A tin paste scraping device for rectifier bridge package
Patent Information
- Application Number
- CN202522290726.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-29
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-29
AI Technical Summary
(1)本实用新型通过对称布置的双刮板与接近开关的相互配合控制,使其在往复运动中均可执行刮平作业,完全消除了传统单向刮平机构的空程返回时间,提高了刮平效率;
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Figure CN224779556U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic component packaging technology, specifically relating to a solder paste leveling device for rectifier bridge packaging. Background Technology
[0002] In the packaging process of a rectifier bridge, a lead frame is typically used as the chip carrier. One of the key steps is to precisely apply solder paste as an adhesive to the die-bonding locations on the lead frame, and then accurately bond the chip to the corresponding positions. In existing technologies, a dispensing device is commonly used for solder paste application. This device has multiple dispensing needles at its lower end, driven by a robotic arm. The specific process is as follows: the dispensing needles pick up solder paste from the solder paste tank, then transfer and dot it onto the various die-bonding locations on the lead frame. To ensure that the amount of solder paste picked up by the multiple dispensing needles each time is consistent, thereby ensuring uniform solder paste on each die-bonding point, the solder paste in the solder paste tank must be leveled before dispensing.
[0003] However, existing solder paste leveling mechanisms mostly employ a unidirectional leveling method, meaning the scraper can only level in one direction. After each leveling stroke, it must return to the starting point without load before the next leveling operation can begin. This reciprocating idle motion results in low leveling efficiency and cannot meet the needs of high-efficiency, continuous production. Therefore, there is an urgent need to develop a device capable of bidirectional continuous leveling to improve solder paste leveling efficiency and meet the demands of high-efficiency packaging production. Utility Model Content
[0004] To address the shortcomings of the prior art, this utility model provides a solder paste leveling device for rectifier bridge packaging, which can achieve bidirectional continuous leveling, thereby improving the solder paste leveling efficiency.
[0005] To achieve the above objectives, the technical solution of this utility model is as follows: A solder paste leveling device for rectifier bridge packaging includes a substrate, a solder paste tank on the substrate, a movable arm located above the solder paste tank, and a drive mechanism for driving the movable arm to reciprocate along the length direction of the solder paste tank. The movable arm is provided with two lifting cylinders and two symmetrically arranged scrapers. The two lifting cylinders are respectively connected to the two scrapers and drive them to rise and fall.
[0006] Preferably, the drive mechanism includes a servo motor, two upright plates, a lead screw disposed between the two upright plates, and two guide rods. The lead screw is rotatably connected to the two upright plates, and one end of the lead screw is connected to the servo motor. A slider is threaded onto the lead screw, and the slider is slidably connected to the two guide rods. The movable arm is connected to one side of the slider.
[0007] Preferably, a slide rail is provided on one side of the slider, the movable arm is slidably connected to the slide rail, positioning rods are provided on both sides of the movable arm, the positioning rods are slidably connected to the strip groove provided on the slider, and the positioning rods pass through the strip groove and are threaded with a locking nut.
[0008] Preferably, the upper end of the scraper is provided with a slide rod, which is slidably connected to a slide hole provided on the moving arm.
[0009] Preferably, both of the upright plates are equipped with proximity switches. When the slider moves to one of the proximity switches, it triggers the lifting cylinder on that side to lower the corresponding scraper to contact the solder paste, while the lifting cylinder on the other side raises the corresponding scraper.
[0010] Preferably, the vertical cross-section of the scraper is arc-shaped, and its arc-shaped groove is disposed opposite to the other scraper.
[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: (1) This utility model uses the symmetrical arrangement of double scrapers and the cooperation of proximity switches to control the scraping operation in reciprocating motion, which completely eliminates the idle return time of the traditional one-way scraping mechanism and improves the scraping efficiency. (2) By adjusting the height of the moving arm on the slider, the gap between the lower edge of the scraper and the bottom of the solder paste tank can be controlled, thereby adjusting and controlling the thickness of the solder paste and adapting to the process requirements of different product specifications. Attached Figure Description
[0012] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.
