A silicon wafer dicing pad cutting apparatus

Abstract

This utility model provides a silicon wafer cutting substrate cutting device, relating to the field of component manufacturing technology. A main body pushing hydraulic rod is welded to the upper right end of the cutting frame. A laser cutting machine is installed on the left side of the side clamping plate, and a fixing bracket is installed on the left side of the laser cutting machine. Under the command of the CNC controller, the wafer body drives the hydraulic rod to bring the wafer body fixing suction vacuum pump head into contact with the surface of the substrate body before cutting. After cutting, the resulting substrate wafer is quickly suctioned and fixed by the wafer body fixing suction vacuum pump head. Subsequently, the wafer body drives the hydraulic rod to retract inward, thereby achieving the purpose of automatically and smoothly moving the substrate wafer out of the cutting area. As the wafer body drives the hydraulic rod to retract the substrate wafer inward, the substrate wafer is stably attached to the substrate wafer clamping frame under the action of adhesive. After the substrate wafer is fixed in the substrate wafer clamping frame, the operator can directly pull the substrate wafer clamping frame out of the fixing bracket and replace it with a new fixing bracket.

Description

Technical Field

[0001] This utility model relates to the field of component manufacturing technology, and in particular to a silicon wafer cutting substrate cutting device. Background Technology

[0002] Silicon wafer substrates are the core substrate of the semiconductor industry. They are made of high-purity single-crystal silicon and provide a flat and clean base for subsequent processes such as thin film growth and circuit etching in chip manufacturing. Silicon wafer substrate cutting is a key upstream process for obtaining usable silicon wafer substrates. It involves dividing large single-crystal silicon ingots into thin slices with uniform thickness and smooth surface through precision cutting technology.

[0003] However, in the existing silicon wafer substrate cutting process, mechanical clamping and feeding are mostly used. However, the physical rigid fixation can easily cause the substrate edge to crack or the surface to be scratched. In addition, the feeding stability is poor during the feeding process, which affects the cutting accuracy. At the same time, after cutting, the substrate wafer needs to be picked up and put down manually, which is inefficient and can easily cause secondary damage during the picking process. The wafer picking is also difficult.

[0004] Therefore, we provide a silicon wafer cutting substrate cutting device to solve the above problems. Utility Model Content

[0005] To overcome the above deficiencies, this utility model provides a silicon wafer cutting substrate cutting device, which aims to solve the aforementioned problems.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: It includes a cutting frame, with a liner slide plate on the upper surface of the cutting frame, side clamping plates at both the front and rear ends of the upper side of the cutting frame, a liner body on the inner side of the side clamping plates, a silicon crystal liner cutting assembly on the outer side of the liner body, a vacuum pump body on the right side of the cutting frame, a main body pushing hydraulic rod welded to the upper right end of the cutting frame, a protective rubber pad at the end of the main body pushing hydraulic rod, a laser cutting machine mounted on the left side of the side clamping plates, a fixing bracket mounted on the left side of the laser cutting machine, and a CNC controller mounted on the front side of the cutting frame.

[0007] Preferably, the liner body is located inside the side plate, the side plate and the liner body are tightly fitted together, and both the liner slide and the side plate are made of polytetrafluoroethylene.

[0008] Preferably, the main body push hydraulic rod and the liner body are bonded to each other through a protective rubber pad, and the main body push hydraulic rod pushes the liner body to move along the liner slide plate.

[0009] Preferably, a feeding vacuum pump head is installed in the middle of each of the main body pushing hydraulic rods. An adsorption pad is adhered to the surface of the feeding vacuum pump head. Through holes are symmetrically arranged on the surfaces of the feeding vacuum pump head and the adsorption pad. The feeding vacuum pump head vacuum adsorbs and fixes the liner body through the adsorption pad. Three sets of feeding vacuum pump heads are arranged vertically at equal intervals. The main body pushing hydraulic rod and the feeding vacuum pump head are electrically connected to the CNC controller.

[0010] Preferably, the inner slot of the fixing bracket is connected to a liner plate frame, the inner surface of the liner plate frame is bonded with adhesive, and the liner plate body is bonded to the surface of the adhesive. The adhesive is a water-soluble pressure-sensitive adhesive.

[0011] Preferably, a plate-driven hydraulic rod is provided on the left side of the fixed card holder, and a plate-fixed adsorption vacuum pump head is installed in the middle of the right end of the plate-driven hydraulic rod. The plate-fixed adsorption vacuum pump head and the plate-driven hydraulic rod are electrically connected to the CNC controller.

[0012] Preferably, the liner body is cut into liner sheet by a laser cutting machine. The sheet drives a hydraulic rod through the inner side of the liner sheet frame and contacts the liner sheet. The sheet drives the hydraulic rod to retract the liner sheet inward and fix the liner sheet to the inner side of the liner sheet frame.

