A new structure for controlling thermal elongation of a main shaft

Abstract

The utility model discloses a novel structure of control main shaft heat elongation, including control main shaft main part, heat dissipation subassembly, heat dissipation subassembly includes liquid storage tank, is used for the storage of cooling liquid, the inner chamber of control main shaft main part is equipped with temperature sensor and heat conducting layer, be equipped with circulating cooling pipe on heat conducting layer, and circulating cooling pipe is connected with liquid storage tank and sets up, refrigeration structure, the refrigeration structure includes the semiconductor refrigeration board in liquid storage tank, the refrigeration end of semiconductor refrigeration board is installed with the cold -conducting plate, and is equipped with a plurality of cold -conducting rods on the cold -conducting plate. The utility model discloses a heat dissipation subassembly can take away the heat of control main shaft, can effectively control the heat elongation of main shaft, has improved the precision of processing, surface finish and tool life, temperature sensor can detect the temperature of control main shaft in real time, and through temperature situation control semiconductor refrigeration board's work power on refrigeration structure, has realized the rapid cooling of cooling liquid after backflow, has improved the refrigeration effect of semiconductor refrigeration board.

Description

Technical Field

[0001] This utility model relates to the field of spindle control technology, and in particular to a novel structure for controlling the thermal elongation of a spindle. Background Technology

[0002] The spindle of a CNC machine tool or machining center is the core power component, and its performance directly determines machining accuracy and efficiency. Modern spindles mostly use servo motor drives to achieve wide-range stepless speed regulation to meet the needs of different materials and processes. Through a built-in encoder connected to the control system in a closed loop, speed, torque, and axial position can be precisely controlled. Controlling spindle thermal expansion is a crucial and classic topic in the field of precision machinery.

[0003] Most existing CNC machine tools or machining centers have a single control spindle without a cooling structure. When the spindle is running at high speed, the temperature rises due to bearing friction, motor heating and cutting heat, which causes thermal expansion of the control spindle, thus affecting machining accuracy, surface finish and tool life.

[0004] Therefore, those skilled in the art have proposed a novel structure for controlling the thermal elongation of the spindle to solve the problems mentioned above. Utility Model Content

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0006] In view of the above-mentioned novel structure for controlling the thermal elongation of the spindle, this utility model is proposed.

[0007] Therefore, the purpose of this utility model is to provide a novel structure for controlling the thermal expansion of the spindle, which solves the problem that the high temperature during high-speed spindle operation causes thermal expansion, affecting machining accuracy.

[0008] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a novel structure for controlling the thermal elongation of a spindle, comprising a control spindle body;

[0009] The heat dissipation assembly includes a liquid storage tank for storing coolant. The inner cavity of the control spindle body is provided with a temperature sensor and a heat-conducting layer. A circulating cooling pipe is provided on the heat-conducting layer and is connected to the liquid storage tank.

[0010] A refrigeration structure includes a semiconductor refrigeration plate disposed in a liquid storage tank. The refrigeration end of the semiconductor refrigeration plate is equipped with a cold-conducting plate, and the cold-conducting plate is provided with multiple sets of cold-conducting rods for cooling the coolant.

[0011] As a preferred embodiment of the novel structure for controlling the thermal expansion of the spindle described in this utility model, the heat dissipation assembly further includes a water pump installed on the liquid storage tank, and the water inlet of the water pump is connected to the liquid storage tank through a pipe.

[0012] As a preferred embodiment of the novel structure for controlling the thermal expansion of the spindle described in this utility model, the water pump outlet is connected to a liquid delivery pipe, the liquid delivery pipe is connected to the liquid inlet of the circulating cooling pipe, the circulating cooling pipe outlet is connected to a return pipe, and the return pipe is connected to the liquid storage tank.

[0013] As a preferred embodiment of the novel structure for controlling the thermal expansion of the main shaft described in this utility model, a rotating sleeve is rotatably connected to the main body of the control shaft, the infusion pipe and the return pipe are disposed inside the rotating sleeve, and a sealing layer is provided between the rotating sleeve and the infusion pipe and the return pipe.

