processing apparatus

Abstract

The utility model provides a kind of processing equipment, comprising: machine body, processing main shaft is provided on machine body;First cleaning assembly, it is set on machine body, and first cleaning assembly includes scrap winding component, scrap winding component is rotatably arranged around predetermined axis, while scrap winding component is movably arranged along first predetermined track, to extend into processing hole, and first chip is wound up and carried out;Second cleaning assembly, it is set on machine body, and first cleaning assembly and second cleaning assembly are switchably connected with processing main shaft, and second cleaning assembly is movably arranged along second predetermined track, and second cleaning assembly is used to generate magnetic force, to extend into processing hole, so that second chip is adsorbed on second cleaning assembly and carried out from processing hole.The present application solves the problem that chip cleaning in deep hole is not complete in the deep hole machining process in the prior art.

Description

Technical Field

[0001] This utility model relates to the field of machining technology, and more specifically, to a machining equipment. Background Technology

[0002] Deep hole machining is a common process in the field of mechanical manufacturing, especially in aerospace, automotive manufacturing, and mold making. This type of machining technology involves the creation of holes with relatively small diameters but depths much greater than their diameters. One of the technical challenges lies in chip management within the deep holes. Chips accumulate inside the holes, leading to tool wear or damage, which affects machining quality and efficiency.

[0003] In existing deep hole machining technologies, chip removal is typically achieved through high-pressure coolant flushing, air blowing, or specialized chip extraction devices. However, in actual machining processes, there are many types of chips, and the same cleaning tool cannot efficiently handle different chip shapes, resulting in incomplete chip removal. Utility Model Content

[0004] The main objective of this invention is to provide a processing device to solve the problem of incomplete chip removal in deep holes during the deep hole processing process in the prior art.

[0005] To achieve the above objectives, according to one aspect of the present invention, a processing device is provided, comprising: a machine body on which a processing spindle is disposed; a first cleaning assembly disposed on the machine body, the first cleaning assembly including a chip-rolling component, the chip-rolling component being rotatably disposed about a predetermined axis and simultaneously movablely disposed along a first predetermined trajectory to extend into a processing hole, thereby rolling up and carrying out first chips; and a second cleaning assembly disposed on the machine body, the first cleaning assembly and the second cleaning assembly being switchably connected to the processing spindle, the second cleaning assembly being movablely disposed along a second predetermined trajectory, the second cleaning assembly being used to generate magnetic force to extend into the processing hole, causing second chips to be adsorbed onto the second cleaning assembly and carried out from the processing hole.

[0006] Furthermore, the processing equipment also includes: a vision recognition component for recognizing the first chip and the second chip, the vision recognition component being connected to the first cleaning component and the second cleaning component respectively, so as to control the operation of the first cleaning component or the second cleaning component according to the recognition result of the vision recognition component.

[0007] Furthermore, the processing equipment also includes: a switching component, movably mounted on the machine body, the switching component having a clamping part, which clamps the first cleaning component or the second cleaning component to install the first cleaning component or the second cleaning component onto the processing spindle.

[0008] Furthermore, the chip-rolling component extends along a predetermined spiral trajectory. After the machining spindle drives the chip-rolling component to extend into the machining hole, the machining spindle drives the chip-rolling component to rotate, so as to roll the first chip onto the chip-rolling component. Then, the machining spindle drives the chip-rolling component to be pulled out from the machining hole.

[0009] Furthermore, the first cleaning assembly also includes a mounting rod, one end of which is detachably connected to the machining spindle and the other end of which is connected to the chip-rolling component. The machining spindle drives the chip-rolling component to move via the mounting rod.

[0010] Furthermore, the processing equipment also includes a chip removal component, which includes a support plate and a chip removal column, which is mounted on the support plate and extends from the support plate. After the processing spindle drives the chip rolling component to move to contact the chip removal column, it drives the chip rolling component to rotate and move in a predetermined direction, so that the first chip is detached from the chip rolling component under the force of the chip removal column.

[0011] Furthermore, the second cleaning component includes: a sleeve with a first contact head disposed inside the sleeve; and a through rod disposed inside the sleeve with a second contact head disposed at the end of the through rod. The sleeve and the through rod are movably disposed relative to each other so that after the first contact head contacts the second contact head, the sleeve generates an electromagnetic force to adsorb the second chip in the machining hole.

[0012] Furthermore, the second cleaning assembly also includes: a gripper, disposed at the open end of the sleeve, the gripper being closable so that after the first contact head contacts the second contact head, the gripper generates an electromagnetic force and rotates toward the inserting rod to clamp the inserting rod, so that the inserting rod moves synchronously with the sleeve.