[0013] This invention provides a silicon wafer dicing substrate cutting device. Compared with the prior art, it has the following advantages:

[0014] 1. This silicon wafer cutting liner cutting equipment, when activated by a CNC controller, controls the main body to push the hydraulic rod, which in turn pushes the liner body forward smoothly along the liner slide. The protective rubber pad at the end of the hydraulic rod effectively prevents squeezing damage to the surface of the liner body. The feeding vacuum pump head is controlled to work, and the liner body is vacuum-adsorbed at multiple points through the adsorption rubber pad. As the hydraulic rod pushes the liner body forward, the feeding vacuum pump head maintains stable adsorption on the liner body through the adsorption rubber pad, preventing the liner body from sliding and causing the feeding to exceed the preset amount. Through the synergistic effect of multi-point adsorption and hydraulic push, stable feeding can be ensured while minimizing the risk of damage to the surface of the liner body.

[0015] 2. This silicon wafer cutting substrate cutting equipment, when needed, involves the wafer body driving the hydraulic rod, under the command of the CNC controller, to bring the wafer body fixing suction vacuum pump head into contact with the surface of the substrate body before cutting. After cutting, the resulting substrate is quickly adsorbed and fixed by the wafer body fixing suction vacuum pump head. Subsequently, the wafer body drives the hydraulic rod to retract inward, thereby achieving the purpose of automatically and smoothly removing the substrate from the cutting area. As the wafer body drives the hydraulic rod to retract the substrate inward, the substrate is stably attached to the substrate holder frame under the action of adhesive. After the substrate is fixed in the substrate holder frame, the operator can directly pull the substrate holder frame out of the fixed holder and replace it with a new fixed holder, reducing the tedious operation of manually handling the substrate. The water-soluble pressure-sensitive adhesive ensures no residue during disassembly and facilitates the removal of the substrate, making subsequent cleaning and recycling convenient. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall appearance structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the overall side structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the overall structure of the silicon crystal substrate cutting assembly of this utility model.

[0019] Figure 4 This is a schematic diagram showing the disassembled structure of the main body of this utility model, including the hydraulic rod and the feeding vacuum pump head.

[0020] Figure 5 This is a schematic diagram showing the disassembled structure of the liner plate frame and the liner plate body of this utility model.

[0021] The diagram is labeled as follows: 1. Cutting frame; 2. Liner plate slide plate; 3. Side clamping plate; 4. Liner plate body; 5. Silicon crystal liner plate cutting assembly; 501. Vacuum pump body; 502. Main body push hydraulic rod; 503. Protective rubber pad; 504. Feeding vacuum pump head; 505. Adsorption rubber pad; 506. Laser cutting machine; 507. Fixing clamping frame; 508. Liner plate clamping frame; 509. Adhesive; 510. Liner plate body; 511. Plate body driving hydraulic rod; 512. Plate body fixing adsorption vacuum pump head; 6. CNC controller. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-5 This utility model provides a technical solution: a silicon wafer cutting substrate cutting device, including a cutting frame 1, a substrate slide plate 2 is provided on the upper surface of the cutting frame 1, side clamping plates 3 are provided at the front and rear ends of the upper side of the cutting frame 1, a substrate body 4 is provided on the inner side of the side clamping plate 3, a silicon crystal substrate cutting assembly 5 is provided on the outer side of the substrate body 4, a vacuum pump body 501 is provided on the right side of the cutting frame 1, a main body pushing hydraulic rod 502 is welded to the upper right end of the cutting frame 1, a protective rubber pad 503 is provided at the end of the main body pushing hydraulic rod 502, a laser cutting machine 506 is installed on the left side of the side clamping plate 3, a fixing bracket 507 is installed on the left side of the laser cutting machine 506, and a CNC controller 6 is installed on the front side of the cutting frame 1.

[0024] The liner body 4 is located inside the side plate 3. The side plate 3 and the liner body 4 are tightly fitted together. Both the liner slide plate 2 and the side plate 3 are made of polytetrafluoroethylene.

[0025] When needed, the liner body 4 to be cut is inserted into the side clamping plate 3. At this time, the side clamping plate 3 limits the liner body 4, while the liner slide plate 2 effectively reduces friction and facilitates the smooth sliding of the liner body 4. Through the side clamping plate 3 and the liner slide plate 2, the liner body 4 can be fed smoothly and without deviation during the feeding process. The polytetrafluoroethylene material has excellent wear resistance and low coefficient of friction, which can reduce the wear on the liner body 4.