[0014] As a preferred embodiment of the novel structure for controlling the thermal expansion of the spindle described in this utility model, the cooling structure further includes a mounting frame fixed to the liquid storage tank, and the semiconductor cooling plate is disposed on the mounting frame.

[0015] In a preferred embodiment of the novel structure for controlling the thermal elongation of the spindle described in this utility model, a heat-conducting plate is installed at the heating end of the semiconductor cooling plate, and a circulating heat dissipation pipe is installed on the heat-conducting plate.

[0016] As a preferred embodiment of the novel structure for controlling the thermal expansion of the spindle described in this utility model, the heat-conducting plate is equipped with multiple sets of heat dissipation fins, and the heat dissipation fins are located on the outside of the circulating heat dissipation pipe.

[0017] As a preferred embodiment of the novel structure for controlling the thermal expansion of the spindle described in this utility model, the liquid storage tank is equipped with a liquid filling pipe that is connected to it, and the end of the liquid filling pipe is provided with a cap.

[0018] The beneficial effects of this invention are as follows: This invention uses a water pump in the heat dissipation assembly to transport the coolant in the storage tank to the circulating cooling pipe. The heat-conducting layer conducts heat from the control spindle to the circulating cooling pipe. The low temperature of the coolant in the circulating cooling pipe carries away the heat, effectively controlling the thermal elongation of the spindle and improving machining accuracy, surface finish, and tool life. The temperature sensor can detect and control the spindle temperature in real time and control the working power of the semiconductor cooling plate on the cooling structure based on the temperature. When the semiconductor cooling plate is working, the cold air generated at the cooling end is conducted to the coolant through the cooling plate and multiple sets of cooling rods, achieving rapid cooling of the coolant after recirculation. The heat-conducting plate, circulating cooling pipe, and heat dissipation fins dissipate the heat generated at the heating end of the semiconductor cooling plate during operation, increasing the heat dissipation area and improving the cooling effect of the semiconductor cooling plate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0020] Figure 1 This is a schematic diagram of the overall structure of a novel structure for controlling the thermal elongation of a spindle according to this utility model.

[0021] Figure 2 This is a schematic diagram of the internal structure of the control spindle body, which is a novel structure for controlling the thermal elongation of the spindle according to this utility model.

[0022] Figure 3 This is a cross-sectional schematic diagram of the connection structure between the refrigeration structure and the liquid storage tank of a novel structure for controlling the thermal expansion of the spindle according to this utility model.

[0023] Figure Descriptions: 100, Control spindle body; 101, Rotating sleeve; 102, Sealing layer; 200, Heat dissipation assembly; 201, Liquid storage tank; 202, Water pump; 203, Infusion pipe; 204, Return pipe; 205, Temperature sensor; 206, Thermal conductive layer; 207, Circulating cooling pipe; 300, Refrigeration structure; 301, Mounting frame; 302, Semiconductor refrigeration plate; 303, Cold conductive plate; 304, Cold conductive rod; 305, Heat conductive plate; 306, Circulating heat dissipation pipe; 307, Heat dissipation fins. Detailed Implementation

[0024] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0025] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0027] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0028] Example 1

[0029] Reference Figures 1 to 3 This is the first embodiment of the present invention. This embodiment provides a novel structure for controlling the thermal expansion of the spindle, which can effectively control the thermal expansion of the spindle and thus improve the machining accuracy. It includes controlling the spindle body 100.

[0030] It should be noted that the main control spindle 100 is the core power component of CNC machine tools or machining centers. Before use, the electrical terminals of the electrical equipment should be electrically connected to the power supply and the electrical terminals of the controller through wires.

[0031] The heat dissipation assembly 200 includes a liquid storage tank 201 for storing coolant. The inner cavity of the control spindle body 100 is provided with a temperature sensor 205 and a heat-conducting layer 206. A circulating cooling pipe 207 is provided on the heat-conducting layer 206 and is connected to the liquid storage tank 201.

