A double-suction head dot painting tin device based on XZ-axis linear motor conveying

Abstract

The utility model relates to a kind of double-suction head point drawing tin device based on XZ axis linear motor handling, and load-bearing model is detachably installed on the top of mounting base by bolt, hollow frame is vertically fixedly installed on the top four corners surface of load-bearing model, hollow tube is vertically fixedly installed in each hollow frame inside middle end, limit stop is rotationally arranged on the four side surfaces of hollow frame outside, conversion mechanism is arranged in the inside of hollow frame, and conversion mechanism and limit stop are driving connection, the utility model can drive electronic chip to move vertically downwards, so that hollow frame and limit stop can be worn from the inner wall of electronic chip four-corner installation groove, and in the process of moving downwards in the inner wall of electronic chip, the bottom right angle edge of limit stop can be above electronic chip, under the sleeve limit effect of hollow frame, electronic chip can be clamped and resisted from horizontal and vertical direction, avoid electronic chip to affect processing quality by arbitrary side shift and swing in soldering process.

Description

Technical Field

[0001] This utility model relates to the field of dotting soldering technology, specifically a dual-head dotting soldering device based on XZ axis linear motor handling. Background Technology

[0002] As the electronics manufacturing industry rapidly develops towards high precision and miniaturization, traditional manual soldering processes are inefficient and inconsistent, making it difficult to meet the soldering needs of modern circuit boards, sensors, and other precision components. This is especially true in the fields of SMT (Surface Mount Technology) and microelectronic packaging, where the requirements for solder joint size, positional accuracy, and environmental friendliness are becoming increasingly stringent. Soldering dot application devices have emerged in this context. These devices integrate mechanical automation, intelligent temperature control, and visual positioning technologies. By precisely controlling solder material delivery and soldering parameters, they achieve stable formation of micron-level solder joints. This device not only significantly improves production efficiency and product yield but also aligns with the lead-free trend, becoming an important tool for promoting the intelligent and green transformation of electronics manufacturing.

[0003] In practical applications, when soldering electronic chips, XY-axis linear motors are used in conjunction with negative pressure suction cups to pick up the chips and move them to the soldering station surface for soldering. To prevent the chips from shifting during subsequent soldering, a limiting slot, tailored to the chip's size, is often used to position them. However, this design limits the chip's position to a horizontal direction only. This limited direction makes it easy for the chip to be vertically displaced from the slot during soldering, affecting the quality of the final soldering. Therefore, a new technical solution is needed to address this issue. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies, adapt to practical needs, and provide a dual-head soldering device based on XZ-axis linear motor handling. This addresses the current practice of using XY-axis linear motors with negative pressure suction cups to adsorb and move electronic chips to a soldering station surface during soldering. To prevent chip displacement during subsequent soldering, a limiting groove adapted to the chip size is often used. However, this design only allows horizontal positioning, which is too unidirectional and can easily lead to the chip being vertically dislodged from the groove by external forces during soldering, thus affecting the quality of the subsequent soldering process.

[0005] To achieve the purpose of this utility model, the technical solution adopted by this utility model is as follows: design a dual-head dotting tin device based on XZ axis linear motor handling, including a mounting base, a bearing mold body is detachably mounted on the top of the mounting base by bolts, hollow frames are vertically fixedly mounted on the four corner surfaces of the top of the bearing mold body, and a hollow tube is vertically fixedly mounted on the middle of the inner side of each hollow frame.

[0006] The hollow frame is provided with limit blocks on all four sides of its exterior. A conversion mechanism is provided inside the hollow frame, and the conversion mechanism and the limit blocks are connected in a transmission connection. A lifting mechanism is provided inside the hollow frame, and the lifting mechanism and the conversion mechanism are connected in a transmission connection.

[0007] The bottom of the mounting base is movably equipped with a pulling mechanism, and the pulling mechanism and the lifting mechanism are connected by a transmission.

[0008] Preferably, the mounting base is provided with first electric slide rails on both sides of the top. The outer sides of the two sets of first electric slide rails are respectively connected to a moving frame and a welding frame. The top of the inner side of the moving frame and the welding frame are provided with second electric slide rails. The outer side of each second electric slide rail is connected to a third electric slide rail. The outer sides of the two sets of third electric slide rails are connected to a fixed seat. The sides of the two sets of fixed seats are respectively provided with a fixed suction cup and a welding head.

