Bin assembly and wafer beveler

Abstract

The utility model provides a kind of bin assembly and wafer chamfering machine, bin assembly includes: material carrying platform, including material carrying part, material carrying part has accommodating space;Material box, detachably set on the bottom surface of accommodating space;Guide part, including multiple guide pieces spaced apart on the bottom surface of accommodating space, to form the limiting space for the lower end of material box is limited;Adjusting part, including adjusting piece set on the bottom surface of accommodating space, adjusting piece is at least along the direction perpendicular to the bottom surface of accommodating space adjustably set, to be used for with the circumferential edge of the bottom surface of material box contact, to adjust the height at the corresponding position of the circumferential edge of the bottom surface of material box, to solve the positioning effect of material box in the bin device of wafer chamfering machine in prior art is poor problem.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and more specifically, to a hopper assembly and a wafer chamfering machine. Background Technology

[0002] In the field of semiconductor wafer processing, wafer chamfering machines are used to improve the surface quality of wafer edges, reduce damage caused by previous processes, such as edge chipping and cracking, and release stress at the wafer edges. Among them, the hopper device is used to store wafers to be processed or processed, and is an important component of the wafer chamfering machine.

[0003] However, in the existing technology, the positioning of the hopper in the hopper device is relatively simple, which often makes it difficult to ensure that the hopper can achieve high-precision positioning every time it is placed. Especially after long-term operation, mechanical wear and cumulative errors may cause the hopper position to shift, which in turn affects the wafer picking and placing and processing accuracy. Utility Model Content

[0004] The main objective of this invention is to provide a hopper assembly and a wafer chamfering machine to solve the problem of poor positioning of the hopper box in the hopper device of the existing wafer chamfering machine.

[0005] To achieve the above objectives, according to one aspect of the present invention, a hopper assembly is provided, comprising: a loading platform including a loading section having a receiving space; a hopper detachably disposed on the bottom surface of the receiving space; a guide section including a plurality of guide members spaced apart on the bottom surface of the receiving space to form a limiting space for limiting the lower end of the hopper; and an adjustment section including an adjustment member disposed on the bottom surface of the receiving space, the adjustment member being adjustablely disposed at least along a direction perpendicular to the bottom surface of the receiving space for contacting the circumferential edge of the bottom surface of the hopper to adjust the height at a corresponding position of the circumferential edge of the bottom surface of the hopper.

[0006] Furthermore, the material box is provided with multiple guide grooves, which are spaced apart around the periphery of the material box, and multiple guide components are inserted into or separated from the multiple guide grooves in a one-to-one correspondence.

[0007] Furthermore, a protective pad is fitted on the outer peripheral surface of each guide member at the end closest to the bottom of the receiving space. The protective pad is located below the corresponding material box and contacts the bottom surface of the receiving space.

[0008] Furthermore, the adjustment section includes multiple adjustment members, which are spaced apart around the circumferential edge of the bottom surface of the material box, so as to contact different positions of the circumferential edge of the bottom surface of the material box.

[0009] Furthermore, the adjusting component includes an adjusting connecting plate and an adjusting screw threadedly connected to the adjusting connecting plate; wherein, the adjusting connecting plate is adjustablely disposed in a direction parallel to the bottom surface of the receiving space, so that the adjusting screw contacts or avoids the circumferential edge of the bottom surface of the material box by rotating or moving the adjusting connecting plate; the adjusting screw is adjustablely disposed in a direction perpendicular to the bottom surface of the receiving space, so that the height at the corresponding position of the circumferential edge of the bottom surface of the material box is adjusted by rotating the adjusting screw.

[0010] Furthermore, the hopper assembly includes a positioning part, which includes a positioning post. The positioning post is disposed on the bottom surface of the accommodating space and located within the limiting space. The hopper is provided with positioning holes for insertion and engagement with the positioning post.

[0011] Furthermore, the positioning part includes multiple positioning posts, which are spaced apart within the limiting space, and the material box is provided with multiple positioning holes for interlocking with the multiple positioning posts one by one.

[0012] Furthermore, there are multiple material-carrying sections, which are connected sequentially from top to bottom. Each material-carrying section has at least one material box, at least one guide section, and at least one adjustment section within its accommodating space.

