A low temperature soldering apparatus for semiconductor chips

Abstract

The utility model relates to welding device technical field especially for a kind of low-temperature welding device of semiconductor chip, including welding torch and tin pipe, tin pipe one end spiral connection has tin outlet, tin outlet includes screw thread, screw thread inner side is fixedly connected with inner tube subassembly by the way of adhesion, screw thread lower end fixedly connected with connecting pipe subassembly, connecting pipe subassembly lower end fixedly connected with tin nozzle, tin nozzle inner side is adhesively fixed with air bag, air bag inner side is provided with reset spring, air bag lower end fixedly connected with cleaning component, inner tube subassembly includes guide tube, guide tube is fixedly connected with fixed disc and is perforated, square hole is set up in guide tube outer side, connecting pipe subassembly includes sealing disc, in the utility model, after the completion of device welding, the excess solder around welding point can be removed by negative pressure adsorption, so that the shape of welding point is more regular, eliminates the hidden danger of continuous tin, avoids the formation of electrical connection between adjacent pads or pin.

Description

Technical Field

[0001] This utility model relates to the field of welding equipment technology, specifically a low-temperature welding device for semiconductor chips. Background Technology

[0002] Welding equipment is a device used to weld metals or other materials. It typically uses heat sources (electric arc, laser, electron beam, etc.) or pressure to locally melt or plastically deform the material, achieving interatomic bonding. From giant steel structures to microelectronic packaging, welding equipment has brought more possibilities to material processing and manufacturing. When welding semiconductor chips, the welding equipment must ensure that the solder completely melts and falls onto the welding point to ensure that the welding point has good electrical connection and mechanical strength, thereby guaranteeing the chip's stable performance, accurate signal transmission, product reliability and durability. However, during the soldering process, semiconductor chip soldering equipment requires increasing the soldering temperature to ensure complete melting of the solder. Excessive peak temperature can cause the solder to become too fluid, resulting in too small gaps between some solder joints. This can easily lead to solder bridging, which can cause short circuits in the semiconductor chip circuitry. This can cause interference between signal channels that should be operating independently, affecting the functionality of the entire electronic device. Therefore, a low-temperature soldering device for semiconductor chips is proposed to address the above problems. Utility Model Content

[0003] The purpose of this invention is to provide a low-temperature soldering device for semiconductor chips, in order to completely melt the solder during the soldering process. However, excessively high peak temperatures can cause the solder to become too fluid, resulting in small gaps between some solder joints and easy solder bridging. Solder bridging can lead to short circuits in the semiconductor chip circuitry, causing interference between signal channels that should be working independently, thus affecting the functionality of the entire electronic device.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A low-temperature soldering apparatus for semiconductor chips includes a soldering torch and a solder feeding tube. One end of the solder feeding tube is spirally connected to a solder outlet, which includes a threaded screw connector. An inner tube assembly is fixedly connected to the inner side of the threaded screw connector by adhesive bonding. A connecting tube assembly is fixedly connected to the lower end of the threaded screw connector. A solder outlet nozzle is fixedly connected to the lower end of the connecting tube assembly. An air bladder is adhesively fixed to the inner side of the solder outlet nozzle. A return spring is provided inside the air bladder. A cleaning assembly is fixedly connected to the lower end of the air bladder. The inner tube assembly includes a guide tube, through which a fixed plate is fixedly connected. A square hole is opened on the outer side of the guide tube. The connecting tube assembly includes a sealing plate, with a connecting spring fixedly connected to the upper end of the sealing plate and a corrugated pipe fixedly connected to the lower end of the sealing plate. The cleaning assembly includes a stainless steel connector, with a vent hole opened on the outer side of the stainless steel connector. A toothed ring is fixedly connected to the lower end of the stainless steel connector.

[0005] As a further optimization of this utility model, the threaded screw connector, the connecting pipe assembly, and the solder outlet nozzle are on the same axis, the inner tube assembly is simultaneously located in the threaded screw connector, the connecting pipe assembly, and the solder outlet nozzle, and the airbag is disposed inside the solder outlet nozzle with the outer side of the airbag in close contact with the inner side of the solder outlet nozzle.

[0006] As a further optimization of this utility model, the central axis of the reset spring and the central axis of the airbag are on the same straight line, the reset spring is completely surrounded inside the airbag and located above the bottom end of the solder nozzle, and the inner side of the airbag is connected to the inner side of the cleaning assembly.

[0007] As a further optimization of this utility model, the outer side of the fixed plate is in close contact with the inner side of the threaded tube, and a number of square holes are provided. The multiple square holes are evenly and equidistantly distributed in a ring array on the outer side of the guide tube, and the square holes are located below the fixed plate.

