An integrated circuit wire bonding ultrasonic welding apparatus

Abstract

The utility model discloses an integrated circuit lead wire bonding ultrasonic welding device, including support station, the top of support station is provided with ultrasonic welding head, the outside of support station is provided with fixed establishment, the fixed establishment includes frame body, cross column, first recessed block, second recessed block, screw rod, screw cap, placing seat, the frame body is fixedly connected in the top of support station, the outer wall of frame body is hinged with cross column, the side wall of frame body and the side wall of cross column are fixedly connected with first recessed block and second recessed block respectively. The utility model relates to integrated circuit processing technical field, and this integrated circuit lead wire bonding ultrasonic welding device cooperates through frame body, cross column, first recessed block, second recessed block, screw rod, screw cap, placing seat, realizes the quick fixing of integrated circuit board conveniently, solves the process in fixed, and the operation step is more, and the operation time is long, thereby leads to the problem of ultrasonic welding device work efficiency low.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit processing technology, specifically to an ultrasonic welding device for integrated circuit wire bonding. Background Technology

[0002] An integrated circuit is a miniature electronic device or component that uses specific processes to interconnect transistors, resistors, capacitors, inductors, and other components and wiring required in a circuit. During integrated circuit manufacturing, ultrasonic welding equipment is needed to weld the integrated circuit leads.

[0003] In traditional ultrasonic welding equipment, the operator places the integrated circuit board on the workbench, fixes it with clamps on both sides, and then performs ultrasonic welding. However, when fixing integrated circuit boards, the clamps are first used to fix them, and after welding, the clamps are moved away from the integrated circuit boards to remove them before welding the next integrated circuit board. This results in many operation steps and a long operation time during the fixing process, which leads to low working efficiency of the ultrasonic welding device. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides an ultrasonic welding device for integrated circuit lead bonding, which solves the problem of low working efficiency caused by numerous operation steps and long operation time during the fixing process.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an ultrasonic welding device for integrated circuit wire bonding, comprising a support platform, an ultrasonic welding head disposed above the support platform, and a fixing mechanism disposed outside the support platform; the fixing mechanism comprises a frame, a horizontal column, a first recess, a second recess, a screw, a threaded cap, and a placement seat; the frame is fixedly connected to the top of the support platform, the outer wall of the frame is hinged to the horizontal column, the side wall of the frame and the side wall of the horizontal column are respectively fixedly connected to the first recess and the second recess, the inner wall of the first recess is rotatably connected to the screw via a pin, the outer wall of the screw is threadedly connected to the threaded cap, the outer wall of the threaded cap is fitted against the outer wall of the second recess, and a placement seat is disposed between the frame and the horizontal column.

[0006] Preferably, the inner wall of the frame is provided with a groove, and the side wall of the placement seat is fixedly connected with a protrusion, the outer wall of the protrusion being inserted into the inner wall of the groove.

[0007] Preferably, an ejector assembly is provided below the support platform; the ejector assembly includes a curved plate, a motor, a crossbar, a cam, a connecting column, and a top plate; the top of the curved plate is fixedly connected to the bottom of the support platform, the side wall of the curved plate is fixedly connected to the motor by bolts, the output end of the motor is fixedly connected to the crossbar, the end of the crossbar is rotatably connected to the inner wall of the curved plate by a bearing, the outer wall of the crossbar is fixedly connected to the cam, the outer wall of the cam is fitted with the connecting column, the connecting column passes through the support platform and is movably connected to the support platform, the top of the connecting column is fixedly connected to the top plate, and the top plate is inserted into the inner wall of the frame.

[0008] Preferably, a first electric slide rail is fixedly connected to the surface of the support platform, a first electric slider is slidably engaged with the outer wall of the first electric slide rail, a frame is fixedly connected to the top of the first electric slider, a second electric slide rail is fixedly connected to the upper outer wall of the frame, and a second electric slider is slidably engaged with the outer wall of the second electric slide rail.

