Wafer chamfering machine

Abstract

The utility model provides a kind of wafer chamfering machine, wafer chamfering machine includes: bunker device, including first bunker assembly and second bunker assembly;Transfer device is set on support base, first bunker assembly is set on transfer device or the first side of transfer device, and second bunker assembly is set on the second side of transfer device;Double-station manipulator and detection device are all set on the second side of transfer device and second bunker assembly and detection device are respectively located the opposite sides of double-station manipulator;Processing device and transfer device are set on support base and located the side of double-station manipulator away from transfer device, to solve the problem of lower processing efficiency of wafer chamfering machine in prior art.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and more specifically, to a wafer chamfering machine. Background Technology

[0002] In the semiconductor manufacturing industry, wafer chamfering is one of the key steps to ensure chip quality and performance. Existing wafer chamfering machines typically employ single-station or low-station processing methods. In these processes, wafer handling, inspection, grinding, cleaning, and drying often need to be performed sequentially at different stations, and wafer transfer between these processes is usually handled by a single-station robotic arm equipped with the wafer chamfering machine.

[0003] However, a single-station robotic arm needs to complete a series of processes, including wafer loading, grinding, and unloading, in each processing operation. While loading or unloading the wafer, another operation cannot be performed simultaneously, resulting in a longer waiting time for the wafer chamfering machine and reduced processing efficiency. Utility Model Content

[0004] The main objective of this invention is to provide a wafer beveling machine to solve the problem of low processing efficiency in existing wafer beveling machines.

[0005] To achieve the above objectives, according to one aspect of the present invention, a wafer chamfering machine is provided, comprising: a hopper device including a first hopper assembly and a second hopper assembly; a transfer device disposed on a supporting base, wherein the first hopper assembly is disposed on the transfer device or on a first side of the transfer device, and the second hopper assembly is disposed on a second side of the transfer device; a dual-station robot and a detection device, both disposed on the second side of the transfer device, with the second hopper assembly and the detection device respectively located on opposite sides of the dual-station robot; a processing device and a transfer device disposed on the supporting base and located on the side of the dual-station robot away from the transfer device; wherein the transfer device is used to transfer the wafer between the first hopper assembly and the dual-station robot, the dual-station robot is used to transfer the wafer between the transfer device, the second hopper assembly, the detection device, and the transfer device, the detection device is used to detect the wafer to be processed or the processed wafer, the transfer device is used to transfer the wafer between the dual-station robot, the detection device, and the processing device, and the processing device is used to process the wafer from the transfer device.

[0006] Furthermore, the processing apparatus includes: a wafer carrier assembly disposed on a support base surface, the wafer carrier assembly including a rotating platform for carrying the wafer; and a grinding assembly disposed on the support base surface and located on one side of the wafer carrier assembly for grinding the wafer located on the rotating platform.

[0007] Furthermore, the grinding assembly includes: a mounting bracket disposed on a support base; an outer peripheral rough grinding wheel assembly rotatably disposed on the mounting bracket for rough grinding of the outer peripheral surface of the wafer; an outer peripheral fine grinding wheel assembly rotatably disposed on the mounting bracket for fine grinding of the outer peripheral surface of the wafer; a marking groove rough grinding wheel assembly rotatably disposed on the mounting bracket for rough grinding of the marking grooves of the wafer; and a marking groove fine grinding wheel assembly rotatably disposed on the mounting bracket for fine grinding of the marking grooves of the wafer.

[0008] Furthermore, the mounting frame includes: a first frame, disposed on a supporting base, with an outer peripheral coarse grinding wheel component located above and connected to the first frame; and a second frame, disposed on the supporting base and partially located above the first frame, with an outer peripheral fine grinding wheel component, an outer peripheral fine grinding wheel component, and a marking groove fine grinding wheel component spaced apart on the second frame.

[0009] Furthermore, the wafer chamfering machine includes a cleaning and drying device, which is located on one side of the transfer device. The transfer device is used to transfer the wafers processed by the processing device to the cleaning and drying device for cleaning and drying, and to transfer the cleaned and dried wafers to the dual-station robotic arm.

[0010] Furthermore, the processing apparatus also includes a standard plate calibration mechanism, including a standard plate for eccentric calibration of the rotating platform to ensure that the center of the wafer coincides with the rotation axis of the rotating platform; and / or, the wafer chamfering machine also includes a trimming plate for mounting on the rotating platform to trim the peripheral fine grinding wheel components, or for storing in the second hopper assembly.

[0011] Furthermore, the dual-station robot includes: a longitudinal movement module, at least a portion of which is movably arranged along a first direction perpendicular to the support base; an intermediate rotation module, the moving part of which is connected to the fixed part of which is rotatably arranged about a predetermined axis parallel to the first direction; a transverse movement module, the rotating part of which is connected to the fixed part of which is movably arranged along a second direction parallel to the support base; and two operating arms, which are spaced apart along the first direction, the moving parts of which are respectively connected to one end of each of the two operating arms, and the other end of each operating arm is used for picking up and placing wafers.

[0012] Further, the transfer device includes: a transfer frame disposed on a support base; a lateral movement assembly disposed within the transfer frame and at least partially movably disposed along a third direction parallel to the support base; and a transfer robot arm, the movable end of the lateral movement assembly being connected to the fixed end of the transfer robot arm, at least a portion of the transfer robot arm being movably disposed along a fourth direction parallel to the support base and a first direction perpendicular to the support base, and rotatably disposed about the first direction, for picking up and placing wafers.

[0013] Furthermore, the transverse assembly includes: a fixed plate, which is installed within the transfer frame; a transverse transmission assembly, which is movably disposed within the transfer frame along a third direction; a transverse drive unit, which is installed on the fixed plate and drivenly connected to the transverse transmission assembly to drive the transverse transmission assembly to move; a transverse guide assembly, whose guide rail is installed on the fixed plate, and whose slider is connected to the transverse transmission assembly to guide the movement of the transverse transmission assembly; and a transverse plate, which is connected to the transverse transmission assembly to drive the transverse plate to move along a third direction, and a transfer robot is installed on the transverse plate to move along the transverse plate along a third direction.

[0014] Furthermore, the transfer robot includes: a first moving module, at least a portion of which is movably disposed along a first direction; a rotating module, the moving part of the first moving module being connected to the fixed part of the rotating module, the rotating part of the rotating module being rotatably disposed about a predetermined axis parallel to the first direction; a second moving module, the rotating part of the rotating module being connected to the fixed part of the second moving module, the moving part of the second moving module being movably disposed along a fourth direction; and a pick-and-place arm, the moving part of the second moving module being connected to one end of the pick-and-place arm, the other end of which is used for picking up and placing wafers.

[0015] Furthermore, both the first and second hopper assemblies include: a loading platform, including a loading section having a receiving space; a hopper detachably disposed on the bottom surface of the receiving space; a guide section, including a plurality of guide members spaced apart on the bottom surface of the receiving space to form a limiting space for limiting the lower end of the hopper; and an adjustment section, including an adjustment member disposed on the bottom surface of the receiving space, the adjustment member being adjustablely disposed at least along a direction perpendicular to the bottom surface of the receiving space to contact the circumferential edge of the bottom surface of the hopper to adjust the height at a corresponding position of the circumferential edge of the bottom surface of the hopper.

[0016] Furthermore, the hopper assembly also includes a support platform, which is located below the loading platform to support the loading platform, and a storage cavity is provided inside the support platform.

[0017] Applying the technical solution of this utility model, the wafer chamfering machine of this utility model includes: a hopper device, including a first hopper assembly and a second hopper assembly; a transfer device, disposed on a supporting base, the first hopper assembly being disposed on the transfer device or on a first side of the transfer device, and the second hopper assembly being disposed on a second side of the transfer device; a dual-station robot and a detection device, both disposed on the second side of the transfer device, with the second hopper assembly and the detection device respectively located on opposite sides of the dual-station robot; a processing device and a transfer device, disposed on the supporting base and located on the side of the dual-station robot away from the transfer device; wherein, the transfer device is used to transfer the wafer between the first hopper assembly and the dual-station robot, the dual-station robot is used to transfer the wafer between the transfer device, the second hopper assembly, the detection device, and the transfer device, the detection device is used to detect the wafer to be processed or the processed wafer, the transfer device is used to transfer the wafer between the dual-station robot, the detection device, and the processing device, and the processing device is used to process the wafer from the transfer device. Technically, this wafer chamfering machine significantly improves the efficiency and precision of wafer chamfering through efficient wafer transfer. In principle, the combination of a transfer device and a dual-station robotic arm enables rapid wafer positioning and transfer, avoiding the excessively long wafer waiting time in traditional single-station designs. In terms of effectiveness, this invention significantly enhances the continuity and automation of wafer chamfering, solving the problem of low processing efficiency in existing wafer chamfering machines, thus achieving high-efficiency and low-damage wafer processing. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0019] Figure 1 A schematic diagram of one embodiment of the wafer chamfering machine according to the present invention is shown;

[0020] Figure 2 A partial structural schematic diagram of another embodiment of the wafer chamfering machine according to the present invention is shown;

[0021] Figure 3 It shows Figure 1 The diagram shows the structural design of the wafer chamfering machine's processing apparatus.

