Laser processing apparatus

Abstract

The application relates to a laser processing equipment, which comprises a processing mechanism, a processing table and a laser assembly, the light path outlet of the laser assembly is arranged corresponding to the processing table, the processing table is provided with a negative pressure channel, a negative pressure inlet and a plurality of negative pressure outlets communicated with the negative pressure channel, and a blocking piece is detachably arranged at part of the negative pressure outlets so that the processing table can place workpieces of different sizes. According to the above scheme, the blocking piece is removed from the negative pressure outlet of the processing table, and then a first-size workpiece to be processed can be placed on the processing table. The blocking piece is installed at part of the negative pressure outlets, the negative pressure outlets are blocked by the blocking piece, and a second-size workpiece to be processed can be placed on the processing table. The negative pressure outlets are blocked by the blocking piece, the processing of workpieces of different sizes is realized, and the compatibility of workpieces of different sizes is realized.

Description

Technical Field

[0001] This application relates to the field of photovoltaic cell technology, and in particular to laser processing equipment. Background Technology

[0002] Photovoltaic power generation is a power generation device that uses photovoltaic cells to convert solar energy into electrical energy based on the photoelectric effect. During the processing of photovoltaic cells, laser processing technology is required to treat the cells. For example, microchannels are created in the passivation layer on the back of the cell, allowing the metal electrodes to form ohmic contacts with the substrate; or lasers are used to create patterns on the front of the cell for laying fine grid lines.

[0003] In related technologies, laser processing equipment includes a processing platform on which solar cells are placed and processed using a laser component. However, the aforementioned laser processing equipment can only process solar cells of a specific size and cannot meet the processing needs of solar cells of multiple sizes. Utility Model Content

[0004] Based on this, this application provides a laser processing device to solve the problem that laser processing devices in the related art cannot meet the processing needs of battery cells of various sizes.

[0005] This application provides a laser processing device, which includes: a processing mechanism, including a processing table and a laser component, wherein the optical path outlet of the laser component is provided corresponding to the processing table; the processing table is provided with a negative pressure channel and a negative pressure inlet and multiple negative pressure outlets connected to the negative pressure channel; and a sealing component, which is detachably provided at some of the negative pressure outlets so that the processing table can place workpieces of different sizes to be processed.

[0006] In one embodiment, the negative pressure channel includes a first channel and a plurality of second channels. The first channel extends along a first direction, the second channels extend along a second direction, and the plurality of second channels are arranged at intervals along the first direction, with the first and second directions intersecting. A negative pressure inlet is disposed in the first channel, and the plurality of second channels are all connected to the first channel. The first channel and the plurality of second channels are all provided with negative pressure outlets. A sealing element is detachably disposed at the negative pressure outlet of the first channel.

[0007] In one embodiment, the processing table is provided with multiple placement stations. The processing table is rotatably arranged around an axis extending in a third direction, such that some placement stations are located in pre-placement positions and the remaining placement stations are located in processing positions. The processing positions are set to correspond to the optical path exit of the laser component, and the pre-placement positions are located on one side of the processing positions.

[0008] In one embodiment, the laser processing equipment further includes a transfer mechanism and a feeding mechanism. The feeding mechanism is located upstream of the processing mechanism. The transfer mechanism includes a transfer arm, which is rotatably arranged around an axis and has a first position and a second position. The transfer arm is provided with multiple gripping parts. When the transfer arm is in the first position, the multiple gripping parts are arranged corresponding to the feeding mechanism. When the transfer arm is in the second position, the multiple gripping parts move to the placement station located at the pre-placement position. The multiple gripping parts and the partial placement station are arranged in a one-to-one correspondence.

[0009] In one embodiment, the laser processing equipment further includes a feeding mechanism, and the feeding mechanism and the feeding mechanism are located on both sides of the processing table; the transfer arm also has a third position corresponding to the feeding mechanism; there are two transfer arms, and when one transfer arm is in the first position, the other transfer arm is in the second position; when one transfer arm is in the second position, the other transfer arm is in the third position.

