A circuit board processing apparatus

Abstract

The utility model discloses a kind of circuit board processing devices, including fixing mechanism, lifting mechanism and plate grinding mechanism, fixing mechanism includes base, negative pressure device, the upper side of base is provided with several suction holes connected with negative pressure device, plate grinding mechanism includes rotating plate, pulley, abrasive belt, support plate and first motor, rotating plate is vertically arranged, pulley is provided with multiple, multiple pulley tension abrasive belt, and rotationally connected on rotating plate, driven by first motor, abrasive belt includes the plate grinding section facing base, support plate is attached to support plate section inside, and can be detachably connected on rotating plate, support plate area is greater than circuit board area, pressure sensor is installed on the side of support plate close to plate grinding section, pressure sensor is connected with lifting mechanism, lifting mechanism can drive rotating plate to move up and down.The utility model proposes a kind of circuit board processing device, improves the evenness of abrasive belt to circuit board pressure, improves the flatness after circuit board polishing.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a circuit board processing device. Background Technology

[0002] During the pre-processing of circuit boards, their surfaces need to be polished to improve surface flatness and cleanliness. Conventional polishing equipment uses abrasive belts to polish the circuit boards. As shown in the patent application number CN202211196788.9, it includes a clamping mechanism, abrasive belt, a moving mechanism, and a driving mechanism. In use, the clamping mechanism locks the circuit board, the driving mechanism drives the abrasive belt, and the moving mechanism drives the abrasive belt to approach the circuit board. The abrasive belt polishes the circuit board. When polishing the circuit board, this type of polishing equipment relies on the tension of the abrasive belt itself to apply pressure to the circuit board. Because the abrasive belt itself is relatively soft, the pressure uniformity of the abrasive belt on the circuit board is poor at different points during polishing, which can easily lead to uneven polishing thickness and ultimately reduce the flatness of the polished side of the circuit board. Utility Model Content

[0003] In order to solve the above-mentioned defects of existing grinding equipment, this utility model proposes a circuit board processing device that improves the uniformity of pressure of the sanding belt on the circuit board and improves the flatness of the circuit board after grinding.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A circuit board processing apparatus includes a fixing mechanism, a lifting mechanism, and a grinding plate mechanism. The fixing mechanism includes a base and a negative pressure device. The upper side of the base is provided with a plurality of suction holes connected to the negative pressure device. The grinding plate mechanism includes a rotating plate, pulleys, a sanding belt, a support plate, and a first motor. The rotating plate is vertically arranged. Multiple pulleys are provided, which tension the sanding belt and are rotatably connected to the rotating plate and driven by the first motor. The sanding belt includes a grinding plate section facing the base. The support plate is attached to the inner side of the supporting grinding plate section and is detachably connected to the rotating plate. The area of ​​the support plate is larger than the area of ​​the circuit board. A pressure sensor is installed on the side of the support plate near the grinding plate section. The pressure sensor is connected to the lifting mechanism, which can drive the rotating plate to move up and down.

[0005] The above settings achieve the following: First, reduce the deformation of the circuit board when the sander belt polishes it, improve the uniformity of the sander belt pressure on the circuit board, and ensure that the circuit board can be polished evenly, thus improving the flatness of the circuit board after polishing. Second, use adsorption to fix the circuit board, preventing the circuit board from being damaged by pressure.

[0006] Furthermore, the lifting mechanism includes a column, a lifting block, a screw, and a second motor. The column is vertically fixedly connected to the upper side of the base, the lifting block is slidably connected to the column, the rotating plate is installed on the lifting block, the screw is vertically rotatably connected to the column and threadedly connected to the lifting block, and the second motor is used to drive the screw.

[0007] Furthermore, at least three pulleys are provided, arranged along the edge of the rotating plate. The sanding belt is spread out by the pulleys to form a polygonal structure. The pulleys divide the sanding belt into multiple grinding plate segments of varying lengths. Each grinding plate segment is supported by a support plate on its inner side. The rotating plate is rotatably connected to the lifting block, and the lifting block is provided with a locking mechanism for locking the rotating plate.