[0013] Furthermore, the through rod is provided with a locking part, which protrudes relative to the surface of the through rod, and at least part of the gripper engages with the locking part to clamp the through rod.

[0014] Furthermore, the second cleaning component also includes: a cover portion disposed on the through rod, the cover portion protruding relative to the surface of the through rod and surrounding the through rod; the sleeve is provided with an open end face, which, after the sleeve is energized to generate electromagnetic force, attracts the cover portion, so that the cover portion fits against the open end face.

[0015] According to the technical solution of this utility model, the processing equipment includes a machine body, a first cleaning component, and a second cleaning component. A processing spindle is provided on the machine body. The first cleaning component and the second cleaning component are switchably connected to the processing spindle. The first cleaning component includes a chip-rolling component, which is rotatably arranged around a predetermined axis and movable along a first predetermined trajectory to extend into the processing hole, roll up the first chip, and carry it out. The second cleaning component is movable along a second predetermined trajectory and is used to generate magnetic force to extend into the processing hole, so that the second chip is attracted to the second cleaning component and carried out from the processing hole.

[0016] By setting up a switchable first cleaning component and a second cleaning component, the processing equipment can flexibly handle the chips generated by workpieces of different materials and sizes during deep hole processing. Whether it is long, curled chips or granular chips, they can be effectively processed, greatly improving the adaptability and versatility of the equipment.

[0017] Traditional chip removal methods often require machine downtime, while the cleaning component in this solution can be directly connected to the machining spindle and controlled by an automated program, eliminating the need for additional machine downtime, greatly shortening chip removal time and improving overall machining efficiency.

[0018] By reducing the wear and blockage of chips on the internal structure of the equipment, the impact of chips on machining accuracy is reduced. Timely and effective chip cleaning ensures the normal working condition of the cutting tools, further improving the dimensional accuracy and surface quality of the machined holes. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0020] Figure 1 A schematic diagram of an embodiment of the first cleaning component in the processing equipment according to the present invention is shown;

[0021] Figure 2 A front view of the first cleaning assembly in the processing equipment according to the present invention is shown;

[0022] Figure 3 A schematic diagram of the structure of the chip removal component in the processing equipment according to the present invention is shown;

[0023] Figure 4 A top view of the chip removal component in the processing equipment according to the present invention is shown;

[0024] Figure 5A schematic diagram of the structure of a first embodiment of the second cleaning component in the processing equipment according to the present invention is shown;

[0025] Figure 6 A cross-sectional view of a first embodiment of the second cleaning assembly in the processing equipment according to the present invention is shown;

[0026] Figure 7 A first-view structural schematic diagram of a second embodiment of the second cleaning component in the processing equipment according to the present invention is shown;

[0027] Figure 8 A cross-sectional view of the second cleaning assembly in the processing equipment according to the present invention is shown;

[0028] Figure 9 A second-view structural schematic diagram of a second embodiment of the second cleaning component in the processing equipment according to the present invention is shown.

[0029] The above figures include the following reference numerals:

[0030] 100. First cleaning component; 110. Chip shredder; 120. Mounting rod;

[0031] 200. Second cleaning component; 210. Sleeve; 211. First contact head; 212. Open end face; 220. Through rod; 221. Second contact head; 230. Gripper; 240. Engaging part; 250. Cover part;

[0032] 300. Chip removal component; 310. Support plate; 320. Chip removal column; 330. Base. Detailed Implementation

[0033] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0034] As mentioned in the background section, in existing deep hole machining processes, chips accumulate inside the hole, causing tool wear or damage, affecting machining quality and efficiency. Existing chip removal methods mainly rely on high-pressure coolant flushing, air blowing, or dedicated chip extraction devices. However, these methods are only suitable for small and lightweight chips, resulting in incomplete chip removal inside the hole and affecting machining accuracy. Therefore, to address the aforementioned technical problems, the processing equipment of this application includes a first cleaning component 100 and a second cleaning component 200 mounted on its body. The first cleaning component 100 cleans first chips, which are typically long, curled chips. The first cleaning component 100 includes a chip-rolling component 110, which is rotatably mounted around a predetermined axis and movable along a first predetermined trajectory to extend into the processing hole, roll up the first chip, and carry it out. The second cleaning component 200 cleans second chips, which are typically granular chips. The second cleaning component 200 is movable along a second predetermined trajectory and generates magnetic force to extend into the processing hole, causing the second chip to adhere to the second cleaning component 200 and be carried out of the processing hole. The first cleaning component 100 and the second cleaning component 200 are switchably connected to the processing spindle, allowing the spindle to be equipped with different cleaning components depending on the type of chip. This solution can effectively handle different types of chips generated during deep hole machining, including long, curled chips and granular chips, ensuring thorough cleaning of chips inside the hole and avoiding the problem of incomplete cleaning of certain types of chips by a single cleaning method.