[0022] Figure 4 It shows Figure 1 The diagram shows the usage of the trimming disc in a wafer chamfering machine;

[0023] Figure 5 It shows Figure 1 The diagram shown is a partial structural schematic of a wafer chamfering machine.

[0024] Figure 6 It shows Figure 5 A magnified view of part A of the wafer chamfering machine shown;

[0025] Figure 7 It shows Figure 5 The diagram shows the structure of a dual-station robotic arm in one direction of a wafer chamfering machine.

[0026] Figure 8 It shows Figure 7 The diagram shows the structure of the dual-station robot in another direction.

[0027] Figure 9 It shows Figure 1 The diagram shows the structure of the transfer device for the wafer chamfering machine;

[0028] Figure 10 It shows Figure 9 The diagram shows the structure of the transfer robot in one direction of the transfer device.

[0029] Figure 11 It shows Figure 10 The diagram shown is a structural schematic of the transfer robot in another direction;

[0030] Figure 12 It shows Figure 10 The diagram shows the structure of the transfer robot in another direction.

[0031] Figure 13 It shows Figure 10 The diagram shows the structure of the transfer robot as it moves along the first direction.

[0032] Figure 14 A schematic diagram of the structure of a first embodiment of a hopper assembly according to the present invention is shown;

[0033] Figure 15 It shows Figure 1 A front view of a portion of the structure of the first hopper assembly of the wafer chamfering machine shown;

[0034] Figure 16 It shows Figure 15 A top view of the first hopper assembly shown;

[0035] Figure 17 It shows Figure 15 The first hopper assembly shown is a front view of the wafer chamfering machine when it is partially obscured.

[0036] Figure 18 It shows Figure 15 The first hopper assembly shown is a front view of the wafer chamfering machine.

[0037] Figure 19 It shows Figure 15 The diagram shows a top view of the hopper assembly in a wafer chamfering machine;

[0038] Figure 20 It shows Figure 15 The diagram shows the structure of the hopper assembly in the wafer chamfering machine;

[0039] Figure 21 It shows Figure 1 The diagram shows the structure of the second hopper assembly of the wafer chamfering machine.

[0040] Figure 22 A flowchart of an embodiment of the wafer chamfering machine control method according to the present invention is shown.

[0041] The above figures include the following reference numerals:

[0042] 1. Material loading platform; 11. Material loading section; 111. Accommodation space; 112. Base plate; 113. Rear plate; 114. Side plate; 115. Material loading plate;

[0043] 2. Material box; 21. Guide groove;

[0044] 3. Guide section; 31. Guide component; 33. Protective pad;

[0045] 4. Adjustment section; 41. Adjustment component; 411. Adjustment connecting plate; 412. Adjustment screw;

[0046] 6. Material box detection components;

[0047] 7. Support platform; 71. Storage cavity;

[0048] 81. Transfer frame;

[0049] 82. Lateral movement assembly; 821. Fixed plate; 822. Lateral movement transmission assembly; 8221. Driving pulley; 8222. Driven pulley; 8223. Transmission belt; 823. Lateral movement drive unit; 824. Lateral movement guide assembly; 825. Lateral movement plate; 826. Limiting part;

[0050] 83. Transfer robot; 831. First moving module; 8311. First base plate; 8312. First drive unit; 8313. First guide assembly; 8314. Lead screw and nut assembly; 8315. Second base plate; 8316. Second drive unit; 8317. Third base plate; 832. Rotating module; 8321. Rotating drive unit; 8322. Rotating disk; 833. Second moving module; 8331. Third drive unit; 8332. Fourth base plate; 834. Pick-and-place arm; 8341. Connecting arm; 8342. Pick-and-place arm;

[0051] 91. Longitudinal moving module; 911. First connecting plate; 912. Longitudinal drive unit; 913. Longitudinal guide assembly; 914. Longitudinal transmission assembly; 915. Second connecting plate; 92. Intermediate rotating module; 921. Intermediate drive unit; 922. Rotating component; 93. Lateral moving module; 931. First lateral drive unit; 932. Third connecting plate; 933. Intermediate connecting plate; 934. Second lateral guide assembly; 935. First lateral transmission assembly; 936. Second lateral transmission assembly; 937. First lateral guide assembly; 938. Fourth connecting plate; 939. Fifth connecting plate; 94. Operating arm; 941. Strip arm; 942. Loading arm;

[0052] 100. Hopper assembly; 200. Second hopper assembly; 300. Transfer device; 400. Dual-station robotic arm; 500. Detection device;

[0053] 600. Processing device; 610. Wafer carrier assembly; 611. Rotating platform; 620. Grinding assembly; 621. Mounting bracket; 622. Outer peripheral rough grinding wheel assembly; 623. Outer peripheral fine grinding wheel assembly; 624. Marking groove rough grinding wheel assembly; 625. Marking groove fine grinding wheel assembly; 626. First frame; 627. Second frame;

[0054] 700. Transfer device; 800. Washing and drying device; 900. Trimming plate. Detailed Implementation

[0055] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0056] like Figures 1 to 21As shown, this utility model provides a wafer chamfering machine, comprising: a hopper device including a first hopper assembly 100 and a second hopper assembly 200; a transfer device 300 disposed on a supporting base, the first hopper assembly 100 disposed on the transfer device 300 or on a first side of the transfer device 300, and the second hopper assembly 200 disposed on a second side of the transfer device 300; a dual-station robot 400 and a detection device 500, both disposed on the second side of the transfer device 300, with the second hopper assembly 200 and the detection device 500 respectively located on opposite sides of the dual-station robot 400; a processing device 600 and a transfer device 700 disposed on the supporting base. It is located on the side of the dual-station robot 400 away from the transfer device 300; wherein, the transfer device 300 is used to transfer the wafer between the first hopper assembly 100 and the dual-station robot 400, the dual-station robot 400 is used to transfer the wafer between the transfer device 300, the second hopper assembly 200, the inspection device 500 and the transfer device 700, the inspection device 500 is used to inspect the wafer to be processed or the processed wafer, the transfer device 700 is used to transfer the wafer between the dual-station robot 400, the inspection device 500 and the processing device 600, and the processing device 600 is used to process the wafer from the transfer device 700.

[0057] Technically, this wafer chamfering machine significantly improves the efficiency and precision of wafer chamfering through efficient wafer transfer. In principle, the combination of a transfer device and a dual-station robotic arm enables rapid wafer positioning and transfer, avoiding the excessively long wafer waiting time in traditional single-station designs. In terms of effectiveness, this invention significantly enhances the continuity and automation of wafer chamfering, solving the problem of low processing efficiency in existing wafer chamfering machines, thus achieving high-efficiency and low-damage wafer processing.

[0058] Among them, Figure 1 In the wafer chamfering machine shown, the first hopper assembly 100 is Figures 14 to 20 The loading and unloading process of the aforementioned hopper may still require manual intervention; Figure 2 In the wafer chamfering machine shown, the first hopper assembly 100 is a fully automatic hopper assembly.

[0059] like Figure 3 As shown, the processing apparatus 600 includes: a wafer carrier assembly 610 disposed on a support base surface, the wafer carrier assembly 610 including a rotating platform 611 for carrying the wafer; and a grinding assembly 620 disposed on the support base surface and located on one side of the wafer carrier assembly 610, for grinding the wafer located on the rotating platform 611.

[0060] Technically, the wafer carrier assembly achieves precise positioning and rotation of the wafer through a rotating platform, while the grinding assembly performs multi-stage fine grinding on the wafer using different types of grinding wheels. In principle, the coordinated work of the wafer carrier assembly and the grinding assembly ensures the stability and accuracy of the wafer during the grinding process, avoiding quality problems caused by minute displacements during processing. In terms of effectiveness, this invention can effectively improve the surface quality and processing accuracy of wafer edges, thereby achieving low-damage grinding of wafer edges.

[0061] like Figure 3 As shown, the grinding assembly 620 includes: a mounting frame 621 disposed on a support base; an outer peripheral rough grinding wheel assembly 622 rotatably disposed on the mounting frame 621 for rough grinding of the outer peripheral surface of the wafer; an outer peripheral fine grinding wheel assembly 623 rotatably disposed on the mounting frame 621 for fine grinding of the outer peripheral surface of the wafer; a marking groove rough grinding wheel assembly 624 rotatably disposed on the mounting frame 621 for rough grinding of the marking grooves of the wafer; and a marking groove fine grinding wheel assembly 625 rotatably disposed on the mounting frame 621 for fine grinding of the marking grooves of the wafer.

[0062] Technically, the grinding assembly employs a multi-stage grinding wheel design, enabling graded grinding of the wafer's outer circumference and marking grooves, thereby ensuring the uniformity of the wafer's chamfer and surface quality. In principle, by using grinding wheels of different grits, the smoothness of the wafer surface is gradually improved from coarse to fine grinding, reducing surface damage. In terms of effect, this invention significantly improves the surface roughness of the wafer edges and reduces the damage rate at the wafer edges, thus achieving high-quality chamfering of the wafer edges.