[0008] The above settings make it easy to grind circuit boards of different lengths.

[0009] Furthermore, the locking mechanism includes a rotating shaft, a pin, and an elastic element. The rotating shaft is fixedly connected to the lifting block, passes through the rotating plate, and is rotatably connected to the rotating plate. The rotating shaft is provided with multiple positioning grooves along the circumference. The pin is slidably connected to the rotating plate. The pin is inserted into one of the positioning grooves, so that one of the grinding plate sections faces the base. The elastic element is installed between the pin and the rotating plate, applying a force to the pin toward the positioning groove.

[0010] The above settings facilitate locking the rotating plate.

[0011] Furthermore, the processing device also includes a dust suction hood and a switch. The dust suction hood is located on the side of the suction hole, and the switch is installed between the dust suction hood, the negative pressure device, and the suction hole to switch the suction direction of the negative pressure device.

[0012] The above settings can absorb the debris generated during polishing, reducing air pollution.

[0013] Furthermore, the switcher includes a valve body, a valve core, and a third motor. The valve body is installed on the lower side of the base and has an air extraction port, a first air inlet, and a second air inlet. The air extraction port is connected to a negative pressure device, the first air inlet is connected to an adsorption hole, and the second air inlet is connected to a dust collection hood. The valve core is rotatably connected in the valve body and has an air passage. The switcher includes an adsorption state and a dust collection state. In the adsorption state, the first air inlet is connected to the air extraction port through the air passage. In the dust collection state, the second air inlet is connected to the air extraction port through the air passage. The third motor drives the valve core to rotate to switch the state of the switcher.

[0014] Furthermore, the support plate is fixedly connected to the ear plate, which is locked to the rotating plate by bolts. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the processing apparatus for an embodiment.

[0016] Figure 2 This is a simplified diagram of the processing apparatus for an embodiment.

[0017] Figure 3 for Figure 2 Enlarged view of point A.

[0018] Figure 4Another simplified diagram of the processing apparatus for an embodiment. Detailed Implementation

[0019] The technical solution of this utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0020] like Figures 1 to 4 A circuit board processing device includes a fixing mechanism, a lifting mechanism 9, and a grinding plate mechanism. The fixing mechanism includes a base 3 and a negative pressure device (not shown in the figure). The upper side of the base 3 is provided with a plurality of suction holes 4 connected to the negative pressure device. The grinding plate mechanism includes a rotating plate 5, pulleys 6, a sanding belt 7, a support plate 8, and a first motor (not shown in the figure). The rotating plate 5 is vertically arranged. Multiple pulleys 6 are provided. The multiple pulleys 6 tension the sanding belt 7 and are rotatably connected to the rotating plate 5 and driven by the first motor. The sanding belt 7 includes a grinding plate section 71 facing the base 3. The support plate 8 fits against the inner side of the supporting grinding plate section 71 and is detachably connected to the rotating plate 5. The area of ​​the support plate 8 is larger than the area of ​​the circuit board 11. A pressure sensor (not shown in the figure) is installed on the side of the support plate 8 near the grinding plate section 71. The pressure sensor is connected to the lifting mechanism 9, which can drive the rotating plate 5 to move up and down.

[0021] With the above settings, firstly, the deformation of the sanding belt 7 when polishing the circuit board is reduced, the uniformity of the pressure of the sanding belt 7 on the circuit board is improved, the circuit board can be polished evenly, and the flatness of the circuit board after polishing is improved. Secondly, the circuit board is fixed by adsorption to prevent the circuit board from being damaged by pressure.