[0008] As a further optimization of this utility model, the sealing disc has a hole with the same diameter as the outer side of the guide tube, the sealing disc is located above the square hole, the upper end of the connecting spring is fixedly connected to a threaded screw tube, and the lower end of the bellows is fixedly connected to a solder outlet nozzle.

[0009] As a further optimization of this utility model, the inner side of the stainless steel joint is fitted with the outer side of the guide tube, a portion of the guide tube is exposed at the lower end of the stainless steel joint, and the central axis of the guide tube and the central axis of the toothed ring are on the same straight line.

[0010] As a further optimization of this utility model, the stainless steel connector has a cavity on its inner side, is located below the solder outlet, has an arc-shaped outer side, and has several vent holes.

[0011] Compared with the prior art, the beneficial effects of this utility model are: In this invention, the device, through the provided solder outlet, can remove excess solder around the solder joint by negative pressure adsorption after soldering, making the shape of the solder joint more regular, eliminating the risk of solder bridging, and preventing electrical connections between adjacent pads or pins. In addition, when no consumables are placed in the guide tube, pulling the connecting tube assembly back and forth can use the cleaning component to clean the solder adhering to the outside of the guide tube, while airflow blows out impurities inside the guide tube. This convenient cleaning method reduces the cleaning time and workload before soldering, further improving soldering efficiency. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the tin outlet structure of this utility model; Figure 3 This is a schematic diagram of the cross-sectional structure of the tin outlet of this utility model; Figure 4 This is a schematic diagram of the installation position of the reset spring of this utility model; Figure 5 This is a schematic diagram of the inner tube assembly structure of this utility model; Figure 6 This is a cross-sectional structural diagram of the connecting pipe assembly of this utility model; Figure 7 This is a cross-sectional structural diagram of the cleaning component of this utility model.

[0013] In the diagram: 1. Soldering torch; 2. Solder feed tube; 3. Solder outlet; 31. Threaded screw connector; 32. Inner tube assembly; 321. Guide tube; 322. Fixing plate; 323. Square hole; 33. Connecting pipe assembly; 331. Sealing disc; 332. Connecting spring; 333. Bellows; 34. Solder nozzle; 35. Airbag; 36. Return spring; 37. Cleaning components; 371. Stainless steel connector; 372. Vent hole; 373. Toothed ring. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0016] Please see Figure 1-7 This utility model provides a technical solution: A low-temperature soldering apparatus for semiconductor chips includes a soldering torch 1 and a solder feeding tube 2. One end of the solder feeding tube 2 is spirally connected to a solder outlet 3. The solder outlet 3 includes a threaded screw-in tube 31. An inner tube assembly 32 is fixedly connected to the inner side of the threaded screw-in tube 31 by adhesive bonding. A connecting tube assembly 33 is fixedly connected to the lower end of the threaded screw-in tube 31. A solder outlet nozzle 34 is fixedly connected to the lower end of the connecting tube assembly 33. An air bladder 35 is adhesively fixed to the inner side of the solder outlet nozzle 34. A return spring 36 is provided inside the air bladder 35. A cleaning device is fixedly connected to the lower end of the air bladder 35. Component 37, inner tube component 32 includes guide tube 321, guide tube 321 is fixedly connected to fixed plate 322, guide tube 321 has a square hole 323 on the outside, connecting tube component 33 includes sealing plate 331, connecting spring 332 is fixedly connected to the upper end of sealing plate 331, corrugated pipe 333 is fixedly connected to the lower end of sealing plate 331, cleaning component 37 includes stainless steel joint 371, vent hole 372 is opened on the outside of stainless steel joint 371, toothed ring 373 is fixedly connected to the lower end of stainless steel joint 371.