[0009] Preferably, each of the four sides of the top of the hollow frame is provided with a movable groove, and each of the limiting blocks is fixedly installed with a connecting rod at both ends on the outside, and the side of the connecting rod is rotatably inserted into the movable groove through a bearing.

[0010] Preferably, the lifting mechanism includes a sliding sleeve, a hollow tube is vertically fixedly installed at the bottom center of the inner side of the hollow frame, the sliding sleeve is slidably sleeved at the top of the outer side of the hollow tube, a sliding plate is slidably installed inside each hollow tube, and a sliding block is fixedly installed at both ends of the outer side of each sliding plate, and the top of the side of the sliding block is fixedly connected to the inner side wall of the sliding sleeve.

[0011] Preferably, both ends of the hollow tube are provided with vertical guide grooves, and the sliding block is slidably installed inside the guide groove. Each hollow tube is movably sleeved with a return spring, and the two ends of the return spring are respectively movably attached to the bottom surface of the sliding sleeve and the bottom of the inner side of the hollow frame.

[0012] Preferably, the conversion mechanism includes a transmission rod, and a connecting block is fixedly installed on the outer side of each sliding sleeve and the bottom surface of the limiting block. The transmission rod is inclinedly hinged between the sides of every two sets of connecting blocks through a rotating shaft, and the transmission rod is movably disposed inside the movable groove.

[0013] Preferably, the pulling mechanism includes a fixed rod and a connecting frame. A fixed rod is vertically fixedly installed at the bottom center of each sliding plate, and the fixed rod is slidably installed inside the mounting base. The bottom outer side of the fixed rod is provided with a thread that matches the spiral direction of the inner wall of the limiting nut. The connecting frame is movably installed at the bottom of the mounting base, and the fixed rod is slidably installed inside the side end of the connecting frame. The bottom of each fixed rod is screwed with a limiting nut by a thread, and the limiting nut is movably installed on the bottom surface of the connecting frame.

[0014] Preferably, a mounting rod is vertically fixedly installed at the bottom center of the connecting frame, and a pull plate is fixedly installed at the bottom of the mounting rod.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] 1. This utility model features hollow frames at each of the four corners of the support mold surface, and right-angled triangular limiting blocks rotatably mounted on each of the four sides inside the hollow frames. When a fixed suction cup negatively presses and moves an electronic chip to the support mold surface, the continuous operation of the third electric slide rail causes the electronic chip to move vertically downwards. This allows the hollow frames and limiting blocks to pass through the inner walls of the mounting slots at the four corners of the electronic chip. During the downward movement of the electronic chip's inner wall, the inclined surface of the limiting blocks abuts against them, causing them to rotate relative to each other within the movable slot around the connecting rod. Combined with the hinge action of the rotating shaft, the two ends of the push rod can rotate relative to each other at the bottom of the limiting block and the outer wall of the sliding sleeve, respectively. This allows the push rod to move the limiting blocks... The rotational force is converted into a vertical pushing force on the sliding sleeve, which then moves vertically along the outer wall of the hollow tube. This causes the sliding sleeve to compress and deform the return spring fitted outside the hollow tube. After the electronic chip is fully fitted and placed below the limiting block, the electronic chip loses its pressure on the limiting block. Under the reverse pushing action of the return spring, the sliding sleeve is driven to return to its vertical position. Under the connecting transmission action of the push rod, the limiting block can rotate and return to its original position. This allows the bottom right-angled edge of the limiting block to be above the electronic chip. Combined with the fitting and limiting action of the hollow frame, the electronic chip can be clamped and abutted in both horizontal and vertical directions, preventing the electronic chip from arbitrarily shifting or shaking during the soldering process and affecting the processing quality.

