Semiconductor discrete device dicing machine

Abstract

The utility model discloses a kind of semiconductor discrete device cutting rib machine, it is related to cutting rib machine technical field.The utility model includes chassis and upper stand;The top of chassis is fixedly connected with limiting plate and discharging assembly, the inside of upper stand is provided with cutting die and pressing assembly;Limiting plate includes board body, slot is opened in the inside of board body;Discharging assembly includes electric push rod and bottom plate, electric push rod is fixedly connected with push rod between output and bottom plate, pusher plate is rotatably connected on the side of bottom plate away from electric push rod;Pressing assembly includes electric cylinder and sliding frame;Cutting die includes mounting plate, the bottom of mounting plate is fixedly connected with multiple cutter corresponding with raw material plate.The utility model can push product out by the pusher box in cutting die and first pusher spring, then cooperate with electric push rod in discharging assembly to drive bottom plate to move, pusher plate pushes corner material, realize the automatic classification of product and corner material and discharge, reduce subsequent sorting workload, improve overall operation efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of tendon cutting machine technology, and in particular relates to a tendon cutting machine for semiconductor discrete devices. Background Technology

[0002] In the mass production process of semiconductor discrete devices, the devices are usually first integrated in an array on a raw material board (i.e., device frame) made of metal or resin. After the preceding processes such as packaging and testing, the frame ribs connecting each device unit on the raw material board need to be removed by special equipment to separate the individual devices. The equipment used in this key process is the semiconductor discrete device rib cutting machine. The rib cutting machine can process the integrated raw material board into independent qualified devices.

[0003] Chinese patent application CN215998918U discloses a semiconductor discrete device lead cutting machine. Its structure includes a feeding mechanism at one end of the feed channel, a lead cutting die mechanism in the middle of the feed channel, and a discharging mechanism at the other end of the feed channel. Transfer robots are respectively installed on the sides of the feed channel on both sides of the lead cutting die mechanism. The advantages of this invention are: a reasonable structural design, achieving efficient loading and unloading of discrete device frames and discrete devices before and after lead cutting, effectively improving production efficiency, ensuring production continuity, and meeting production needs.

[0004] Although the aforementioned existing technology has solved the problems of automation and continuity of loading and unloading in the rebar cutting process and improved the overall operation efficiency, after the rebar cutting mold mechanism has finished cutting, the separated individual products and the remaining frame scraps will be output simultaneously through the unloading mechanism, and the two are in a mixed state, making it impossible to achieve automatic classification.

[0005] To address these issues, we provide a semiconductor discrete device cutting machine. Utility Model Content

[0006] The purpose of this utility model is to provide a semiconductor discrete device lead cutting machine. The product can be pushed out by the push box and the first push spring in the cutting mold. Then, the electric push rod in the discharge assembly drives the base plate to move and the push plate pushes the scrap material to realize the automatic classification and discharge of the product and scrap material, which solves the problem that the existing lead cutting machine needs to sort the materials again.

[0007] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model is a semiconductor discrete device cutting machine, including a base frame and an upper frame fixedly connected to the top of the base frame; the top of the base frame is fixedly connected to a limiting plate for placing raw material boards and a discharge assembly for discharging products and scraps; the upper frame is provided with a cutting mold for cutting raw material boards and a pressing assembly for pushing the cutting mold to cut the raw material boards. The limiting plate includes a plate body fixedly connected to the top of the base frame. The plate body has a slot inside, and the bottom of the slot has a discharge port for discharging products. The top of the limiting plate is fixedly connected to two symmetrically distributed L-shaped clips for positioning the raw material plate. The material discharge assembly includes an electric push rod fixedly connected to the side of the base frame and a base plate movably inserted into the slot. A push rod is fixedly connected between the output end of the electric push rod and the base plate. An L-shaped push plate for pushing scrap materials is rotatably connected to the side of the base plate away from the electric push rod. The pressing assembly includes an electric cylinder fixedly connected to the top of the upper frame and a slide that is movably sleeved on the outside of the upper frame support legs, with the slide fixedly connected to the output end of the electric cylinder. The cutting mold includes a mounting plate fixedly connected to the bottom of the carriage, and a plurality of cutting blades corresponding to the raw material plate are fixedly connected to the bottom of the mounting plate.

[0008] The present invention is further configured such that a mounting groove is provided on the side of the base plate away from the electric push rod, and the push plate is rotatably connected to the inside of the mounting groove, and a plurality of push springs for pushing the push plate are fixedly connected inside the mounting groove.