[0063] like Figure 3 As shown, the mounting frame 621 includes: a first frame 626, which is disposed on the support base, with an outer peripheral coarse grinding wheel component 622 located above and connected to the first frame 626; and a second frame 627, which is disposed on the support base and partially located above the first frame 626, with an outer peripheral fine grinding wheel component 623, an outer peripheral fine grinding wheel component 623 and a marking groove fine grinding wheel component 625 spaced apart on the second frame 627.

[0064] Technically, by layering the grinding wheel components with different functions, not only is space saved, but the replacement and maintenance of the grinding wheels are also facilitated. In principle, the layered design of the grinding wheel components helps reduce mutual interference between the grinding wheels, improving the stability of the grinding process. In terms of effectiveness, this invention simplifies the structure of the wafer chamfering machine, reduces its cost, and maintains high-precision grinding results.

[0065] like Figure 1As shown, the wafer chamfering machine includes a cleaning and drying device 800, which is located on one side of the transfer device 700. The transfer device 700 is used to transfer the wafers processed by the processing device 600 to the cleaning and drying device 800 for cleaning and drying, and to transfer the cleaned and dried wafers to the dual-station robot arm 400.

[0066] Technically, the integrated design of the cleaning and drying device with the transfer device enables automated cleaning and drying of wafers after processing, improving the continuity and automation of wafer processing. In principle, the cleaning and drying device effectively removes grinding residues from the wafer surface through high-pressure water jets and high-speed rotation, preventing contamination in subsequent processing. In terms of effectiveness, this invention significantly improves the overall efficiency and cleanliness of wafer processing, thus achieving highly efficient and clean wafer processing.

[0067] like Figure 4 As shown, the processing apparatus 600 also includes a standard plate calibration mechanism, including a standard plate, for eccentric calibration of the rotating platform 611 to ensure that the center of the wafer coincides with the rotation axis of the rotating platform 611; and / or, the wafer chamfering machine also includes a trimming plate 900, for mounting on the rotating platform 611 to trim the peripheral fine grinding wheel component 623, or stored in the second hopper assembly 200.

[0068] like Figures 5 to 8 As shown, the dual-station robot 400 of this utility model includes a longitudinal movement module 91, at least a portion of which is movably arranged along a first direction perpendicular to the support base; an intermediate rotation module 92, the moving part of the longitudinal movement module 91 is connected to the fixed part of the intermediate rotation module 92, the rotating part of the intermediate rotation module 92 is rotatably arranged around a predetermined axis, the predetermined axis being parallel to the first direction; a transverse movement module 93, the rotating part of the intermediate rotation module 92 is connected to the fixed part of the transverse movement module 93, the moving part of the transverse movement module 93 is movably arranged along a second direction parallel to the support base; and two operating arms 94, the two operating arms 94 being spaced apart along the first direction, the moving part of the transverse movement module 93 being connected to one end of each of the two operating arms 94, and the other end of each operating arm 94 being used for picking up and placing wafers.

[0069] Technically, this invention achieves precise movement and positioning of a dual-station robotic arm in three-dimensional space through the combination of a longitudinal movement module 91, a central rotation module 92, and a transverse movement module 93. This design ensures high efficiency and accuracy in loading and unloading operations. In principle, the drive units and transmission components of each module work together to achieve precise movement of the operating arm 94. Simultaneously, the rotating part of the central rotation module rotates around a predetermined axis, ensuring flexible loading and unloading of the operating arm 94 in the vertical direction. In terms of effectiveness, this dual-station robotic arm can handle loading and unloading simultaneously, solving the problem of low processing efficiency in existing wafer chamfering machines and reducing waiting time.

[0070] like Figures 5 to 8 As shown, the longitudinal movement module 91 includes a first connecting plate 911 disposed on a support base; a longitudinal drive unit 912 disposed on the first connecting plate 911; a longitudinal guide assembly 913 with its guide rail disposed on the first connecting plate 911 and extending along a first direction; and a longitudinal transmission assembly 914 with its lead screw extending along the first direction. The longitudinal drive unit 912 is driven to the lead screw of the longitudinal transmission assembly 914 to drive the lead screw of the longitudinal transmission assembly 914 to rotate. The slider of the longitudinal guide assembly 913 is connected to the nut of the longitudinal transmission assembly 914 to move synchronously with the nut of the longitudinal transmission assembly 914 along the lead screw of the longitudinal transmission assembly 914.

[0071] Technically, this invention achieves precise movement of the nut along the lead screw through a drive connection between the longitudinal drive unit and the longitudinal transmission assembly. This structure ensures the high efficiency and stability of the longitudinal movement module. In principle, the guide rail and slider of the longitudinal guide assembly provide guidance and limits for the nut, ensuring straightness and smoothness during movement. Functionally, the longitudinal movement module in this invention can precisely control the vertical movement of the operating arm, providing stable and reliable support for wafer loading and unloading.

[0072] like Figures 5 to 8 As shown, the longitudinal moving module 91 includes a second connecting plate 915, at least one of the slider of the longitudinal guide assembly 913 and the nut of the longitudinal transmission assembly 914 is connected to the second connecting plate 915, and the second connecting plate 915 is connected to the fixed part of the intermediate rotating module 92 to drive the intermediate rotating module 92 to move along the first direction.

[0073] Technically, the second connecting plate in this invention makes the connection between the longitudinal moving module and the intermediate rotating module more stable, while ensuring the vertical translation of the intermediate rotating module, thus enhancing the flexibility and adaptability of the wafer chamfering machine. In principle, the second connecting plate acts as a connector, transmitting the movement of the longitudinal moving module to the intermediate rotating module, achieving linkage between them. In terms of effectiveness, this embodiment, through the use of the second connecting plate, ensures the stability and accuracy of the operating arm during wafer handling.

[0074] like Figures 5 to 8 As shown, the intermediate rotation module 92 includes an intermediate drive unit 921, which is disposed on the second connecting plate 915; and a rotating member 922. The intermediate drive unit 921 is driven to rotate the rotating member 922 around a predetermined axis. The rotating member 922 is connected to the fixed part of the transverse movement module 93.

[0075] Technically, the intermediate drive unit of this invention is connected to the drive of the rotating component, enabling the rotating component to rotate around a predetermined axis. This design ensures flexible picking and placing of the operating arm in the vertical direction. In principle, the intermediate drive unit of this invention transmits power to the rotating component, enabling it to rotate precisely. In terms of effect, the intermediate rotation module in this invention enables the operating arm to rotate in the vertical direction, improving the processing efficiency and accuracy of the wafer chamfering machine.

[0076] like Figures 5 to 8 As shown, the lateral movement module 93 includes a first lateral drive unit 931, the rotating part of the intermediate rotation module 92 is connected to the first lateral drive unit 931, and a third connecting plate 932. The first lateral drive unit 931 and the third connecting plate 932 are driven to drive the third connecting plate 932 to move along the second direction, and the third connecting plate 932 is connected to the operating arm 94.

[0077] Technically, the first lateral drive unit of this invention is connected to the third connecting plate, enabling the horizontal movement of the operating arm. This design ensures efficient wafer transfer within the wafer chamfering machine. In principle, the first lateral drive unit transmits power to the third connecting plate, allowing it to move precisely in the horizontal direction. Effectively, the lateral movement module in this invention enables rapid horizontal positioning of the operating arm, improving the processing speed and accuracy of the wafer chamfering machine.

[0078] like Figures 5 to 8As shown, the lateral movement module 93 includes: an intermediate connecting plate 933, the rotating part of the intermediate rotating module 92 is connected to the intermediate connecting plate 933; a second lateral driving part is disposed on the intermediate connecting plate 933; and a fourth connecting plate 938, the second lateral driving part is connected to the fourth connecting plate 938 to drive the fourth connecting plate 938 to move along the second direction, and a first lateral driving part 931 is disposed on the fourth connecting plate 938.

[0079] Technically, this invention achieves indirect driving of the first lateral drive unit and the operating arm through the cooperation of the intermediate connecting plate and the second lateral drive unit. In principle, the second lateral drive unit drives the fourth connecting plate to move, and the first lateral drive unit moves accordingly, thereby driving the operating arm to move horizontally. In terms of effectiveness, the technology in this invention enhances the modular design of the wafer chamfering machine, facilitating its maintenance and upgrades.

[0080] like Figures 5 to 8 As shown, the lateral movement module 93 includes: a fifth connecting plate 939, which is disposed on the fourth connecting plate 938 and moves with the fourth connecting plate 938; a first lateral transmission assembly 935, which is disposed on the fifth connecting plate 939, with a transmission belt extending along a second direction; a first lateral drive unit 931, which is driven connected to the drive pulley of the first lateral transmission assembly 935 to drive the drive pulley of the first lateral transmission assembly 935 to rotate; a transmission belt of the first lateral transmission assembly 935, which is connected to a third connecting plate 932 to drive the third connecting plate 932 to move; and a first lateral guide assembly 937, whose guide rail extends along the second direction and is disposed on the fifth connecting plate 939, with a slider of the first lateral guide assembly 937 connected to the third connecting plate 932.

[0081] Specifically, the transmission belt of the first transverse transmission assembly 935 is sleeved on the outside of the driving pulley and the driven pulley, and the driving pulley and the driven pulley are spaced apart on the fifth connecting plate 939 along the second direction. The guide rail and the slider of the first transverse guide assembly 937 are slidably connected.