[0022] Specifically, the working principle of the circuit board processing device of this application is as follows: the base 3 is fixed on the ground, and the upper surface of the base 3 is horizontal. The circuit board to be ground is placed horizontally on the upper side of the base 3 at the position where the adsorption hole 4 is provided, and it is in contact with the base 3. After the negative pressure device is evacuated, a negative pressure environment is formed on the lower side of the circuit board, and the circuit board is adsorbed on the upper side of the base 3. The negative pressure device can be an existing air extraction device. The sanding belt 7 includes at least one grinding plate section 71, which is a taut section of the sanding belt 7. When there is only one grinding plate section 71, the grinding plate section 71 is located on the lower side of the sanding belt 7 and parallel to the upper side of the circuit board, and is used to grind the upper surface of the circuit board. The support plate 8 is in contact with the inner side of the grinding plate section 71 to prevent the sanding belt 7 from deforming at the grinding plate section 71, so that the grinding plate section 71 is always taut. The first motor drives the pulley 6 to rotate, so that the sanding belt 7 runs. The lifting mechanism 9 drives the rotating plate 5 to move downward, so that the sanding belt 7 moves downward as a whole. Figure 4After the lower surface of the grinding plate section 71 contacts the upper surface of the circuit board, it grinds the upper surface of the circuit board. The support plate 8 supports the inner side of the grinding plate section 71, and the grinding plate section 71 applies uniform pressure to the upper surface of the circuit board. The pressure sensor detects the pressure of the support plate 8 in real time. When the pressure reaches the preset value, the lifting mechanism 9 stops descending and maintains the pressure to grind the circuit board. The area of ​​the support plate 8 is larger than the area of ​​the circuit board, so the entire upper surface of the circuit board can be subjected to uniform pressure, thereby making the grinding thickness of the upper surface of the circuit board basically the same. After grinding, the upper surface of the circuit board has a higher flatness and is a standard plane, which facilitates the subsequent processing of the circuit board. After grinding is completed, the lifting mechanism 9 drives the rotating plate 5 to move upward, the sanding belt 7 leaves the circuit board, and after the negative pressure device stops, the air pressure under the circuit board is restored through the return air valve or other structure, and a new circuit board is replaced for the next round of grinding.

[0023] As one implementation, the lifting mechanism 9 includes a column 91, a lifting block 92, a screw 93, and a second motor 94. The column 91 is vertically fixed to the upper side of the base 3, the lifting block 92 is slidably connected to the column 91, the rotating plate 5 is installed on the lifting block 92, the screw 93 is vertically rotatably connected to the column 91 and threadedly connected to the lifting block 92, and the second motor 94 is used to drive the screw 93.

[0024] Specifically, the principle of the lifting mechanism 9 driving the sanding belt 7 to move up and down is as follows: the second motor 94 drives the screw 93 to rotate, the screw 93 rotates relative to the lifting block 92, and the lifting block 92 moves up or down along the column 91, thereby driving the sanding belt 7 to move up or down.

[0025] As one implementation, at least three pulleys 6 are provided, arranged along the edge of the rotating plate 5. The sanding belt 7 is spread open by the pulleys 6 to form a polygonal structure. The pulleys 6 divide the sanding belt 7 into multiple grinding plate segments 71 of unequal length. Each grinding plate segment 71 is supported by a support plate 8 on its inner side. The rotating plate 5 is rotatably connected to the lifting block 92. The lifting block 92 is provided with a locking mechanism 10 for locking the rotating plate 5.

[0026] The above settings make it easy to grind circuit boards of different lengths.

[0027] Specifically, this application uses three pulleys 6 arranged in a triangular pattern. The pulleys 6 are taut to form a triangle with three sides of different lengths. Each straight side corresponds to a grinding plate segment 71, for a total of three grinding plate segments 71. The lower grinding plate segment 71 is used for grinding the circuit board, while the other two are for backup. Each grinding plate segment 71 has a support plate 8 of a suitable length attached to its inner side. For example, the three support plates 8 may have lengths of 10cm, 15cm, and 20cm respectively. When grinding a circuit board with a length of 8cm, the rotating plate 5 is rotated. The grinding plate segment 71 corresponding to the 10cm long support plate 8 is oriented downwards. When grinding a circuit board with a length of 13cm, the grinding plate segment 71 corresponding to the 15cm long support plate 8 is oriented downwards, and so on. The length of the support plate 8 is greater than the length of the circuit board, but as close as possible to the length of the circuit board to prevent the support plate 8 from being too large and wasting resources. This is because when grinding the circuit board, the lower working support plate 8 will wear down due to relative friction with the grinding plate segment 71 and will need to be replaced. Reducing the size of the support plate 8 helps to reduce replacement costs.

