Floating die structure of busbar punching machine
Patent Information
- Application Number
- CN202522256696.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-24
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-24
AI Technical Summary
现有冲孔机在使用时,冲头单次下压会产生高达30T的向下力,长期使用后,滚珠导轨续长期承受这部分冲击力,导致滚珠导轨结构发生损坏,损坏后的滚珠导轨会影响冲孔机的加工精度,导致设备损坏
1)本申请所提供的母线冲孔机浮动凹模结构,该装置通过在模座与冲孔机中心区域设置模套,并在模套与模座相接面上设置多个弹性材料缓冲件,并在垫块与模套之间设置缓冲间隔,以减少滚珠导轨所受向下的力,有效保护滚珠导轨,避免设置于垫板与模座之间的滚珠导轨受力过大导致受损。提高该装置的使用安全可靠性。
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Figure CN224779107U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of busbar processing technology, and in particular to a floating die structure for a busbar punching machine. Background Technology
[0002] The current busbar processing requires punching, which is mainly done using a punching machine. When using a punching machine, the punch generates a downward force of up to 30 tons with each press. Over time, the ball bearing guides bear this impact force, leading to damage to the ball bearing guide structure. Damaged ball bearing guides affect the processing accuracy of the punching machine, ultimately causing equipment failure.
[0003] The information disclosed in the background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that such information constitutes prior art known to those skilled in the art. Utility Model Content
[0004] This application provides a floating die structure for a busbar punching machine to address the above-mentioned technical problems. This device can prevent the downward pressure generated by the punch from acting directly on the ball guide rail, effectively protecting the ball guide rail.
[0005] This application provides a floating die structure for a busbar punching machine, including: a die base, a ball bearing guide rail, a base plate, a pad, and a die sleeve; the ball bearing guide rail and the pad are disposed between the die base and the base plate; A mounting hole is provided in the center area of the mold base; the mold sleeve is accommodated and set in the mounting hole; the die cavity is accommodated and set in the mold sleeve. The spacer block is positioned directly opposite the bottom of the mounting hole and spaced apart from the bottom of the mold sleeve. A gap is left between the mold sleeve and the mounting hole, and multiple elastic material cushioning elements are filled in the gap.
[0006] Preferably, it includes: a stepped groove; the stepped groove is disposed on the top surface of the mounting hole and has a gap with the bottom surface of the mounting ring on the upper part of the mold sleeve; multiple elastic material buffers are filled in the gap.
[0007] Preferably, a buffer gap is provided between the bottom surface of the mold and the pad.
[0008] Preferably, the width of the stepped groove is greater than the diameter of the mounting hole; the width of the mounting ring at the upper part of the mold sleeve is greater than that of the lower body structure.
[0009] Preferably, it includes: a punch; the punch is positioned opposite the die.
[0010] Preferably, it includes: a blanking hole; the blanking hole is formed in the mold sleeve and communicates with the die cavity.
[0011] Preferably, it includes: a discharge hole; the discharge hole is formed in the pad and aligned with the discharge hole in the mold sleeve.
[0012] Preferably, it includes: a discharge hole; the discharge hole is formed in the base plate and communicates with the discharge hole in the pad block.
[0013] Preferably, the ball bearing guides are arranged in pairs on opposite sides of the pad.
[0014] The beneficial effects that this application can produce include: 1) The floating die structure for the busbar punching machine provided in this application reduces the downward force on the ball guide rail by setting a die sleeve in the central area of the die base and the punching machine, setting multiple elastic material buffers on the contact surface between the die sleeve and the die base, and setting a buffer interval between the pad and the die sleeve. This effectively protects the ball guide rail and prevents it from being damaged due to excessive force. This improves the safety and reliability of the device. Attached Figure Description
[0015] Figure 1 A front sectional view of the floating die structure of the busbar punching machine in at least one embodiment provided in this application; Legend: Busbar 12, punch 11, die 211, groove 2, blanking hole 21, elastic material buffer 14, gap 141, mold sleeve 13, mold base 1, ball guide rail 221, base plate 3, pad block 231, mounting hole 131, step groove 132, buffer interval 133. Detailed Implementation
[0016] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can typically be arranged and designed in various different configurations.
[0017] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0018] Technical means not detailed in this application and not used to solve the technical problems of this application are all set according to common general knowledge in the field, and multiple common general knowledge setting methods can be implemented.
[0019] The structure provided in this application is installed on existing commonly used busbar punching and / or shearing machines, such as the CKJ30S CNC busbar automatic punching machine. The structure of other components of the punching machine is the same as that of existing punching machines, and will not be described in detail here.