[0082] Technically, the combination of the first lateral transmission component and the first lateral guide component of this invention achieves smooth and precise movement of the operating arm. In principle, the first lateral drive unit of this invention drives the drive pulley of the first lateral transmission component 935 to rotate, and the transmission belt of the first lateral transmission component 935 drives the third connecting plate to move along the guide rail. The slider of the first lateral guide component 937 slides on the guide rail of the first lateral guide component 937, ensuring the stability of the movement of the transmission belt of the first lateral transmission component 935. In terms of effect, the technology in this invention improves the positioning accuracy during wafer processing and reduces wafer offset during movement.

[0083] like Figures 5 to 8 As shown, the lateral movement module 93 includes: a second lateral transmission assembly 936, the rack of the second lateral transmission assembly 936 extending along a second direction and disposed on an intermediate connecting plate 933, a second lateral drive unit being connected to the gear of the second lateral transmission assembly 936 to drive the gear of the second lateral transmission assembly 936 to rotate and move along the rack of the second lateral transmission assembly 936 with the gear of the second lateral transmission assembly 936; and a second lateral guide assembly 934, the guide rail of the second lateral guide assembly 934 being disposed on the intermediate connecting plate 933 and extending along a second direction, and the slider of the second lateral guide assembly 934 being connected to a fourth connecting plate 938.

[0084] Specifically, the gears and racks of the second transverse transmission assembly 936 mesh with each other, and the guide rails and sliders of the second transverse guide assembly 934 are slidably connected.

[0085] Technically, the combination of the second lateral transmission component and the second lateral guide component of this invention achieves indirect driving and guiding of the first lateral drive unit and the operating arm. In principle, the second lateral drive unit of this invention drives the gear to move on the rack, and the slider slides on the guide rail, ensuring stable movement of the first lateral drive unit and the operating arm. In terms of effect, the technology in this invention improves the positioning speed and accuracy in wafer processing and optimizes the spatial layout of the wafer chamfering machine. Furthermore, the technical problems of improving drive efficiency and reducing maintenance costs can be solved by using ball screw or belt drives.

[0086] like Figures 5 to 8 As shown, each operating arm 94 includes a strip arm 941 and two carrier arms 942. The two carrier arms 942 are spaced apart. The first end of the strip arm 941 is connected to the moving part of the lateral movement module 93. The first ends of the two carrier arms 942 are respectively connected to the second end of the strip arm 941. The second ends of the two carrier arms 942 extend in a direction away from the strip arm 941 for picking up and placing wafers.

[0087] The manipulator arm 94 in this invention achieves stable wafer handling via vacuum adsorption. In terms of effectiveness, this invention enables the dual-station robotic arm 400 to stably handle wafers, reducing wafer handling time and significantly improving the processing cycle of the wafer chamfering machine. Furthermore, by increasing the suction control of the manipulator arm 94, it can adapt to handling wafers of different thicknesses and hardnesses, solving the compatibility issues during wafer handling.

[0088] like Figure 1 As shown, the transfer device 300 is disposed on the support base and located on one side of the dual-station robot 400. The first hopper assembly 100 is disposed above the transfer device 300, and the second hopper assembly 200 is disposed on the side of the transfer device 300 near the dual-station robot 400. The transfer device 300 is used to transfer wafers between the first hopper assembly 100 and the dual-station robot 400, and the dual-station robot 400 is used to place defective wafers in the second hopper assembly 200.

[0089] Technically, this invention achieves efficient wafer storage and transfer by setting up a first hopper assembly, a second hopper assembly, and a transfer device. This design ensures the continuity and automation of loading and unloading operations. In principle, the transfer device of this invention acts as a connection point, enabling automatic wafer transfer. In terms of effectiveness, the hopper assembly and transfer device in this invention enable automatic wafer loading and unloading, reducing manual intervention and improving production efficiency and safety.

[0090] like Figure 1 As shown, the transfer device 700 is disposed on the support base and located on the side of the dual-station robot 400 away from the transfer device 300, for transferring the wafer between the dual-station robot 400 and the processing device 600; the detection device 500 is disposed between the transfer device 300, the dual-station robot 400 and the transfer device 700, for detecting whether the wafer is qualified before and after processing.

[0091] Specifically, the inspection device 500 is used to perform contour inspection on the wafer.

[0092] like Figures 9 to 13 As shown, the transfer device includes: a transfer frame 81 disposed on a support base; a transverse component 82 disposed within the transfer frame 81 and at least partially movably disposed along a third direction parallel to the support base; and a transfer robot 83, the movable end of the transverse component 82 being connected to the fixed end of the transfer robot 83, at least a portion of the transfer robot 83 being movably disposed along a fourth direction parallel to the support base and a first direction perpendicular to the support base, and rotatably disposed about the first direction, for picking up and placing wafers.

[0093] Technically, the transfer frame 81 of this invention serves as the supporting structure for the entire device, providing a stable support foundation and ensuring the accurate operation of the transverse component 82 and the transfer robot 83. The transverse component 82, through its movement within the transfer frame 81, achieves efficient wafer transfer between different workstations, while the multi-degree-of-freedom design of the transfer robot 83 allows for flexible wafer handling, adapting to various processing requirements. In principle, the motion control of the transverse component 82 and the transfer robot 83 in this invention ensures high precision and stability. In terms of effectiveness, this invention significantly improves the efficiency and accuracy of wafer transfer, solves the problem of low processing efficiency in existing wafer chamfering machines, reduces processing waiting time, and enhances the overall processing capacity of the wafer chamfering machine.

[0094] like Figure 9 As shown, the transverse movement assembly 82 includes: a fixed plate 821, which is installed inside the transfer frame 81; a transverse movement transmission assembly 822, which is movably disposed inside the transfer frame 81 along a third direction; a transverse movement drive unit 823, which is installed on the fixed plate 821 and drivenly connected to the transverse movement transmission assembly 822 to drive the transverse movement transmission assembly 822 to move; a transverse movement guide assembly 824, whose guide rail is installed on the fixed plate 821, and whose slider is connected to the transverse movement transmission assembly 822 to guide the movement of the transverse movement transmission assembly 822; a transverse movement plate 825, which is connected to the transverse movement transmission assembly 822 to drive the transverse movement plate 825 to move along a third direction; and a transfer robot 83, which is installed on the transverse movement plate 825 to move along the third direction with the transverse movement plate 825.

[0095] Technically, the design of the transverse component 82 in this invention ensures that the transfer robot 83 can move smoothly along a third direction, improving the continuity and efficiency of wafer transfer. In principle, the transverse drive unit 823 in this invention drives the transverse transmission component 822 to move the transverse plate 825, thereby driving the transfer robot 83 to perform horizontal wafer transfer. In terms of effect, this invention provides stable horizontal movement capability, enhancing the wafer processing capacity of the wafer chamfering machine, especially when processing large numbers of wafers, maintaining a high transfer rate.

[0096] like Figure 9As shown, the transverse transmission assembly 822 includes: a driving pulley 8221, a driven pulley 8222, and a transmission belt 8223. The driving pulley 8221 and the driven pulley 8222 are spaced apart on the fixed plate 821 along a third direction. The driving pulley 8221 and the driven pulley 8222 are rotatable relative to the fixed plate 821. The transmission belt 8223 is sleeved on the driving pulley 8221 and the driven pulley 8222. The transverse drive unit 823 is connected to the driving pulley 8221 to drive the driving pulley 8221 to rotate, thereby driving the transmission belt 8223 to move along a third direction. The transverse plate 825 is mounted on the transmission belt 8223.

[0097] Technically, the use of the transverse transmission assembly 822 in this invention ensures the smooth movement of the transverse plate 825, improving the continuity and stability of wafer transfer. In principle, the transverse drive unit 823 in this invention drives the drive pulley 8221, which in turn drives the transmission belt 8223 and the transverse plate 825 to move along a third direction, realizing the horizontal transfer of the transfer robot 83. In terms of effectiveness, this invention provides reliable horizontal movement capability, especially when handling heavy or long wafers, maintaining stable transfer speed and accuracy.

[0098] like Figure 9 As shown, the transverse assembly 82 further includes a limiting part 826, which is disposed on the fixed plate 821 and located at one end of the transverse plate 825 in the moving direction, so as to limit the movement of the transverse plate 825.

[0099] Technically, the limiting part 826 of this invention ensures boundary control of the transverse plate 825 during movement, preventing overshoot or collision and improving the safety and reliability of the wafer chamfering machine. In principle, the limiting part 826 of this invention detects the position of the transverse plate 825 through sensing or mechanical means. Once a predetermined position is reached, a stop signal is triggered, achieving precise control of the movement range of the transverse plate 825. In terms of effectiveness, this invention enhances the safety performance of the transverse assembly 82, especially in high-speed operation or emergency situations, promptly preventing excessive movement of the transverse plate 825 and protecting the wafer chamfering machine and wafers from damage.

