Diode lead bending and cutting apparatus

Abstract

The utility model relates to diode processing technical field, concretely relates to a diode pin bending cutting device. Including base, the upside of base is equipped with bending cutting mechanism, the upside of base is equipped with positioning mechanism, the positioning mechanism straightens the bent diode pin to facilitate subsequent processing. The utility model discloses, when diode is transported to between first locating seat and second locating seat, bidirectional electric sliding platform drive moving seat and mounting frame move towards each other, and mounting frame drives first locating seat and second locating seat synchronous movement in the moving process, so that diode pin enters the clearance between two adjacent locating plates, and simultaneously, one end of second locating seat also embeds this clearance, under the synergistic effect of the push of first locating seat, the jacking of second locating seat and the lateral constraint of locating plate, the bent diode pin is straightened, so as to facilitate subsequent bending cutting mechanism to the processing treatment of diode pin.

Description

Technical Field

[0001] This utility model relates to the field of diode processing technology, and more specifically, to a diode lead bending and cutting device. Background Technology

[0002] A diode is an electronic device made of semiconductor material. It has two electrodes, a positive electrode and a negative electrode, also called an anode and a cathode. A diode has unidirectional conductivity. When it is conducting, the current flows from the anode through the tube to the cathode. When a forward voltage is applied between the two electrodes of the diode, the diode conducts. When a reverse voltage is applied, the diode is cut off. The conduction and cutoff of the diode are equivalent to the opening and closing of a switch.

[0003] In the processing of diodes, such as light-emitting diodes, the leads are located on the same side of the diode. Diodes are usually processed by a cutting and forming machine. The cutting and forming machine is equipped with a conveying mechanism and a bending and cutting mechanism 2. The conveying mechanism transports the diode to the bending and cutting mechanism 2, which cuts the diode leads to a standard length and bends them into a specific shape. However, during the process of transporting the diode by the conveying mechanism, the diode leads are very prone to plastic bending due to collisions. This damages the leads and causes them to have inconsistent effective lengths when cut uniformly in the subsequent process. As a result, the bent and formed leads cannot meet the design requirements, which not only wastes the diode body but also increases the production cost. In view of this, we propose a diode lead bending and cutting device. Utility Model Content

[0004] The purpose of this invention is to provide a diode lead bending and cutting device to solve the problem mentioned in the background art where diode leads are bent due to collisions during transportation, affecting subsequent lead processing.

[0005] To address the aforementioned problems, the present invention aims to provide a diode lead bending and cutting device, comprising a base, a bending and cutting mechanism on the upper side of the base for cutting and bending diode leads, a positioning mechanism on the upper side of the base located on one side of the bending and cutting mechanism for straightening the bent diode leads, and the positioning mechanism comprising a driving component, a first positioning seat, and a second positioning seat. The driving component is disposed on the upper side of the base and drives the first and second positioning seats to move toward or away from each other. When the diode lead moves between the first and second positioning seats, the driving component drives the first and second positioning seats to move toward the diode lead to straighten the bent diode lead.

[0006] As a further improvement to this technical solution, a number of positioning grooves are provided on the side of the first positioning seat near the second positioning seat, and a number of elastic sponge pads are fixedly connected to the side of the first positioning seat near the second positioning seat.

[0007] As a further improvement to this technical solution, a number of positioning plates are fixedly connected to the side of the second positioning seat near the first positioning seat, and the number and shape of the positioning plates match the positioning grooves.

[0008] As a further improvement to this technical solution, the side of the adjacent positioning plates that is close to each other is a positioning slope, the distance between adjacent positioning plates that are close to the first positioning seat is greater than the distance between them that are far away from the first positioning seat, and the gap between adjacent positioning plates that is far away from the first positioning seat is adapted to the shape of the diode pin cross-section.

[0009] As a further improvement to this technical solution, the top of the positioning plate near the first positioning seat is a guide tip, and the bottom of the guide tip is an arc-shaped guide surface.

