signal have opposite phase polarities, that is, pulse electrical signals with opposite phase polarities are applied to the PMUT transducer to achieve positive and negative voltage bipolar differential.

[0059] Figure 13 This is a circuit diagram of applying a pulse electrical signal to both ends of the PMUT transducer in a variation of this utility model, as shown below. Figure 13 As shown, the first pulse generator includes: Transistor MN1, wherein the drain (D) of transistor MN1 is connected to a high-voltage source through resistor R1, and the source (S) is grounded; Transistor MN2, the source (S) of transistor MN2 is used to connect to a high voltage source, the drain (D) is connected to the first electrode of the PMUT transducer, and the gate (G) is connected to the drain (D) of transistor MN1. Transistor MN3, wherein the drain of transistor MN3 is connected to the drain of transistor MN2, and the source is grounded; The first level converter is connected to the gate of transistor MN1 on one hand through the first non-overlapping generator, and to the gate of transistor MN3 on the other hand through the buffer BF1. The first non-overlapping generator is used to generate two non-overlapping control pulses based on the two control pulse signals generated by the level converter.

[0060] TR transistor MP1, wherein the source (S) of TR transistor MP1 is grounded, the drain (D) is connected to the source (S) of transistor MN3, and the gate (G) is used to receive TR signals to control the switching between the drain (D) and source (S) of TR transistor MP1. An echo signal receiving port is provided between the source (S) terminal of transistor MN3 and the drain (D) terminal of TR transistor MP1.

[0061] The second pulse generator includes: Transistor MN4, wherein the drain (D) of transistor MN4 is connected to a high-voltage source through resistor R2, and the source (S) is grounded; Transistor MN5, the source (S) of transistor MN5 is connected to a high-voltage source, the drain (D) is connected to the second electrode of the PMUT transducer, and the gate (G) is connected to the drain (D) of transistor MN4. Transistor MN6, wherein the drain of transistor MN6 is connected to the drain of transistor MN5; The second level converter is connected to the gate of transistor MN4 on one hand through the second non-overlapping generator, and to the gate of transistor MN6 on the other hand through buffer BF2; The second non-overlapping generator is used to generate two non-overlapping control pulses based on the two control pulse signals generated by the level converter.

[0062] TR transistor MP2, the source (S) of TR transistor MP2 is grounded, the drain (D) is connected to the source (S) of transistor MN3, and the gate (G) is used to receive TR signals to control the switching between the drain (D) and source (S) of TR transistor MP2. An echo signal receiving port is provided between the source (S) terminal of transistor MN3 and the drain (D) terminal of TR transistor MP2.

[0063] In this embodiment of the invention, transistors MN1, MN2, MN3, MN4, MN5, and MN6 are N-type MOS transistors, and transistor MP1 is a P-type MOS transistor.

[0064] In this embodiment of the invention, the non-overlapping generator includes: The delay unit includes at least two first inverters connected in series, used to delay the control pulse signal to generate a delayed control signal; The logic processing unit includes a NAND gate and a second inverter. The two inputs of the NAND gate are used to receive the control pulse signal and the delayed control signal, respectively. The output is generated as a non-overlapping control pulse after passing through the second inverter.

[0065] In an optional embodiment of this utility model, the delay unit delays the original control pulse of the input signal by a fixed time and generates an inverse delayed signal; When the original control pulse is valid and the delay control signal is valid, the NAND gate outputs a valid signal, and the second inverter inverts the output signal of the NAND gate to restore the original logic level of the signal.

[0066] Figure 14 This is a schematic diagram of the on-chip ultrasonic integrated module in a variation of this utility model, as shown below. Figure 14 As shown, the on-chip ultrasound integrated module provided by this utility model includes: Multiple interconnected or spliced ​​substrates 101; A plurality of PMUT transducers 102 are formed on each of the substrates 101; An ultrasonic control integrated circuit is formed on the substrate 101 and coupled to the plurality of PMUT transducers.

[0067] The ultrasonic chip 101 includes a substrate 101 and an ultrasonic control integrated circuit sequentially formed on the substrate 101; Multiple interconnected ultrasonic chips 101 are interconnected to form a ring phased array via a flexible substrate 104. The ultrasonic chips are disposed on a cavity 106, which provides physical support for the ultrasonic chips; an outer membrane layer 105 covers the outer side of each ultrasonic chip 101.

[0068] In this embodiment of the invention, a PMUT transducer is directly integrated onto the substrate. The PMUT transducer is used to convert received pulse electrical signals into ultrasonic waves and transmit them, or to convert received ultrasonic echoes into echo electrical signals. An ultrasonic control integrated circuit is formed on the substrate. The ultrasonic control integrated circuit includes a pulse transmitting circuit and an echo receiving circuit. The pulse transmitting circuit is used to transmit pulse electrical signals to drive the PMUT transducer to transmit ultrasonic waves. The echo receiving circuit is used to receive and process the echo electrical signals. This integrated design solves the bottlenecks in size, cost, and performance of traditional medical ultrasound chips.