[0026] The main body push hydraulic rod 502 and the liner body 4 are attached to each other through a protective rubber pad 503. The main body push hydraulic rod 502 pushes the liner body 4 to move along the liner slide plate 2.

[0027] When needed, the main body pushes the hydraulic rod 502, which pushes the liner body 4 to move smoothly along the liner slide plate 2. The protective rubber pad 503 at the end of the main body pushes the hydraulic rod 502 can effectively prevent squeezing damage to the surface of the liner body 4.

[0028] Each of the main body push hydraulic rods 502 is equipped with a feeding vacuum pump head 504. An adsorption pad 505 is adhered to the surface of the feeding vacuum pump head 504. Both the feeding vacuum pump head 504 and the adsorption pad 505 have symmetrical through holes. The feeding vacuum pump head 504 uses the adsorption pad 505 to vacuum adsorb and fix the liner body 4. There are three sets of feeding vacuum pump heads 504 arranged vertically at equal intervals. The main body push hydraulic rod 502 and the feeding vacuum pump head 504 are electrically connected to the CNC controller 6.

[0029] When needed, the CNC controller 6 is activated to control the feeding vacuum pump head 504 to work. The vacuum pump head 504 performs multi-point vacuum adsorption on the liner body 4 through the adsorption pad 505. As the main body pushes the hydraulic rod 502 to push the liner body 4 forward, the feeding vacuum pump head 504 maintains stable adsorption on the liner body 4 through the adsorption pad 505, avoiding the liner body 4 from sliding and causing the feeding to exceed the preset amount. Through the synergistic effect of multi-point adsorption and hydraulic push, the feeding can be stable and the risk of damage to the surface of the liner body 4 can be reduced.

[0030] The inner slot of the fixed card holder 507 is connected to the liner plate card frame 508. The inner surface of the liner plate card frame 508 is bonded with adhesive 509. The surface of the adhesive 509 is bonded with the liner plate body 510. The adhesive 509 is a water-soluble pressure-sensitive adhesive.

[0031] As the sheet body drives the hydraulic rod 511 to retract the liner sheet 510 inward, the liner sheet 510 is stably attached to the liner sheet holder 508 under the action of the adhesive 509. After the liner sheet 510 is fixed in the liner sheet holder 508, the staff can directly pull the liner sheet holder 508 out of the fixing bracket 507 and replace it with a new fixing bracket 507, reducing the tedious operation of manually handling the liner sheet 510. The water-soluble pressure-sensitive adhesive ensures that there is no residue during disassembly and that the liner sheet 510 can be easily removed, facilitating subsequent cleaning and recycling.

[0032] A plate-driven hydraulic rod 511 is provided on the left side of the fixed card holder 507, and a plate-fixed adsorption vacuum pump head 512 is installed in the middle of the right end of the plate-driven hydraulic rod 511. The plate-fixed adsorption vacuum pump head 512 and the plate-driven hydraulic rod 511 are electrically connected to the CNC controller 6.

[0033] When needed, the sheet body drives the hydraulic rod 511 to bring the sheet body fixed adsorption vacuum pump head 512 into contact with the surface of the liner body 4 before cutting, under the instruction of the CNC controller 6. After cutting, the resulting liner sheet body 510 is quickly adsorbed and fixed by the sheet body fixed adsorption vacuum pump head 512. Then the sheet body drives the hydraulic rod 511 to retract inward, thereby achieving the purpose of automatically and smoothly moving the liner sheet body 510 out of the cutting area.

[0034] The liner body 4 is cut by a laser cutting machine 506 to produce a liner sheet 510. The sheet drives the hydraulic rod 511 through the inside of the liner sheet frame 508 and contacts the liner sheet 510. The sheet drives the hydraulic rod 511 to cause the liner sheet 510 to retract inward and fix the liner sheet 510 to the inside of the liner sheet frame 508.

[0035] When needed, the CNC controller 6 starts the laser cutting machine 506 to precisely cut the liner body 4, producing the liner sheet 510. At this time, the sheet drives the hydraulic rod 511 through the middle gap of the liner sheet holder 508 and contacts the liner sheet 510, thus fixing the liner sheet 510 into the liner sheet holder 508. In this way, when the liner sheet holder 508 is removed and replaced, a new set of fixing brackets 507 can be quickly positioned and installed, improving the continuity of operation.

[0036] Working principle: When needed, first place the cutting frame 1 in the required position, then insert the liner body 4 into the side clamping plate 3, and the right side of the liner body 4 is attached to the surface of the protective rubber pad 503 outside the main body pushing hydraulic rod 502. Then, the vacuum pump body 501 controls the feeding vacuum pump head 504 to perform vacuum suction, and the adsorption rubber pad 505 outside the feeding vacuum pump head 504 serves as both an adsorption surface and a buffer surface.