[0013] Furthermore, the accommodating space is a rectangular cavity extending in a horizontal direction parallel to the horizontal plane. Multiple material boxes, multiple guide parts, and multiple adjustment parts are provided in the accommodating space. The multiple material boxes are spaced apart along the extension direction of the accommodating space, and the multiple guide parts and multiple adjustment parts are provided in a one-to-one correspondence with the multiple material boxes.

[0014] Furthermore, the material-carrying section includes a bottom plate, a rear plate, two side plates, and a material-carrying plate to form an accommodating space; wherein, the two side plates are respectively connected to the opposite sides of the rear plate, and the rear plate and the two side plates are respectively connected to the three sides of the bottom plate; the material-carrying plate is disposed above the bottom plate, and the upper surface of the material-carrying plate is the bottom surface of the accommodating space.

[0015] Furthermore, the hopper assembly also includes a hopper detection component, which is disposed on the loading section and located below the receiving space. The hopper detection component is positioned facing the receiving space. A first detection through hole is provided at the bottom of the receiving space, and a second detection through hole is provided at the bottom of the hopper for communicating with the first detection through hole, so as to allow the hopper detection component to detect whether there is material in the hopper located on the bottom surface of the receiving space.

[0016] Furthermore, the hopper assembly also includes a support platform, which is located below the loading platform to support the loading platform, and a storage cavity is provided inside the support platform.

[0017] According to another aspect of the present invention, a wafer chamfering machine is provided, including the aforementioned hopper assembly.

[0018] Applying the technical solution of this utility model, the hopper assembly of this utility model includes: a material loading platform, including a material loading section having a receiving space; a material box, detachably disposed on the bottom surface of the receiving space; a guide section, including a plurality of guide members spaced apart on the bottom surface of the receiving space to form a limiting space for limiting the lower end of the material box; and an adjustment section, including an adjustment member disposed on the bottom surface of the receiving space, the adjustment member being adjustablely disposed at least along a direction perpendicular to the bottom surface of the receiving space, for contacting the circumferential edge of the bottom surface of the material box to adjust the height at a corresponding position on the circumferential edge of the bottom surface of the material box. Technically, the hopper assembly of this utility model, through the combined design of the material loading platform, material box, guide section, and adjustment section, achieves precise positioning and height adjustment of the material box, ensuring the stability of the wafer during the loading and unloading process. In principle, the guide component of the guide part in this invention cooperates with the lower end of the material box, restricting the lateral movement of the material box. Meanwhile, the adjusting component of the adjusting part precisely controls the height of the circumferential edge of the bottom surface of the material box through vertical adjustment, thereby ensuring the parallelism between the wafers inside the material box and the material handling device. In terms of effectiveness, this invention solves the problem of poor positioning of the material box in the material hopper device of existing wafer chamfering machines. It facilitates precise alignment of the wafers and processing units during wafer processing, reduces wafer damage caused by inaccurate positioning, and improves processing quality and efficiency. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0020] Figure 1 A schematic diagram of the structure of a first embodiment of a hopper assembly according to the present invention is shown;

[0021] Figure 2 It shows Figure 1 A front view of a portion of the structure of the silo assembly shown;

[0022] Figure 3 It shows Figure 1 A top view of the hopper assembly shown;

[0023] Figure 4 It shows Figure 1 The shown is a front view of the hopper assembly in the wafer chamfering machine, partially obscured.

[0024] Figure 5 It shows Figure 1 The shown is a front view of the hopper assembly in the wafer chamfering machine;

[0025] Figure 6 It shows Figure 5 The diagram shows a top view of the hopper assembly in a wafer chamfering machine;

[0026] Figure 7 It shows Figure 1 The diagram shows the structure of the hopper assembly in the wafer chamfering machine;

[0027] Figure 8 A schematic diagram of a second embodiment of the hopper assembly according to the present invention is shown;

[0028] Figure 9 A schematic diagram of a portion of the structure of an embodiment of the wafer chamfering machine according to the present invention is shown;

[0029] Figure 10 It shows Figure 9 The diagram shows the structure of a wafer chamfering machine.

