An electronic device housing processing apparatus

Abstract

The utility model relates to electronic equipment shell processing device relates to electronic equipment shell processing technical field, it contains machine table and installs the frame on machine table, installs the engraving assembly and the conduction point probe assembly for removing the oxide film on electronic equipment shell on the frame, is equipped with the clamping piece for clamping electronic equipment shell on the machine table, and the driving assembly that drives the clamping piece moves along the length, width direction of machine table is installed on the machine table. Adopt above -mentioned technical scheme this device can automatically transport electronic equipment shell and carry out the film breaking processing, static electricity release and static electricity detection, and these operations can be completed on a device, make electronic equipment shell processing more fast, work efficiency higher.

Description

Technical Field

[0001] This utility model relates to the field of electronic device housing processing technology, and specifically to an electronic device housing processing device. Background Technology

[0002] Although the casing of electronic devices undergoes anodizing (forming a dense Al2O3 insulating layer), static charge buildup occurs when internal electronic components operate. If not discharged, this can lead to two major hazards: 1. Electrostatic coupling affects signal transmission stability, causing electromagnetic interference; 2. High-voltage static electricity may damage components, potentially causing spontaneous combustion / explosion in extreme cases, posing a safety hazard. To maintain overall protection, a controllable conductive path is created. For example, the antenna feed points on the metal frame of mobile phones / tablets and the grounding screw mounting points on industrial controller enclosures require pre-removal of the oxide layer to ensure reliable grounding. During the process from oxide removal to conductivity testing, precise local modification of the device / tablet is used to construct a safe electrostatic discharge path while ensuring the casing's protective performance.

[0003] Currently, the membrane breaking and conductivity testing of electronic device casings need to be performed in batches, which is quite cumbersome. This paper proposes an electronic device casing processing device to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings and deficiencies of existing technologies by providing an electronic device housing processing apparatus. This apparatus can automatically transport electronic device housings for membrane breaking, electrostatic discharge, and electrostatic detection, and these operations can be completed on a single device, making electronic device housing processing faster and more efficient.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: an electronic device housing processing device, including a machine base and a frame mounted on the machine base. The frame is equipped with a laser engraving component and a conductive point probe component for removing oxide film from the electronic device housing. The machine base is provided with a clamping component for holding the electronic device housing, and a driving component is installed on the machine base to drive the clamping component to move along the length and width of the machine base.

[0006] Preferably, the machine base is equipped with a control module, and the laser engraving component, the conductive point probe component, and the drive component are all electrically connected to the control module.

[0007] Preferably, the drive assembly includes a first movable component mounted on the machine base and a second movable component mounted on the first movable component. The first movable component drives the second movable component to move along the length direction of the machine base, and the second movable component drives the clamping component to move along the width direction of the machine base. Both the first movable component and the second movable component are electrically connected to the control module.

[0008] Preferably, the continuity probe assembly includes a third moving component, a mounting base, continuity probes, and a signal processing unit. The third moving component is mounted on the frame and located next to the laser engraving assembly. The mounting base is detachably connected to the third moving component. Several continuity probes are provided and are all mounted on the bottom of the mounting base. The third moving component drives the mounting base and continuity probes to move along the height direction of the frame. The third moving component, the signal processing unit, and the control module are electrically connected to each other.

[0009] Preferably, the signal processing unit includes an excitation source and a detection module, both of which are electrically connected to a conduction probe.

[0010] Preferably, the excitation source is a constant current source or a pulse voltage generator.

[0011] Preferably, the detection module is a high-precision digital multimeter or an impedance analyzer.

[0012] Preferably, an indicator light is installed on the mounting base. The indicator light is a dual-color light and is electrically connected to the control module.

[0013] Preferably, the laser engraving component includes a laser.

[0014] Preferably, the clamping member includes a placement box for accommodating the housing of an electronic device, the placement box having an elastic layer on all four sides of its inner wall.

[0015] After adopting the above technical solution, the beneficial effects of this utility model are as follows: The drive assembly moves the clamping components and the electronic device housing below the laser engraving assembly. The laser engraving assembly then emits a laser to remove the oxide film from designated areas on the electronic device housing, creating an electrostatic discharge channel. After the oxide film is removed, the drive assembly continues to move the electronic device housing below the continuity probe assembly. The continuity probe assembly then performs electrostatic discharge and electrostatic detection on the electronic device housing. This device can automatically transport the electronic device housing for oxide film removal, electrostatic discharge, and electrostatic detection, all within a single unit, making the processing of electronic device housings faster and more efficient. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a utility model Figure 1 Main view; Figure 3 This is a utility model Figure 1 Side view; Figure 4 This is a schematic diagram of the clamping component structure of this utility model.