[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This utility model Figure 1 Enlarged structural diagram at point A in the middle; Figure 3 This utility model Figure 1 Enlarged structural diagram at point B; Figure 4 This is a schematic diagram of the scraper structure of this utility model; In the diagram: 1. Substrate, 2. Solder paste tray, 3. Moving arm, 4. Lifting cylinder, 5. Scraper, 6. Servo motor, 7. Vertical plate, 8. Lead screw, 9. Guide rod, 10. Slider, 11. Slide rail, 12. Positioning rod, 13. Strip groove, 14. Locking nut, 15. Slide rod, 16. Slide hole, 17. Proximity switch, 18. Controller. Detailed Implementation
[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0015] In the description of this utility model, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0016] In this utility model, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," "link," and "fix" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection; a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0017] like Figure 1 As shown, a solder paste leveling device for rectifier bridge packaging includes a substrate 1, a solder paste tank 2 on the substrate, a movable arm 3 located above the solder paste tank, and a drive mechanism that drives the movable arm to reciprocate along the length of the solder paste tank. The movable arm is equipped with two lifting cylinders 4 and two symmetrically arranged scrapers 5. The two lifting cylinders are respectively connected to and drive the scrapers to rise and fall. The rising and falling of the two scrapers are controlled separately by the two lifting cylinders. When the scraper moves from one side of the solder paste tank to the other, the upstream scraper descends to contact the solder paste, leveling the solder paste as the movable arm moves horizontally, while the downstream scraper rises to disengage from the solder paste tank. When the scraper reaches the other side under the action of the drive mechanism, the scraper that was originally in contact with the solder paste rises, while the other scraper descends to achieve reverse leveling. This process continues in a bidirectional manner, achieving continuous leveling and thus improving the solder paste leveling efficiency. Figure 2 and Figure 4 As shown, the vertical cross-section of the scraper in this embodiment is arc-shaped, with its arc-shaped groove facing away from the other scraper. This structural design can evenly and smoothly apply the solder paste, improve the scraping quality, and ensure that the amount of solder paste picked up by multiple dipping needles is consistent each time during subsequent use. A slide rod 15 is provided at the upper end of the scraper, and the slide rod is slidably connected to the slide hole 16 provided on the moving arm, which can ensure the stability of each lifting and lowering movement of the scraper.
[0018] The drive mechanism includes a servo motor 6, two upright plates 7, a lead screw 8 positioned between the two upright plates, and two guide rods 9. The lead screw is rotatably connected to the two upright plates, and one end of the lead screw is connected to the servo motor. A slider 10 is threaded onto the lead screw, and the slider is slidably connected to the two guide rods. A movable arm is connected to one side of the slider. The servo motor drives the lead screw to rotate, causing the slider to slide horizontally along the two guide rods. When the lead screw rotates in the opposite direction, the slider moves in the opposite direction, thereby enabling the movable arm to reciprocate horizontally.
[0019] To ensure accurate matching between the lifting and lowering movements of the two scrapers and the travel position of the moving arm, proximity switches 17 are installed on both upright plates. When the slider moves to one of the proximity switches, it triggers the lifting cylinder on that side, causing the corresponding scraper to descend and contact the solder paste. Simultaneously, the lifting cylinder on the other side causes the corresponding scraper to rise. A PLC controller is installed on the base plate, and the servo motor, the two lifting cylinders, and the two proximity switches are all electrically connected to the PLC controller. The proximity switches are known standard components, and their working principle is existing technology, which will not be elaborated here. Figure 1 As shown, the two proximity switches in this embodiment are proximity switch 17a (left side of the figure) and proximity switch 17b (right side of the figure). The preset starting position of the slider is at proximity switch 17a. At this time, the controller, based on the signal from the proximity switch, causes the scraper on the left to descend and contact the solder paste in the solder paste tank, while the scraper on the right rises and disengages from the solder paste tank. As the lead screw rotates forward, driving the moving arm to move to the right, the scraper on the left smooths the solder paste. When the slider moves to proximity switch 17b, proximity switch 17b sends a signal back to the controller. The controller controls the lifting cylinder on the right to drive the corresponding scraper to descend and contact the solder paste, while the lifting cylinder on the left drives the corresponding scraper to rise. At the same time, the servo motor rotates in the opposite direction, driving the slider to move the moving arm to the left, and so on.
[0020] Because the amount of solder paste added to the solder paste tank varies each time, the height of the moving arm on the slider in this embodiment is freely adjustable to facilitate adjustment of the scraping thickness of the scraper after descent, based on actual conditions. For example... Figure 3 As shown, a slide rail 11 is provided on one side of the slider, and the moving arm is slidably connected to the slide rail. Positioning rods 12 are provided on both sides of the moving arm. The positioning rods are slidably connected to the strip groove 13 provided on the slider. The positioning rods pass through the strip groove and are threadedly connected to a locking nut 14. The height position of the moving arm in the slide rail can be locked and fixed by turning the locking nut.