[0010] In one embodiment, the processing table includes a rotating table and multiple hollow plates. The rotating table is rotatably arranged, and the negative pressure channel, negative pressure inlet and multiple negative pressure outlets are all arranged on the hollow plates. Multiple placement stations are arranged on the same side of the rotating table along a third direction, and each placement station is provided with a hollow plate. The height difference between the surfaces of the multiple hollow plates is less than or equal to 20 μm.

[0011] In one embodiment, the laser processing equipment further includes a dust removal mechanism, which includes a dust removal hood and an exhaust fan. The dust removal hood is placed at the processing position, and the exhaust fan is connected to the inner cavity of the dust removal hood. The dust removal hood is provided with a clearance opening to avoid the optical path exit of the laser component.

[0012] In one embodiment, the dust removal mechanism further includes a blower, with the blower and exhaust fan located on opposite sides of the dust removal hood, and the air outlet of the blower corresponding to the processing position.

[0013] In one embodiment, the dust collector hood is provided with an air extraction port, and the exhaust fan is connected to the inner cavity of the dust collector hood through the air extraction port. A detection element is provided at the air extraction port for detecting fragments.

[0014] In one embodiment, the laser processing equipment further includes a marble base, which includes a processing platform and an optical platform. The processing platform and the optical platform are spaced apart along a second direction. The processing table is rotatably disposed on the processing platform, and the laser component is disposed on the optical platform. The laser processing equipment also includes an identification mechanism, which includes an identification bracket and an identification element. The identification bracket is disposed on the marble base, and the identification element is disposed on the identification bracket and faces the processing table. The identification element is used to identify the workpiece to be processed.

[0015] By applying the technical solution of this application, the sealing component is removed from the negative pressure outlet of the processing table, allowing a workpiece of a first size to be processed to be placed on the processing table. Air is drawn in through the negative pressure inlet, creating negative pressure suction within the negative pressure channel and at multiple negative pressure outlets, thus adsorbing the workpiece onto the processing table. A laser beam is then emitted through the optical path outlet of the laser assembly, enabling the processing of the workpiece. Alternatively, by installing the sealing component at some of the negative pressure outlets, these outlets can be blocked, preventing negative pressure suction. A workpiece of a second size can then be placed on the processing table, and the remaining negative pressure outlets will adsorb it onto the processing table, allowing the laser assembly to process it. By using the above solution and the removal and installation of the sealing component at the negative pressure outlets, processing of workpieces of different sizes can be achieved, realizing compatibility with workpieces of different sizes. Attached Figure Description

[0016] Figure 1 A partial structural schematic diagram of the laser processing equipment provided in an embodiment of this application is shown.

[0017] Figure 2 It shows Figure 1 A magnified view of a portion of point A in the middle.

[0018] Figure 3 A schematic diagram of the structure of the perforated plate provided in an embodiment of this application is shown.

[0019] Figure 4 A schematic diagram of the dust removal mechanism provided in an embodiment of this application is shown.

[0020] Figure 5 A schematic diagram of the structure of the marble base provided in an embodiment of this application is shown.

[0021] Figure 6 A schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application is shown.

[0022] Explanation of reference numerals in the attached figures:

[0023] 10. Machining mechanism; 11. Machining table; 111. Negative pressure channel; 1111. First channel; 1112. Second channel; 112. Negative pressure inlet; 113. Negative pressure outlet; 114. Pre-placement position; 115. Machining position; 116. Rotating table; 117. Hollow plate; 12. Laser component; 20. Sealing component; 30. Transfer mechanism; 31. Transfer arm; 311. Gripping part; 40. Feeding mechanism; 50. Unloading mechanism; 60. Dust removal mechanism; 61. Dust hood; 611. Clearance opening; 612. Air extraction port; 62. Exhaust fan; 63. Blower; 70. Marble base; 71. Machining platform; 72. Optical platform; 80. Identification mechanism; 81. Identification bracket; 82. Identification component; 90. Workpiece to be processed. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0025] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0026] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0030] See Figures 1 to 3 , Figure 1 A partial structural schematic diagram of the laser processing equipment provided in an embodiment of this application is shown. Figure 2 It shows Figure 1 A magnified view of a portion of point A in the middle. Figure 3 A schematic diagram of the structure of the perforated plate provided in an embodiment of this application is shown. One embodiment of this application provides a laser processing device, which includes a processing mechanism 10 and a sealing component 20. The processing mechanism 10 includes a processing table 11 and a laser assembly 12. The optical path outlet of the laser assembly 12 is disposed corresponding to the processing table 11. The processing table 11 is provided with a negative pressure channel 111 and a negative pressure inlet 112 and multiple negative pressure outlets 113 communicating with the negative pressure channel 111. The sealing component 20 is detachably disposed at some of the negative pressure outlets 113, so that the processing table 11 can hold workpieces 90 of different sizes to be processed.

[0031] By applying the technical solution of this application, the sealing member 20 is removed from the negative pressure outlet 113 of the processing table 11, allowing the workpiece 90 of the first size to be processed to be placed on the processing table 11. Air is drawn through the negative pressure inlet 112, generating negative pressure suction within the negative pressure channel 111 and at multiple negative pressure outlets 113, thus adsorbing the workpiece 90 onto the processing table 11. A laser beam is then emitted through the optical path outlet of the laser assembly 12, enabling the processing of the workpiece 90. Alternatively, by installing the sealing member 20 at a portion of the negative pressure outlets 113, the negative pressure outlets 113 can be blocked, preventing negative pressure suction from being generated at that portion. A workpiece 90 of the second size can then be placed on the processing table 11, and the remaining negative pressure outlets 113 can be used to adsorb the workpiece 90 onto the processing table 11, allowing the laser assembly 12 to process the workpiece 90. By adopting the above scheme, the installation and removal of the sealing component 20 at the negative pressure outlet 113 can realize the processing of workpieces 90 of different sizes, thus achieving compatibility of workpieces 90 of different sizes.

[0032] Depending on the arrangement of the multiple negative pressure outlets 113 on different processing tables 11, when switching to workpieces 90 of different sizes, the position and number of the negative pressure outlets 113 blocked by the sealing component 20 need to be changed accordingly.

[0033] In this application, the workpiece 90 to be processed refers to a silicon wafer. Furthermore, the negative pressure outlets 113 in this application are arranged in rows and columns. When all negative pressure outlets 113 are unblocked by the sealing element 20, a whole 210mm x 210mm silicon wafer can be laser-processed. When some negative pressure outlets 113 are blocked by the sealing element 20, a half 210mm x 105mm silicon wafer can be laser-processed. In this application, when processing a half silicon wafer, the two outermost rows of negative pressure outlets 113 are blocked using the sealing element 20, allowing the silicon wafer of this size to be arranged on the processing table 11, and the remaining negative pressure outlets 113 to be used for adsorption. By being compatible with both whole and half wafer processing, when increased production capacity is required, the whole silicon wafer processing equipment can be used directly without equipment switching. Furthermore, only the blocking of the negative pressure outlets 113 is needed to switch between half and whole wafer equipment with a single click.

[0034] In some embodiments, the laser assembly 12 mainly includes optical elements such as a laser, a reflector, a beam expander, a DOE (Distribution Optical Array), a scanning galvanometer, and a field lens. The laser beam generated by the laser is processed and transmitted by the aforementioned series of optical elements, and then focused onto the surface of the silicon wafer to achieve the processing of the silicon wafer.

[0035] In this application, the laser processing equipment can be used for processing BC batteries, employing a top-tier laser with stable laser power and high beam quality. Imported scanning galvanometers are used to ensure laser processing precision.

