Optical transmitter sub-module press bonding device
Patent Information
- Application Number
- CN202522130638.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-09
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-09
AI Technical Summary
光通信模块是实现光电转换功能的关键部件，其性能直接决定了通信系统的质量；在光通信模块的制造过程中，核心步骤之一是将光发射次模块组件可靠精确地压合到预设的电路板上；光发射次模块在压合至电路板的过程中，传统的手动装配在安装时效率较低；因此亟需一款装置，来解决上述问题
本实用新型光发射次模块压合装置，其包括：载物台、位于载物台一侧的基板和位于载物台上方的真空吸附枪，一安装于基板上的立柱板朝向载物台的侧表面设置有一滑轨和套接于滑轨上的滑块，一安装于滑块上挂架的托板上设置有真空吸附枪，立柱板的上端设置有一第一磁铁，挂架上端设置有一与第一磁铁对应的第二磁铁；一位于真空吸附枪周边的千分尺设置于托板的边缘处，立柱板位于载物台的上方区域设置于一与千分尺对应的挡板，真空吸附枪的吸嘴从挂架的通孔延伸出，一套装于真空吸附枪的套筒与真空吸附枪之间通过至少一对销钉和销槽配合连接，当真空吸附枪吸嘴处安装的工件移动至板件表面时，通过千分尺与挡板抵力接触进行限位，避免了因工件压合时产生过大的压紧力导致的工件的损伤，同时通过磁铁的设计操作人员可以便捷的将处于高位吸附状态中的挂架上的真空吸附枪轻松下移至指定位置，使得安装工件时具有较高的效率及便捷性。
Smart Images
Figure CN224779802U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a light-emitting sub-module pressing device, belonging to the field of optical communication device technology. Background Technology
[0002] In fields such as high-speed data communication, telecommunications networks, and data center interconnection, optical communication technology has become indispensable due to its advantages such as high bandwidth, low loss, and resistance to electromagnetic interference. The optical communication module is a key component for realizing photoelectric conversion, and its performance directly determines the quality of the communication system. One of the core steps in the manufacturing process of optical communication modules is to reliably and accurately press the optical emission sub-module assembly onto a pre-set circuit board. Traditional manual assembly of the optical emission sub-module onto the circuit board is inefficient during installation; therefore, a device is urgently needed to solve these problems. Summary of the Invention
[0003] The purpose of this invention is to provide a light-emitting sub-module pressing device that avoids damage to the workpiece caused by excessive clamping force during workpiece pressing, while also making workpiece installation more efficient and convenient.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a light-emitting sub-module pressing device, comprising: a stage, a substrate located on one side of the stage, and a vacuum adsorption gun located above the stage; a column plate mounted on the substrate has a slide rail and a slider sleeved on the slide rail on its side surface facing the stage; the vacuum adsorption gun is mounted on a bracket mounted on the slider; a first magnet is provided at the upper end of the column plate; a second magnet corresponding to the first magnet is provided at the upper end of the bracket; a micrometer located around the vacuum adsorption gun is provided at the edge of the bracket; a baffle corresponding to the micrometer is provided in the area above the stage on the column plate; the suction nozzle of the vacuum adsorption gun extends from the through hole of the bracket; a sleeve fitted onto the vacuum adsorption gun is connected to the vacuum adsorption gun by at least one pair of pins and slots.
[0005] The following are further improvements to the above technical solution: 1. In the above scheme, the stage is located on the substrate.
[0006] 2. In the above scheme, the micrometer is mounted on the support plate via a support block.
[0007] 3. In the above scheme, the micrometer screw of the micrometer is embedded in the through hole of the support block and extends downward from the through hole.
[0008] 4. In the above scheme, the number of pins and pin slots is two pairs.
[0009] 5. In the above scheme, the pin and pin groove are located on the outer surface of the vacuum adsorption gun and the inner surface of the sleeve.