[0035] Please refer to Figures 1 to 6 This application provides a processing device, including: a machine body, on which a processing spindle is disposed; a first cleaning assembly 100 disposed on the machine body, the first cleaning assembly 100 including a chip-rolling component 110, the chip-rolling component 110 being rotatably disposed around a predetermined axis and simultaneously movablely disposed along a first predetermined trajectory to extend into a processing hole, roll up and carry out a first chip; and a second cleaning assembly 200 disposed on the machine body, the first cleaning assembly 100 and the second cleaning assembly 200 being switchably connected to the processing spindle, the second cleaning assembly 200 being movablely disposed along a second predetermined trajectory, the second cleaning assembly 200 being used to generate magnetic force to extend into the processing hole, causing a second chip to be adsorbed onto the second cleaning assembly 200 and carried out from the processing hole.

[0036] The processing equipment provided in this application includes a machine body, a first cleaning component 100, and a second cleaning component 200. A processing spindle is provided on the machine body. The first cleaning component 100 and the second cleaning component 200 are switchably connected to the processing spindle. The first cleaning component 100 includes a chip-rolling component 110, which is rotatably arranged around a predetermined axis and movable along a first predetermined trajectory to extend into the processing hole, roll up the first chip, and carry it out. The second cleaning component 200 is movable along a second predetermined trajectory and is used to generate magnetic force to extend into the processing hole, so that the second chip is adsorbed on the second cleaning component 200 and carried out from the processing hole.

[0037] By setting up a switchable first cleaning component 100 and a second cleaning component 200, the processing equipment can flexibly handle the chips generated by workpieces of different materials and sizes during deep hole processing. Whether it is long, curled chips or granular chips, they can be effectively processed, greatly improving the adaptability and versatility of the equipment.

[0038] Traditional chip removal methods often require machine downtime, while the cleaning component in this solution can be directly connected to the machining spindle and controlled by an automated program, eliminating the need for additional machine downtime, greatly shortening chip removal time and improving overall machining efficiency.

[0039] By reducing the wear and blockage of chips on the internal structure of the equipment, the impact of chips on machining accuracy is reduced. Timely and effective chip cleaning ensures the normal working condition of the cutting tools, further improving the dimensional accuracy and surface quality of the machined holes.

[0040] In the specific implementation process, the processing equipment also includes: a vision recognition component for recognizing the first chip and the second chip. The vision recognition component is connected to the first cleaning component 100 and the second cleaning component 200 respectively, so as to control the operation of the first cleaning component 100 or the second cleaning component 200 according to the recognition result of the vision recognition component.

[0041] The visual recognition component can monitor the chip situation inside the machining hole in real time, accurately identifying the type of chips through image analysis technology, such as distinguishing between long, curled chips and granular chips. This precise classification capability ensures that the selection of cleaning components matches the chip type, improving cleaning efficiency and effectiveness.

[0042] The connection between the vision recognition component and the cleaning assembly allows the cleaning process to proceed automatically based on the type of chips, eliminating the need for manual judgment and intervention. Once the chip type is identified, the system automatically switches to the corresponding cleaning assembly's operating mode, achieving automated management and control of deep hole machining and reducing the workload of operators.

[0043] The vision recognition component includes a camera module, an illumination system, and an image processing unit. The camera module uses a high-resolution industrial camera to ensure clear capture of the chip situation inside the machined hole, providing basic image data for recognition. It is equipped with illumination devices suitable for the deep hole environment, such as LED light sources, to improve lighting conditions inside the deep hole and enhance image quality.

[0044] The image processing unit is used to receive images captured by the camera and extract features from the images. The extracted signals are then transmitted to the control center. Upon receiving the chip type result, the control center automatically switches to the corresponding first cleaning component 100 or second cleaning component 200 to prepare for chip cleaning.

[0045] To facilitate the replacement of the first cleaning component 100 and the second cleaning component 200, the processing equipment further includes a switching component, which is movably mounted on the machine body. The switching component has a clamping part, which clamps the first cleaning component 100 or the second cleaning component 200 to install the first cleaning component 100 or the second cleaning component 200 onto the processing spindle.

[0046] The switching component has a clamping function, which can quickly lock and release the first cleaning component 100 and the second cleaning component 200, significantly shortening the time required to replace the cleaning components and improving the response speed and production efficiency of the processing equipment.