[0069] In traditional medical ultrasound chips, the PMUT transducer and ultrasound control circuit are typically designed separately, requiring complex wiring and packaging to connect the individual components. This not only occupies a lot of space but also increases the size and weight of the probe. However, in this invention, the PMUT transducer is directly integrated onto the substrate, and the ultrasound control integrated circuit is formed on the same wafer, achieving end-to-end integration from signal generation and transmission to reception and processing. This highly integrated design significantly reduces the connection distance and space occupation between components, allowing for a substantial reduction in the overall size of the ultrasound chip and significantly improving the portability of the device. In the separate design of traditional medical ultrasound chips, each PZT transducer needs to be individually cut and manufactured. Due to operational errors in the cutting process and slight differences in the performance of raw materials from different batches, it is difficult to maintain high consistency in size, material properties, and electrical parameters among the transducers. This invention, however, adopts an integrated design, integrating the PMUT transducer with the substrate, avoiding the drawbacks of individual cutting, fundamentally solving the consistency problem, and improving the overall performance of the probe. In traditional discrete probes, signal transmission between the PMUT transducer and the ultrasonic control circuit requires a long connecting cable, which introduces problems such as signal attenuation and interference, affecting signal quality and transmission efficiency. However, in this embodiment, the PMUT transducer and the ultrasonic control integrated circuit are tightly integrated on the same chip, significantly shortening the signal transmission path, reducing parasitic capacitance and resistance, minimizing signal loss and interference during transmission, improving signal integrity, and enabling faster and more accurate conversion of pulsed electrical signals into ultrasonic waves for transmission, as well as converting received ultrasonic echoes into high-quality echo electrical signals.

[0070] The various embodiments described in this specification are presented in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The above description of the disclosed embodiments enables those skilled in the art to implement or use this invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this invention. Therefore, this invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0071] The specific embodiments of this utility model have been described above. It should be understood that this utility model is not limited to the specific embodiments described above, and those skilled in the art can make various modifications or variations within the scope of the claims, which do not affect the substantive content of this utility model.

Claims

1. An on-chip ultrasonic integrated module, characterized in that, include: Substrate; Multiple PMUT transducers are formed on this substrate; An ultrasonic control integrated circuit formed on a substrate, the ultrasonic control integrated circuit being coupled to multiple PMUT transducers.

2. The on-chip ultrasonic integrated module according to claim 1, characterized in that, The ultrasonic control integrated circuit includes a pulse transmitting circuit and an echo receiving circuit; The pulse transmitting circuit is used to transmit pulse electrical signals to drive the PMUT transducer to emit ultrasonic waves; The echo receiving circuit is used to receive and process the echo electrical signal generated by the PMUT transducer; A switching switch is used to switch the PMUT transducer connected to or disconnected from the pulse transmitting circuit or the echo receiving circuit.

3. The on-chip ultrasonic integrated module according to claim 1, characterized in that, The PMUT transducer includes: An insulating layer formed on the substrate; The cavity formed in the insulating layer; A piezoelectric layer and an elastic layer are formed on the upper side of the cavity; Bottom and top electrodes for receiving electrical signals are formed on both sides of the piezoelectric layer.

4. The on-chip ultrasonic integrated module according to claim 2, characterized in that, The echo receiving circuit includes a signal amplifier; The signal amplifier is used to reduce noise and amplify the echo electrical signal.

5. The on-chip ultrasonic integrated module according to claim 4, characterized in that, The signal amplifier is a low-noise amplifier or a transimpedance amplifier.

6. The on-chip ultrasonic integrated module according to claim 2, characterized in that, The pulse transmitting circuit includes a transmitting beamformer and a pulse generating unit; The transmitting beamformer is used to delay and adjust the phase of the electrical pulse, synthesize a beam pointing towards the target area, so that the pulse generating unit transmits pulse electrical signals according to the delay and phase of the electrical pulse.

7. The on-chip ultrasonic integrated module according to claim 4, characterized in that, The echo receiving circuit includes a receiving beamformer; The receiving beamformer is used to superimpose multiple echo signals to enhance the echo signals.

8. The on-chip ultrasonic integrated module according to claim 7, characterized in that, It also includes an analog-to-digital converter; the analog-to-digital converter is used to convert the echo electrical signal from an analog signal into an echo digital electrical signal.

9. The on-chip ultrasonic integrated module according to claim 8, characterized in that, It also includes a time gain compensator; The time gain compensator is used to adjust the gain of the echo electrical signal according to the propagation time of the ultrasonic wave; The time gain compensator is located between the switching switch and the signal amplifier, between the signal amplifier and the receiving beamformer, between the receiving beamformer and the analog-to-digital converter, or downstream of the circuit of the analog-to-digital converter.

10. An on-chip ultrasonic integrated module, characterized in that, include: Multiple interconnected or spliced ​​substrates; Multiple PMUT transducers are formed on each of the substrates; An ultrasonic control integrated circuit is formed on the substrate and coupled to the plurality of PMUT transducers.

11. An interventional device, characterized in that, The interventional device includes the on-chip ultrasound integrated module as described in any one of claims 1 to 10.

12. A wearable device, characterized in that, The wearable device includes the on-chip ultrasound integrated module as described in any one of claims 1 to 10.

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