Semiconductor module grinding micro-porous ceramic chuck

Abstract

The utility model discloses a kind of semiconductor module grinding microporous ceramic suction disc, including bottom disc, top disc, alumina ceramic vacuum suction block and microporous ceramic sheet, vacuum chamber is in alumina ceramic vacuum suction block, bottom disc is arranged with several first through holes with annular array as center of middle shaft, alumina ceramic vacuum suction block is set as up-down through structure, several alumina ceramic vacuum suction blocks are sealingly fixed and installed on top surface of top disc, top disc and bottom disc are sealingly fixed connection.This suction disc realizes the grinding process of semiconductor industry product in adsorption fixed semiconductor module use, guarantee semiconductor module grinding processing flatness and the requirement of surface without mark scratch.Top disc and bottom disc can be detached and separated, replace different size types of alumina ceramic vacuum suction block and microporous ceramic sheet can meet the use demand of different products, clean maintenance is also facilitated to each first through hole, annular first channel, connecting channel, second channel.

Description

Technical Field

[0001] This utility model belongs to the field of grinding machine processing in the semiconductor processing industry, and in particular relates to a grinding machine processing method. Background Technology

[0002] In the grinding process of the semiconductor manufacturing industry, due to the high requirements for the flatness and cleanliness of the product surface, the use of traditional chucks will cause a series of problems. In particular, if the product surface is coated with copper film, it is easy to leave marks. Summary of the Invention

[0003] The technical problem to be solved by this utility model is to provide a microporous ceramic suction cup that will not leave adsorption marks on semiconductor modules.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: a microporous ceramic chuck for grinding semiconductor modules, comprising a base plate, a top plate, an alumina ceramic vacuum chuck block, and a microporous ceramic sheet. The alumina ceramic vacuum chuck block has a vacuum chamber. The base plate has several rings of first through holes arranged in a circular array around its central axis. The alumina ceramic vacuum chuck block is configured as a vertically through structure. Several alumina ceramic vacuum chuck blocks are sealed and fixedly installed on the top surface of the top plate. The top plate is sealed and fixedly connected to the base plate. The bottom surface of the top plate is provided with several rings of first channels corresponding to the first through holes. The rings of first channels are connected to each other. The top surface of the top plate is provided with a second channel connected to the vacuum chamber and the first channels. The microporous ceramic sheet is sealed and fixedly installed in the vacuum chamber of the alumina ceramic vacuum chuck block.

[0005] Preferably, the vacuum chamber has a stepped surface, with microporous ceramic plates placed on the stepped surface, and a gap of 1-8 cm exists between the bottom surface of the vacuum chamber and the top plate.

[0006] Preferably, the top plate and the bottom plate are provided with a second through hole in a ring array at the edge of the combination.

[0007] Preferably, the top of the alumina ceramic vacuum block is provided with an annular gasket groove, and a support gasket is embedded in the annular gasket groove.

[0008] As a preferred option, a positioning post is fixedly installed on the top surface of the top plate.

[0009] Compared with existing technologies, the advantages of this invention are: this suction cup enables the adsorption and fixation of semiconductor modules in the grinding process of semiconductor products, ensuring the flatness of the semiconductor module during grinding and the absence of marks and scratches on the surface. The top and bottom plates can be disassembled and separated, and different sizes and types of alumina ceramic vacuum suction blocks and microporous ceramic sheets can be replaced to meet the needs of different products. It also facilitates the cleaning and maintenance of each first through hole, annular first channel, connecting channel, and second channel. Attached Figure Description

[0010] The present invention will be further described below with reference to the accompanying drawings.

[0011] Figure 1 This is a perspective view of the present invention.

[0012] Figure 2 This is the front view of this utility model.

[0013] Figure 3 yes Figure 2 A sectional view along line AA.

[0014] Figure 4 It is a 3D view of the bottom of the chassis. Detailed Implementation

[0015] The present invention will now be described in detail with reference to specific embodiments: like Figures 1 to 4 The semiconductor module grinding microporous ceramic chuck shown includes a base plate 1, a top plate 2, an alumina ceramic vacuum chuck 3, and a microporous ceramic sheet 5. The alumina ceramic vacuum chuck 3 has a vacuum chamber 32. The base plate 1 has several rings of first through holes 11 arranged in a ring array with its central axis as the center. The alumina ceramic vacuum chuck 3 is configured as a vertically through structure. Several alumina ceramic vacuum chuck 3 are sealed and fixedly installed on the top surface of the top plate 2. The top plate 2 is sealed and fixedly connected to the base plate 1. The bottom surface of the top plate 2 is provided with several rings of annular first channels 21 corresponding to the first through holes 11. The rings of first channels 21 are connected to each other by 3-6 connecting channels arranged in a ring. The top surface of the top plate 2 is provided with second channels 22 that are connected to the vacuum chamber 32 and the first channels 21. The microporous ceramic sheet 5 is sealed and fixedly installed in the vacuum chamber 32 of the alumina ceramic vacuum chuck 3.