[0032] The refrigeration structure 300 includes a semiconductor refrigeration plate 302 disposed in the liquid storage tank 201. A cooling plate 303 is installed on the cooling end of the semiconductor refrigeration plate 302, and multiple sets of cooling rods 304 are provided on the cooling plate 303 for cooling the coolant.

[0033] During use, coolant is added to the reservoir 201. The heat-conducting layer 206 dissipates the heat generated when the main spindle body 100 rotates at high speed. The low temperature of the coolant in the circulating cooling pipe 207 dissipates the heat dissipated by the heat-conducting layer 206. The temperature sensor 205 can detect the temperature of the main spindle body 100 in real time and feed the temperature status back to the controller. The controller controls the working power of the semiconductor cooling plate 302 on the cooling structure 300. When the semiconductor cooling plate 302 is working, the cold air generated at the cooling end is discharged through the cooling plate 303. Multiple sets of cooling rods 304 conduct the cold air to the coolant, realizing rapid cooling of the coolant after recirculation.

[0034] Example 2

[0035] Reference Figures 1 to 3 This is the second embodiment of the present invention. Unlike the previous embodiment, the heat dissipation component 200 also includes a water pump 202 installed on the liquid storage tank 201. The water inlet of the water pump 202 is connected to the liquid storage tank 201 through a pipe.

[0036] Furthermore, the outlet of the water pump 202 is connected to a liquid delivery pipe 203, which is connected to the inlet of the circulating cooling pipe 207. The outlet of the circulating cooling pipe 207 is connected to a return pipe 204, which is connected to the storage tank 201. The operation of the water pump 202 delivers the coolant in the storage tank 201 to the circulating cooling pipe 207 through the liquid delivery pipe 203, and the circulating cooling pipe 207 returns to the storage tank 201 through the return pipe 204.

[0037] The control spindle body 100 is rotatably connected to a rotating sleeve 101. The liquid delivery pipe 203 and the liquid return pipe 204 are located inside the rotating sleeve 101, and a sealing layer 102 is provided between the rotating sleeve 101 and the liquid delivery pipe 203 and the liquid return pipe 204. The sealing layer 102 plays a sealing role, and the rotating sleeve 101 plays a role in fixing the position of the liquid delivery pipe 203 and the liquid return pipe 204. The liquid delivery pipe 203 and the liquid return pipe 204 are rotatably connected to the inlet and outlet of the circulating cooling pipe 207 (through a rotatable interface), respectively. When the control spindle body 100 rotates, the position of the liquid delivery pipe 203 and the liquid return pipe 204 does not move, and does not affect the delivery and return of the coolant.

[0038] The refrigeration structure 300 also includes a mounting frame 301 fixed to the liquid storage tank 201, and a semiconductor refrigeration plate 302 is disposed on the mounting frame 301.

[0039] Among them, the heat-generating end of the semiconductor cooling plate 302 is equipped with a heat-conducting plate 305, and a circulating heat dissipation pipe 306 is installed on the heat-conducting plate 305.

[0040] Furthermore, multiple sets of heat dissipation fins 307 are installed on the heat conduction plate 305, and the heat dissipation fins 307 are located outside the circulating heat dissipation pipe 306. The heat conduction plate 305 has good heat conduction properties, which can conduct the heat generated by the heat-generating end of the semiconductor cooling plate 302 when it is working, and discharge it through the circulating heat dissipation pipe 306 and multiple sets of heat dissipation fins 307, thereby increasing the heat dissipation area and improving the cooling effect of the semiconductor cooling plate 302.

[0041] The liquid storage tank 201 is equipped with a liquid filling pipe that is connected to it, and the pipe end is covered with a cap; the cap can be easily opened and closed, and the liquid filling pipe is used to add coolant.