[0018] Explanation of reference numerals in the attached drawings: 1. Machine base; 2. Frame; 3. Laser engraving component; 4. First moving part; 5. Second moving part; 6. Clamping part; 61. Placement box; 62. Elastic layer; 7. Third moving part; 8. Mounting base; 9. Conductive probe; 10. Indicator light; 11. Control module. Detailed Implementation

[0019] The present invention will be further described in detail below with reference to the accompanying drawings.

[0020] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive element, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

[0021] This embodiment relates to an electronic device housing processing apparatus, such as... Figure 1-3 As shown, the device includes a machine base 1 and a frame 2 mounted on the machine base 1. The frame 2 is equipped with a laser engraving assembly 3 and a continuity point probe assembly for removing oxide film from the casing of electronic devices. The frame 2 supports the laser engraving assembly 3 and the continuity point probe assembly. The laser engraving assembly 3 includes a laser. The laser emitted by the laser can remove part of the oxide film on the casing of electronic devices, thereby creating an electrostatic discharge channel. The machine base 1 is provided with a clamping member 6 for holding the casing of electronic devices, and the machine base 1 is equipped with a drive assembly that drives the clamping member 6 to move along the length and width of the machine base 1.

[0022] The drive assembly moves the clamping component 6 and the electronic device housing below the laser engraving component 3. The laser engraving component 3 then emits a laser to remove the oxide film from a designated area on the electronic device housing, creating an electrostatic discharge channel. After the film removal is complete, the drive assembly continues to move the electronic device housing below the continuity probe component. The continuity probe component then performs electrostatic discharge and electrostatic detection on the electronic device housing. This device can automatically transport the electronic device housing for film removal, electrostatic discharge, and electrostatic detection, all within a single unit, making the processing of electronic device housings faster and more efficient.

[0023] The machine 1 is equipped with a control module 11. The laser engraving component 3, the continuity point probe component and the drive component are all electrically connected to the control module 11. The control module 11 is a computer or control panel. The working interval time of the laser engraving component 3, the continuity point probe component and the drive component can be preset through the control module 11, making the device more automated.

[0024] The drive assembly includes a first moving part 4 mounted on the machine base 1 and a second moving part 5 mounted on the first moving part 4. The first moving part 4 drives the second moving part 5 to move along the length direction of the machine base 1, and the second moving part 5 drives the clamping part 6 to move along the width direction of the machine base 1. Both the first moving part 4 and the second moving part 5 are electrically connected to the control module 11. Both the first moving part 4 and the second moving part 5 are electric guide rails.

[0025] Specifically, such as Figure 1-3 As shown, the continuity probe assembly includes a third moving part 7, a mounting base 8, continuity probes 9, and a signal processing unit (not shown). The third moving part 7 is mounted on the frame 2 and located next to the laser engraving assembly 3. The mounting base 8 is detachably connected to the third moving part 7. Several continuity probes 9 are provided and are all mounted on the bottom of the mounting base 8. The third moving part 7 drives the mounting base 8 and the continuity probes 9 to move along the height direction of the frame 2. The third moving part 7, the signal processing unit, and the control module 11 are electrically connected. The third moving part 7 is an electric guide rail.

[0026] Furthermore, the signal processing unit includes an excitation source and a detection module, both of which are electrically connected to the conduction probe 9; the excitation source is a constant current source or a pulse voltage generator; the detection module is a high-precision digital multimeter or an impedance analyzer.

[0027] like Figure 1-2 As shown, an indicator light 10 is installed on the mounting base 8. The indicator light 10 is a dual-color light, including a red light and a green light. The indicator light 10 is electrically connected to the control module 11. When the continuity probe assembly detects static electricity on the electronic device housing, the control module 11 activates the red light in the indicator light 10 to indicate that the electronic device housing is currently in a defective state. When the continuity probe assembly has completely discharged the static electricity on the electronic device housing and no static electricity is detected, the control module 11 activates the green light in the indicator light 10 to indicate that the electronic device housing has passed the test.

[0028] like Figure 4 As shown, the clamping member 6 includes a placement box 61 for accommodating the electronic device housing. The inner wall of the placement box 61 has an elastic layer 62 around its perimeter. The elastic layer 62 is made of soft rubber or an elastic clamping member so that the electronic device housing is stably positioned inside the placement box 61.