[0047] The switching component is controlled by the tool changing program in the machining equipment, and the switching component is connected to the tool changing fixture in the machining equipment. In this way, the first cleaning component 100 and the second cleaning component 200 are equipped in the tool magazine. When it is necessary to clean the chips, the first cleaning component 100 or the second cleaning component 200 can be directly replaced by the tool changing fixture, so there is no need to set up a separate structure for replacing the first cleaning component 100 and the second cleaning component 200.

[0048] In the embodiments provided in this application, the chip-rolling component 110 extends along a predetermined spiral trajectory. After the machining spindle drives the chip-rolling component 110 to extend into the machining hole, the machining spindle drives the chip-rolling component 110 to rotate so as to roll the first chip onto the chip-rolling component 110. Then, the machining spindle drives the chip-rolling component 110 to be pulled out from the machining hole.

[0049] The spiral shape of the chip-rolling component 110 and its movement along the spiral trajectory enable it to penetrate deep into the hole, contact and roll up long, coiled chips. This design mimics the principle of a thread, effectively guiding the chips along its structure to form a tight coil, facilitating their removal from the hole in one go and significantly improving chip-rolling efficiency.

[0050] The spiral trajectory of the chip-rolling component not only helps to roll up chips, but also plays a guiding role in the chip-rolling process, preventing chips from running around or clogging in the hole. Especially when the hole diameter is small and the depth is large, the design of the spiral trajectory is particularly important. It can smoothly guide the chips to the hole opening and ensure that the cleaning channel is unobstructed.

[0051] Long, coiled chips, if not cleaned promptly, can easily become entangled in the cutting tool, leading to tool damage or even breakage. The design in this embodiment effectively rolls up and removes the chips, reducing their adverse effects on the tool, extending tool life, and lowering processing costs.

[0052] The automated operation of the chip removal component and its integration with the machining spindle make chip removal an integral part of the machining process, eliminating the need for additional downtime to handle chips. This optimizes the continuity and smoothness of deep hole machining, reduces production interruptions, and enhances the flexibility and responsiveness of the production line.

[0053] The first cleaning component 100 further includes a mounting rod 120, one end of which is detachably connected to the machining spindle and the other end of which is connected to the chip folding component 110. The machining spindle drives the chip folding component 110 to move through the mounting rod 120.

[0054] The mounting rod 120 serves as a connector, ensuring a secure connection between the chip-rolling component 110 and the machining spindle. It remains stable even in high-speed rotation and complex machining environments, preventing safety accidents and machining interruptions that may be caused by loosening or falling off of the connector.

[0055] One end of the mounting rod 120 is detachably connected to the machining spindle, making the replacement of the chip coiling component 110 more convenient. Operators can quickly replace chip coiling components of different specifications or designs according to actual machining needs to adapt to different workpieces and chip conditions, improving the adaptability and work efficiency of the equipment.

[0056] The mounting rod 120 is designed with efficient power transmission in mind. It can smoothly transmit the rotational force of the machining spindle to the chip-rolling component 110, ensuring the smooth movement and efficient operation of the chip-rolling component inside the deep hole, and avoiding energy loss and component damage during power transmission.

[0057] In the specific implementation process, such as Figure 3 and Figure 4As shown, the processing equipment also includes a chip removal component 300, which includes a support plate 310 and a chip removal column 320 disposed on the support plate 310. The chip removal column 320 extends from the support plate 310. The processing spindle drives the chip rolling component 110 to move until it abuts against the chip removal column 320, and then drives the chip rolling component 110 to rotate and move in a predetermined direction, so that the first chip is detached from the chip rolling component 110 under the force of the chip removal column 320.

[0058] The machining spindle drives the chip-rolling component 110 to come into contact with and rotate the chip-removing column 320. This automated process efficiently removes the chips from the chip-rolling component, avoiding the tediousness and time consumption of manual cleaning.

[0059] The chips fall off naturally under the action of the chip removal column 320, making the cleaning of the chip removal component 300 and the chip rolling component 110 simpler and reducing the complexity and time of maintenance.

[0060] There are multiple chip removal columns 320, which are spaced apart on the support plate 310. The chip rolling component 110 is inserted between two adjacent chip removal columns 320. Under the force of the chip removal column 320, the chip rolling component 110 moves away from the support plate 310 and rotates in the opposite direction, causing the first chip to fall off.

[0061] Multiple chip removal columns 320 are spaced apart along the length of the support plate 310. This arrangement ensures that the chip removal component 110 is subjected to uniform force during movement, avoiding deformation or damage caused by excessive local force.