[0017] 2. This utility model features vertically movable sliding plates inside the hollow tube, which are connected to the sliding sleeve via sliding blocks. The connecting frame and sliding plates are then connected by the tightening action of the fixing rod and the limiting nut, allowing the connecting frame to be pulled. This, in turn, drives the sliding plates and sliding sleeve to move vertically under the transmission action of the fixing rod and the limiting nut. Combined with the transmission conversion action of the transmission rod, this provides a corresponding pulling force to the limiting block, causing it to rotate and retract to the inner wall of the hollow frame, thus removing its resistance to the electronic chip. This allows the operator to easily separate the electronic chip from its four outer corners, enabling quick removal for subsequent processing and material replacement. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall top structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the overall structure of the bearing mold and pulling mechanism of this utility model;

[0020] Figure 3 This is a schematic diagram of the internal structure of the hollow frame of this utility model;

[0021] Figure 4 This is a front view cross-sectional structural diagram of the hollow tube of this utility model;

[0022] In the diagram: 1. Mounting base; 11. First electric slide rail; 12. Moving frame; 13. Welding frame; 14. Second electric slide rail; 15. Third electric slide rail; 16. Fixed seat; 17. Fixed suction cup; 18. Welding head; 2. Bearing mold body; 21. Hollow frame; 22. Movable groove; 23. Connecting rod; 24. Limiting block; 25. Hollow tube; 26. Sliding sleeve; 27. Connecting block; 28. Transmission rod; 29. ​​Return spring; 3. Fixed rod; 31. Sliding plate; 32. Sliding block; 33. Guide groove; 4. Connecting frame; 41. Limiting nut; 42. Mounting rod; 43. Hand pull plate. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0024] Example 1: A dual-head dotting soldering device based on XZ-axis linear motor handling, see [link to example]. Figures 1 to 4 The top of the mounting base 1 is detachably mounted with a bearing mold 2 by bolts. Hollow frames 21 are vertically fixed to the four corner surfaces of the top of the bearing mold 2. A hollow tube 25 is vertically fixed to the middle of the inner side of each hollow frame 21.

[0025] The mounting base 1 has first electric slide rails 11 on both sides of its top. The outer sides of the two sets of first electric slide rails 11 are respectively connected to a moving frame 12 and a welding frame 13. The top of the inner side of the moving frame 12 and the welding frame 13 are each provided with a second electric slide rail 14. The outer side of each second electric slide rail 14 is connected to a third electric slide rail 15. The outer side of the two sets of third electric slide rails 15 is connected to a fixed seat 16. The sides of the two sets of fixed seats 16 are respectively provided with a fixed suction cup 17 and a welding head 18. Under the negative pressure adsorption of the fixed suction cup 17, the electronic chip placed on the top side of the mounting base 1 can be adsorbed and moved. Then, the welding head 18 can perform soldering on the electronic chip.

[0026] When soldering is required on an electronic chip, the chip is placed on the side surface of the mounting base 1. Then, the first electric slide rail 11 is activated, causing the moving frame 12 to move horizontally on the surface of the mounting base 1. Next, the second electric slide rail 14 and the third electric slide rail 15 on the surface of the moving frame 12 are activated to adjust the position of the fixing suction cup 17 until the bottom surface of the fixing suction cup 17 is in contact with the surface of the electronic chip. Under the operation of the external negative pressure pump, the fixing suction cup 17 can fix and adsorb the electronic chip. Then, under the driving action of the first electric slide rail 11, the electronic chip is moved horizontally to the surface of the carrier mold 2 on the other side of the mounting base 1. After the electronic chip is fixed, the first electric slide rail 11 is activated to drive the soldering frame 13 to move horizontally on the surface of the mounting base 1. This causes the soldering frame 13 and the soldering head 18 to move horizontally to the surface of the electronic chip. Then, under the operation of the second electric slide rail 14 and the third electric slide rail 15, the soldering head 18 can perform soldering on the surface of the electronic chip.

[0027] For details, see Figures 1 to 4 Each hollow frame 21 has a limit block 24 rotatably installed on all four sides of its exterior. The vertical cross section of each limit block 24 is a right triangle. Each hollow frame 21 has a movable groove 22 on all four sides of its top. Each limit block 24 has a connecting rod 23 fixedly installed at both ends of its outer side. The side of the connecting rod 23 is rotatably inserted into the movable groove 22 through a bearing. The conversion mechanism includes a transmission rod 28. Each sliding sleeve 26 has a connecting block 27 fixedly installed on its outer side and the bottom surface of the limit block 24. The transmission rod 28 is inclinedly hinged between the sides of every two sets of connecting blocks 27 through a rotating shaft. The transmission rod 28 is movably installed inside the movable groove 22.