[0009] Preferably, a connecting plate is fixedly connected to the top of the second electric slider, a hydraulic cylinder is fixedly connected to the bottom of the connecting plate by bolts, a mounting plate is fixedly connected to the bottom output end of the hydraulic cylinder by bolts, and the bottom of the mounting plate is fixedly connected to the top of the ultrasonic welding head. Beneficial effects

[0010] This invention provides an ultrasonic welding device for integrated circuit wire bonding. It offers the following advantages: This ultrasonic welding device for integrated circuit wire bonding, through the cooperation of the frame, crossbar, first recess, second recess, screw, threaded cap, and placement seat, achieves convenient and rapid fixation of the integrated circuit board, solving the problem of low efficiency caused by numerous and time-consuming steps in the fixing process. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 for Figure 1 Exploded view; Figure 3 for Figure 2 Schematic diagram of the middle frame, horizontal columns, and placement base; Figure 4 for Figure 2 A structural diagram of the curved plate, motor, and cross column; Figure 5 for Figure 3 Enlarged view of point A in the middle.

[0012] In the diagram: 1. Support platform; 2. First electric slide rail; 3. First electric slider; 4. Frame; 5. Second electric slide rail; 6. Second electric slider; 7. Connecting plate; 8. Hydraulic cylinder; 9. Mounting plate; 10. Ultrasonic welding head; 11. Frame; 12. Horizontal column; 13. First concave block; 14. Second concave block; 15. Screw; 16. Threaded cap; 17. Groove; 18. Raised strip; 19. Placement seat; 20. Curved plate; 21. Motor; 22. Crossbar; 23. Cam; 24. Connecting column; 25. Top plate. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] This results in numerous operational steps and a long operation time during the fixing process, leading to low working efficiency of the ultrasonic welding device.

[0015] In view of this, the present invention provides an ultrasonic welding device for integrated circuit lead bonding. Through the cooperation between the frame, the crossbar, the first concave block, the second concave block, the screw, the threaded cap, and the placement seat, it is possible to quickly and conveniently fix the integrated circuit board, thus solving the problem that the ultrasonic welding device has low working efficiency due to the many operation steps and long operation time in the fixing process.

[0016] Those skilled in the art will connect the electrical components and their compatible power supplies in this case using wires. Appropriate controllers and encoders should be selected according to the actual situation to meet control requirements. The specific connection and control sequence should refer to the working principle below, where the electrical components are connected in the order of operation. The detailed connection methods are well-known in the art. The following mainly introduces the working principle and process, without further explanation of electrical control.