[0062] As the chip-rolling component 110 moves away from the support plate, the machining spindle drives the chip-rolling component to rotate in the opposite direction. This reverse rotation uses centrifugal force to peel off the chips adsorbed on the chip-rolling component, which then fall into the chip-cleaning area, completing the chip cleaning process.

[0063] To ensure complete chip removal, the chip-rolling component 110 can re-enter the deep hole after completing one chip-removal action, repeating the cleaning process until all chips are removed. This process can be executed automatically through a preset program or dynamically adjusted based on the chip residue signal detected by the sensor.

[0064] Furthermore, the chip removal component 300 also includes a base 330, and a support plate 310 is disposed on the base 330. The base 330 is arranged in a horizontal direction, and the support plate 310 is arranged in a vertical direction. The base 330 is used to fix the support plate 310 in a predetermined position to prevent the support plate 310 from moving during the chip removal process of the chip rolling component 110, which would affect the chip removal efficiency.

[0065] In the first embodiment provided in this application, such as Figure 5 and Figure 6 As shown, the second cleaning component 200 includes: a sleeve 210, with a first contact head 211 disposed inside the sleeve 210; and a through rod 220 disposed inside the sleeve 210, with a second contact head 221 disposed at the end of the through rod 220. The sleeve 210 and the through rod 220 are movably disposed relative to each other so that after the first contact head 211 contacts the second contact head 221, the sleeve 210 generates an electromagnetic force to adsorb the second chip in the machining hole.

[0066] By controlling the contact between the first contact head 211 and the second contact head 221, the electromagnetic force generated by the through rod 220 can be precisely activated. This electromagnetic force can effectively adsorb granular chips in the hole, preventing chips from accumulating in the hole and causing damage to the tool or the hole wall.

[0067] The relatively movable design of the sleeve 210 and the through rod 220 allows for precise control of the generation of electromagnetic force. The position of the sleeve can be adjusted according to the depth of the machined hole and the chip distribution to ensure that the electromagnetic force acts on the chips, thereby improving the flexibility and adaptability of cleaning.

[0068] The electromagnetic force can quickly remove chips from the hole. Compared with traditional cleaning methods, electromagnetic cleaning is faster and more thorough, especially when dealing with granular chips, where efficiency is significantly improved.

[0069] The electromagnetic adsorption design of the second cleaning component 200 not only effectively solves the problem of cleaning granular chips in deep hole machining, but also improves the performance of processing equipment, reduces maintenance costs, reduces energy consumption, and enhances production safety through its precise, flexible, and efficient characteristics.

[0070] Furthermore, the second cleaning assembly 200 also includes a gripper 230 disposed at the open end of the sleeve 210. The gripper 230 is configured to open and close so that after the first contact head 211 contacts the second contact head 221, the gripper 230 generates an electromagnetic force and rotates toward the through rod 220 to clamp the through rod 220, so that the through rod 220 and the sleeve 210 move synchronously.

[0071] When the first contact head 211 contacts the second contact head 221, the gripper 230 can precisely hold the inserting rod 220, ensuring that the two parts are tightly aligned. This prevents the inserting rod from shifting or vibrating during movement, thus ensuring the stability and accuracy of the assembly throughout the cleaning process. The inserting rod is a magnetic component.

[0072] During the synchronous movement of the inserting rod and the sleeve, the gripper 230 plays a protective role, preventing the inserting rod from accidentally coming loose when rotating at high speed or stopping suddenly, reducing the possibility of equipment failure, and also ensuring the personal safety of the operators.

[0073] The through rod 220 is provided with a locking part 240, which protrudes from the surface of the through rod 220. At least a portion of the gripper 230 engages with the locking part 240 to clamp the through rod 220.

[0074] By engaging the locking part 240 on the insert rod with the gripper 230, precise positioning and stable clamping of the insert rod can be achieved during movement. The protruding design of the locking part 240 allows the gripper 230 to accurately locate and lock onto this structure, ensuring the positional stability of the insert rod throughout the cleaning process and avoiding the decrease in suction force or incomplete chip removal caused by vibration or displacement.

[0075] The design of the locking part 240 increases the contact area between the gripper 230 and the through rod, improving the reliability of clamping. Even when the through rod 220 moves quickly or encounters a sudden situation, it can be ensured that it will not fall off the gripper 230, reducing the risk of equipment damage or operator injury.

[0076] When the sleeve 210 is pulled out of the machining hole, the jaws 230 are released, and the sleeve 210 moves relative to the through rod 220 under the action of gravity, causing the first contact head 211 to separate from the second contact head 221. The sleeve 210 loses its magnetic force, causing the chips adsorbed on its surface to fall off.