[0010] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: This utility model relates to a light-emitting sub-module pressing device, comprising: a stage, a substrate located on one side of the stage, and a vacuum adsorption gun located above the stage; a column plate mounted on the substrate has a slide rail and a slider sleeved on the slide rail on its side surface facing the stage; a vacuum adsorption gun is mounted on a bracket mounted on the slider; a first magnet is mounted on the upper end of the column plate; a second magnet corresponding to the first magnet is mounted on the upper end of the bracket; a micrometer located around the vacuum adsorption gun is located at the edge of the bracket; and a corresponding micrometer is located on the upper area of the column plate above the stage. The baffle plate extends from the through hole of the vacuum adsorption gun. A sleeve fitted with the vacuum adsorption gun is connected to the vacuum adsorption gun by at least one pair of pins and slots. When the workpiece installed at the vacuum adsorption gun nozzle moves to the surface of the plate, it is limited by the contact between the micrometer and the baffle plate, which avoids damage to the workpiece caused by excessive clamping force during workpiece pressing. At the same time, the design of the magnet allows the operator to easily move the vacuum adsorption gun on the rack in the high adsorption state to the designated position, making the installation of workpieces highly efficient and convenient. Attached Figure Description
[0011] Appendix Figure 1 This is a first-view structural schematic diagram of the optical emission sub-module pressing device of this utility model; Appendix Figure 2 For the appendix Figure 1 Enlarged structural diagram at point A; Appendix Figure 3 This is a structural schematic diagram of the optical emission sub-module pressing device of this utility model from a second perspective; Appendix Figure 4 For the appendix Figure 3 Enlarged structural diagram at point B; Appendix Figure 5 This is a schematic diagram of the structure at the micrometer position in the optical emission sub-module pressing device of this utility model.
[0012] In the above attached figures: 1. Stage; 2. Base plate; 3. Vacuum suction gun; 31. Suction nozzle; 4. Column plate; 51. Slide rail; 52. Slider; 6. Hanger; 61. Support plate; 71. First magnet; 72. Second magnet; 8. Micrometer; 81. Micrometer screw; 9. Baffle; 10. Support block; 11. Sleeve; 121. Pin; 122. Pin groove. Detailed Implementation
[0013] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.
[0014] Example 1: A light-emitting sub-module pressing device includes: a stage 1, a substrate 2 located on one side of the stage 1, and a vacuum adsorption gun 3 located above the stage 1. A column plate 4 mounted on the substrate 2 has a slide rail 51 and a slider 52 sleeved on the slide rail 51 on its side surface facing the stage 1. The vacuum adsorption gun 3 is mounted on a support plate 61 of a bracket 6 mounted on the slider 52. A first magnet 71 is provided at the upper end of the column plate 4, and a second magnet 72 corresponding to the first magnet 71 is provided at the upper end of the bracket 6. A micrometer 8 located around the vacuum adsorption gun 3 is provided at the edge of the support plate 61. A baffle 9 corresponding to the micrometer 8 is provided in the area above the stage 1 of the column plate 4. The suction nozzle 31 of the vacuum adsorption gun 3 extends from the through hole of the bracket 6. A sleeve 11 fitted onto the vacuum adsorption gun 3 is connected to the vacuum adsorption gun 3 by at least one pair of pins 121 and pin grooves 122.
[0015] The aforementioned stage 1 is located on the substrate 2.
[0016] The aforementioned micrometer 8 is mounted onto the support plate 61 via the support block 10.
[0017] The micrometer screw 81 of the micrometer 8 is embedded in the through hole of the support block 10 and extends downward from the through hole.
[0018] The number of the aforementioned pins 121 and pin slots 122 is two pairs.
[0019] Example 2: A light-emitting sub-module pressing device includes: a stage 1, a substrate 2 located on one side of the stage 1, and a vacuum adsorption gun 3 located above the stage 1. A column plate 4 mounted on the substrate 2 has a slide rail 51 and a slider 52 sleeved on the slide rail 51 on its side surface facing the stage 1. The vacuum adsorption gun 3 is mounted on a support plate 61 of a bracket 6 mounted on the slider 52. A first magnet 71 is provided at the upper end of the column plate 4, and a second magnet 72 corresponding to the first magnet 71 is provided at the upper end of the bracket 6. A micrometer 8 located around the vacuum adsorption gun 3 is provided at the edge of the support plate 61. A baffle 9 corresponding to the micrometer 8 is provided in the area above the stage 1 of the column plate 4. The suction nozzle 31 of the vacuum adsorption gun 3 extends out from the through hole of the bracket 6. A sleeve 11 fitted onto the vacuum adsorption gun 3 is connected to the vacuum adsorption gun 3 by at least one pair of pins 121 and pin grooves 122.