[0036] Combination Figure 3 As shown, the negative pressure channel 111 includes a first channel 1111 and a plurality of second channels 1112. The first channel 1111 extends along a first direction Y, and the second channels 1112 extend along a second direction X. The plurality of second channels 1112 are arranged at intervals along the first direction Y, and the first direction Y and the second direction X intersect. A negative pressure inlet 112 is disposed in the first channel 1111, and the plurality of second channels 1112 are all connected to the first channel 1111. Both the first channel 1111 and the plurality of second channels 1112 are provided with negative pressure outlets 113. A sealing member 20 is detachably disposed at the negative pressure outlet 113 of the first channel 1111. By adopting the above design and the above row and column arrangement, multiple second channels 1112 can all form negative pressure through only one first channel 1111. Furthermore, by simply blocking the connection between the first channel 1111 and the second channel 1112, all negative pressure suction ports corresponding to the second channel 1112 can be blocked, reducing the number of sealing components 20 used and improving operational efficiency.

[0037] In some embodiments, a negative pressure outlet 113 is provided at the connection between the first channel 1111 and each of the second channels 1112. The negative pressure outlet 113 is blocked by the sealing member 20, which can block the second channel 1112 and the negative pressure outlet 113 provided in the second channel 1112.

[0038] Combination Figure 2 As shown, the processing table 11 is provided with multiple placement stations. The processing table 11 is rotatably arranged around an axis extending in the third direction Z, so that some placement stations are located at pre-placement positions 114, and the remaining placement stations are located at processing positions 115. The processing position 115 is set at the optical path exit of the laser component 12, and the pre-placement position 114 is located to one side of the processing position 115. With the above design, by placing some placement stations at the processing position 115, the workpiece 90 to be processed at that position can be processed. By placing some placement stations at the pre-placement positions 114, the workpiece 90 to be processed can be placed at the placement stations in advance. Then, by rotating the processing table 11, the placement stations can be moved to the processing position 115, thereby saving the placement time of the workpiece 90 to be processed and improving processing efficiency.

[0039] In this embodiment, the processing table 11 is provided with four placement stations, which are arranged in pairs opposite each other. That is, two placement stations can be in the processing position 115 at the same time, and the other two placement stations can be in the pre-placement position 114 at the same time. This enables the simultaneous processing of two workpieces 90 to be processed, further improving processing efficiency.

[0040] Combination Figure 2 As shown, the laser processing equipment also includes a transfer mechanism 30 and a loading mechanism 40. The loading mechanism 40 is located upstream of the processing mechanism 10. The transfer mechanism 30 includes a transfer arm 31, which is rotatably arranged around an axis and has a first position and a second position. The transfer arm 31 is provided with a plurality of gripping parts 311. When the transfer arm 31 is in the first position, the plurality of gripping parts 311 are arranged corresponding to the loading mechanism 40. When the transfer arm 31 is in the second position, the plurality of gripping parts 311 move to the placement station located at the pre-placement position 114. The plurality of gripping parts 311 and the placement station are arranged one-to-one. Using the above design, the workpiece 90 to be processed is placed on the feeding mechanism 40, and the feeding mechanism 40 is used to transport the workpiece 90 to be processed. When the transfer arm 31 is in the first position, the gripping part 311 grips the workpiece 90 to be processed. When the transfer arm 31 rotates to the second position, the gripping part 311 moves to the placement station located at the pre-placement station, thereby releasing the workpiece 90 to be processed to the placement station and realizing the feeding of the workpiece 90 to be processed.

[0041] In this embodiment, the transfer arm 31 is equipped with two gripping parts 311, which correspond to two placement stations located at the pre-placement position 114. Each time, the transfer arm 31 can use the two gripping parts 311 to grip two workpieces 90 to be processed and place them at their respective placement stations. By simultaneously feeding and processing two silicon wafers, the processing time for each silicon wafer can be controlled within 0.7 seconds, the maximum cycle time can be controlled within 1.4 seconds, and the overall production capacity of the equipment can reach 10,000 wafers.