[0030] The above figures include the following reference numerals:

[0031] 1. Material loading platform; 11. Material loading section; 111. Accommodation space; 112. Base plate; 113. Rear plate; 114. Side plate; 115. Material loading plate;

[0032] 2. Material box; 21. Guide groove;

[0033] 3. Guide section; 31. Guide component; 33. Protective pad;

[0034] 4. Adjustment section; 41. Adjustment component; 411. Adjustment connecting plate; 412. Adjustment screw;

[0035] 6. Material box detection components;

[0036] 7. Support platform; 71. Storage cavity;

[0037] 100. First hopper assembly; 200. Second hopper assembly; 300. Transfer station. Detailed Implementation

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] like Figures 1 to 8As shown, this utility model provides a hopper assembly, including: a loading platform 1, including a loading section 11, the loading section 11 having a receiving space 111; a hopper 2, detachably disposed on the bottom surface of the receiving space 111; a guide section 3, including a plurality of guide members 31 spaced apart on the bottom surface of the receiving space 111 to form a limiting space for limiting the lower end of the hopper 2; and an adjustment section 4, including an adjustment member 41 disposed on the bottom surface of the receiving space 111, the adjustment member 41 being adjustablely disposed at least along a direction perpendicular to the bottom surface of the receiving space 111, for contacting the circumferential edge of the bottom surface of the hopper 2 to adjust the height at a corresponding position of the circumferential edge of the bottom surface of the hopper 2.

[0040] Technically, the hopper assembly of this invention, through the combined design of a loading platform, a hopper box, a guide section, and an adjustment section, achieves precise positioning and height adjustment of the hopper box, ensuring the stability of the wafers during loading and unloading. In principle, the guide section's guide component cooperates with the lower end of the hopper box, restricting its lateral movement. The adjustment section's adjustment component, through vertical adjustment, precisely controls the height of the circumferential edge of the hopper box's bottom surface, thus ensuring the parallelism between the wafers inside the hopper box and the loading device. In terms of effectiveness, this invention solves the problem of poor hopper box positioning in existing wafer chamfering machine hopper devices, facilitating precise alignment of the wafers with the processing unit during wafer processing, reducing wafer damage caused by inaccurate positioning, and improving processing quality and efficiency.

[0041] Specifically, the hopper assembly can be Figures 1 to 7 The first hopper assembly 100 shown can also be Figure 8 The second hopper assembly 200 is shown.

[0042] like Figure 3 As shown, the material box 2 is provided with multiple guide grooves 21, which are spaced apart around the periphery of the material box 2. Multiple guide members 31 are inserted into or separated from the multiple guide grooves 21 in a one-to-one correspondence.

[0043] Technically, this invention enhances the positioning stability of the material box on the loading platform by setting a guide groove on the material box, which interlocks with the guide component of the guide part. In principle, the cooperation between the guide groove and the guide component utilizes the mechanical limiting principle to restrict the lateral displacement of the material box, ensuring the positional accuracy of the wafer during processing. Effectively, this invention facilitates precise alignment of the wafer with the processing unit during processing, further reducing wafer wobbling during loading and unloading, and improving the accuracy and efficiency of wafer processing.

[0044] like Figure 3As shown, a protective pad 33 is also provided on the outer peripheral surface of the end of each guide member 31 that is close to the bottom surface of the receiving space 111. The protective pad 33 is located below the corresponding material box 2 and is in contact with the bottom surface of the receiving space 111.

[0045] Technically, this invention protects the contact surface between the material box and the material carrier platform by adding a protective pad to the guide component, thus preventing wear during long-term use. In principle, the protective pad utilizes the cushioning and wear-resistant properties of the material to reduce direct friction between the bottom surface of the receiving space 111 and the bottom surface of the material box, extending the service life of the material box. Effectively, this invention achieves precise alignment between the wafer and the processing unit during wafer processing, while simultaneously protecting the material box, reducing maintenance costs, and improving equipment operating efficiency.

[0046] Alternatively, the material box can be made of iron, and magnetic material can be added to the protective pad to enhance the adsorption force on the material box and improve the positioning stability of the material box in a high-vibration environment.

[0047] like Figure 3 As shown, the adjustment part 4 includes a plurality of adjustment members 41, which are arranged at intervals around the circumferential edge of the bottom surface of the material box 2, so as to contact different positions of the circumferential edge of the bottom surface of the material box 2.