[0010] As a further improvement to this technical solution, the drive assembly includes a bidirectional electric slide fixedly connected to the upper side of the base. Two movable seats are slidably connected to the bidirectional electric slide. The bidirectional electric slide drives the two movable seats to move towards or away from each other. A mounting bracket is fixedly connected to the upper side of the movable seat. The first positioning seat and the second positioning seat are respectively fixedly connected to the top of the two mounting brackets on the side close to each other.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. In this diode lead bending and cutting device, after the diode is transported between the first positioning seat and the second positioning seat, the bidirectional electric slide drives the moving seat to move towards the mounting frame. During the movement, the mounting frame drives the first and second positioning seats to move synchronously, so that the diode lead enters the gap between the two adjacent positioning plates. At the same time, one end of the second positioning seat is also embedded in this gap. Under the combined action of the pushing of the first positioning seat, the supporting of the second positioning seat, and the lateral constraint of the positioning plate, the bent diode lead is straightened and restored to a vertical state, so that the subsequent bending and cutting mechanism can process the diode lead. Attached Figure Description

[0013] Figure 1 This is one of the overall structural schematic diagrams of this utility model;

[0014] Figure 2 This is the second schematic diagram of the overall structure of this utility model;

[0015] Figure 3 This is one of the structural schematic diagrams of the positioning mechanism in this utility model;

[0016] Figure 4 This is the second schematic diagram of the positioning mechanism in this utility model;

[0017] Figure 5 This is the third schematic diagram of the positioning mechanism in this utility model;

[0018] Figure 6 This is the fourth structural schematic diagram of the positioning mechanism in this utility model.

[0019] The meanings of the labels in the diagram are as follows:

[0020] 1. Base;

[0021] 2. Bending and cutting mechanism;

[0022] 3. Positioning mechanism; 31. Bidirectional electric slide; 32. Movable seat; 33. Mounting bracket; 34. First positioning seat; 341. Positioning groove; 35. Second positioning seat; 351. Positioning plate; 352. Positioning ramp. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1

[0025] Please see Figure 1 - Figure 6 As shown, the purpose of this embodiment is to provide a diode lead bending and cutting device, including a base 1, a bending and cutting mechanism 2 on the upper side of the base 1, the bending and cutting mechanism 2 being used to cut and bend the diode lead, and a positioning mechanism 3 on the upper side of the base 1, the positioning mechanism 3 being located on one side of the bending and cutting mechanism 2. During the diode lead cutting and forming process, when the conveying mechanism conveys the diode to the position corresponding to the positioning mechanism 3, the positioning mechanism 3 straightens the bent diode lead, restoring it to a vertical state. After the diode lead is straightened, the conveying mechanism moves the diode to the position corresponding to the bending and cutting mechanism 2, so that the bending and cutting mechanism 2 can subsequently process the diode lead.

[0026] refer to Figure 3 - Figure 6The positioning mechanism 3 includes a drive assembly, a first positioning seat 34, and a second positioning seat 35. The drive assembly is located on the upper side of the base 1. The drive assembly drives the first positioning seat 34 and the second positioning seat 35 to move closer to or further away from each other. Several positioning slots 341 are formed on the side of the first positioning seat 34 closest to the second positioning seat 35. Several elastic sponge pads are fixedly connected to the side of the first positioning seat 34 closest to the second positioning seat 35, i.e., each elastic sponge pad is installed on the first positioning seat 34 between two adjacent positioning slots 341. Several positioning plates 351 are fixedly connected to the side of the second positioning seat 35 closest to the first positioning seat 34. The number and shape of the positioning plates 351 match the number and shape of the positioning slots 341. When the diode pin moves between the first positioning seat 34 and the second positioning seat 35, the drive assembly drives the first positioning seat 34 and the second positioning seat 35 to move closer to the diode pin, causing the bent diode to... During the straightening of the diode pin, as the first positioning seat 34 and the second positioning seat 35 move toward each other, the first positioning seat 34 and the elastic sponge pad push the diode pin into the gap between the adjacent positioning plates 351. At the same time, the side of the first positioning seat 34 closest to the second positioning seat 35 enters between the adjacent positioning plates 351, causing the positioning plates 351 to enter the interior of the positioning groove 341. During this process, the elastic sponge pad is compressed by the positioning plates 351. As the first positioning seat 34 and the second positioning seat 35 continue to move toward each other, the first positioning seat 34 presses the diode pin against the side wall of the second positioning seat 35. Under the synergistic action of the adjacent positioning plates 351, the first positioning seat 34 and the second positioning seat 35, the diode pin is wrapped in all directions, gradually reducing the activity space of the diode pin, thereby straightening the bent diode pin so that the subsequent bending and cutting mechanism 2 can cut and shape the diode pin.