[0100] like Figures 10 to 13As shown, the transfer robot 83 includes: a first moving module 831, at least a portion of which is movably disposed along a first direction; a rotating module 832, the moving portion of the first moving module 831 being connected to the fixed portion of the rotating module 832, the rotating portion of the rotating module 832 being rotatably disposed about a predetermined axis parallel to the first direction; a second moving module 833, the rotating portion of the rotating module 832 being connected to the fixed portion of the second moving module 833, the moving portion of the second moving module 833 being movably disposed along a fourth direction; and a pick-and-place arm 834, the moving portion of the second moving module 833 being connected to one end of the pick-and-place arm 834, the other end of which is used for picking up and placing wafers.

[0101] Technically, the first moving module 831, the rotating module 832, and the second moving module 833 of this invention constitute the three-dimensional motion capability of the transfer robot 83, enabling it to accurately position and place wafers in space. In principle, the motion control of each module in this invention ensures high-precision motion control. In terms of effectiveness, the transfer robot 83 of this invention can respond quickly, improving wafer processing speed while reducing the risk of wafer damage caused by the movement of the transfer robot 83.

[0102] like Figures 10 to 13 As shown, the first moving module 831 includes: a first substrate 8311; a first driving part 8312, the first driving part 8312 being disposed on the first substrate 8311; a first guide component 8313, the guide rail of the first guide component 8313 being disposed on the first substrate 8311, and the guide rail of the first guide component 8313 extending along a first direction; a lead screw and nut assembly 8314, the lead screw of the lead screw and nut assembly 8314 extending along the first direction; the first driving part 8312 being drivenly connected to the lead screw of the lead screw and nut assembly 8314 to drive the lead screw of the lead screw and nut assembly 8314 to rotate; and the slider of the first guide component 8313 being connected to the nut of the lead screw and nut assembly 8314 to move synchronously with the nut of the lead screw and nut assembly 8314 along the lead screw of the lead screw and nut assembly 8314.

[0103] Technically, the use of the lead screw and nut assembly 8314 in this invention ensures precise positioning and efficient movement of the first moving module 831 in the first direction. In principle, the lead screw and nut assembly 8314 in this invention uses a servo motor to drive the lead screw to rotate, thereby moving the nut along the lead screw to achieve precise linear motion. In terms of effect, this invention provides stable vertical movement, enhancing the overall performance of the transfer robot 83, especially when handling heavy wafers, ensuring sufficient support and stability.

[0104] like Figures 10 to 13As shown, the first moving module 831 includes: a second substrate 8315, at least one of the slider of the first guide assembly 8313 and the nut of the lead screw nut assembly 8314 connected to the second substrate 8315; a second driving part 8316 disposed on the second substrate 8315; and a third substrate 8317, the second driving part 8316 being drivenly connected to the third substrate 8317 to drive the third substrate 8317 to move along a first direction, and the third substrate 8317 being connected to the fixed part of the rotating module 832 to drive the rotating module 832 to move along the first direction.

[0105] Technically, the introduction of the second substrate 8315 and the third substrate 8317 in this invention increases the movement levels of the first moving module 831, enabling more precise control of vertical movement and increasing the vertical movement distance. It also provides a stable mounting foundation for the subsequent rotating module 832. In principle, the second drive unit 8316 in this invention indirectly controls the vertical movement of the rotating module 832 by driving the third substrate 8317, achieving multi-degree-of-freedom coordinated control. In terms of effect, this invention enhances the vertical flexibility of the transfer robot 83, enabling it to quickly switch positions and improving the adaptability and processing efficiency of the wafer chamfering machine.

[0106] like Figures 10 to 13 As shown, the rotating module 832 includes: a rotating drive unit 8321, which is disposed on the third substrate 8317; and a rotating disk 8322, which is drivenly connected to the rotating drive unit 8321 to drive the rotating disk 8322 to rotate around a predetermined axis. The rotating disk 8322 is connected to the fixed part of the second moving module 833.

[0107] Technically, the combination of the rotation drive unit 8321 and the rotating disk 8322 in this invention endows the transfer robot 83 with rotational capability in a first direction, enabling it to pick up and place wafers at different angles. In principle, the rotation drive unit 8321 in this invention drives the rotating disk 8322 to rotate via a motor, achieving wafer rotational positioning. In terms of effectiveness, this invention allows the transfer robot 83 to adapt to various motion requirements, avoiding positional errors in the wafer processing.

[0108] like Figures 10 to 13 As shown, the second moving module 833 includes: a third driving part 8331, the rotating part of the rotating module 832 is connected to the third driving part 8331; and a fourth substrate 8332, the third driving part 8331 is drivingly connected to the fourth substrate 8332 to drive the fourth substrate 8332 to move along the fourth direction, and the fourth substrate 8332 is connected to the pick-and-place arm 834.

[0109] Technically, the addition of the second moving module 833 in this invention enables the transfer robot 83 to move in a direction parallel to the supporting base, expanding its operating range. In principle, the third drive unit 8331 in this invention drives the fourth substrate 8332 via a servo motor, achieving precise horizontal movement of the pick-and-place arm 834. In terms of effect, this invention improves the horizontal movement speed and accuracy of the transfer robot 83, enabling it to transfer wafers faster, reducing processing waiting time, and increasing the utilization rate of the wafer chamfering machine.

[0110] like Figures 10 to 13 As shown, the pick-and-place arm 834 includes a connecting arm 8341 and two pick-and-place arms 8342, which are spaced apart. The first end of the connecting arm 8341 is connected to the moving part of the second moving module 833, and the first ends of the two pick-and-place arms 8342 are respectively connected to the second end of the connecting arm 8341. The second ends of the two pick-and-place arms 8342 extend in a direction away from the connecting arm 8341 for picking and placing wafers.

[0111] The pick-and-place arm 8342 in this invention achieves stable wafer pick-and-place via vacuum adsorption. In terms of effectiveness, this invention enables the transfer robot 83 to stably pick up and place wafers, reducing wafer pick-and-place time and significantly improving the processing cycle of the wafer chamfering machine. Furthermore, by increasing the suction control of the pick-and-place arm 8342, it can adapt to the pick-and-place of wafers of different thicknesses and hardnesses, solving the compatibility problem during wafer pick-and-place.

[0112] The workflow of part of the wafer chamfering machine of this utility model is as follows:

[0113] (1) No contour inspection process after wafer processing: The wafer to be processed on the pick-and-place arm 834 of the transfer robot 83 is taken away by the upper operating arm 94 of the dual-station robot 400 → The processed wafer on the lower operating arm 94 of the dual-station robot 400 is taken away by the pick-and-place arm 834 of the transfer robot 83 → The pick-and-place arm 834 of the transfer robot 83 places the processed wafer into the material box of the first material box assembly 100.

[0114] (2) After wafer processing, there is a contour inspection process: The processed wafer on the lower operating arm 94 of the dual-station robot 400 is placed on the inspection table of the inspection device 500 by the lower operating arm 94 of the dual-station robot 400 → The wafer inspection component of the inspection device 500 performs contour inspection on the processed wafer → The upper operating arm 94 of the dual-station robot 400 removes the processed wafer from the inspection table of the inspection device 500 → The wafer to be processed on the pick-and-place arm 834 of the transfer robot 83 is placed on the lower operating arm 94 of the dual-station robot 400 by the lower operating arm 94 of the transfer robot 83. The processing wafers that pass inspection on the upper operating arm 94 of the dual-station robot 400 are picked up by the pick-and-place arm 834 of the transfer robot 83. The pick-and-place arm 834 of the transfer robot 83 places the processing wafers that pass inspection into the hopper of the first hopper assembly 100. (In addition, the processing wafers that fail inspection on the upper operating arm 94 of the dual-station robot 400 are placed into the hopper of the second hopper assembly 200 by the upper operating arm 94 of the dual-station robot 400.)

[0115] like Figures 14 to 21 As shown, both the first hopper assembly 100 and the second hopper assembly 200 include: a loading platform 1, including a loading section 11, the loading section 11 having a receiving space 111; a hopper 2, detachably disposed on the bottom surface of the receiving space 111; a guide section 3, including a plurality of guide members 31 spaced apart on the bottom surface of the receiving space 111 to form a limiting space for limiting the lower end of the hopper 2; and an adjustment section 4, including an adjustment member 41 disposed on the bottom surface of the receiving space 111, the adjustment member 41 being adjustablely disposed at least along a direction perpendicular to the bottom surface of the receiving space 111, for contacting the circumferential edge of the bottom surface of the hopper 2 to adjust the height at a corresponding position of the circumferential edge of the bottom surface of the hopper 2.

[0116] Technically, the first hopper assembly 100 and the second hopper assembly 200 of this invention, through the combined design of a loading platform, a hopper, a guide, and an adjustment section, achieve precise positioning and height adjustment of the hopper, ensuring the stability of the wafers during the loading and unloading process. In principle, the guide component of the guide section cooperates with the lower end of the hopper to restrict the lateral movement of the hopper, while the adjustment component of the adjustment section precisely controls the height of the circumferential edge of the hopper's bottom surface through vertical adjustment, thereby ensuring the parallelism between the wafers inside the hopper and the loading device. In terms of effectiveness, this invention solves the problem of poor hopper positioning in the hopper devices of existing wafer chamfering machines, facilitating precise alignment of the wafers with the processing units during wafer processing, reducing wafer damage caused by inaccurate positioning, and improving processing quality and efficiency.