[0048] Technically, this invention achieves precise adjustment of multiple positions along the circumferential edge of the material box's bottom surface by incorporating multiple adjustment components, ensuring the parallelism and stability of the wafer during loading and unloading. In principle, the adjustment components utilize mechanical fine-tuning principles; through vertical movement, the height of the circumferential edge of the material box's bottom surface is precisely controlled, thus guaranteeing the parallelism between the wafer and the loading device. Effectively, this invention achieves precise alignment between the wafer and the processing unit during wafer fabrication, reducing wafer damage caused by inaccurate positioning and improving processing quality and efficiency. Furthermore, integrating sensors into the adjustment components allows for real-time monitoring of the height of the circumferential edge of the material box's bottom surface, further enhancing positioning accuracy and reliability and solving positioning challenges caused by changes in material size or shape.

[0049] like Figure 3As shown, the adjusting component 41 includes an adjusting connecting plate 411 and an adjusting screw 412 threadedly connected to the adjusting connecting plate 411; wherein, the adjusting connecting plate 411 is adjustablely arranged in a direction parallel to the bottom surface of the receiving space 111, and the adjusting screw 412 is made to contact or avoid the circumferential edge of the bottom surface of the material box 2 by rotating or moving the adjusting connecting plate 411; the adjusting screw 412 is adjustablely arranged in a direction perpendicular to the bottom surface of the receiving space 111, and the height at the corresponding position of the circumferential edge of the bottom surface of the material box 2 is adjusted by rotating the adjusting screw 412.

[0050] Specifically, the adjusting connecting plate 411 is rotatably or movable on the bottom surface of the accommodating space 111, and the adjusting screw 412 is rotatably mounted on the adjusting connecting plate 411.

[0051] Technically, this invention achieves fine-tuning of the circumferential edge height of the wafer cassette bottom surface by adjusting the combination of the connecting plate and the adjusting screw, ensuring the parallelism and stability of the wafer during loading and unloading. In principle, the vertical movement of the adjusting screw utilizes the precision adjustment characteristics of the thread to achieve accurate control of the circumferential edge height of the wafer cassette bottom surface; the horizontal movement of the connecting plate, by changing the relative position of the adjusting screw and the circumferential edge of the wafer cassette bottom surface, achieves compatibility with wafers of different sizes. In terms of effectiveness, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer damage caused by inaccurate positioning, and improves processing quality and efficiency.

[0052] Specifically, the hopper assembly includes a positioning part, which includes a positioning post. The positioning post is disposed on the bottom surface of the accommodating space 111 and located within the limiting space. The hopper 2 is provided with a positioning hole for insertion and engagement with the positioning post.

[0053] Technically, this invention achieves precise positioning of the wafer cassette on the loading platform through the cooperation of positioning posts and positioning holes, ensuring the stability of the wafer during loading and unloading. In principle, the insertion and cooperation of the positioning posts and positioning holes utilizes the mechanical limiting principle to restrict the lateral movement of the wafer cassette, ensuring the positional accuracy of the wafer during processing. Effectively, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer wobbling during loading and unloading, and improves the accuracy and efficiency of wafer processing.

[0054] Furthermore, the positioning part includes multiple positioning posts, which are spaced apart within the limiting space. The material box 2 is provided with multiple positioning holes for interlocking with the multiple positioning posts.

[0055] Technically, this invention achieves multi-point positioning of the material box on the loading platform by setting multiple positioning posts, further enhancing the positioning stability of the material box. In principle, the cooperation of multiple positioning posts and multiple positioning holes utilizes the multi-point limiting principle to further restrict the lateral displacement of the material box, ensuring the positional accuracy of the wafer during processing. In terms of effect, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, further reducing wafer wobbling during loading and unloading, and improving the accuracy and efficiency of wafer processing.

[0056] like Figures 1 to 7 As shown, there are multiple material loading sections 11 connected sequentially from top to bottom. Each material loading section 11 has at least one material box 2, at least one guide section 3 and at least one adjustment section 4 in its accommodating space 111.

[0057] Technically, this invention achieves multi-layer wafer storage by setting up multiple material loading sections, thereby improving the storage capacity and processing efficiency of the hopper assembly. In principle, each material loading section in this invention includes a material, a guide, and an adjustment section, ensuring the positioning accuracy and stability of different material boxes on different loading platforms. In terms of effectiveness, this invention facilitates precise alignment of wafers with processing units during wafer processing, improves the equipment's storage capacity and processing efficiency, reduces wafer damage during handling, and enhances the precision and efficiency of wafer processing.