[0028] Both ends of the hollow tube 25 are vertically provided with guide grooves 33, and the sliding block 32 is slidably installed inside the guide groove 33. Each hollow tube 25 is movably sleeved with a return spring 29, and the two ends of the return spring 29 are respectively movably attached to the bottom surface of the sliding sleeve 26 and the bottom of the inner side of the hollow frame 21.

[0029] After the fixed suction cup 17 moves the electronic chip horizontally to the surface of the carrier mold 2, during the downward movement of the electronic chip, the hollow frame 21 and its outer limiting blocks 24 move relative to each other into the mounting slots at the four corners of the electronic chip. As the electronic chip continues to move downward, the inner wall of the electronic chip will abut against the inclined surface of the limiting blocks 24, causing them to rotate relative to each other inside the movable slot 22 with the connecting rod 23 as the center. Combined with the hinge action of the rotating shaft, the two ends of the push rod can rotate relative to each other at the bottom of the limiting blocks 24 and the outer wall of the sliding sleeve 26, respectively. This allows the push rod to convert the rotational force of the limiting blocks 24 into a vertical push on the sliding sleeve 26. The force causes the sliding sleeve 26 to move vertically on the outer wall of the hollow tube 25, which in turn compresses the return spring 29 fitted outside the hollow tube 25, causing it to deform. After the electronic chip is fully fitted and placed below the limiting block 24, the electronic chip loses the pressure on the limiting block 24. Under the reverse pushing action of the return spring 29, the sliding sleeve 26 is driven to return to its vertical position. Under the connecting transmission action of the push rod, the limiting block 24 can rotate and return to its original position. This allows the bottom right-angled edge of the limiting block 24 to be above the electronic chip. Combined with the fitting and limiting action of the hollow frame 21, the electronic chip can be engaged and abutted in both horizontal and vertical directions.

[0030] Further, see Figures 1 to 4 The lifting mechanism includes a sliding sleeve 26. A hollow tube 25 is vertically fixedly installed at the bottom center of the inner side of the hollow frame 21. The sliding sleeve 26 is slidably sleeved at the top outer side of the hollow tube 25. A sliding plate 31 is slidably installed inside each hollow tube 25. A sliding block 32 is fixedly installed at both ends of the outer side of each sliding plate 31, and the top side of the sliding block 32 is fixedly connected to the inner side wall of the sliding sleeve 26.

[0031] It is worth noting that, see Figures 1 to 4 The pulling mechanism includes a fixed rod 3 and a connecting frame 4. A fixed rod 3 is vertically fixedly installed at the bottom center of each sliding plate 31, and the fixed rod 3 is slidably installed inside the mounting base 1. The bottom outer side of the fixed rod 3 is provided with a thread that matches the spiral direction of the inner wall of the limit nut 41. The connecting frame 4 is movably installed at the bottom of the mounting base 1, and the fixed rod 3 is slidably installed inside the side end of the connecting frame 4. The bottom of each fixed rod 3 is screwed with a limit nut 41, and the limit nut 41 is movably installed on the bottom surface of the connecting frame 4. An installation rod 42 is vertically fixedly installed at the bottom center of the connecting frame 4, and a pull plate 43 is fixedly installed at the bottom of the installation rod 42.

[0032] After the electronic chip has been soldered, when it needs to be removed and replaced, the operator can move the connecting frame 4 vertically downwards in sync. Under the tightening action of the limit nut 41 on the fixing rod 3, the four sets of fixing rods 3 can be driven to move vertically downwards at the bottom of the mounting base 1. Simultaneously, the sliding plate 31 and the sliding sleeve 26 will move vertically. Combined with the transmission conversion action of the transmission rod 28, the corresponding pulling force is provided to the limit block 24, causing the limit block 24 to rotate and retract into the inner wall of the hollow frame 21, so that it loses its resistance and limiting force on the electronic chip. This makes it easier for the operator to separate the electronic chip from the four corners on the outside, and then quickly remove the electronic chip for subsequent processing and replacement.

[0033] In addition, all components designed in this utility model are general standard parts or components known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods. Those skilled in the art can fully implement them, so there is no need to elaborate. The content protected by this utility model does not involve improvements to the internal structure and method.

[0034] The embodiments disclosed herein are preferred embodiments, but are not limited thereto. Those skilled in the art can readily grasp the spirit of this utility model based on the above embodiments and make different extensions and variations. However, as long as they do not depart from the spirit of this utility model, they are all within the protection scope of this utility model.