[0017] Example 1, by Figure 1-5As can be seen, the ultrasonic welding device for integrated circuit wire bonding in this case includes a support platform 1, an ultrasonic welding head 10 is provided on the top of the support platform 1, and a fixing mechanism is provided on the outside of the support platform 1; the fixing mechanism includes a frame 11, a horizontal column 12, a first recess 13, a second recess 14, a screw 15, a threaded cap 16, and a placement seat 19; the frame 11 is fixed to the top of the support platform 1, the horizontal column 12 is hinged to the outer wall of the frame 11, the first recess 13 and the second recess 14 are fixed to the side wall of the frame 11 and the side wall of the horizontal column 12 respectively, the screw 15 is rotatably connected to the inner wall of the first recess 13 through a pin, the threaded cap 16 is threaded to the outer wall of the screw 15, the outer wall of the threaded cap 16 is attached to the outer wall of the second recess 14, and a placement seat 19 is provided between the frame 11 and the horizontal column 12; In the specific implementation process, it is worth noting that the ultrasonic welding head 10 uses the welding head of the SH2000 ultrasonic aluminum wire bonding machine. When ultrasonically welding the integrated circuit lead bonding, the operator places the integrated circuit board in the fixing groove on the surface of the placement seat 19. After that, the operator starts the ultrasonic welding head 10 to weld the integrated circuit board. After welding is completed, the operator stops the ultrasonic welding head 10. The size of the integrated circuit board matches the size of the fixing groove on the surface of the placement seat 19. When the placement seat 19 is fixed inside the frame 11, the operator rotates the threaded cap 16. The surface is textured with anti-slip texture to reduce friction on the surface of the threaded cap 16. The threaded cap 16 moves away from the second recess 14. After this, the operator rotates the screw 15 to rotate it out of the second recess 14. The operator also rotates the crossbar 12 to open the frame 11 and places the placement seat 19 into the frame 11. Finally, the operator rotates the crossbar 12 back to its initial position, rotates the screw 15 into the second recess 14, rotates the threaded cap 16 onto the screw 15, and presses the threaded cap 16 against the second recess 14 to fix the placement seat 19 in place. Different sizes of placement seats 19 can also be replaced to facilitate quick fixation of integrated circuit boards. Furthermore, the inner wall of the frame 11 is provided with a groove 17, and the side wall of the placement seat 19 is fixedly connected with a protrusion 18, the outer wall of the protrusion 18 being inserted into the inner wall of the groove 17. In the specific implementation process, it is worth noting that when the placement seat 19 is fixed, the placement seat 19 drives the protrusion 18 to move, and the protrusion 18 is inserted into the groove 17 to limit the placement seat 19. Furthermore, an ejection assembly is provided below the support platform 1; the ejection assembly includes a curved plate 20, a motor 21, a crossbar 22, a cam 23, a connecting column 24, and a top plate 25; the top of the curved plate 20 is fixed to the bottom of the support platform 1, the side wall of the curved plate 20 is fixed to the motor 21 by bolts, the output end of the motor 21 is fixed to the crossbar 22, the end of the crossbar 22 is rotatably connected to the inner wall of the curved plate 20 by a bearing, the outer wall of the crossbar 22 is fixed to the cam 23, the outer wall of the cam 23 is attached to the connecting column 24, the connecting column 24 passes through the support platform 1 and is movably connected to the support platform 1, the top of the connecting column 24 is fixed to the top plate 25, and the top plate 25 is inserted into the inner wall of the frame 11; In the specific implementation process, it is worth noting that after the integrated circuit board is soldered, the staff connects the motor 21 to the external power supply. The motor 21 drives the crossbar 22 to rotate, the crossbar 22 drives the cam 23 to rotate, and the cam 23 drives the connecting column 24 to move. The connecting column 24 is limited in the support platform 1. The connecting column 24 drives the top plate 25 to move. The top plate 25 moves in the placement seat 19, pushing the integrated circuit board on the surface of the top plate 25 out of the placement seat 19. The staff removes it. After completion, the motor 21 continues to rotate, rotating the cam 23 to the initial position. The motor 21 stops working. When soldering the next integrated circuit board, the integrated circuit board is placed on the top plate 25 and pushed, thereby moving the top plate 25 to the initial position. The integrated circuit board is inserted into the placement seat 19, making it convenient for the staff to remove the integrated circuit board after soldering. Furthermore, a first electric slide rail 2 is fixedly connected to the surface of the support platform 1, a first electric slider 3 is slidably engaged with the outer wall of the first electric slide rail 2, a frame 4 is fixedly connected to the top of the first electric slider 3, a second electric slide rail 5 is fixedly connected to the upper outer wall of the frame 4, and a second electric slider 6 is slidably engaged with the outer wall of the second electric slide rail 5. In the specific implementation process, it is worth noting that there are two first electric slide rails 2, the model of which is KK8620P-300A1-F0. The model of the first electric slider 3 is matched with that of the first electric slide rail 2. A synchronizer is installed between the two first electric slide rails 2. The synchronizer is driven by a dual-axis servo motor. The model of the second electric slide rail 5 is KK6010P-200A1-F0. The model of the second electric slider 6 is matched with that of the second electric slide rail 5. When soldering integrated circuit boards, the operator activates the first electric slide rail 2 and the second electric slide rail 5, which causes the first electric slide rail 2 to move the first electric slider 3, which in turn moves the frame 4, thereby causing the ultrasonic welding head 10 to move back and forth. The second electric slide rail 5 drives the second electric slider 6 to move, which in turn causes the ultrasonic welding head 10 to move left and right, performing soldering on different positions of the integrated circuit board. After soldering is completed, the operator stops the first electric slide rail 2 and the second electric slide rail 5, thus realizing the movement of the ultrasonic welding head 10 in the back-and-forth and left-and-right directions.