[0020] See Figure 1 The floating die structure of the busbar punching machine provided in this application has a mounting hole 131 in the central area of the die base 1, which houses the die sleeve 13. A stepped groove 132 is provided above the mounting hole 131, and the width of the stepped groove 132 is greater than the width of the mounting hole 131. A mounting ring is provided at the top of the die sleeve 13. A gap 141 is provided between the mounting ring and the inner wall of the stepped groove 132. Multiple elastic material buffers 14 are provided in the gap 141. Ball bearing guides 221 are symmetrically arranged on the outer side of the pad 231. The pad 231 and the guide mounting plate 22 are mounted on the top surface of the base plate 3.
[0021] A buffer gap 133 is provided between the bottom surface of the die sleeve 13 and the pad block 231. When the busbar 12 placed on the die sleeve 13 is pressed down by the upper punch 11, the busbar 12 is inserted into the die cavity 211, forming a punch on the busbar 12. At the same time, the downward pressure pushes the die sleeve 13, which is connected to the outer wall of the die cavity 211, down. At this time, the die sleeve 13 presses down and squeezes the elastic material buffer 14. The bottom of the die sleeve 13 presses down on the pad block 231 simultaneously, thereby effectively dispersing and buffering the downward pressure of the punch, avoiding direct impact on the ball guide rail 221 and causing damage to the ball guide rail 221. The die sleeve 13 is set to move up and down reciprocally within the mounting hole 131, and squeezes the elastic material buffer 14 each time it presses down to punch.
[0022] In one specific embodiment, elastic material buffer members 14 are spaced apart and filled within the gap 141.
[0023] In one specific embodiment, a discharge hole 21 is provided in the central area of the pad block 231 and the base plate 3 so that the punching waste of the busbar 12 falling from the die 211 can be discharged.
[0024] In one specific embodiment, the die sleeve 13 is provided below the die cavity 211 and is connected to the die cavity 211 and the central discharge hole 21 of the pad block 231, thereby realizing the directional and timely discharge of punching waste.
[0025] In one specific embodiment, the elastic material buffer 14 is a polyurethane buffer strip or a natural rubber buffer strip.
[0026] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A floating die structure for a busbar punching machine, characterized in that, include: Mold base (1), ball guide rail (221), base plate (3), pad (231), mold sleeve (13); ball guide rail (221) and pad (231) are provided between mold base (1) and base plate (3); A mounting hole (131) is provided in the central area of the mold base (1); the mold sleeve (13) is accommodated and set in the mounting hole (131); The die (211) is housed within the die sleeve (13); The pad (231) is positioned directly opposite the bottom of the mounting hole (131) and spaced apart from the bottom of the mold sleeve (13); A gap (141) is left between the mold sleeve (13) and the mounting hole (131), and multiple elastic material buffers (14) are filled in the gap (141).
2. The floating die structure for the busbar punching machine according to claim 1, characterized in that, include: Step groove (132); Step groove (132) is provided on the top surface of mounting hole (131) and a gap (141) is provided between it and the bottom surface of mounting ring on the upper part of mold sleeve (13); Multiple elastic material buffers (14) are filled in the gap (141).
3. The floating die structure for the busbar punching machine according to claim 2, characterized in that, A buffer gap (133) is provided between the bottom surface of the mold (13) and the pad (231).
4. The floating die structure for the busbar punching machine according to claim 2, characterized in that, The width of the stepped groove (132) is greater than the diameter of the mounting hole (131); the width of the mounting ring on the upper part of the mold sleeve (13) is greater than the width of the lower body structure.
5. The floating die structure for the busbar punching machine according to claim 1, characterized in that, include: Punch (11); Punch (11) is positioned opposite die (211).
6. The floating die structure for the busbar punching machine according to claim 1, characterized in that, include: The blanking hole (21) is located in the mold sleeve (13) and is connected to the die cavity (211).
7. The floating die structure for the busbar punching machine according to claim 6, characterized in that, The material discharge hole (21) is opened in the pad (231) and is aligned with the material discharge hole (21) in the mold sleeve (13).
8. The floating die structure for the busbar punching machine according to claim 6, characterized in that, The feeding hole (21) is located in the base plate (3) and is connected to the feeding hole (21) in the pad block (231).
9. The floating die structure for the busbar punching machine according to claim 1, characterized in that, Ball guides (221) are arranged in pairs on opposite sides of the pad (231).