A soldering device for common mode inductor production

CN224779543UActive Publication Date: 2026-09-22SHENZHEN MAOXING HENGYE TECH CO LTD
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Patent Information

Application Number
CN202521978371.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-15
Publication Date
2026-09-22
Estimated Expiration
2035-09-15

AI Technical Summary

Technical Problem

[0005]为了克服能耗巨大和热惯性大的缺点,本实用新型提供一种共模电感生产用的焊锡设备,旨在解决上述缺点

Benefits of technology

1、通过喷锡管、加压器与微型储锡盒的配合,仅需对电感引脚局部定向喷射熔融锡液,使锡液需求量减少,配合加热板仅需维持微型储锡盒内少量锡液的熔融状态,降低热能消耗,同时大幅减少焊锡材料氧化损耗,达到显著节能降耗、降低生产成本的核心目的。

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Abstract

This utility model relates to the field of electronic component manufacturing technology, and in particular to a soldering device for common mode inductor production. The device includes a base with drive units mounted at both ends. Each drive unit has a set of rotating shafts, and each set of rotating shafts is fitted with a conveyor belt. The conveyor belt is connected to several limiting plates. The drive units are equipped with extrusion components to provide adaptive clamping force. A solder storage box is connected to the center of the base, and a pressure device is mounted on the box. The outlet of the pressure device is connected to a solder spraying tube. Through the cooperation of the solder spraying tube, pressure device, and miniature solder storage box, molten solder is only sprayed locally and directionally onto the inductor leads. With the heating plate, only a small amount of molten solder in the miniature storage box needs to be kept in a molten state, reducing heat consumption and significantly reducing solder material oxidation loss. This achieves the core objectives of significant energy saving, consumption reduction, and lower production costs.
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Description

Technical Field

[0001] This utility model relates to the field of electronic component manufacturing technology, and in particular to a soldering equipment for producing common mode inductors. Background Technology

[0002] Common-mode inductors, as key passive components in electronic circuits, are widely used in power supply filtering, electromagnetic compatibility, and other fields. Their core function is to suppress common-mode noise in circuits. During the manufacturing process of electronic devices, common-mode inductors need to be soldered and fixed onto printed circuit boards. The basic medium for achieving reliable electrical connection and mechanical fixation is solder, which, after melting, wets the metal leads of the inductor and the pads on the PCB, forming stable solder joints after cooling.

[0003] In existing mature common-mode inductor manufacturing processes, the inductor leads are typically pre-tinned before final circuit board assembly and soldering. This step is crucial: by immersing the inductor leads in molten solder, an appropriate amount of solder adheres to and coats the lead surface. Through precisely controlled process parameters, the amount of solder suspended on the leads is designed to be just right. After this treatment, in subsequent circuit board soldering processes, the pre-stored solder on the leads remelts and bonds with the pads, eliminating the need for additional solder and avoiding the need for specialized solder removal due to excess solder. This significantly improves production efficiency and the consistency of solder joint quality.

[0004] However, the widely used pre-tinning process for inductor leads has a significant drawback: it relies on immersing the inductor leads in a large solder bath to maintain their molten state. To ensure the solder remains liquid and has good fluidity and wettability, a large amount of solder needs to be continuously heated and maintained at a temperature far above its melting point. The thermal energy required to maintain such a large amount of molten metal is enormous, leading not only to high energy costs but also to slow equipment heating, high thermal inertia, and sluggish temperature control response. Furthermore, the high-temperature environment accelerates solder oxidation and flux volatilization. Utility Model Content

[0005] To overcome the drawbacks of high energy consumption and large thermal inertia, this invention provides a soldering device for common mode inductor production, aiming to solve the above-mentioned shortcomings.