[0058] like Figures 1 to 3 As shown, the accommodating space 111 is a rectangular cavity extending in a horizontal direction parallel to the horizontal plane. Multiple material boxes 2, multiple guide parts 3 and multiple adjustment parts 4 are provided in the accommodating space 111. The multiple material boxes 2 are arranged at intervals along the extension direction of the accommodating space 111, and the multiple guide parts 3 and multiple adjustment parts 4 are arranged one-to-one with the multiple material boxes 2.

[0059] Technically, this invention achieves horizontally spaced storage of material boxes through the design of rectangular cavities, improving the equipment's storage capacity and processing efficiency. In principle, the multiple guide parts and adjustment parts in this invention correspond one-to-one with the multiple material boxes, ensuring the positioning accuracy and stability of each material box on its corresponding loading platform. In terms of effectiveness, this invention facilitates precise alignment of wafers and processing units during wafer fabrication, improves the equipment's storage capacity and processing efficiency, reduces wafer damage during handling, and enhances the precision and efficiency of wafer processing.

[0060] like Figure 3As shown, the material-carrying section 11 includes a bottom plate 112, a rear plate 113, two side plates 114, and a material-carrying plate 115, forming an accommodating space 111. The two side plates 114 are respectively connected to the opposite sides of the rear plate 113, and the rear plate 113 and the two side plates 114 are respectively connected to the three sides of the bottom plate 112. The material-carrying plate 115 is disposed above the bottom plate 112, and the upper surface of the material-carrying plate 115 is the bottom surface of the accommodating space 111.

[0061] Technically, this invention achieves stable support and positioning of the material box through the structural design of the material carrier section, ensuring the parallelism and stability of the wafer during loading and unloading. In principle, the combination of the base plate, rear plate, side plate, and material carrier plate in this invention utilizes the support and limiting principles of mechanical structures to form a stable support space, ensuring the positional accuracy of the material box on the material carrier platform. In terms of effectiveness, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer wobbling during loading and unloading, and improves the accuracy and efficiency of wafer processing.

[0062] like Figure 2 As shown, the hopper assembly also includes a hopper detection component 6. The hopper detection component 6 is disposed on the loading part 11 and located below the receiving space 111. The hopper detection component 6 is disposed facing the receiving space 111. A first detection through hole is provided at the bottom of the receiving space 111. A second detection through hole is provided at the bottom of the hopper 2 for communicating with the first detection through hole, so as to allow the hopper detection component 6 to detect whether there is material in the hopper 2 located on the bottom surface of the receiving space 111.

[0063] Among them, the material box detection component 6 can be a photoelectric sensor. The detection light of the photoelectric sensor can pass through the first detection through hole and the second detection through hole to reach the corresponding material box 2. When the detection light is blocked by the wafer in the material box 2, it indicates that there is a wafer in the material box 2.

[0064] Technically, this invention achieves automatic detection of materials within the material bin through the inclusion of a material bin detection component, thereby improving the automation level and processing efficiency of the equipment. In principle, the material bin detection component utilizes photoelectric detection, determining the presence of material in the bin by detecting the obstruction of through-holes, thus achieving automatic material detection. In terms of effectiveness, this invention facilitates precise alignment of the wafer and processing unit during wafer fabrication, improving equipment automation, reducing manual intervention, and enhancing the efficiency and precision of wafer fabrication.

[0065] Specifically, the first hopper assembly 100 includes multiple material loading platforms 1 and multiple material boxes 2. The multiple material loading platforms 1 are arranged sequentially from top to bottom, and each material loading platform 1 has multiple material boxes 2 inside it.

[0066] like Figure 8 As shown, the hopper assembly also includes a support platform 7, which is located below the loading platform 1 to support the loading platform 1. The support platform 7 has a storage cavity 71 inside. The storage cavity 71 is used to place some processing tools, etc.

[0067] Specifically, the second hopper assembly 200 includes a loading platform 1, a material box 2, and a support platform 7. The loading platform 1 is mounted on the support platform 7, and the material box 2 is mounted on the loading platform 1.