[0016] The vacuum chamber 32 has a stepped surface, and the microporous ceramic sheet 5 is placed on the stepped surface. There is a 2mm gap between the bottom surface of the vacuum chamber 32 and the top plate 2, which facilitates the sealing and fixing of the bottom of the microporous ceramic sheet 5 to the stepped surface. A sealing strip is provided on the stepped surface, and the microporous ceramic sheet 5 is placed on the sealing strip. The 2mm gap height facilitates the provision of a sealing strip groove on the stepped surface.

[0017] The top plate 2 and the base plate 1 are arranged in a ring array at the edge of the combination. The top plate 2 and the base plate 1 are connected and fixed by bolts and lock nuts through the second through holes 7. The combination of the top plate 2 and the base plate 1 can also be sealed and fixed to the turntable chamber by bolts and lock nuts through the second through holes 7. The turntable chamber is connected to the vacuum generator through the pipeline. The turntable chamber is also installed on the automated rotating equipment.

[0018] The top of the alumina ceramic vacuum block 3 is provided with an annular gasket groove 31. The semiconductor module 6 is placed on a rubber support gasket. The inner ring of the support gasket is attached to the vacuum chamber 32. The microporous ceramic sheet 5 is embedded in the inner ring of the support gasket, which further improves the sealing between the microporous ceramic sheet 5 and the inner wall of the vacuum chamber 32. The semiconductor module 6 is adsorbed onto the microporous ceramic sheet 5 by vacuum.

[0019] A positioning column 8 is fixedly installed on the top surface of the top plate 2, so that the top plate 2 can be picked up by an automated robot arm in conjunction with the clamp and the positioning column 8 for installation or disassembly and replacement.

[0020] The internal chamber of the turntable is connected to each of the first through holes 11, the annular first channel 21, the connecting channel, the second channel 22, and the vacuum chamber 32, so that the top surface of the microporous ceramic sheet 5 in the vacuum chamber 32 generates suction force to adsorb and fix the semiconductor module 6 placed on it, and then perform grinding processing on it.

Claims

1. A ceramic chuck for grinding micro-holes in semiconductor modules, characterized in that: The device includes a chassis (1), a top plate (2), an alumina ceramic vacuum suction block (3), and a microporous ceramic plate (5). The alumina ceramic vacuum suction block (3) has a vacuum chamber (32). The chassis (1) is arranged in a ring array with several rings of first through holes (11) centered on its central axis. The alumina ceramic vacuum suction block (3) is configured as an upper and lower through structure. Several alumina ceramic vacuum suction blocks (3) are sealed and fixedly installed on the top surface of the top plate (2). The top plate (2) is sealed and fixedly connected to the chassis (1). The bottom surface of the top plate (2) is provided with several rings of annular first channels (21) corresponding to the first through holes (11). The rings of first channels (21) are connected to each other. The top surface of the top plate (2) is provided with a second channel (22) connected to the vacuum chamber (32) and the first channel (21). The microporous ceramic plate (5) is sealed and fixedly installed in the vacuum chamber (32) of the alumina ceramic vacuum suction block (3).

2. The semiconductor module grinding micro-hole ceramic chuck according to claim 1, characterized in that: The vacuum chamber (32) has a stepped surface, and the microporous ceramic plate (5) is placed on the stepped surface. There is a gap of 1-8 cm between the bottom surface of the vacuum chamber (32) and the top plate (2).

3. The semiconductor module grinding micro-hole ceramic chuck according to claim 1, characterized in that: The top plate (2) and the bottom plate (1) are arranged in a ring array with second through holes (7) at the edge of the combination.

4. The semiconductor module grinding micro-hole ceramic chuck according to claim 1, characterized in that: The top of the alumina ceramic vacuum suction block (3) is provided with an annular gasket groove (31), and a support gasket is embedded in the annular gasket groove (31).

5. The semiconductor module grinding micro-hole ceramic chuck according to claim 1, characterized in that: The top plate (2) has a fixed positioning column (8) on its top surface.

Images