[0006] A soldering device for common mode inductor production includes a base, with drive units mounted on the left and right ends of the base. Each drive unit is equipped with a set of rotating shafts, and each set of rotating shafts is fitted with a conveyor belt. The conveyor belt is connected to several limiting plates. The rear end of the base is the feeding end, and the front end is the discharging end. The drive units are equipped with extrusion components for providing adaptive clamping force. A solder storage box is connected to the middle of the base, and a pressure device is mounted on the solder storage box. The outlet of the pressure device is connected to a solder spraying tube, which extends from the left and right ends toward the middle.

[0007] In a preferred embodiment of the present invention, the extrusion assembly includes an extrusion roller, the driving device is slidably connected to a plurality of sliding rods, the ends of the sliding rods are rotatably connected to the extrusion roller, and a spring is sleeved on the sliding rod, one end of the spring being connected to the sliding rod and the other end being connected to the driving device.

[0008] In a preferred embodiment of this utility model, a heating plate is installed on the tin storage box.

[0009] In a preferred embodiment of this utility model, a guide rail is connected to the base, and the guide rail is located at the feed end of the base.

[0010] In a preferred embodiment of this utility model, a plurality of adjustable feet are installed at the bottom of the base.

[0011] In a preferred embodiment of this utility model, the limiting plate is provided with a curved groove facing the discharge end, and the guide rail is provided with a long and narrow groove in the front-to-back direction.

[0012] Compared with the prior art, the present invention has the following advantages: 1. By combining the solder spray tube, pressure device and miniature solder storage box, molten solder is sprayed locally and directionally onto the inductor pins, reducing the amount of solder required. With the heating plate, only a small amount of molten solder needs to be kept in the miniature solder storage box, reducing heat consumption and significantly reducing the oxidation loss of solder material, thus achieving the core purpose of significant energy saving, consumption reduction and production cost reduction.

[0013] 2. By combining a miniature tin storage box with a precise temperature-controlled heating plate, the volume of molten tin that needs to be continuously melted at high temperatures is compressed to an extremely small scale, which drastically reduces the system's heat capacity. The heating plate can complete the melting of molten tin and temperature stabilization within minutes, achieving minimal thermal inertia. The equipment can be started and stopped flexibly and the temperature response is sensitive, ultimately solving the pain points of slow heating, delayed temperature control, and high energy consumption for heat preservation in traditional processes. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 2 This is a three-dimensional structural diagram of the solder storage box and solder spray tube of this utility model.

[0016] Figure 3 This is a three-dimensional structural diagram of the limiting plate, pressure device, and rotating shaft of this utility model.

[0017] The above-mentioned figures include the following reference numerals: 1. base, 2. drive device, 3. rotating shaft, 4. conveyor belt, 5. limiting plate, 6. extrusion roller, 7. spring, 8. sliding rod, 9. solder storage box, 10. pressure device, 11. solder spray tube, 12. heating plate, 13. guide rail, 14. adjusting foot. Detailed Implementation

[0018] Although this invention may be described with respect to a particular application or industry, those skilled in the art will recognize its broader applicability. Those skilled in the art will understand that terms such as "above," "below," "upward," "downward," etc., are used to describe the drawings and not to indicate a limitation on the scope of the invention as defined by the appended claims. Any numerical designations such as "first" or "second" are merely illustrative and not intended to limit the scope of the invention in any way.

[0019] Example: A soldering device for common mode inductor production, such as... Figures 1-3 As shown, the system includes a base 1, a drive unit 2, a rotating shaft 3, a conveyor belt 4, a limiting plate 5, an extrusion assembly, a solder storage box 9, a pressure device 10, a solder spraying tube 11, and a pressure assembly. Drive units 2 are mounted on the left and right ends of the base 1, and each drive unit 2 is equipped with a set of rotating shafts 3. The left and right drive units 2 drive the connected rotating shafts 3 to rotate in opposite directions. Each set of rotating shafts 3 is fitted with a conveyor belt 4, which is connected to several limiting plates 5. The limiting plates 5 have curved grooves facing the discharge end. The rear end of the base 1 is the inlet end. The front end is the discharge end. The drive device 2 is equipped with an extrusion component for providing adaptive clamping force. The base 1 is connected to a solder storage box 9 in the middle. A pressure device 10 is installed on the solder storage box 9. The outlet of the pressure device 10 is connected to a solder spraying pipe 11. The solder spraying pipe 11 is directed from the left and right ends toward the middle. The pressure device 10 on the solder storage box 9 sprays the molten solder onto the inductor pins that are conveyed by the conveyor belt 4 to the top of the solder storage box 9 through the solder spraying pipe 11. This realizes the automatic delivery, precise positioning and localized and directional solder spraying of the inductor, replacing the traditional large solder pot that immerses the entire pin.