[0027] Simultaneously, the side of the adjacent positioning plates 351 closest to each other is set as a positioning slope 352, so that the distance between the adjacent positioning plates 351 near the first positioning seat 34 is greater than the distance between them far from the first positioning seat 34, thereby widening the gap between the adjacent positioning plates 351 near the first positioning seat 34, making it easier for the diode pin to enter the gap between the adjacent positioning plates 351. The top of the side of the positioning plate 351 near the first positioning seat 34 is a guide tip, and the bottom of the guide tip is an arc-shaped guide surface. If the diode pin is bent towards the direction of the positioning plate 351, and the bending angle of the diode pin is too large, making its size larger than the gap between the adjacent positioning plates 351, the diode pin will have difficulty entering the interior of the gap between the adjacent positioning plates 351. During the straightening process of the diode pin, the second positioning seat 35 moves towards the direction of the diode pin. At this time, the position of the diode pin corresponds to the position of the gap between the adjacent positioning plates 351. During the movement of the second positioning seat 35, the second positioning seat 35 moves towards the direction of the diode pin. The upper side of the diode lead first enters between adjacent guide tips. As the second positioning seat 35 continues to move, the lower side of the diode lead contacts the arc-shaped guide surface and slides along the arc-shaped guide surface. Under the guidance of the arc-shaped guide surface, the lower side of the diode lead bends downward, turning the diode lead with an excessively large bending angle into a diode lead with a smaller bending angle, thereby initially straightening the diode lead and reducing the size of the diode lead to facilitate its entry into the gap between adjacent positioning plates 351. If the diode lead bends towards the direction of the first positioning seat 34 and the second positioning seat 35, the diode lead is straightened under the pressure of the first positioning seat 34 and the second positioning seat 35. The position of the gap between adjacent positioning plates 351 away from the first positioning seat 34 is adapted to the shape of the diode lead cross-section, so that the diode lead fits tightly with the gap between adjacent positioning plates 351 during the straightening process, thereby improving the straightening effect of the first positioning seat 34 and the second positioning seat 35 on the diode lead.

[0028] The drive assembly includes a bidirectional electric slide 31 fixedly connected to the upper side of the base 1. The bidirectional electric slide 31 is existing technology and will not be improved upon in this solution; therefore, it will not be described here. Two movable seats 32 are slidably connected to the bidirectional electric slide 31. The bidirectional electric slide 31 drives the two movable seats 32 to move towards or away from each other. A mounting bracket 33 is fixedly connected to the upper side of each movable seat 32. A first positioning seat 34 and a second positioning seat 35 are respectively fixedly connected to the top of the two mounting brackets 33 on the side closest to each other. During movement, the movable seat 32 drives the mounting bracket 33 to move, causing it to move the first positioning seat 34 and the second positioning seat 35. Moving towards or away from each other, to determine whether the diode has moved between the first positioning seat 34 and the second positioning seat 35, an infrared sensor is installed on the upper side of the bidirectional electric slide 31 at a position corresponding to the first positioning seat 34 and the second positioning seat 35. The infrared sensor is existing technology and will not be improved in this solution, so it will not be described here. The infrared sensor is used to detect whether the diode has moved between the first positioning seat 34 and the second positioning seat 35. When the infrared sensor detects the position of the diode, it transmits the information to the controller of the diode pin bending and cutting device. Under the control of the controller, the bidirectional electric slide 31 is made to work.