[0017] As a further implementation of this solution, the threaded screw pipe 31, the connecting pipe assembly 33, and the solder outlet 34 are on the same axis. The inner pipe assembly 32 is simultaneously located in the threaded screw pipe 31, the connecting pipe assembly 33, and the solder outlet 34. The airbag 35 is located inside the solder outlet 34, and the outer side of the airbag 35 is in close contact with the inner side of the solder outlet 34. The coaxial arrangement of the threaded screw pipe 31, the connecting pipe assembly 33, and the solder outlet 34 makes the structural connection between them more stable. The close contact between the outer side of the airbag 35 and the inner side of the solder outlet 34 can prevent the airbag 35 from sliding out of the solder outlet 34 when it is squeezed. At the same time, the restriction of the solder outlet 34 also fixes the exhaust direction of the airbag 35. As a further implementation of this solution, the central axis of the return spring 36 and the central axis of the airbag 35 are on the same straight line. The return spring 36 is completely surrounded inside the airbag 35 and located above the bottom end of the solder nozzle 34. The inner side of the airbag 35 is connected to the inner side of the cleaning component 37. The setting of the return spring 36 can make the airbag 35 deform more slowly when it is squeezed, and recover its deformation more quickly. The design of the inner side of the airbag 35 being connected to the inner side of the cleaning component 37 can discharge the air inside the airbag 35 through the cleaning component 37, or draw air from the inner side of the cleaning component 37 when the airbag 35 recovers its deformation. As a further implementation of this solution, the outer side of the fixed plate 322 is in close contact with the inner side of the threaded screw tube 31. Several square holes 323 are provided, and the multiple square holes 323 are evenly and equidistantly distributed in a ring array on the outer side of the guide tube 321. The square holes 323 are located below the fixed plate 322. The close contact between the outer side of the fixed plate 322 and the inner side of the threaded screw tube 31 can prevent the guide tube 321, which is fixedly connected to the fixed plate 322, from shaking, and play a role in protecting the welding material inside the guide tube 321. The setting of multiple square holes 323 allows air to enter the guide tube 321 better through the square holes 323, which has a better effect when cleaning the guide tube 321 by blowing air in the future. As a further implementation of this solution, the inner side of the sealing disc 331 is provided with a hole of the same diameter as the outer side of the guide tube 321. The sealing disc 331 is located above the square hole 323. The upper end of the connecting spring 332 is fixedly connected to the threaded screw tube 31, and the lower end of the bellows 333 is fixedly connected to the solder outlet 34. The fact that the inner side of the sealing disc 331 is provided with a hole of the same diameter as the outer side of the guide tube 321 can ensure that when the sealing disc 331 slides up and down on the outer side of the guide tube 321, air will not flow out from the gap between the two, thus ensuring the sealing between the components. The setting of the connecting spring 332 allows the sealing disc 331 to be buffered to a certain extent when it moves, preventing it from being displaced excessively. As a further implementation of this solution, the inner side of the stainless steel connector 371 is fitted to the outer side of the guide tube 321, and a portion of the guide tube 321 is exposed at the lower end of the stainless steel connector 371. The central axis of the guide tube 321 and the central axis of the toothed ring 373 are on the same straight line. A cavity is provided on the inner side of the stainless steel connector 371. The stainless steel connector 371 is located below the solder nozzle 34. The outer side of the stainless steel connector 371 is arc-shaped, and several vent holes 372 are provided. The fact that a portion of the guide tube 321 is exposed at the lower end of the stainless steel connector 371 can prevent insufficient solder from protruding during welding. The design of the inner side of the stainless steel connector 371 fitting to the outer side of the guide tube 321 can enhance the stability of the guide tube 321. The vent holes 372 and the cavity on the inner side of the stainless steel connector 371 allow air to be delivered from the stainless steel connector 371 to the air bag 35.

[0018] Working process: During use, by rotating the solder outlet 3, a spiral connection is formed and fixed between the threaded screw connector 31 and the solder delivery tube 2. Then, the solder wire is fed into the guide tube 321 through the solder delivery tube 2. When the solder wire enters the guide tube 321 and exits from the other end, the soldering gun 1 can be activated to melt the semiconductor chip. When the solder wire melts into a liquid state, the outer side of the stainless steel connector 371 can be brought into contact with the chip, and the solder delivery tube 2 is gently pressed, causing the solder delivery tube 2 to move the solder outlet 3. The connecting tube assembly 33 is subjected to the force of the threaded screw connector 31 fixed at the upper end, and at the same time, it is subjected to the force of the cleaning component. The force applied to the bellows 333 by the solder nozzle 34 causes deformation. When the bellows 333 deforms, the sealing disc 331 compresses the air inside the bellows 333 and the solder nozzle 34, causing the airbag 35 to deform under air pressure. The deformation of the airbag 35 also causes the return spring 36 inside it to deform. Due to the setting of the return spring 36, the deformation of the airbag 35 is buffered, so that the exhaust speed through the connected cleaning component 37 is not too fast. In addition, the setting of multiple vent holes 372 disperses the air flowing out of the stainless steel connector 371, so as not to damage the solder joint. The liquid solder has too much of an impact. When the solder delivery tube 2 is no longer pressed, the bellows 333 will quickly return to its original position. The air bladder 35 will no longer be compressed by the air inside the solder outlet 34 and will quickly return to its original position under the elastic force of the return spring 36. At this time, a negative pressure is formed inside the air bladder 35, and air is drawn in through the vent 372 on the outside of the stainless steel connector 371. Since some liquid solder will adhere to the outer surface of the stainless steel connector 371 when it contacts the chip, the arc-shaped design on the outside of the stainless steel connector 371 can increase the adhesion of the liquid solder to its surface. When the vent 372 draws in air, it will remove excess liquid solder. The liquid solder is sucked away, thus avoiding excessive solder bridging. When no consumables are placed in the guide tube 321, the connecting tube assembly 33 is pulled back and forth, causing the relative position of the cleaning assembly 37 and the inner tube assembly 32 to change. The toothed ring 373 will slide on the outside of the guide tube 321, scraping off the solder adhering to the outside of the guide tube 321, thus avoiding excessive solder melting during the next soldering. At the same time, the guide tube 321 moves up and down, causing some air in the solder outlet 34 to enter the guide tube 321 through the square hole 323, blowing out excess impurities in the guide tube 321 and ensuring the cleanliness of the device.