[0020] like Figure 1 and Figure 2As shown, the extrusion assembly includes an extrusion roller 6, a spring 7, and a sliding rod 8. Several sliding rods 8 are slidably connected to the drive device 2. The ends of the sliding rods 8 are rotatably connected to the extrusion rollers 6. Springs 7 are fitted onto the sliding rods 8, with one end connected to the sliding rod 8 and the other end connected to the drive device 2. When clamping inductors of different sizes, the inductors extrude outwards against the conveyor belt 4. The conveyor belt 4 transmits force to the extrusion rollers 6, which are rotatably connected inwards. The extrusion rollers 6 push the connected sliding rods 8 to overcome the resistance of the springs 7, causing them to slide and retract inwards into the drive device 2. The compressed springs 7 generate a counterforce, constantly pressing the limiting plate 5 against the inductor housing through the extrusion rollers 6 and the conveyor belt 4. Adapting to common-mode inductors of different sizes, the springs 7 ensure a stable clamping force.

[0021] like Figure 2 and Figure 3 As shown, it also includes a heating plate 12. The heating plate 12 is installed on the solder storage box 9 to maintain the molten state of the solder in the solder storage box 9, and crucially ensures that the solder remains liquid and has good fluidity throughout the entire path of being transported to the spray point through the pressurizer 10 and the solder spray pipe 11.

[0022] like Figure 1 and Figure 2 As shown, it also includes a guide rail 13. The base 1 is connected to the guide rail 13, which is located at the feed end of the base 1. The guide rail 13 has a long and narrow groove in the front-to-back direction. The groove ensures that the inductor pins are in the front-to-back direction, avoids adjacent pins from blocking each other when spraying solder from left to right, and ensures that the solder can evenly cover all pins, thus improving the soldering quality.

[0023] like Figure 1 and Figure 2 As shown, it also includes adjustable feet 14. Several adjustable feet 14 are installed at the bottom of the base 1 to compensate for the unevenness of the ground on which the equipment is placed. By adjusting the height of each foot, the entire base 1 is kept level.

[0024] The common-mode inductor to be soldered enters the guide rail 13 from the feed end. The groove design in the middle of the guide rail 13 guides and constrains the inductor, ensuring that its pins always maintain the front-to-back orientation and are neatly arranged. Under subsequent power drive, the inductor is stably transported into the equipment along the groove of the guide rail 13.

[0025] When the inductor is conveyed to the predetermined position at the front end of the guide rail 13, the drive devices 2 on both sides are activated, driving the rotating shaft 3 on them to move the conveyor belts 4 on both sides synchronously toward the center of the equipment. The limiting plates 5 installed on the outer side of the conveyor belts 4 then approach the sides of the inductor housing. As the conveyor belts 4 continue to move, the limiting plates 5 on both sides work together to effectively "push" and clamp the inductor housing. At this time, the movement of the conveyor belts 4 is transformed into an active clamping and conveying force on the inductor, stably lifting the inductor from the front end of the guide rail 13 and continuing to convey it forward.

[0026] During the clamping and conveying process, if a large inductor is encountered, its housing exerts an outward squeezing force on the conveyor belts 4 and limiting plates 5 on both sides. This squeezing force is transmitted through the conveyor belts 4 to the squeezing rollers 6 rotatably connected to the inner side. The squeezing rollers 6 transmit the force to the sliding rods 8 connected to them, causing the sliding rods 8 to overcome the elastic force of the springs 7 and slide into the drive unit 2. The compressed springs 7 generate a counterforce, and through the squeezing rollers 6, the conveyor belts 4 and limiting plates 5 are always tightly pressed against the inductor housing, ensuring a stable and reliable clamping force for inductors of different sizes and achieving adaptive adjustment.