[0042] In some embodiments, the gripping unit 311 employs a suction cup to adhere the workpiece 90 to be processed onto the transfer arm 31 and move along with the transfer arm 31. After the transfer arm 31 moves to the second position, the suction cup releases the workpiece 90 to be processed to the placement station.

[0043] The feeding mechanism 40 includes multiple conveyor belts arranged sequentially along the second direction X. On the side of the feeding mechanism 40 away from the processing table 11, there is also a basket mechanism for temporarily storing the workpieces 90 to be processed. Multiple workpieces 90 to be processed are placed on the basket mechanism. The basket mechanism is used to transfer the multiple workpieces 90 to be processed sequentially to the conveyor belt, and the conveyor belt is used to transport the workpieces 90 to be processed to the corresponding area of ​​the transfer arm 31. Then, the transfer arm 31 is used to realize the transfer of the workpieces 90 to be processed.

[0044] Combination Figure 2 As shown, the laser processing equipment also includes a feeding mechanism 50, and the feeding mechanism 40 and feeding mechanism 50 are located on both sides of the processing table 11. The transfer arm 31 also has a third position corresponding to the feeding mechanism 50. There are two transfer arms 31; when one transfer arm 31 is in the first position, the other transfer arm 31 is in the second position. When one transfer arm 31 is in the second position, the other transfer arm 31 is in the third position. With this design, when one transfer arm 31 is in the first position, it can grip the workpiece 90 to be processed. At this time, when the other transfer arm 31 is in the second position, it can release the gripped workpiece 90 to the placement station. When one transfer arm 31 is in the second position, it can grip the processed workpiece. At this time, when the other transfer arm 31 is in the second position, it can release the gripped workpiece to the feeding mechanism 50.

[0045] Through the above-mentioned arrangement of various mechanisms and the reasonable design of the transfer mechanism 30, the automation of workpiece loading, processing and unloading can be realized, and the speed of workpiece transfer can be accelerated, thereby improving processing efficiency.

[0046] In some embodiments, the loading mechanism 40 and the unloading mechanism 50 are arranged sequentially along the first direction Y, and the unloading mechanism 50 has the same structure as the loading mechanism 40 but operates in different directions. The transfer mechanism 30 is located between the loading mechanism 40 and the unloading mechanism 50, and the processing table 11 and the transfer mechanism 30 are arranged sequentially along the second direction X. This arrangement enables rapid transfer of workpieces between the mechanisms.

[0047] Combination Figure 2 and Figure 3As shown, the processing table 11 includes a rotating table 116 and multiple perforated plates 117. The rotating table 116 is rotatably arranged, and the negative pressure channel 111, negative pressure inlet 112, and multiple negative pressure outlets 113 are all disposed on the perforated plates 117. Multiple placement stations are all disposed on the same side of the rotating table 116 along the third direction Z. Each placement station is provided with a perforated plate 117, and the height difference between the surfaces of the multiple perforated plates 117 is less than or equal to 20μm. By adopting the above design, by controlling the height difference between the surfaces of the perforated plates 117 to within 20μm, the height difference between the surfaces of each perforated plate 117 can be reduced, so that after the workpieces 90 to be processed are placed at the placement stations, the height difference between each workpiece 90 to be processed is within the required range, thereby reducing processing errors.

[0048] The design of the perforated plate 117 allows fragments generated during processing to leak through the holes in the perforated plate 117 and thus not affect the subsequent processing of the workpiece 90, ensuring processing quality.

[0049] In some embodiments, the motor of the turntable 116 has a small moment of inertia, and the turntable rotation time can be controlled within 200ms.