[0077] The first contact head 211 is disposed on the bottom wall surface of the sleeve 210. A buffer sleeve is fitted on the through rod 220. The buffer sleeve is made of rubber and fits against the inner wall surface of the sleeve 210. An elastic component is disposed between the buffer sleeve and the bottom wall surface of the sleeve 210. When the sleeve 210 moves to the predetermined position in the machining hole, the through rod 220 overcomes the elastic force of the elastic component under the drive of the machining spindle and continues to move toward the bottom of the sleeve 210 until the first contact head 211 connects with the second contact head 221. The sleeve 210 and the gripper 230 generate electromagnetic force at the same time. At this time, the gripper 230 locks the through rod 220 and the sleeve 210 together. After adsorption is complete and the sleeve 210 is withdrawn from the machining hole, the gripper 230 loses its electromagnetic force and releases. Under the elastic restoring force of the elastic component, the sleeve 210 is pushed to move away from the through rod 220, so that the first contact head 211 and the second contact head 221 separate. The gripper 230 and the sleeve 210 are connected by a torsion spring. This arrangement ensures that when the gripper 230 loses its electromagnetic force, it can return to the open position under the elastic restoring force of the torsion spring.

[0078] A buffer sleeve made of rubber is fitted onto the through rod 220. Due to its good elasticity and wear resistance, the rubber material can buffer the contact when the through rod comes into contact with the sleeve, avoiding damage to the contact head from hard contact and extending the service life of the equipment.

[0079] An elastic component, typically a spring, is installed between the buffer sleeve and the bottom wall of the sleeve 210. When the inserting rod 220 moves toward the bottom of the sleeve, the elastic component provides a certain resistance to ensure a smooth transition in the final stage before contact, thus avoiding equipment damage or performance instability caused by impact.

[0080] Before the cleaning process begins, the insert rod 220 and sleeve 210 are separated, the gripper 230 is released, the first contact head 211 and the second contact head 221 are not in contact, and the elastic component remains in its natural state. Driven by the machining spindle, the sleeve 210 and insert rod 220 move together toward the machining hole. When they approach a predetermined position within the hole, the insert rod 220 continues to move toward the bottom of the sleeve, compressing the elastic component until the first contact head 211 contacts the second contact head 221. The connection between the first contact head 211 and the second contact head 221 triggers the energization of the insert rod 220, initiating the adsorption of granular C-shaped chips within the hole. At this point, the gripper 230 closes under electromagnetic force, locking the insert rod 220 and sleeve together to ensure they do not separate during the chip cleaning process.

[0081] Once cleaning is complete, the sleeve is pulled out of the machining hole and the power is turned off, causing the gripper 230 to release. Under the elastic restoring force of the elastic component, the sleeve 210 automatically moves away from the through rod 220, and the first contact head 211 separates from the second contact head 221, preparing for the next cleaning operation.

[0082] In the second embodiment provided in this application, such as Figures 7 to 9 As shown, this embodiment differs from the first embodiment in that the second cleaning component 200 further includes: a cover portion 250, which is disposed on the through rod 220. The cover portion 250 protrudes relative to the surface of the through rod 220 and is disposed around the through rod 220. The sleeve 210 is provided with an open end face 212. After the sleeve 210 is energized to generate electromagnetic force, it attracts the cover portion 250, so that the cover portion 250 fits against the open end face 212.

[0083] By replacing the gripper 230 with the cover 250, synchronous movement of the inserting rod 220 and the sleeve 210 is achieved, reducing the number of parts in the cleaning assembly, making the overall structure simpler, and reducing the complexity of assembly and maintenance. The magnetic connection between the cover 250 and the open end face 212 forms a closed structure under the action of electromagnetic force. Compared with mechanical clamping, this provides a more stable connection, reducing the risk of parts loosening during high-speed movement or deep hole cleaning, and ensuring the safety of equipment operation.

[0084] Deep hole machining typically refers to machining holes with a depth-to-diameter ratio greater than 10. This machining method is common in mechanical manufacturing, especially in the aerospace, automotive, and mold industries. However, deep hole machining presents several challenges, one of which is chip removal. In deep hole machining, chips accumulate inside the hole, leading to tool wear or damage, affecting machining quality and efficiency. Therefore, timely chip removal is crucial; however, chip removal can be difficult, especially with small hole diameters where space is limited, and chip blockage is common.