[0028] As one implementation, the locking mechanism 10 includes a rotating shaft 101, a pin 102, and an elastic element 103. The rotating shaft 101 is fixedly connected to the lifting block 92. The rotating shaft 101 passes through the rotating plate 5 and is rotatably connected to the rotating plate 5. The rotating shaft 101 is provided with a plurality of positioning grooves 104 along the circumferential direction. The pin 102 is slidably connected to the rotating plate 5. The pin 102 is inserted into one of the positioning grooves 104, so that one of the grinding plate sections 71 faces the base 3. The elastic element 103 is installed between the pin 102 and the rotating plate 5, and applies a force to the pin 102 toward the positioning groove 104.

[0029] The above settings facilitate locking the rotating plate 5.

[0030] The rotating plate 5 of this application is rotatably connected to the lifting block 92 via a rotating shaft 101. The rotating shaft 101 is specifically provided with three positioning grooves 104, which correspond one-to-one with the three grinding plate segments 71. When it is necessary to switch the grinding plate segment 71, push the pin 102 outward. After the pin 102 is pulled out of the positioning groove 104, rotate the rotating plate 5 so that the other grinding plate segment 71 faces downward. Then release the pin 102. Under the action of the elastic element 103, the pin 102 is inserted into the corresponding positioning groove 104 to lock the rotating plate 5. The elastic element 103 can be a spring.

[0031] As one implementation, the processing device also includes a dust suction hood 12 and a switch 13. The dust suction hood 12 is disposed on the side of the suction hole 4, and the switch 13 is installed between the dust suction hood 12, the negative pressure device and the suction hole 4, for switching the suction direction of the negative pressure device.

[0032] The above settings can absorb the debris generated during polishing, reducing air pollution.

[0033] Specifically, when the switch 13 connects the suction hole 4 to the negative pressure device, the negative pressure device draws air to adsorb the circuit board onto the upper side of the base 3. During polishing, the switch 13 connects the dust hood 12 to the negative pressure device, with the opening of the dust hood 12 facing the circuit board. The negative pressure device draws air, and the debris generated during polishing is sucked away through the dust hood 12 to prevent air pollution. In addition, a filter screen can be installed between the dust hood 12 and the switch 13 to collect the debris.

[0034] As one implementation, the switcher 13 includes a valve body 131, a valve core 132, and a third motor (not shown in the figure). The valve body 131 is installed on the lower side of the base 3 and is provided with an air extraction port 133, a first air inlet 134, and a second air inlet 135. The air extraction port 133 is connected to a negative pressure device, the first air inlet 134 is connected to an adsorption hole 4, and the second air inlet 135 is connected to a dust collection hood 12. The valve core 132 is rotatably connected in the valve body 131 and is provided with an air passage 136. The switcher 13 includes an adsorption state and a dust collection state. In the adsorption state, the first air inlet 134 is connected to the air extraction port 133 through the air passage 136. In the dust collection state, the second air inlet 135 is connected to the air extraction port 133 through the air passage 136. The third motor drives the valve core 132 to rotate to switch the state of the switcher 13.

[0035] Specifically, such as Figure 2 The valve core 132 is basically a cylindrical structure. The two ends of the air passage 136 correspond to a 120-degree central angle. A cylindrical rotating groove adapted to the valve core 132 is provided on the inner side of the valve body 131. When the valve core 132 is rotatably connected in the rotating groove, its outer circumference fits against the groove to ensure airtightness. The suction port 133, the first air inlet 134, and the second air inlet 135 are arranged approximately at 120-degree central angle intervals on the outer circumference of the valve core 132. When one end of the air passage 136 is connected to the suction port 133 and the other end is connected to the first air inlet 134, the air passage 136 and the second air inlet 135 are staggered. When the negative pressure device is running, it adsorbs the circuit board onto the upper side of the base 3 through the suction port 133, the air passage 136, the first air inlet 134, and the suction hole 4. During polishing, if... Figure 4 The third motor drives the valve core 132 to rotate 120 degrees clockwise. One end of the air passage 136 is connected to the second air inlet 135, and the other end is connected to the suction port 133. The air passage 136 is offset from the first air inlet 134. When the negative pressure device is running, the negative pressure device draws air through the suction port 133, the air passage 136, the second air inlet 135, and the dust collection hood 12 to suck up debris.