[0117] like Figure 16As shown, the material box 2 is provided with multiple guide grooves 21, which are spaced apart around the periphery of the material box 2. Multiple guide members 31 are inserted into or separated from the multiple guide grooves 21 in a one-to-one correspondence.

[0118] Technically, this invention enhances the positioning stability of the material box on the loading platform by setting a guide groove on the material box, which interlocks with the guide component of the guide part. In principle, the cooperation between the guide groove and the guide component utilizes the mechanical limiting principle to restrict the lateral displacement of the material box, ensuring the positional accuracy of the wafer during processing. Effectively, this invention facilitates precise alignment of the wafer with the processing unit during processing, further reducing wafer wobbling during loading and unloading, and improving the accuracy and efficiency of wafer processing.

[0119] like Figure 16 As shown, a protective pad 33 is also provided on the outer peripheral surface of the end of each guide member 31 that is close to the bottom surface of the receiving space 111. The protective pad 33 is located below the corresponding material box 2 and is in contact with the bottom surface of the receiving space 111.

[0120] Technically, this invention protects the contact surface between the material box and the material loading platform by adding a protective pad to the guide component, thus preventing wear during long-term use. In principle, the protective pad utilizes the cushioning and wear-resistant properties of the material to reduce direct friction between the bottom surface of the receiving space 111 and the bottom surface of the material box, extending the service life of the material box. Effectively, this invention achieves precise alignment between the wafer and the processing unit during wafer processing, while protecting the material box, reducing maintenance costs, and improving the operating efficiency of the wafer chamfering machine.

[0121] Alternatively, the material box can be made of iron, and magnetic material can be added to the protective pad to enhance the adsorption force on the material box and improve the positioning stability of the material box in a high-vibration environment.

[0122] like Figure 16 As shown, the adjustment part 4 includes a plurality of adjustment members 41, which are arranged at intervals around the circumferential edge of the bottom surface of the material box 2, so as to contact different positions of the circumferential edge of the bottom surface of the material box 2.

[0123] Technically, this invention achieves precise adjustment of multiple positions along the circumferential edge of the hopper's bottom surface by incorporating multiple adjustment components, ensuring the parallelism and stability of the wafer during loading and unloading. In principle, the adjustment components utilize mechanical fine-tuning principles; through vertical movement, the height of the circumferential edge of the hopper's bottom surface is precisely controlled, thus guaranteeing the parallelism between the wafer and the loading device. Effectively, this invention achieves precise alignment between the wafer and the processing unit during wafer fabrication, reducing wafer damage caused by inaccurate positioning and improving processing quality and efficiency. Furthermore, integrating sensors into the adjustment components allows for real-time monitoring of the circumferential edge height of the hopper's bottom surface, further enhancing positioning accuracy and reliability and solving positioning challenges caused by changes in wafer size or shape.

[0124] like Figure 16 As shown, the adjusting component 41 includes an adjusting connecting plate 411 and an adjusting screw 412 threadedly connected to the adjusting connecting plate 411; wherein, the adjusting connecting plate 411 is adjustablely arranged in a direction parallel to the bottom surface of the receiving space 111, and the adjusting screw 412 is made to contact or avoid the circumferential edge of the bottom surface of the material box 2 by rotating or moving the adjusting connecting plate 411; the adjusting screw 412 is adjustablely arranged in a direction perpendicular to the bottom surface of the receiving space 111, and the height at the corresponding position of the circumferential edge of the bottom surface of the material box 2 is adjusted by rotating the adjusting screw 412.

[0125] Specifically, the adjusting connecting plate 411 is rotatably or movable on the bottom surface of the accommodating space 111, and the adjusting screw 412 is rotatably mounted on the adjusting connecting plate 411.

[0126] Technically, this invention achieves fine-tuning of the circumferential edge height of the wafer cassette bottom surface by adjusting the combination of the connecting plate and the adjusting screw, ensuring the parallelism and stability of the wafer during loading and unloading. In principle, the vertical movement of the adjusting screw utilizes the precision adjustment characteristics of the thread to achieve accurate control of the circumferential edge height of the wafer cassette bottom surface; the horizontal movement of the connecting plate, by changing the relative position of the adjusting screw and the circumferential edge of the wafer cassette bottom surface, achieves compatibility with wafers of different sizes. In terms of effectiveness, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer damage caused by inaccurate positioning, and improves processing quality and efficiency.

[0127] Specifically, the first hopper assembly 100 and the second hopper assembly 200 include a positioning part, the positioning part includes a positioning post, the positioning post is disposed on the bottom surface of the accommodating space 111 and located within the limiting space, and the hopper 2 is provided with a positioning hole for inserting and cooperating with the positioning post.

[0128] Technically, this invention achieves precise positioning of the wafer cassette on the loading platform through the cooperation of positioning posts and positioning holes, ensuring the stability of the wafer during loading and unloading. In principle, the insertion and cooperation of the positioning posts and positioning holes utilizes the mechanical limiting principle to restrict the lateral movement of the wafer cassette, ensuring the positional accuracy of the wafer during processing. Effectively, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer wobbling during loading and unloading, and improves the accuracy and efficiency of wafer processing.

[0129] Furthermore, the positioning part includes multiple positioning posts, which are spaced apart within the limiting space. The material box 2 is provided with multiple positioning holes for interlocking with the multiple positioning posts.

[0130] Technically, this invention achieves multi-point positioning of the material box on the loading platform by setting multiple positioning posts, further enhancing the positioning stability of the material box. In principle, the cooperation of multiple positioning posts and multiple positioning holes utilizes the multi-point limiting principle to further restrict the lateral displacement of the material box, ensuring the positional accuracy of the wafer during processing. In terms of effect, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, further reducing wafer wobbling during loading and unloading, and improving the accuracy and efficiency of wafer processing.

[0131] like Figures 14 to 20 As shown, there are multiple material loading sections 11 connected sequentially from top to bottom. Each material loading section 11 has at least one material box 2, at least one guide section 3 and at least one adjustment section 4 in its accommodating space 111.

[0132] Technically, this invention achieves multi-layer wafer storage by setting up multiple material loading sections, thereby improving the storage capacity and processing efficiency of the hopper assembly. In principle, each material loading section in this invention includes a material, a guide, and an adjustment section, ensuring the positioning accuracy and stability of different material boxes on different loading platforms. In terms of effectiveness, this invention facilitates precise alignment of wafers with processing units during wafer processing, improves the storage capacity and processing efficiency of the wafer chamfering machine, reduces wafer damage during loading and unloading, and enhances the accuracy and efficiency of wafer processing.

[0133] like Figures 14 to 16 As shown, the accommodating space 111 is a rectangular cavity extending in a horizontal direction parallel to the horizontal plane. Multiple material boxes 2, multiple guide parts 3 and multiple adjustment parts 4 are provided in the accommodating space 111. The multiple material boxes 2 are arranged at intervals along the extension direction of the accommodating space 111, and the multiple guide parts 3 and multiple adjustment parts 4 are arranged one-to-one with the multiple material boxes 2.

[0134] Technically, this invention achieves horizontally spaced storage of material boxes through the design of rectangular cavities, improving the storage capacity and processing efficiency of the wafer chamfering machine. In principle, the multiple guide parts and adjustment parts in this invention correspond one-to-one with the multiple material boxes, ensuring the positioning accuracy and stability of each material box on its corresponding loading platform. In terms of effectiveness, this invention facilitates precise alignment of wafers and processing units during wafer processing, improves the storage capacity and processing efficiency of the wafer chamfering machine, reduces wafer damage during handling, and enhances the accuracy and efficiency of wafer processing.

[0135] like Figure 16 As shown, the material-carrying section 11 includes a bottom plate 112, a rear plate 113, two side plates 114, and a material-carrying plate 115, forming an accommodating space 111. The two side plates 114 are respectively connected to the opposite sides of the rear plate 113, and the rear plate 113 and the two side plates 114 are respectively connected to the three sides of the bottom plate 112. The material-carrying plate 115 is disposed above the bottom plate 112, and the upper surface of the material-carrying plate 115 is the bottom surface of the accommodating space 111.

[0136] Technically, this invention achieves stable support and positioning of the material box through the structural design of the material carrier section, ensuring the parallelism and stability of the wafer during loading and unloading. In principle, the combination of the base plate, rear plate, side plate, and material carrier plate in this invention utilizes the support and limiting principles of mechanical structures to form a stable support space, ensuring the positional accuracy of the material box on the material carrier platform. In terms of effectiveness, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer wobbling during loading and unloading, and improves the accuracy and efficiency of wafer processing.

[0137] like Figure 15 As shown, the first hopper assembly 100 and the second hopper assembly 200 also include a hopper detection component 6. The hopper detection component 6 is disposed on the loading part 11 and located below the receiving space 111. The hopper detection component 6 is disposed facing the receiving space 111. The bottom of the receiving space 111 is provided with a first detection through hole. The bottom of the hopper 2 is provided with a second detection through hole for communicating with the first detection through hole, so as to allow the hopper detection component 6 to detect whether there is a wafer in the hopper 2 located on the bottom surface of the receiving space 111.