[0029] The working principle of this utility model is roughly as follows: First, the electronic device housing is clamped by the clamping member 6. The first moving member 4 and the second moving member 5 are activated by the control module 11. The first moving member 4 will drive the second moving member 5, the clamping member 6 and the electronic device housing to move together along the length direction of the machine platform 1. At the same time, the second moving member 5 will drive the clamping member 6 and the electronic device housing to move along the width direction of the machine platform 1. When the film breaking point of the electronic device housing is located below the laser, the control module 11 will shut down the first moving member 4 and the second moving member 5. The laser will emit laser light to remove the oxide film at that point. After the membrane is broken, the first moving part 4 and the second moving part 5 are activated to move the electronic device housing to below several conductive probes 9. Then, the first moving part 4 and the second moving part 5 are closed, and the third moving part 7 is activated to move the mounting base 8 and the conductive probes 9 downward along the height direction of the frame 2, so that the several conductive probes 9 come into contact with the electrostatic discharge channel of the electronic device housing. The conductive probes 9 can discharge the static electricity on the electronic device housing. At the same time, the excitation source will apply a small voltage to the tip of the conductive probe 9 through the wire. The detection module will detect the current between the tip of the conductive probe 9 and the electronic device housing, and calculate the conductance value. The detection module will transmit this information to the control module 11. When the conductive probe assembly detects static electricity on the electronic device housing, the control module 11 will activate the red light in the indicator light 10 to indicate that the electronic device housing is in a non-compliant state. When the conductive probe assembly has completely discharged the static electricity on the electronic device housing and no static electricity is detected, the control module 11 will activate the green light in the indicator light 10 to indicate that the electronic device housing has passed the test.

[0030] The above is only used to illustrate the technical solution of this utility model and not to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. An apparatus for processing electronic device housings, characterized in that, include: The machine base (1) and the frame (2) mounted on the machine base (1) are provided with a laser engraving component (3) and a conductive point probe component for removing oxide film on the electronic device housing. The machine base (1) is provided with a clamping component (6) for clamping the electronic device housing, and the machine base (1) is provided with a drive component for moving the clamping component (6) along the length and width of the machine base (1).

2. The electronic device housing processing apparatus according to claim 1, characterized in that: The machine tool (1) is equipped with a control module (11), and the laser engraving component (3), the conductive point probe component and the drive component are all electrically connected to the control module (11).

3. The electronic device housing processing apparatus according to claim 2, characterized in that: The drive assembly includes a first moving part (4) mounted on the machine base (1) and a second moving part (5) mounted on the first moving part (4). The first moving part (4) drives the second moving part (5) to move along the length direction of the machine base (1), and the second moving part (5) drives the clamping part (6) to move along the width direction of the machine base (1). Both the first moving part (4) and the second moving part (5) are electrically connected to the control module (11).

4. The electronic device housing processing apparatus according to claim 3, characterized in that: The conduction point probe assembly includes a third moving part (7), a mounting base (8), conduction probes (9) and a signal processing unit. The third moving part (7) is mounted on the frame (2) and located next to the laser engraving assembly (3). The mounting base (8) is detachably connected to the third moving part (7). Several conduction probes (9) are provided and are all mounted on the bottom of the mounting base (8). The third moving part (7) drives the mounting base (8) and the conduction probes (9) to move along the height direction of the frame (2). The third moving part (7), the signal processing unit and the control module (11) are electrically connected to each other.

5. The electronic device housing processing apparatus according to claim 4, characterized in that: The signal processing unit includes an excitation source and a detection module, both of which are electrically connected to the conduction probe (9).

6. The electronic device housing processing apparatus according to claim 5, characterized in that: The excitation source is a constant current source or a pulse voltage generator.

7. The electronic device housing processing apparatus according to claim 5, characterized in that: The detection module is a high-precision digital multimeter or impedance analyzer.

8. The electronic device housing processing apparatus according to claim 2, characterized in that: An indicator light (10) is installed on the mounting base (8). The indicator light (10) is a dual-color light and is electrically connected to the control module (11).

9. The electronic device housing processing apparatus according to claim 1, characterized in that: The laser engraving component (3) includes a laser.

10. The electronic device housing processing apparatus according to claim 1, characterized in that: The clamping member (6) includes a placement box (61) for accommodating the housing of an electronic device, the placement box (61) having an elastic layer (62) on all four sides of its inner wall.

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