[0036] As one implementation, the support plate 8 is fixedly connected to the ear plate 14, and the ear plate is locked to the rotating plate 5 by bolts 15.

[0037] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A circuit board processing apparatus, characterized in that, The device includes a fixing mechanism, a lifting mechanism, and a grinding plate mechanism. The fixing mechanism includes a base and a negative pressure device. The upper side of the base is provided with several suction holes connected to the negative pressure device. The grinding plate mechanism includes a rotating plate, pulleys, a sanding belt, a support plate, and a first motor. The rotating plate is vertically arranged. Multiple pulleys are provided, which tension the sanding belt and are rotatably connected to the rotating plate and driven by the first motor. The sanding belt includes a grinding plate section facing the base. The support plate fits against and supports the inner side of the grinding plate section and is detachably connected to the rotating plate. The area of ​​the support plate is larger than the area of ​​the circuit board. A pressure sensor is installed on the side of the support plate near the grinding plate section. The pressure sensor is connected to the lifting mechanism, which can drive the rotating plate to move up and down.

2. The circuit board processing apparatus according to claim 1, characterized in that, The lifting mechanism includes a column, a lifting block, a screw, and a second motor. The column is vertically fixedly connected to the upper side of the base. The lifting block is slidably connected to the column. The rotating plate is installed on the lifting block. The screw is vertically rotatably connected to the column and threadedly connected to the lifting block. The second motor is used to drive the screw.

3. The circuit board processing apparatus according to claim 2, characterized in that, At least three pulleys are provided and arranged along the edge of the rotating plate. The sanding belt is spread open by the pulleys to form a polygonal structure. The pulleys divide the sanding belt into multiple grinding plate segments of unequal length. Each grinding plate segment is supported by a support plate on its inner side. The rotating plate is rotatably connected to the lifting block. The lifting block is provided with a locking mechanism for locking the rotating plate.

4. The circuit board processing apparatus according to claim 3, characterized in that, The locking mechanism includes a rotating shaft, a pin, and an elastic element. The rotating shaft is fixedly connected to the lifting block. The rotating shaft passes through the rotating plate and is rotatably connected to the rotating plate. The rotating shaft has multiple positioning grooves along its circumference. The pin is slidably connected to the rotating plate. The pin is inserted into one of the positioning grooves, so that one of the grinding plate sections faces the base. The elastic element is installed between the pin and the rotating plate, applying a force to the pin toward the positioning groove.

5. The circuit board processing apparatus according to claim 1, characterized in that, The processing device also includes a dust suction hood and a switch. The dust suction hood is disposed on the side of the suction hole, and the switch is installed between the dust suction hood, the negative pressure device and the suction hole to switch the suction direction of the negative pressure device.

6. The circuit board processing apparatus according to claim 5, characterized in that, The switcher includes a valve body, a valve core, and a third motor. The valve body is installed on the lower side of the base and has an air extraction port, a first air inlet, and a second air inlet. The air extraction port is connected to a negative pressure device, the first air inlet is connected to an adsorption hole, and the second air inlet is connected to a dust collection hood. The valve core is rotatably connected in the valve body and has an air passage. The switcher includes an adsorption state and a dust collection state. In the adsorption state, the first air inlet is connected to the air extraction port through the air passage. In the dust collection state, the second air inlet is connected to the air extraction port through the air passage. The third motor drives the valve core to rotate to switch the state of the switcher.

7. The circuit board processing apparatus according to claim 1, characterized in that, The support plate is fixedly connected to the ear plate, which is locked to the rotating plate by bolts.

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