[0068] Technically, this invention achieves stable support for the material carrier platform through the installation of a support platform, ensuring the stability of the wafer during the loading and unloading process. In principle, the support platform in this invention utilizes the support principle of a mechanical structure; its stable support ensures the stability of the material carrier platform, thereby guaranteeing the positional accuracy of the wafer during processing. In terms of effectiveness, this invention facilitates precise alignment of the wafer and processing unit during wafer processing, reduces wafer wobbling during loading and unloading, and improves the accuracy and efficiency of wafer processing.

[0069] like Figure 9 and Figure 10 As shown, this utility model also provides a wafer chamfering machine, including the aforementioned hopper assembly.

[0070] Technically, the wafer chamfering machine of this invention achieves efficient storage and precise positioning of wafers through the integration of the aforementioned hopper assembly, ensuring the parallelism and stability of the wafers during processing. In principle, the hopper assembly of the wafer chamfering machine utilizes mechanical positioning and fine-tuning principles. Through the cooperation of the guiding part, adjusting part, and positioning part, it achieves precise positioning of the wafers within the hopper, ensuring the positional accuracy of the wafers during processing. In terms of effectiveness, this invention facilitates precise alignment of the wafers with the processing unit during wafer processing, improving the efficiency and accuracy of wafer processing, reducing damage to wafers during handling, and increasing the yield of wafers processed.

[0071] Specifically, the wafer chamfering machine includes a transfer station 300, which is set on a horizontal support base. A first hopper assembly 100 of the hopper assembly is set on the transfer station 300, and the lowermost loading platform 1 in the first hopper assembly 100 is connected to the upper surface of the transfer station 300 for placing materials sent from the previous station. A second hopper assembly 200 of the hopper assembly is set on one side of the transfer station 300, and a support platform 7 in the second hopper assembly 200 is set on the support base for placing defective materials.

[0072] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0073] The hopper assembly of this utility model includes: a material loading platform 1, including a material loading section 11, the material loading section 11 having a receiving space 111; a material box 2, detachably disposed on the bottom surface of the receiving space 111; a guide section 3, including a plurality of guide members 31 spaced apart on the bottom surface of the receiving space 111 to form a limiting space for limiting the lower end of the material box 2; and an adjustment section 4, including an adjustment member 41 disposed on the bottom surface of the receiving space 111, the adjustment member 41 being adjustablely disposed at least along a direction perpendicular to the bottom surface of the receiving space 111, for contacting the circumferential edge of the bottom surface of the material box 2 to adjust the height at a corresponding position on the circumferential edge of the bottom surface of the material box 2. Technically, the hopper assembly of this utility model, through the combined design of the material loading platform, material box, guide section, and adjustment section, achieves precise positioning and height adjustment of the material box, ensuring the stability of the wafer during the loading and unloading process. In principle, the guide component of the guide part in this invention cooperates with the lower end of the material box, restricting the lateral movement of the material box. Meanwhile, the adjusting component of the adjusting part precisely controls the height of the circumferential edge of the bottom surface of the material box through vertical adjustment, thereby ensuring the parallelism between the wafers inside the material box and the material handling device. In terms of effectiveness, this invention solves the problem of poor positioning of the material box in the material hopper device of existing wafer chamfering machines. It facilitates precise alignment of the wafers and processing units during wafer processing, reduces wafer damage caused by inaccurate positioning, and improves processing quality and efficiency.

[0074] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0075] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0076] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0077] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0078] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0079] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A hopper assembly, characterized in that, include: The material loading platform (1) includes a material loading section (11) having a receiving space (111). The material box (2) is detachably disposed on the bottom surface of the receiving space (111); The guide section (3) includes a plurality of guide members (31) spaced apart on the bottom surface of the receiving space (111) to form a limiting space for limiting the lower end of the material box (2); The adjustment part (4) includes an adjustment member (41) disposed on the bottom surface of the receiving space (111). The adjustment member (41) is adjustablely disposed at least in a direction perpendicular to the bottom surface of the receiving space (111) for contacting the circumferential edge of the bottom surface of the material box (2) to adjust the height at the corresponding position of the circumferential edge of the bottom surface of the material box (2).