[0037] Once ready, the CNC controller 6 controls the main body to push the hydraulic rod 502 to move the liner body 4 to the left along the liner slide plate 2. After reaching the laser cutting machine 506, the CNC controller 6 controls the sheet body to extend the hydraulic rod 511 to the right until the end of the sheet body driving the hydraulic rod 511 contacts the left side surface of the liner body 4. At the same time, the sheet body fixed adsorption vacuum pump head 512 in the middle of the sheet body driving the hydraulic rod 511 will also be vacuum adsorbed and fixed. Subsequently, as the laser cutting machine 506 cuts out the liner sheet 510 from the liner body 4, the sheet body driving the hydraulic rod 511 will retract inward. Once the liner plate 510 has reached the distance where it is inserted into the liner plate holder 508, the liner plate, along with the hydraulic rod 511 and the liner plate fixed suction vacuum pump head 512, will detach from the surface of the liner plate 510. The adhesive 509 inside the liner plate holder 508 will then bond the liner plate 510 to the inside of the liner plate holder 508. At this point, the operator will remove the liner plate holder 508 from the fixed holder 507 and replace it with a new liner plate holder 508, inserting it into the fixed holder 507 to proceed with the next cutting operation. This completes the use of a silicon wafer cutting liner plate cutting device.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer dicing substrate cutting device, comprising a dicing frame (1), characterized in that: The upper surface of the cutting frame (1) is provided with a liner slide plate (2), the front and rear ends of the upper side of the cutting frame (1) are provided with side clamping plates (3), the inner side of the side clamping plate (3) is provided with a liner body (4), the outer side of the liner body (4) is provided with a silicon crystal liner cutting assembly (5), the right side of the cutting frame (1) is provided with a vacuum pump body (501), the upper right end of the cutting frame (1) is welded with a main body pushing hydraulic rod (502), the end of the main body pushing hydraulic rod (502) is provided with a protective rubber pad (503), the left side of the side clamping plate (3) is equipped with a laser cutting machine (506), the left side of the laser cutting machine (506) is equipped with a fixed clamping bracket (507), and the front side of the cutting frame (1) is equipped with a CNC controller (6).

2. The silicon wafer cutting substrate cutting equipment according to claim 1, characterized in that, The liner body (4) is located inside the side plate (3), and the side plate (3) and the liner body (4) are closely fitted together. The liner slide plate (2) and the side plate (3) are both made of polytetrafluoroethylene.

3. The silicon wafer cutting substrate cutting equipment according to claim 1, characterized in that, The main body push hydraulic rod (502) and the liner body (4) are attached to each other by a protective rubber pad (503), and the main body push hydraulic rod (502) pushes the liner body (4) to move along the liner slide plate (2).

4. The silicon wafer cutting substrate cutting equipment according to claim 1, characterized in that, A feeding vacuum pump head (504) is installed in the middle of each of the main body pushing hydraulic rods (502). An adsorption pad (505) is adhered to the surface of the feeding vacuum pump head (504). Through holes are symmetrically arranged on the surfaces of the feeding vacuum pump head (504) and the adsorption pad (505). The feeding vacuum pump head (504) uses the adsorption pad (505) to vacuum adsorb and fix the liner body (4). Three sets of feeding vacuum pump heads (504) are arranged vertically at equal distances. The main body pushing hydraulic rod (502) and the feeding vacuum pump head (504) are electrically connected to the CNC controller (6).

5. A silicon wafer cutting substrate cutting device according to claim 1, characterized in that, The inner slot of the fixed card holder (507) is connected to the liner plate card frame (508), and the inner surface of the liner plate card frame (508) is bonded with adhesive (509). The surface of the adhesive (509) is bonded with the liner plate body (510), and the adhesive (509) is a water-soluble pressure-sensitive adhesive.

6. The silicon wafer cutting substrate cutting equipment according to claim 1, characterized in that, The left side of the fixed bracket (507) is provided with a plate-driven hydraulic rod (511), and the right end of the plate-driven hydraulic rod (511) is provided with a plate-fixed adsorption vacuum pump head (512). The plate-fixed adsorption vacuum pump head (512) and the plate-driven hydraulic rod (511) are electrically connected to the CNC controller (6).

7. A silicon wafer cutting substrate cutting device according to claim 6, characterized in that, The liner body (4) is cut by a laser cutting machine (506) to produce a liner sheet (510). The sheet drives a hydraulic rod (511) through the inside of the liner sheet frame (508) and contacts the liner sheet (510). The sheet drives the hydraulic rod (511) to cause the liner sheet (510) to retract inward and fix the liner sheet (510) to the inside of the liner sheet frame (508).

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