[0042] During use, the water pump 202 of the heat dissipation component 200 operates, transporting the coolant in the storage tank 201 to the circulating cooling pipe 207 through the delivery pipe 203. The heat-conducting layer 206 dissipates the heat generated when the spindle body 100 rotates at high speed. The low temperature of the coolant in the circulating cooling pipe 207 dissipates the heat dissipated by the heat-conducting layer 206. The return pipe 204 returns the hot coolant to the storage tank 201, which can effectively control the thermal expansion of the spindle and improve the machining accuracy, surface finish and tool life.

[0043] Temperature sensor 205 can detect and control the temperature of spindle body 100 in real time, and control the working power of semiconductor cooling plate 302 on cooling structure 300 according to the temperature (power increases when the temperature is high, improving the cooling effect). When semiconductor cooling plate 302 is working, the cold air generated at the cooling end is conducted to the coolant in the liquid storage tank 201 through cooling plate 305 and multiple sets of cooling rods 304, realizing rapid cooling of the coolant after recirculation. Heat conduction plate 305, circulating heat pipe 306 and heat dissipation fins 307 dissipate the heat generated at the heating end of semiconductor cooling plate 302 when it is working, improving the cooling effect of semiconductor cooling plate 302.

[0044] It is worth noting that the entire device is controlled by a controller. Since the controller is a common device and belongs to existing mature technology, its electrical connection relationship and specific circuit structure will not be described in detail here.

[0045] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0046] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0047] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A novel structure for controlling the thermal elongation of a spindle, comprising a spindle control body (100), characterized in that... ； The heat dissipation assembly (200) includes a liquid storage tank (201) for storing coolant. The inner cavity of the control spindle body (100) is provided with a temperature sensor (205) and a heat-conducting layer (206). The heat-conducting layer (206) is provided with a circulating cooling pipe (207), and the circulating cooling pipe (207) is connected to the liquid storage tank (201). A cooling structure (300) includes a semiconductor cooling plate (302) disposed in a liquid storage tank (201). A cooling plate (303) is installed on the cooling end of the semiconductor cooling plate (302), and multiple sets of cooling rods (304) are provided on the cooling plate (303) for cooling the coolant.

2. The novel structure for controlling the thermal elongation of the spindle according to claim 1, characterized in that: The heat dissipation assembly (200) also includes a water pump (202) installed on the liquid storage tank (201), and the water inlet of the water pump (202) is connected to the liquid storage tank (201) through a pipe.

3. The novel structure for controlling the thermal elongation of the spindle according to claim 2, characterized in that: The outlet of the water pump (202) is connected to a liquid delivery pipe (203), which is connected to the inlet of the circulating cooling pipe (207). The outlet of the circulating cooling pipe (207) is connected to a return pipe (204), which is connected to the storage tank (201).

4. The novel structure for controlling the thermal elongation of the spindle according to claim 3, characterized in that: A rotating sleeve (101) is rotatably connected to the main body (100) of the control spindle. The infusion tube (203) and return tube (204) are located inside the rotating sleeve (101), and a sealing layer (102) is provided between the rotating sleeve (101) and the infusion tube (203) and return tube (204).

5. The novel structure for controlling the thermal elongation of the spindle according to claim 1, characterized in that: The refrigeration structure (300) also includes a mounting frame (301) fixed to the liquid storage tank (201), and the semiconductor refrigeration plate (302) is disposed on the mounting frame (301).

6. The novel structure for controlling the thermal elongation of the spindle according to claim 1, characterized in that: The heat-generating end of the semiconductor cooling plate (302) is equipped with a heat-conducting plate (305), and a circulating heat dissipation pipe (306) is installed on the heat-conducting plate (305).

7. The novel structure for controlling the thermal elongation of the spindle according to claim 6, characterized in that: The heat-conducting plate (305) is equipped with multiple sets of heat dissipation fins (307), and the heat dissipation fins (307) are located outside the circulating heat dissipation pipe (306).

8. The novel structure for controlling the thermal elongation of the spindle according to claim 1, characterized in that: The liquid storage tank (201) is equipped with a liquid filling pipe that is connected to it, and the end of the liquid filling pipe is covered with a cap.

Images