[0138] Among them, the material box detection component 6 can be a photoelectric sensor. The detection light of the photoelectric sensor can pass through the first detection through hole and the second detection through hole to reach the corresponding material box 2. When the detection light is blocked by the wafer in the material box 2, it indicates that there is a wafer in the material box 2.

[0139] Technically, this invention achieves automatic detection of wafers within the wafer bin through the inclusion of a detection component, thereby improving the automation level and processing efficiency of the wafer chamfering machine. In principle, the wafer bin detection component utilizes photoelectric detection to determine the presence of wafers in the bin by detecting the obstruction of through-holes, thus achieving automatic wafer detection. In terms of effectiveness, this invention facilitates precise alignment of wafers with processing units during wafer processing, improves the automation level of the wafer chamfering machine, reduces manual intervention, and enhances the efficiency and precision of wafer processing.

[0140] Specifically, the first hopper assembly 100 includes multiple material loading platforms 1 and multiple material boxes 2. The multiple material loading platforms 1 are arranged sequentially from top to bottom, and each material loading platform 1 has multiple material boxes 2 inside it.

[0141] like Figure 21 As shown, the second hopper assembly 200 also includes a support platform 7, which is located below the loading platform 1 to support the loading platform 1. The support platform 7 has a storage cavity 71 inside. The storage cavity 71 is used to place some processing tools, etc.

[0142] Specifically, the second hopper assembly 200 includes a loading platform 1, a material box 2, and a support platform 7. The loading platform 1 is mounted on the support platform 7, and the material box 2 is mounted on the loading platform 1.

[0143] Technically, this invention achieves stable support for the material carrier platform through the installation of a support platform, ensuring the stability of the wafer during the loading and unloading process. In principle, the support platform in this invention utilizes the support principle of a mechanical structure; its stable support ensures the stability of the material carrier platform, thereby guaranteeing the positional accuracy of the wafer during processing. In terms of effectiveness, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer wobbling during loading and unloading, and improves the accuracy and efficiency of wafer processing.

[0144] Specifically, the first hopper assembly 100 is disposed on the transfer device 300, and the lowermost loading platform 1 in the first hopper assembly 100 is connected to the upper surface of the transfer device 300 for placing wafers sent from the previous station; the second hopper assembly 200 is disposed on one side of the transfer device 300, and the support platform 7 in the second hopper assembly 200 is disposed on the support base surface for placing defective wafers.

[0145] like Figure 22As shown, this utility model provides a control method for a wafer chamfering machine, applicable to the aforementioned wafer chamfering machine. When the wafer to be processed is placed in the first hopper assembly 100 and the start button of the wafer chamfering machine is pressed, the control method includes: controlling the pick-and-place arm 834 of the transfer device 300 to take the wafer to be processed from the first hopper assembly 100 and move it to the side close to the dual-station robot 400; controlling the first operating arm 94 of the dual-station robot 400 to take the wafer to be processed from the pick-and-place arm 834 and move it to the detection device 500; controlling the detection device 500 to detect the wafer to be processed to determine whether the wafer to be processed is qualified; when the detection device 500 detects that the wafer to be processed is qualified, controlling the transfer device 700 to take the wafer to be processed from the detection device 500 and move it to the wafer carrying assembly 610 of the processing device 600; and controlling the grinding assembly 620 of the processing device 600 to perform grinding processing on the wafer to be processed.

[0146] Technically, the control method of the wafer chamfering machine achieves automation and intelligence in wafer processing through precise control of the wafer processing flow. In principle, feedback from the detection device allows for real-time adjustment of the wafer processing flow, ensuring processing quality and efficiency. In terms of effectiveness, this invention significantly improves the continuity and automation of wafer processing, thereby achieving high efficiency and low damage in wafer processing.

[0147] The wafer chamfering machine control method of this utility model includes: when the detection device 500 detects that the wafer to be processed is unqualified, controlling the second operating arm 94 of the dual-station robot 400 to take away the wafer to be processed from the detection device 500 and put it into the second material hopper assembly 200.

[0148] Technically, the additional operating arm of the dual-station robotic arm enables automatic sorting and processing of defective wafers, improving the intelligent processing capabilities of the wafer chamfering machine. In principle, feedback from the detection device allows for timely identification of defective wafers, preventing resource waste in subsequent processing. In terms of effectiveness, this invention significantly enhances the continuity and automation of wafer processing, thereby achieving high efficiency and low damage in wafer processing.

[0149] The wafer chamfering machine control method of this utility model includes: controlling the transfer device 700 to take the processed wafer from the processing device 600 and move it to the second operating arm 94 of the dual-station robot 400; controlling the second operating arm 94 of the dual-station robot 400 to move the processed wafer to the detection device 500; controlling the detection device 500 to detect the processed wafer to determine whether the processed wafer is qualified; when the detection device 500 detects that the processed wafer is qualified, controlling the second operating arm 94 of the dual-station robot 400 to take the processed wafer from the pick-and-place arm 834 and move it to the side close to the transfer device 300; controlling the first operating arm 94 of the dual-station robot 400 to take the next wafer to be processed from the pick-and-place arm 834 of the transfer device 300, and controlling the pick-and-place arm 834 of the transfer device 300 to take the processed wafer from the second operating arm 94 and put it into the first hopper assembly 100.

[0150] Technically, the efficient wafer transfer device enables automated cleaning and drying after wafer processing, improving the overall efficiency of wafer processing. In principle, the cleaning and drying device effectively removes residues from the wafer surface through high-pressure water flow and high-speed rotation, preventing contamination during subsequent processing. In terms of effectiveness, this invention significantly improves the overall efficiency and cleanliness of wafer processing, thus achieving highly efficient and clean wafer processing.

[0151] The wafer chamfering machine control method of this utility model includes: when the detection device 500 detects that the processed wafer is unqualified, controlling the second operating arm 94 of the dual-station robot 400 to take away the processed wafer from the detection device 500 and put it into the second hopper assembly 200.

[0152] Technically, the other operating arm of the dual-station robotic arm enables automatic sorting and processing of defective wafers after processing, improving the intelligent processing capabilities of the wafer chamfering machine. In principle, feedback from the detection device allows for timely identification of defective wafers, preventing confusion and waste in subsequent processing. In terms of effectiveness, this invention significantly improves the continuity and automation of wafer processing, thereby achieving high efficiency and low damage in wafer processing.

[0153] During the process of controlling the transfer device 700 to remove the processed wafer from the processing device 600 and move it to the second operating arm 94 of the dual-station robot 400, the wafer chamfering machine control method includes: controlling the transfer device 700 to remove the processed wafer from the processing device 600 and move it to the cleaning and drying device 800; controlling the cleaning and drying device 800 to clean and dry the processed wafer; and controlling the transfer device 700 to remove the processed wafer from the cleaning and drying device 800 and move it to the second operating arm 94 of the dual-station robot 400.

[0154] Before the grinding assembly 620 of the control processing device 600 performs grinding processing on the wafer to be processed, the wafer chamfering machine control method further includes: taking out a calibration piece from the standard piece calibration mechanism of the wafer chamfering machine to perform eccentric calibration on the rotating platform 611 of the wafer carrier assembly 610 to ensure that the center of the wafer coincides with the rotation axis of the rotating platform 611; taking out a trimming piece 900 from the second hopper assembly 200 to install on the rotating platform 611 to trim the outer peripheral fine grinding wheel component 623 of the grinding assembly 620.

[0155] Technically, the application of standard and dressing plates enables precise calibration of the wafer carrier and grinding components, improving the accuracy and consistency of wafer processing. In principle, the standard plate calibrates the rotation center of the wafer carrier, while the dressing plate maintains the state of the grinding wheel in the grinding component, ensuring high-quality chamfering of the wafer edges. Effectively, this invention significantly improves the accuracy and efficiency of wafer processing, thereby achieving high-quality chamfering of wafer edges.

[0156] When the grinding assembly 620 of the control processing device 600 performs grinding processing on the wafer to be processed, the wafer chamfering machine control method includes: controlling the outer peripheral rough grinding wheel component 622 of the grinding assembly 620 to rotate to perform rough grinding on the outer peripheral surface of the wafer located on the wafer support assembly 610; controlling the marking groove rough grinding wheel component 624 of the grinding assembly 620 to perform rough grinding on the marking groove of the wafer located on the wafer support assembly 610; controlling the outer peripheral fine grinding wheel component 623 of the grinding assembly 620 to perform fine grinding on the outer peripheral surface of the wafer located on the wafer support assembly 610; and controlling the marking groove fine grinding wheel component 625 of the grinding assembly 620 to perform fine grinding on the marking groove of the wafer located on the wafer support assembly 610.

[0157] Technically, multi-stage grinding with multiple grinding wheels achieves refined processing of the wafer edges, improving the surface quality and processing accuracy of the wafer's outer circumference and marking grooves. In principle, grinding wheels of different grit sizes, from coarse to fine grinding, gradually improve the surface finish of the wafer's outer circumference and marking grooves, reducing surface damage. Effectively, this invention significantly improves the surface roughness of the wafer's outer circumference and marking grooves, reducing the damage rate at the wafer edges, thereby achieving high-quality processing of the wafer edges.