[0021] like Figures 1 to 4 As shown, the working process of this utility model in use is as follows: (1) Before use, the staff adds a certain amount of solder paste to the solder paste tank 2, and adjusts the height position of the moving arm 3 on the slide rail 11 in advance according to the depth of the solder paste tank 2 and the required solder paste thickness, so that the lower edge of the scraper 5 and the bottom of the solder paste tank 2 maintain an appropriate gap. The moving arm 3 is firmly locked by screwing the locking nut 14 to complete the preset scraping depth.
[0022] (2) The slider 10 is positioned at the proximity switch 17a as the starting position, and the scraper 5 is located at the left end of the solder paste tank 2. At this time, the controller 18 causes the scraper 5 on the left side to descend and contact the solder paste in the solder paste tank according to the signal of the proximity switch 17a, while the scraper 5 on the right side rises and disengages from the solder paste tank 2.
[0023] (3) Start the servo motor 6. The servo motor 6 drives the lead screw 8 to rotate clockwise, which drives the slider 10 and the entire scraping mechanism to move along the guide rod 9 to the other end (right side) of the solder paste tank. The left scraper scrapes the solder paste in the solder paste tank. When the slider moves to the detection position of the proximity switch 17b, the proximity switch 17b is triggered and sends a signal to the controller 18. The controller controls the right lifting cylinder 4 to push the right scraper down so that the lower edge of the scraper contacts the solder paste surface. At the same time, it controls the left lifting cylinder 4 to drive the left scraper up to the safe position of being separated from the solder paste.
[0024] (4) The servo motor 6 drives the lead screw 8 to rotate counterclockwise, which drives the slider 10 and the entire scraping mechanism to move along the guide rod 9 to the starting side (left side) of the solder paste tank. The right scraper 5 scrapes the solder paste in the solder paste tank 2. When the slider 10 moves to the detection position of the proximity switch 17a, the proximity switch 17a is triggered and sends a signal to the controller. The controller 18 controls the right lifting cylinder to retract so that the right scraper rises, and at the same time controls the left lifting cylinder to extend so that the left scraper falls.
[0025] (5) The process continues according to the above logic, using two scrapers 5 alternately in the reciprocating motion. Each scraper 5 performs the scraping operation only for half of its stroke corresponding to its direction of movement, and remains in a raised state during the return stroke. This cycle is repeated to achieve continuous and efficient scraping of the solder paste.
[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all changes falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model.
Claims
1. A solder paste leveling device for rectifier bridge packaging, characterized in that: The device includes a substrate, on which a solder paste tank is provided, a movable arm located above the solder paste tank, and a drive mechanism for driving the movable arm to reciprocate along the length of the solder paste tank. The movable arm is provided with two lifting cylinders and two symmetrically arranged scrapers. The two lifting cylinders are respectively connected to the two scrapers and drive them to rise and fall.
2. The solder paste leveling device for rectifier bridge packaging as described in claim 1, characterized in that: The drive mechanism includes a servo motor, two upright plates, a lead screw and two guide rods disposed between the two upright plates. The lead screw is rotatably connected to the two upright plates, and one end of the lead screw is connected to the servo motor. A slider is threaded onto the lead screw, and the slider is slidably connected to the two guide rods. The moving arm is connected to one side of the slider.
3. The solder paste leveling device for rectifier bridge packaging as described in claim 2, characterized in that: The slider has a slide rail on one side, and the moving arm is slidably connected to the slide rail. The moving arm has positioning rods on both sides, and the positioning rods are slidably connected to the strip groove on the slider. The positioning rods pass through the strip groove and are threaded with a locking nut.
4. The solder paste leveling device for rectifier bridge packaging as described in claim 1, characterized in that: The upper end of the scraper is provided with a sliding rod, which is slidably connected to a sliding hole provided on the moving arm.
5. The solder paste leveling device for rectifier bridge packaging as described in claim 2, characterized in that: Both of the upright plates are equipped with proximity switches. When the slider moves to one of the proximity switches, it triggers the lifting cylinder on that side to lower the corresponding scraper to contact the solder paste, while the lifting cylinder on the other side raises the corresponding scraper.
6. The solder paste leveling device for rectifier bridge packaging as described in claim 1, characterized in that: The vertical cross-section of the scraper is arc-shaped, and its arc-shaped groove is set opposite to the other scraper.