[0085] Using the processing equipment described in this application, such as Figure 7 As shown, the specific process includes the following steps:

[0086] When starting to clean the chips, it is first necessary to determine the type of chips. During the deep hole machining process of CNC machine tools, the chips generated can be roughly divided into two types: one is small granular C-type chips, and the other is ribbon-like long coiled chips. The method proposed in this application requires first determining the type of chips, and then using different cleaning methods according to different types of chips.

[0087] For long, coiled chips, which are prone to tangling due to their length, a first chip cleaning component 100 is designed to clean the chips. The structure of the first cleaning component 100 is as follows: Figure 1 and Figure 2 As shown, the mounting rod 120 in the first cleaning component 100 is used to adapt to the machine tool spindle and is directly installed on the spindle. The other end is used to install the chip rolling component 110. The installation method can be fixed by welding or other methods. The chip rolling component 110 is used to roll up long, coiled chips and bring them out of the deep hole.

[0088] The specific chip removal process is as follows: The machining center, through the CNC system's tool changer program, moves the first cleaning component 100 to the spindle. Then, the first cleaning component 100 is moved to a position above the deep hole and begins to rotate forward. Simultaneously, the spindle begins to feed downwards at a certain speed and feed rate, causing the tip of the chip-rolling component 110 to move into the deep hole. After contacting the chips, it continues to move downwards, rolling the chips onto the chip-rolling component 110. After moving a certain distance, the spindle feeds upwards, exiting the deep hole and carrying the chips out. After the chips are carried out, chip removal is required. The spindle moves to the chip removal position, and the chip-rolling component 110 is placed against the chip-removing component 300. The spindle then reverses direction, leaving the chips on the chip-removing component 300. The chip-removing component 300... Figure 3 and Figure 4 As shown, it includes a base 330, a support plate 310, and a chip removal column 320. The base 330 is used to install the support plate 310 in a predetermined position. The base 330 has mounting holes. The support plate 310 is used to fix the chip removal column 320. The chip removal column 320 is fixed on the support plate 310. This process is one chip removal operation.

[0089] If the chips are small, granular C-type, the first chip-cleaning component 100 will not be suitable as it cannot pick them up. In this case, an electromagnet will be used to attract the chips. Figure 5 and Figure 6 As shown, the tool holder is used to mount the spindle, the electromagnet body is used for adsorption, the sleeve is used for up-and-down movement, and the electromagnet sensor and sleeve sensor are used to determine when the adsorption is activated. The specific chip removal process is as follows: The machining center, through the tool changer program of the CNC system, changes the electromagnet chip removal tool to the spindle, and then moves the electromagnet chip removal tool to the position above the deep hole. At the same time, the spindle begins to feed downwards at a certain feed speed, causing the electromagnet chip removal tool to move into the deep hole. After the sleeve contacts the chips, it continues to move downwards until the electromagnet sensor and sleeve sensor contact. At this time, the power is turned on, the jaws retract and grab the tool holder, the electromagnet is energized and begins to adsorb, the spindle feeds upwards and exits the deep hole, taking the chips out. After the chips are taken out, chip removal is required. The spindle moves to the chip removal position, the electromagnet is de-energized, the adsorption force disappears, and the chips fall off. This process is one chip removal operation.

[0090] After a chip removal operation, it is determined whether the chip removal is complete. The determination process can be achieved by the CNC system providing feedback on the current or vibration. If chips are still present, the current will be different from when there are no chips. If the removal is complete, the operation ends; if not, the removal process is repeated.

[0091] During machining, the current and vibration are usually constant, or at least fluctuate slightly. However, the presence of chips can interfere with the machining process, causing an abnormal fluctuation in the current or vibration, such as a sudden increase or decrease. This can be used to determine the source of the problem. The current and vibration can be monitored using the built-in functions of the machining center system.

[0092] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0093] The processing equipment provided in this application includes a machine body, a first cleaning component 100, and a second cleaning component 200. A processing spindle is provided on the machine body. The first cleaning component 100 and the second cleaning component 200 are switchably connected to the processing spindle. The first cleaning component 100 includes a chip-rolling component 110, which is rotatably arranged around a predetermined axis and movable along a first predetermined trajectory to extend into the processing hole, roll up the first chip, and carry it out. The second cleaning component 200 is movable along a second predetermined trajectory and is used to generate magnetic force to extend into the processing hole, so that the second chip is adsorbed on the second cleaning component 200 and carried out from the processing hole.

[0094] By setting up a switchable first cleaning component 100 and a second cleaning component 200, the processing equipment can flexibly handle the chips generated by workpieces of different materials and sizes during deep hole processing. Whether it is long, curled chips or granular chips, they can be effectively processed, greatly improving the adaptability and versatility of the equipment.