[0050] Figure 4 A schematic diagram of the dust removal mechanism provided in an embodiment of this application is shown. Figure 6 A schematic diagram of the structure of the laser processing equipment provided in an embodiment of this application is shown. (Combined with...) Figure 4 and Figure 6 As shown, the laser processing equipment also includes a dust removal mechanism 60, which includes a dust removal hood 61 and an exhaust fan 62. The dust removal hood 61 is installed at the placement position of the processing position 115, and the exhaust fan 62 is connected to the inner cavity of the dust removal hood 61. The dust removal hood 61 is provided with a clearance opening 611 to avoid the optical path exit of the laser component 12. By using the above-mentioned dust removal mechanism 60, the dust generated during laser processing can be effectively removed, ensuring a clean processing environment and preventing dust from affecting the processing quality of the silicon wafer.

[0051] In some embodiments, the dust removal mechanism 60 further includes a dust removal cabinet, and an exhaust fan 62 is disposed in the dust removal cabinet.

[0052] Combination Figure 4 As shown, the dust removal mechanism 60 also includes a blower 63. The blower 63 and the exhaust fan 62 are located on opposite sides of the dust removal hood 61, and the air outlet of the blower 63 is positioned corresponding to the processing position 115. The blower 63 blows air into the dust removal hood 61, thereby blowing the dust inside the dust removal hood 61 toward one side of the exhaust fan 62, so that the exhaust fan 62 can suck the dust out of the dust removal hood 61.

[0053] By combining the blower 63 and the exhaust fan 62, a positive airflow can be formed inside the dust removal hood 61, ensuring the effectiveness of dust removal.

[0054] Combination Figure 4 As shown, the dust collector hood 61 is equipped with an exhaust port 612. The exhaust fan 62 is connected to the inner cavity of the dust collector hood 61 through the exhaust port 612. A detection element is installed at the exhaust port 612 to detect debris. By detecting debris at the exhaust port 612, it is possible to prevent debris from being sucked into the dust collection pipeline and ensure the safe and stable operation of the dust collection system.

[0055] Figure 5 A schematic diagram of the structure of a marble base provided in an embodiment of this application is shown. (Combined with...) Figure 5 As shown, the laser processing equipment also includes a marble base 70, which includes a processing platform 71 and an optical platform 72. The processing platform 71 and the optical platform 72 are spaced apart along a second direction X. The processing table 11 is rotatably mounted on the processing platform 71, and the laser assembly 12 is mounted on the optical platform 72. Using a marble base 70 can increase the stability of the equipment during operation.

[0056] In some embodiments, the marble base 70 includes a first base and a second base. The second base is provided with a plurality of columns, which support the first base, such that the height of the second base is greater than the height of the first base. A processing platform 71 is disposed on the first base, and an optical platform 72 is disposed on the second base. This allows the optical platform 72 to be positioned appropriately and to have high precision and high stability.

[0057] In some embodiments, the laser processing equipment further includes an identification mechanism 80, which includes an identification bracket 81 and an identification element 82. The identification bracket 81 is disposed on a marble base 70, and the identification element 82 is disposed on the identification bracket 81 and faces the processing table 11. The identification element 82 is used to identify the workpiece 90 to be processed. The identification element 82 enables the positioning and identification of silicon wafers, quickly and accurately identifying the position, angle, and surface features of the silicon wafers, providing precise positioning information for laser processing and ensuring the accuracy and precision of laser processing.

[0058] In some embodiments, the identification element 82 includes five identification cameras, all of which are disposed on the identification bracket 81. Four of the identification cameras are located around the periphery of another identification camera, the identification camera located in the middle can be used for contour positioning of the silicon wafer, and the other four identification cameras can identify Mark point positioning.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser processing device, characterized in that, The laser processing equipment includes: The processing mechanism includes a processing table and a laser component, wherein the optical path outlet of the laser component is provided corresponding to the processing table; the processing table is provided with a negative pressure channel and a negative pressure inlet and multiple negative pressure outlets connected to the negative pressure channel; A sealing element is detachably disposed at part of the negative pressure outlet so that the processing table can hold workpieces of different sizes.