[0019] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A low-temperature soldering apparatus for semiconductor chips, comprising a soldering torch (1) and a solder feeding tube (2), characterized in that: One end of the solder feeding tube (2) is spirally connected to a solder outlet (3); The solder outlet (3) includes a threaded screw tube (31), an inner tube assembly (32) is fixedly connected to the inner side of the threaded screw tube (31) by adhesive bonding, a connecting tube assembly (33) is fixedly connected to the lower end of the threaded screw tube (31), a solder outlet nozzle (34) is fixedly connected to the lower end of the connecting tube assembly (33), an air bag (35) is adhesively fixed to the inner side of the solder outlet nozzle (34), a return spring (36) is provided inside the air bag (35), and a cleaning assembly (37) is fixedly connected to the lower end of the air bag (35). The inner tube assembly (32) includes a guide tube (321), which is fixedly connected to a fixed plate (322) through the guide tube (321), and a square hole (323) is provided on the outer side of the guide tube (321). The connecting pipe assembly (33) includes a sealing disc (331), a connecting spring (332) is fixedly connected to the upper end of the sealing disc (331), and a bellows (333) is fixedly connected to the lower end of the sealing disc (331). The cleaning component (37) includes a stainless steel connector (371), with a vent hole (372) on the outside of the stainless steel connector (371), and a toothed ring (373) fixedly connected to the lower end of the stainless steel connector (371).

2. The low-temperature welding apparatus for semiconductor chips according to claim 1, characterized in that: The threaded screw connector (31), the connecting pipe assembly (33) and the solder outlet (34) are on the same axis. The inner tube assembly (32) is simultaneously located in the threaded screw connector (31), the connecting pipe assembly (33) and the solder outlet (34). The air bladder (35) is located inside the solder outlet (34) and the outer side of the air bladder (35) is in close contact with the inner side of the solder outlet (34).

3. The low-temperature welding apparatus for semiconductor chips according to claim 1, characterized in that: The central axis of the reset spring (36) is on the same straight line as the central axis of the airbag (35). The reset spring (36) is completely surrounded inside the airbag (35) and located above the bottom end of the solder nozzle (34). The inner side of the airbag (35) is connected to the inner side of the cleaning assembly (37).

4. The low-temperature welding apparatus for semiconductor chips according to claim 1, characterized in that: The outer side of the fixed plate (322) is in close contact with the inner side of the threaded tube (31). Several square holes (323) are provided. The multiple square holes (323) are evenly and equidistantly distributed in a ring array on the outer side of the guide tube (321). The square holes (323) are located below the fixed plate (322).

5. The low-temperature welding apparatus for semiconductor chips according to claim 1, characterized in that: The sealing disc (331) has a hole with the same diameter as the outer side of the guide tube (321) on its inner side. The sealing disc (331) is located above the square hole (323). The upper end of the connecting spring (332) is fixedly connected to a threaded screw tube (31), and the lower end of the bellows (333) is fixedly connected to a solder outlet nozzle (34).

6. The low-temperature welding apparatus for semiconductor chips according to claim 1, characterized in that: The inner side of the stainless steel connector (371) is fitted to the outer side of the guide tube (321), and a portion of the guide tube (321) is exposed at the lower end of the stainless steel connector (371). The central axis of the guide tube (321) and the central axis of the toothed ring (373) are on the same straight line.

7. The low-temperature welding apparatus for semiconductor chips according to claim 1, characterized in that: The stainless steel connector (371) has a cavity on its inner side. The stainless steel connector (371) is located below the solder outlet (34). The outer side of the stainless steel connector (371) is arc-shaped. Several vent holes (372) are provided.

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