[0095] Traditional chip removal methods often require machine downtime, while the cleaning component in this solution can be directly connected to the machining spindle and controlled by an automated program, eliminating the need for additional machine downtime, greatly shortening chip removal time and improving overall machining efficiency.

[0096] By reducing the wear and blockage of chips on the internal structure of the equipment, the impact of chips on machining accuracy is reduced. Timely and effective chip cleaning ensures the normal working condition of the cutting tools, further improving the dimensional accuracy and surface quality of the machined holes.

[0097] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0098] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0099] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0100] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0101] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0102] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A processing equipment, characterized in that, include: Machine body, on which a machining spindle is mounted; A first cleaning assembly (100) is disposed on the machine body. The first cleaning assembly (100) includes a chip-rolling component (110). The chip-rolling component (110) is rotatably disposed about a predetermined axis and movablely disposed along a first predetermined trajectory to extend into the machining hole, roll up the first chip and carry it out. The second cleaning component (200) is disposed on the machine body. The first cleaning component (100) and the second cleaning component (200) are switchably connected to the machining spindle. The second cleaning component (200) is movably disposed along a second predetermined trajectory. The second cleaning component (200) is used to generate magnetic force to extend into the machining hole, so that the second chip is adsorbed on the second cleaning component (200) and carried out from the machining hole.

2. The processing equipment according to claim 1, characterized in that, The processing equipment also includes: A visual recognition component is used to identify the first chip and the second chip. The visual recognition component is connected to the first cleaning component (100) and the second cleaning component (200) respectively, so as to control the operation of the first cleaning component (100) or the second cleaning component (200) according to the recognition result of the visual recognition component.

3. The processing equipment according to claim 1, characterized in that, The processing equipment also includes: A switching component is movably disposed on the machine body. The switching component has a clamping part, which clamps the first cleaning component (100) or the second cleaning component (200) to install the first cleaning component (100) or the second cleaning component (200) onto the machining spindle.

4. The processing equipment according to claim 1, characterized in that, The chip-rolling component (110) extends along a predetermined spiral trajectory. After the machining spindle drives the chip-rolling component (110) to extend into the machining hole, the machining spindle drives the chip-rolling component (110) to rotate so as to roll the first chip onto the chip-rolling component (110). Then, the machining spindle drives the chip-rolling component (110) to be pulled out from the machining hole.

5. The processing equipment according to claim 4, characterized in that, The first cleaning component (100) further includes: Mounting rod (120), one end of which is detachably connected to the machining spindle and the other end of which is connected to the chip-rolling component (110), the machining spindle drives the chip-rolling component (110) to move through the mounting rod (120).

6. The processing equipment according to claim 1, characterized in that, The processing equipment further includes: a chip removal component (300), the chip removal component (300) comprising: Support plate (310); A chip removal column (320) is disposed on the support plate (310). The chip removal column (320) extends from the support plate (310). The machining spindle drives the chip rolling component (110) to move until it abuts against the chip removal column (320). Then, the chip rolling component (110) rotates and moves in a predetermined direction so that the first chip is detached from the chip rolling component (110) under the force of the chip removal column (320).

7. The processing equipment according to claim 1, characterized in that, The second cleaning component (200) includes: Sleeve (210), the sleeve (210) is provided with a first contact head (211) inside; A rod (220) is inserted into the sleeve (210). The end of the rod (220) is provided with a second contact head (221). The sleeve (210) is movably disposed relative to the rod (220) so that after the first contact head (211) contacts the second contact head (221), the sleeve (210) generates an electromagnetic force to attract the second chip in the machining hole.

8. The processing equipment according to claim 7, characterized in that, The second cleaning component (200) also includes: A gripper (230) is provided at the open end of the sleeve (210). The gripper (230) is configured to open and close so that after the first contact head (211) contacts the second contact head (221), the gripper (230) generates an electromagnetic force and rotates toward the through rod (220) to clamp the through rod (220) so that the through rod (220) and the sleeve (210) move synchronously.

9. The processing equipment according to claim 8, characterized in that, The through rod (220) is provided with a locking part (240), the locking part (240) protrudes relative to the surface of the through rod (220), and at least part of the gripper (230) engages with the locking part (240) to clamp the through rod (220).

10. The processing equipment according to claim 7, characterized in that, The second cleaning component (200) also includes: A cover (250) is provided on the through rod (220), the cover (250) protrudes relative to the surface of the through rod (220), and the cover (250) is provided around the through rod (220); The sleeve (210) is provided with an open end face (212). After the sleeve (210) is energized and generates electromagnetic force, it attracts the cover part (250) so that the cover part (250) fits with the open end face (212).

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