Claims

1. A dual-head dotting soldering device based on XZ-axis linear motor handling, comprising a mounting base (1), characterized in that, The mounting base (1) is detachably mounted with a bearing mold (2) by bolts. A hollow frame (21) is vertically fixedly mounted on the four corner surfaces of the top of the bearing mold (2). A hollow tube (25) is vertically fixedly mounted on the middle of the inner side of each hollow frame (21). The hollow frame (21) has four external sides with rotatable limit blocks (24), the hollow frame (21) has a conversion mechanism inside, and the conversion mechanism and the limit blocks (24) are connected in a transmission. The hollow frame (21) has a lifting mechanism inside, and the lifting mechanism and the conversion mechanism are connected in a transmission. The mounting base (1) is movably provided with a pulling mechanism at its bottom, and the pulling mechanism and the lifting mechanism are connected in a transmission connection.

2. The dual-head dotting soldering device based on XZ-axis linear motor conveying as described in claim 1, characterized in that, The mounting base (1) is provided with first electric slide rails (11) on both sides of the top. The two sets of first electric slide rails (11) are respectively connected to a moving frame (12) and a welding frame (13) on the outside. The moving frame (12) and the welding frame (13) are respectively provided with second electric slide rails (14) on the top of the inner side. Each second electric slide rail (14) is connected to a third electric slide rail (15) on the outside. The two sets of third electric slide rails (15) are connected to a fixed seat (16) on the outside. The two sets of fixed seats (16) are respectively provided with a fixed suction cup (17) and a welding head (18) on the side.

3. The dual-head dotting soldering device based on XZ-axis linear motor conveying as described in claim 1, characterized in that, Each of the hollow frames (21) has a movable groove (22) on its four sides at the top. Each of the limiting blocks (24) has a connecting rod (23) fixedly installed at both ends on its outer side. The side of the connecting rod (23) is inserted into the movable groove (22) through a bearing.

4. The dual-head dotting soldering device based on XZ-axis linear motor conveying as described in claim 1, characterized in that, The lifting mechanism includes a sliding sleeve (26). A hollow tube (25) is vertically fixedly installed at the bottom center of the inner side of the hollow frame (21). The sliding sleeve (26) is slidably sleeved at the top outer side of the hollow tube (25). A sliding plate (31) is slidably installed inside each hollow tube (25). A sliding block (32) is fixedly installed at both ends of the outer side of each sliding plate (31). The top side of the sliding block (32) is fixedly connected to the inner side wall of the sliding sleeve (26).

5. The dual-head dotting soldering device based on XZ-axis linear motor conveying as described in claim 4, characterized in that, Both ends of the hollow tube (25) are vertically provided with guide grooves (33), and the sliding block (32) is slidably installed inside the guide groove (33). Each hollow tube (25) is movably sleeved with a reset spring (29), and the two ends of the reset spring (29) are respectively movably attached to the bottom surface of the sliding sleeve (26) and the bottom of the inner side of the hollow frame (21).

6. The dual-head dotting soldering device based on XZ-axis linear motor conveying as described in claim 4, characterized in that, The conversion mechanism includes a transmission rod (28), and a connecting block (27) is fixedly installed on the outer side of each sliding sleeve (26) and the bottom surface of the limiting block (24). The transmission rod (28) is inclinedly hinged between the sides of each pair of connecting blocks (27) through a rotating shaft, and the transmission rod (28) is movably arranged inside the movable groove (22).

7. The dual-head dotting soldering device based on XZ-axis linear motor conveying as described in claim 4, characterized in that, The pulling mechanism includes a fixed rod (3) and a connecting frame (4). A fixed rod (3) is vertically fixed at the middle of the bottom of each sliding plate (31), and the fixed rod (3) is slidably installed inside the mounting base (1). The connecting frame (4) is movably installed at the bottom of the mounting base (1), and the fixed rod (3) is slidably installed inside the side end of the connecting frame (4). A limit nut (41) is screwed into the bottom of each fixed rod (3), and the limit nut (41) is movably installed on the bottom surface of the connecting frame (4).

8. The dual-head dotting soldering device based on XZ-axis linear motor conveying as described in claim 7, characterized in that, A mounting rod (42) is vertically fixed at the bottom center of the connecting frame (4), and a pull plate (43) is fixedly installed at the bottom of the mounting rod (42).

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