[0018] Example 2, by Figure 1 and 2 It can be seen that the top of the second electric slider 6 is fixedly connected to the connecting plate 7, the bottom of the connecting plate 7 is fixedly connected to the hydraulic cylinder 8 by bolts, the bottom output end of the hydraulic cylinder 8 is fixedly connected to the mounting plate 9 by bolts, and the bottom of the mounting plate 9 is fixedly connected to the top of the ultrasonic welding head 10. In the specific implementation process, it is worth noting that the hydraulic cylinder 8 is model CG1BN40-50-B. When welding the integrated circuit board, the operator starts the hydraulic cylinder 8, which drives the mounting plate 9 to move. The mounting plate 9 then drives the ultrasonic welding head 10 to descend to the surface of the integrated circuit board for welding. After completion, the hydraulic cylinder 8 drives the ultrasonic welding head 10 to rise back to the initial position, and the operator stops the hydraulic cylinder 8, thus driving the ultrasonic welding head 10 to move up and down.

[0019] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An ultrasonic welding apparatus for integrated circuit wire bonding, comprising a support platform (1), characterized in that: An ultrasonic welding head (10) is provided above the support platform (1), and a fixing mechanism is provided on the outside of the support platform (1). The fixing mechanism includes a frame (11), a horizontal column (12), a first recess (13), a second recess (14), a screw (15), a threaded cap (16), and a placement seat (19). The frame (11) is fixed to the top of the support platform (1). A horizontal column (12) is hinged to the outer wall of the frame (11). A first recess (13) and a second recess (14) are fixed to the side wall of the frame (11) and the side wall of the horizontal column (12), respectively. A screw (15) is rotatably connected to the inner wall of the first recess (13) through a pin. A threaded cap (16) is threaded to the outer wall of the screw (15). The outer wall of the threaded cap (16) is attached to the outer wall of the second recess (14). A placement seat (19) is provided between the frame (11) and the horizontal column (12).

2. The ultrasonic welding apparatus for integrated circuit wire bonding according to claim 1, characterized in that: The inner wall of the frame (11) is provided with a groove (17), and the side wall of the placement seat (19) is fixedly connected with a protrusion (18), the outer wall of the protrusion (18) is inserted into the inner wall of the groove (17).

3. The ultrasonic welding apparatus for integrated circuit wire bonding according to claim 1, characterized in that: A push-out component is provided below the support platform (1); The ejection assembly includes a curved plate (20), a motor (21), a crossbar (22), a cam (23), a connecting column (24), and a top plate (25); The top of the curved plate (20) is fixed to the bottom of the support platform (1). A motor (21) is fixed to the side wall of the curved plate (20) by bolts. A crossbar (22) is fixed to the output end of the motor (21). The end of the crossbar (22) is rotatably connected to the inner wall of the curved plate (20) by a bearing. A cam (23) is fixed to the outer wall of the crossbar (22). A connecting column (24) is attached to the outer wall of the cam (23). The connecting column (24) passes through the support platform (1) and is movably connected to the support platform (1). A top plate (25) is fixed to the top of the connecting column (24). The top plate (25) is inserted into the inner wall of the frame (11).

4. The ultrasonic welding apparatus for integrated circuit wire bonding according to claim 1, characterized in that: The surface of the support platform (1) is fixedly connected to a first electric slide rail (2), the outer wall of the first electric slide rail (2) is slidably connected to a first electric slider (3), the top of the first electric slider (3) is fixedly connected to a frame (4), the upper part of the outer wall of the frame (4) is fixedly connected to a second electric slide rail (5), and the outer wall of the second electric slide rail (5) is slidably connected to a second electric slider (6).

5. The ultrasonic welding apparatus for integrated circuit wire bonding according to claim 4, characterized in that: The top of the second electric slider (6) is fixedly connected to a connecting plate (7), the bottom of the connecting plate (7) is fixedly connected to a hydraulic cylinder (8) by bolts, the bottom output end of the hydraulic cylinder (8) is fixedly connected to a mounting plate (9) by bolts, and the bottom of the mounting plate (9) is fixedly connected to the top of the ultrasonic welding head (10).

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