[0158] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0159] The wafer chamfering machine of this utility model includes: a hopper device, including a first hopper assembly 100 and a second hopper assembly 200; a transfer device 300, disposed on a supporting base, with the first hopper assembly 100 disposed on the transfer device 300 or on a first side of the transfer device 300, and the second hopper assembly 200 disposed on a second side of the transfer device 300; a dual-station robot 400 and a detection device 500, both disposed on the second side of the transfer device 300, with the second hopper assembly 200 and the detection device 500 respectively located on opposite sides of the dual-station robot 400; a processing device 600 and a transfer device 700, disposed on the supporting base and located on opposite sides of the dual-station robot 400. The robotic arm 400 is positioned away from the transfer device 300. The transfer device 300 transfers wafers between the first hopper assembly 100 and the dual-station robotic arm 400. The dual-station robotic arm 400 transfers wafers between the transfer device 300, the second hopper assembly 200, the inspection device 500, and the transfer device 700. The inspection device 500 inspects wafers before or after processing. The transfer device 700 transfers wafers between the dual-station robotic arm 400, the inspection device 500, and the processing device 600. The processing device 600 processes the wafers from the transfer device 700. Technically, this wafer chamfering machine significantly improves the efficiency and accuracy of wafer chamfering through efficient wafer transfer. In principle, the cooperation between the transfer device and the dual-station robotic arm enables rapid wafer positioning and transfer, avoiding the problem of excessively long wafer waiting times in traditional single-station designs. In terms of effectiveness, this invention can significantly improve the continuity and automation of wafer chamfering, and solves the problem of low processing efficiency of existing wafer chamfering machines, thereby achieving high efficiency and low damage in wafer processing.

[0160] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0161] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and wafer chamfering machines known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and wafer chamfering machines should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0162] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0163] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0164] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0165] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer chamfering machine, characterized in that, include: The hopper device includes a first hopper assembly (100) and a second hopper assembly (200); A transfer device (300) is disposed on a supporting base surface, a first hopper assembly (100) is disposed on the transfer device (300) or on a first side of the transfer device (300), and a second hopper assembly (200) is disposed on a second side of the transfer device (300); The dual-station robot (400) and the detection device (500) are both located on the second side of the transfer device (300), and the second hopper assembly (200) and the detection device (500) are located on opposite sides of the dual-station robot (400); The processing device (600) and the transfer device (700) are disposed on the support base and located on the side of the dual-station robot (400) away from the transfer device (300); The transfer device (300) is used to transfer wafers between the first hopper assembly (100) and the dual-station robot (400). The dual-station robot (400) is used to transfer wafers between the transfer device (300), the second hopper assembly (200), the detection device (500), and the transfer device (700). The detection device (500) is used to detect wafers to be processed or processed wafers. The transfer device (700) is used to transfer wafers between the dual-station robot (400), the detection device (500), and the processing device (600). The processing device (600) is used to process wafers from the transfer device (700).

2. The wafer chamfering machine according to claim 1, characterized in that, The processing apparatus (600) includes: A wafer carrier assembly (610) is disposed on the support base surface, and the wafer carrier assembly (610) includes a rotating platform (611) for carrying the wafer. A grinding assembly (620) is disposed on the support base surface and located on one side of the wafer carrier assembly (610) for grinding the wafer located on the rotating platform (611).

3. The wafer chamfering machine according to claim 2, characterized in that, The grinding assembly (620) includes: Mounting bracket (621) is disposed on the support base surface; The peripheral rough grinding wheel component (622) is rotatably mounted on the mounting bracket (621) for rough grinding the outer peripheral surface of the wafer; The peripheral grinding wheel component (623) is rotatably mounted on the mounting bracket (621) for grinding the outer peripheral surface of the wafer; The marking groove coarse grinding wheel component (624) is rotatably mounted on the mounting bracket (621) for coarse grinding the marking grooves of the wafer; The marking groove grinding wheel component (625) is rotatably mounted on the mounting bracket (621) for grinding the marking grooves of the wafer.

4. The wafer chamfering machine according to claim 3, characterized in that, The mounting bracket (621) includes: The first frame (626) is disposed on the support base surface, and the outer peripheral coarse grinding wheel component (622) is located above the first frame (626) and connected to the first frame (626); The second frame (627) is disposed on the support base and partially located above the first frame (626). The peripheral fine grinding wheel component (623), the peripheral fine grinding wheel component (623) and the marking groove fine grinding wheel component (625) are spaced apart on the second frame (627).

5. The wafer chamfering machine according to claim 3, characterized in that, The wafer chamfering machine includes a cleaning and drying device (800), which is located on one side of the transfer device (700). The transfer device (700) is used to transfer the wafers processed by the processing device (600) to the cleaning and drying device (800) for cleaning and drying, and to transfer the cleaned and dried wafers to the dual-station robot (400).

6. The wafer chamfering machine according to claim 3, characterized in that, The processing apparatus (600) further includes a standard wafer calibration mechanism, comprising a standard wafer, for eccentric calibration of the rotating platform (611) to ensure that the center of the wafer coincides with the rotation axis of the rotating platform (611); and / or, The wafer chamfering machine also includes a trimming plate (900) for mounting on the rotating platform (611) to trim the peripheral fine grinding wheel component (623), or for storing in the second hopper assembly (200).

7. The wafer chamfering machine according to claim 1, characterized in that, The dual-station robotic arm (400) includes: A longitudinal moving module (91), at least a portion of which is movably disposed along a first direction perpendicular to the support base surface; The intermediate rotating module (92) has a moving part of the longitudinal moving module (91) connected to a fixed part of the intermediate rotating module (92). The rotating part of the intermediate rotating module (92) is rotatably arranged around a predetermined axis, which is parallel to the first direction. A transverse moving module (93) is provided, wherein the rotating part of the intermediate rotating module (92) is connected to the fixed part of the transverse moving module (93), and the moving part of the transverse moving module (93) is movably arranged along a second direction parallel to the supporting base surface. Two operating arms (94) are spaced apart along the first direction. The moving part of the lateral moving module (93) is connected to one end of each of the two operating arms (94). The other end of each operating arm (94) is used to pick up and place wafers.

8. The wafer chamfering machine according to claim 1, characterized in that, The transfer device (300) includes: The transfer frame (81) is set on the support base surface; A transverse component (82) is disposed within the transfer frame (81) and is at least partially movably disposed along a third direction parallel to the support base surface; A transfer robot (83) is provided, wherein the moving end of the lateral component (82) is connected to the fixed end of the transfer robot (83), and at least a portion of the transfer robot (83) is movably disposed along a fourth direction parallel to the support base and a first direction perpendicular to the support base, and is rotatably disposed about the first direction, for picking up and placing wafers.

9. The wafer chamfering machine according to claim 8, characterized in that, The lateral movement component (82) includes: A fixing plate (821) is installed inside the transfer frame (81); A transverse transmission assembly (822) is movably disposed within the transfer frame (81) along the third direction; A transverse drive unit (823) is mounted on the fixed plate (821) and drivenly connected to the transverse transmission assembly (822) to drive the transverse transmission assembly (822) to move; A transverse guide assembly (824) has a guide rail mounted on the fixed plate (821), and a slider of the transverse guide assembly (824) is connected to the transverse transmission assembly (822) to guide the movement of the transverse transmission assembly (822). A transverse plate (825) is connected to the transverse transmission assembly (822) to drive the transverse plate (825) to move along the third direction. The transfer robot (83) is mounted on the transverse plate (825) to move along the third direction with the transverse plate (825).

10. The wafer chamfering machine according to claim 8, characterized in that, The transfer robot (83) includes: A first moving module (831) is provided, at least a portion of which is movably disposed along the first direction; A rotating module (832) is provided, wherein the moving part of the first moving module (831) is connected to the fixed part of the rotating module (832), and the rotating part of the rotating module (832) is rotatably arranged around a predetermined axis, the predetermined axis being parallel to the first direction; The second moving module (833) has a rotating part of the rotating module (832) connected to a fixed part of the second moving module (833), and the moving part of the second moving module (833) is movably arranged along the fourth direction. The pick-and-place arm (834) has a moving part of the second moving module (833) connected to one end of the pick-and-place arm (834), and the other end of the pick-and-place arm (834) is used for picking up and placing wafers.

11. The wafer chamfering machine according to claim 1, characterized in that, Both the first hopper assembly (100) and the second hopper assembly (200) include: The material loading platform (1) includes a material loading section (11) having a receiving space (111). The material box (2) is detachably disposed on the bottom surface of the receiving space (111); The guide section (3) includes a plurality of guide members (31) spaced apart on the bottom surface of the receiving space (111) to form a limiting space for limiting the lower end of the material box (2); The adjustment part (4) includes an adjustment member (41) disposed on the bottom surface of the receiving space (111). The adjustment member (41) is adjustablely disposed at least in a direction perpendicular to the bottom surface of the receiving space (111) for contacting the circumferential edge of the bottom surface of the material box (2) to adjust the height at the corresponding position of the circumferential edge of the bottom surface of the material box (2).

12. The wafer chamfering machine according to claim 11, characterized in that, The hopper assembly also includes a support platform (7), which is located below the loading platform (1) to support the loading platform (1). The support platform (7) has a storage cavity (71) inside.

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