[0020] The aforementioned stage 1 is located on the substrate 2.
[0021] The aforementioned micrometer 8 is mounted onto the support plate 61 via the support block 10.
[0022] The aforementioned pin 121 and pin groove 122 are located on the outer surface of the vacuum adsorption gun 3 and the inner surface of the sleeve 11.
[0023] The working principle of this patent is as follows: First, the hanger 6 is placed in a high position and magnetically attached to the column plate 4. Then, the plate is placed in the designated position on the platform 1, and the workpiece is placed at the suction nozzle 31 of the vacuum suction gun 3. The negative pressure provided by the vacuum suction gun 3 causes the workpiece to be attached to the suction nozzle 31. Then, the tray 61 is manually moved down so that the hanger 6 slides along the slide rail 51 and is released from the magnetic attachment state. The vacuum suction gun 3 can be moved up and down conveniently. When the workpiece installed at the suction nozzle 31 of the vacuum suction gun 3 moves to the surface of the plate, it is limited by the contact between the micrometer 8 and the baffle 9 to avoid damage to the workpiece caused by excessive clamping force during workpiece pressing. At this time, the workpiece and the plate are pressed together by glue. Then, the vacuum suction gun 3 stops adsorption, and the tray 61 is manually moved up to the position between the hanger 6 and the column plate 4 and magnetically attached.
[0024] When the above-mentioned light emission sub-module pressing device is used, when the workpiece installed at the vacuum suction gun nozzle moves to the surface of the plate, it is limited by the contact between the micrometer and the baffle, which avoids damage to the workpiece caused by excessive clamping force during workpiece pressing. At the same time, the design of the magnet allows the operator to easily move the vacuum suction gun on the hanger in the high-position suction state to the designated position, making the installation of workpieces highly efficient and convenient.
[0025] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.
Claims
1. A light-emitting sub-module pressing device, characterized in that: include: The platform (1), the base plate (2) located on one side of the platform (1), and the vacuum adsorption gun (3) located above the platform (1) are provided. A column plate (4) mounted on the base plate (2) has a slide rail (51) and a slider (52) sleeved on the slide rail (51) on its side surface facing the platform (1). The vacuum adsorption gun (3) is provided on the support plate (61) of the bracket (6) mounted on the slider (52). A first magnet (71) is provided at the upper end of the column plate (4). A magnet (71) is provided at the upper end of the bracket (6). The second magnet (72) is corresponding to the magnet (71); a micrometer (8) located around the vacuum suction gun (3) is set at the edge of the tray (61); the column plate (4) is located above the platform (1) and is set with a baffle (9) corresponding to the micrometer (8); the suction nozzle (31) of the vacuum suction gun (3) extends out from the through hole of the bracket (6); a sleeve (11) fitted onto the vacuum suction gun (3) is connected to the vacuum suction gun (3) by at least one pair of pins (121) and pin grooves (122).
2. The optical emission sub-module pressing device according to claim 1, characterized in that: The stage (1) is located on the substrate (2).
3. The optical emission sub-module pressing device according to claim 1, characterized in that: The micrometer (8) is mounted on the tray (61) via a support block (10).
4. The optical emission sub-module pressing device according to claim 3, characterized in that: The micrometer screw (81) of the micrometer (8) is embedded in the through hole of the support block (10) and extends downward from the through hole.
5. The optical emission sub-module pressing device according to claim 1, characterized in that: The number of pins (121) and pin slots (122) is two pairs.
6. The optical emission sub-module pressing device according to claim 1, characterized in that: The pin (121) and the groove (122) are located on the outer surface of the vacuum adsorption gun (3) and the inner surface of the sleeve (11).