[0029] When using this device:

[0030] In the initial state, the first positioning seat 34 and the second positioning seat 35 are located far apart from each other. During the diode pin cutting and forming process, the diode is transported to the position corresponding to the positioning mechanism 3 by the conveying mechanism.

[0031] When the diode pin moves between the first positioning seat 34 and the second positioning seat 35, the gap between the adjacent positioning plates 351 corresponds to the position of the diode pin. Then, the bidirectional electric slide 31 drives the two moving seats 32 and the mounting bracket 33 to move, causing the first positioning seat 34 and the second positioning seat 35 to move towards the diode pin.

[0032] During the movement of the first positioning seat 34 and the second positioning seat 35, the first positioning seat 34 and the elastic sponge pad push the upper side of the diode pin into the space between adjacent guide tips. As the first positioning seat 34 and the second positioning seat 35 continue to move, the lower side of the diode pin contacts and slides with the arc-shaped guide surface. Under the guidance of the arc-shaped guide surface, the lower side of the diode pin bends downward and enters the space between adjacent positioning plates 351. Under the synergistic action of the adjacent positioning plates 351, the first positioning seat 34 and the second positioning seat 35, the diode pin is wrapped and squeezed in all directions, thereby straightening the bent diode pin.

[0033] After the diode pins are straightened, the bidirectional electric slide 31 drives the two moving seats 32 and the mounting bracket 33 to move, causing the first positioning seat 34 and the second positioning seat 35 to move away from the diode pins. The conveying mechanism then transports the diode to the bending and cutting mechanism 2 at the position where the diode pins are cut and shaped, so that the diode pins are cut and shaped.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A diode lead bending and cutting device, comprising a base (1), wherein a bending and cutting mechanism (2) is provided on the upper side of the base (1), the bending and cutting mechanism (2) being used to cut and bend the diode lead, characterized in that: The upper side of the base (1) is provided with a positioning mechanism (3), which is located on one side of the bending and cutting mechanism (2). The positioning mechanism (3) straightens the bent diode pin. The positioning mechanism (3) includes a driving component, a first positioning seat (34) and a second positioning seat (35). The driving component is located on the upper side of the base (1). The driving component drives the first positioning seat (34) and the second positioning seat (35) to move towards each other or away from each other. When the diode pin moves between the first positioning seat (34) and the second positioning seat (35), the driving component drives the first positioning seat (34) and the second positioning seat (35) to move towards the diode pin so that it straightens the bent diode pin.

2. The diode lead bending and cutting device according to claim 1, characterized in that: The first positioning seat (34) has several positioning grooves (341) on the side near the second positioning seat (35), and several elastic sponge pads are fixedly connected to the side of the first positioning seat (34) near the second positioning seat (35).

3. The diode lead bending and cutting device according to claim 2, characterized in that: The second positioning seat (35) has several positioning plates (351) fixedly connected to the side of the first positioning seat (34) near the second positioning seat (35), and the number and shape of the positioning plates (351) match the positioning grooves (341).

4. The diode lead bending and cutting device according to claim 3, characterized in that: The side of the adjacent positioning plates (351) that is close to each other is the positioning slope (352). The distance between the adjacent positioning plates (351) that are close to the first positioning seat (34) is greater than the distance between them that are far away from the first positioning seat (34). The gap between the adjacent positioning plates (351) that is far away from the first positioning seat (34) is adapted to the shape of the diode pin cross-section.

5. The diode lead bending and cutting device according to claim 3, characterized in that: The top of the positioning plate (351) near the first positioning seat (34) is a guide tip, and the bottom of the guide tip is an arc-shaped guide surface.

6. The diode lead bending and cutting device according to claim 1, characterized in that: The drive assembly includes a bidirectional electric slide (31) fixedly connected to the upper side of the base (1). Two movable seats (32) are slidably connected on the bidirectional electric slide (31). The bidirectional electric slide (31) drives the two movable seats (32) to move toward each other or away from each other. A mounting bracket (33) is fixedly connected to the upper side of the movable seat (32). The first positioning seat (34) and the second positioning seat (35) are respectively fixedly connected to the top of the two mounting brackets (33) on the side close to each other.

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