[0027] The inductor, held and conveyed by conveyor belt 4 and limiting plate 5, moves to the area directly above the solder reservoir 9. The pressurizer 10 activates, drawing molten solder from the reservoir 9 and precisely spraying it out through the solder spray nozzles 11 on both sides, pointing towards the center. The heating plate 12 mounted on the reservoir 9 continuously operates, ensuring that the reservoir 9 and the molten solder flowing through the spray nozzles 11 remain in a molten state. The sprayed molten solder directly covers and wets the vertically downward-pointing inductor leads. Under precise control, the lead surfaces are coated with just the amount of molten solder required for subsequent soldering. Excess molten solder not adhering to the leads drips directly back into the reservoir 9 below under gravity, achieving solder recycling.

[0028] After the soldering process is complete, the conveyor belt 4 and the limiting plate 5 continue to transport the inductor forward, moving it away from the clamping area of ​​the drive unit 2 and above the solder storage box 9. At this point, the molten solder adhering to the pins is exposed to room temperature air, causing the temperature to drop rapidly and achieving "rapid solidification," forming a solid pre-soldered layer on the pin surface. The solidified inductor is then conveyed to the discharge end, where it is received by the operator or subsequent automated equipment. At this point, the inductor pins are evenly coated with an appropriate amount of solder, fully preparing them for the subsequent soldering process on the circuit board, eliminating the need for additional soldering or removal.

[0029] After the equipment is initially installed or moved, the operator rotates each adjusting foot 14 on the bottom of the base 1 to adjust its height individually. This operation effectively compensates for the effects of uneven ground, ensuring that the entire base 1 is in a stable horizontal state, providing a fundamental guarantee for the accuracy and consistency of the entire soldering process.

[0030] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, those skilled in the art can conceive of other specific embodiments of the present invention without creative effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. A soldering device for producing common mode inductors, characterized in that: The base (1) includes a base (1), on which drive devices (2) are installed at the left and right ends respectively. Each drive device (2) is equipped with a set of rotating shafts (3). Each set of rotating shafts (3) is fitted with a conveyor belt (4). The conveyor belt (4) is connected to several limiting plates (5). The rear end of the base (1) is the feeding end and the front end is the discharging end. The drive device (2) is equipped with an extrusion assembly for providing adaptive clamping force. A solder storage box (9) is connected to the middle of the base (1). A pressure device (10) is installed on the solder storage box (9). The outlet of the pressure device (10) is connected to a solder spraying tube (11). The solder spraying tubes (11) are respectively directed from the left and right ends toward the middle.

2. The soldering equipment for common mode inductor production as described in claim 1, characterized in that: The extrusion assembly includes an extrusion roller (6), and the driving device (2) is slidably connected to a plurality of sliding rods (8). The ends of the sliding rods (8) are rotatably connected to the extrusion roller (6). A spring (7) is sleeved on the sliding rods (8). One end of the spring (7) is connected to the sliding rod (8), and the other end is connected to the driving device (2).

3. The soldering equipment for common mode inductor production as described in claim 2, characterized in that: A heating plate (12) is installed on the tin storage box (9).

4. The soldering equipment for common mode inductor production as described in claim 3, characterized in that: A guide rail (13) is connected to the base (1), and the guide rail (13) is located at the feed end of the base (1).

5. The soldering equipment for common mode inductor production as described in claim 4, characterized in that: The base (1) has several adjustable feet (14) installed at its bottom.

6. The soldering equipment for common mode inductor production as described in claim 5, characterized in that: The limiting plate (5) is provided with a curved groove facing the discharge end, and the guide rail (13) has a long and narrow groove in the front and back direction.