2. The hopper assembly according to claim 1, characterized in that, The material box (2) is provided with a plurality of guide grooves (21), which are spaced apart around the periphery of the material box (2). The plurality of guide members (31) are inserted into or separated from the plurality of guide grooves (21) in a one-to-one correspondence.

3. The hopper assembly according to claim 1, characterized in that, A protective pad (33) is also provided on the outer peripheral surface of one end of each guide member (31) near the bottom surface of the receiving space (111). The protective pad (33) is located below the corresponding material box (2) and is in contact with the bottom surface of the receiving space (111).

4. The hopper assembly according to claim 1, characterized in that, The adjustment part includes a plurality of adjustment members (41), which are spaced apart around the circumferential edge of the bottom surface of the material box (2) to contact different positions of the circumferential edge of the bottom surface of the material box (2).

5. The hopper assembly according to claim 1, characterized in that, The adjusting component (41) includes an adjusting connecting plate (411) and an adjusting screw (412) threadedly connected to the adjusting connecting plate (411); wherein the adjusting connecting plate (411) is adjustablely arranged in a direction parallel to the bottom surface of the receiving space (111) so that the adjusting screw (412) contacts or avoids the circumferential edge of the bottom surface of the material box (2) by rotating or moving the adjusting connecting plate (411); the adjusting screw (412) is adjustablely arranged in a direction perpendicular to the bottom surface of the receiving space (111) so that the height at the corresponding position of the circumferential edge of the bottom surface of the material box (2) can be adjusted by rotating the adjusting screw (412).

6. The hopper assembly according to claim 1, characterized in that, The hopper assembly includes a positioning part, the positioning part includes a positioning post, the positioning post is disposed on the bottom surface of the accommodating space (111) and located within the limiting space, and the hopper (2) is provided with a positioning hole for insertion and cooperation with the positioning post.

7. The hopper assembly according to claim 6, characterized in that, The positioning part includes a plurality of positioning posts, which are spaced apart within the limiting space. The material box (2) is provided with a plurality of positioning holes for inserting and engaging with the plurality of positioning posts in a one-to-one correspondence.

8. The hopper assembly according to claim 1, characterized in that, The number of the material-carrying parts (11) is multiple, and the multiple material-carrying parts (11) are connected in sequence from top to bottom. Each material-carrying part (111) is provided with at least one material box (2), at least one guide part (3) and at least one adjustment part (4) in its accommodating space (111).

9. The hopper assembly according to claim 1, characterized in that, The accommodating space (111) is a rectangular cavity extending in a horizontal direction parallel to the horizontal plane. The accommodating space (111) is provided with a plurality of material boxes (2), a plurality of guide parts (3) and a plurality of adjustment parts (4). The plurality of material boxes (2) are arranged at intervals along the extension direction of the accommodating space (111), and the plurality of guide parts (3) and the plurality of adjustment parts (4) are arranged one-to-one with the plurality of material boxes (2).

10. The hopper assembly according to claim 1, characterized in that, The material-carrying part (11) includes a bottom plate (112), a rear plate (113), two side plates (114) and a material-carrying plate (115) to form the accommodating space (111); wherein, the two side plates (114) are respectively connected to the opposite sides of the rear plate (113), and the rear plate (113) and the two side plates (114) are respectively connected to the three sides of the bottom plate (112), the material-carrying plate (115) is disposed above the bottom plate (112), and the upper surface of the material-carrying plate (115) is the bottom surface of the accommodating space (111).

11. The hopper assembly according to any one of claims 1 to 10, characterized in that, The hopper assembly also includes a hopper detection component (6), which is disposed on the loading part (11) and located below the accommodating space (111). The hopper detection component (6) is disposed facing the accommodating space (111). The bottom of the accommodating space (111) is provided with a first detection through hole, and the bottom of the hopper (2) is provided with a second detection through hole for communicating with the first detection through hole, so as to allow the hopper detection component (6) to detect whether there is material in the hopper (2) located on the bottom surface of the accommodating space (111).

12. The hopper assembly according to claim 1, characterized in that, The hopper assembly also includes a support platform (7), which is located below the loading platform (1) to support the loading platform (1). The support platform (7) has a storage cavity (71) inside.

13. A wafer chamfering machine, characterized in that, The hopper assembly includes any one of claims 1 to 12.

Images