2. The laser processing equipment according to claim 1, characterized in that, The negative pressure channel includes a first channel and a plurality of second channels. The first channel extends along a first direction, and the second channels extend along a second direction. The plurality of second channels are arranged at intervals along the first direction, and the first direction and the second direction intersect. The negative pressure inlet is disposed in the first channel, and the plurality of second channels are all connected to the first channel. The first channel and the plurality of second channels are all provided with the negative pressure outlet. The sealing member is detachably disposed at the negative pressure outlet of the first channel.

3. The laser processing equipment according to claim 1, characterized in that, The processing table is provided with multiple placement stations. The processing table is rotatably arranged around an axis extending in a third direction, so that some of the placement stations are located in pre-placement positions and the remaining placement stations are located in processing positions. The processing positions are set corresponding to the optical path outlet of the laser component, and the pre-placement positions are located on one side of the processing positions.

4. The laser processing equipment according to claim 3, characterized in that, The laser processing equipment further includes a transfer mechanism and a loading mechanism. The loading mechanism is located upstream of the processing mechanism. The transfer mechanism includes a transfer arm, which is rotatably arranged around the axis and has a first position and a second position. The transfer arm is provided with multiple gripping parts. When the transfer arm is in the first position, the multiple gripping parts are arranged corresponding to the loading mechanism. When the transfer arm is in the second position, the multiple gripping parts move to the placement station located at the pre-placement position. The multiple gripping parts and the placement station are arranged in a one-to-one correspondence.

5. The laser processing equipment according to claim 4, characterized in that, The laser processing equipment further includes a feeding mechanism, and the feeding mechanism and the feeding mechanism are respectively located on both sides of the processing table; the transfer arm also has a third position corresponding to the feeding mechanism; there are two transfer arms, and when one of the transfer arms is in the first position, the other transfer arm is in the second position; when one of the transfer arms is in the second position, the other transfer arm is in the third position.

6. The laser processing equipment according to claim 3, characterized in that, The processing table includes a rotating table and multiple hollow plates. The rotating table is rotatably arranged. The negative pressure channel, the negative pressure inlet, and the multiple negative pressure outlets are all arranged on the hollow plates. The multiple placement stations are all arranged on the same side of the rotating table along the third direction. Each placement station is provided with a hollow plate. The height difference between the surfaces of the multiple hollow plates is less than or equal to 20μm.

7. The laser processing equipment according to claim 3, characterized in that, The laser processing equipment also includes a dust removal mechanism, which includes a dust removal hood and an exhaust fan. The dust removal hood is placed at the processing position, and the exhaust fan is connected to the inner cavity of the dust removal hood. The dust removal hood is provided with a clearance opening to avoid the optical path outlet of the laser component.

8. The laser processing equipment according to claim 7, characterized in that, The dust removal mechanism also includes a blower, which and the exhaust fan are located on opposite sides of the dust removal hood, and the air outlet of the blower is set corresponding to the processing position.

9. The laser processing equipment according to claim 7, characterized in that, The dust collector hood is provided with an air extraction port, and the exhaust fan is connected to the inner cavity of the dust collector hood through the air extraction port. A detection element is provided at the air extraction port, and the detection element is used to detect fragments.

10. The laser processing equipment according to claim 1, characterized in that, The laser processing equipment also includes a marble base, which includes a processing platform and an optical platform. The processing platform and the optical platform are spaced apart along a second direction. The processing table is rotatably mounted on the processing platform, and the laser component is mounted on the optical platform. The laser processing equipment also includes an identification mechanism, which includes an identification bracket and an identification component. The identification bracket is disposed on the marble base, and the identification component is disposed on the identification bracket and faces the processing table. The identification component is used to identify the workpiece to be processed.

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