[0009] The present invention is further configured such that a plurality of limiting posts are fixedly connected inside the mounting groove, and an ejector spring is movably sleeved on the outside of the limiting posts.

[0010] The present invention is further configured such that a pusher box is movably sleeved inside the cutter, a first movable rod is fixedly connected to the center of the inner cavity of the pusher box, and the first movable rod is movably sleeved inside the mounting plate. A first pusher spring for pushing the pusher box is movably sleeved outside the first movable rod, and a rubber pad is fixedly connected to the bottom of the pusher box.

[0011] The present invention is further configured such that a second movable rod is movably sleeved at each of the four corners of the mounting plate, a pressure frame for pressing down the scrap material is fixedly connected to the bottom of the four second movable rods, and a second push spring for pushing the pressure frame is movably sleeved on the outside of the four second movable rods.

[0012] The present invention is further configured such that a product discharge trough for discharging products is fixedly connected inside the base frame, and a scrap material discharge trough for discharging scrap materials is fixedly connected on the side of the base frame away from the electric push rod.

[0013] The present invention is further configured such that a controller for controlling the operation of the electric push rod and the electric cylinder is fixedly connected to the top of the upper frame.

[0014] This utility model has the following beneficial effects: 1. This utility model uses an electric push rod in the discharge assembly to drive the base plate to move within the slot of the limiting plate, so that the cut products fall from the discharge port into the product discharge trough of the base frame. At the same time, the push plate pushes the scrap to the scrap discharge trough of the base frame, realizing the automatic classification and discharge of products and scrap, eliminating the need for manual sorting, reducing the workload of subsequent sorting, and improving the overall operation efficiency.

[0015] 2. This utility model uses the first pushing spring inside the cutting mold to push the pushing box downward, which can promptly push out the product stuck in the cutter after cutting, avoiding product jamming and subsequent cutting failures. At the same time, the second pushing spring pushes the pressure frame to press the raw material plate scraps, which not only prevents the raw material plate from vibrating and shifting during cutting, but also pushes the scraps to prevent them from getting stuck outside the cutter, thus improving the stability and reliability of the equipment operation. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0018] Figure 2 This is a schematic diagram of the base plate of this utility model in the open state.

[0019] Figure 3 This is a schematic diagram of the plate structure of this utility model.

[0020] Figure 4 This is a schematic diagram of the structure of the base plate of this utility model.

[0021] Figure 5 This is a cross-sectional view of the cutting die of this utility model.

[0022] The attached diagram lists the components represented by each number as follows: 100. Base frame; 101. Product discharge chute; 102. Scrap material discharge chute; 200. Upper frame; 300. Limiting plate; 301. Plate body; 301a. Slot; 301b. Discharge port; 400. Discharge assembly; 401. Electric push rod; 302. L-shaped retaining strip; 402. Base plate; 402a. Mounting slot; 402b. Ejection spring; 402c. Limiting post; 403. Push rod; 404. Push plate; 500. Pressing assembly; 501. Electric cylinder; 502. Slide; 600. Cutting mold; 601. Mounting plate; 602. Cutter; 603. Push box; 604. First movable rod; 605. First push spring; 606. Rubber pad; 607. Second movable rod; 608. Pressure frame; 609. Second push spring; 700. Controller; 800. Raw material plate. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] Example 1 Please see Figures 1 to 5 This utility model is a semiconductor discrete device lead cutting machine, including a base frame 100 and an upper frame 200 fixedly connected to the top of the base frame 100; the top of the base frame 100 is fixedly connected to a limiting plate 300 for placing a raw material board 800 and a discharge assembly 400 for discharging products and scraps; the upper frame 200 is internally provided with a cutting mold 600 for cutting the raw material board 800 and a pressing assembly 500 for pushing the cutting mold 600 to cut the raw material board 800; the limiting plate 300 can position the raw material board 800 to prevent the raw material board 800 from shifting during cutting and ensure cutting accuracy; the discharge assembly 400 realizes automatic discharge of products and scraps, reduces manual sorting operations, and improves work efficiency; the pressing assembly 500 provides stable downward pressure for the cutting mold 600 to ensure that the cutter 602 can smoothly cut the raw material board 800; The limiting plate 300 includes a plate body 301 fixedly connected to the top of the base frame 100. The plate body 301 has a slot 301a inside. The bottom of the slot 301a has a discharge port 301b for discharging products. The top of the limiting plate 300 is fixedly connected to two symmetrically distributed L-shaped clips 302 for positioning the raw material plate 800. The two L-shaped clips 302 can assist in positioning the raw material plate 800. The discharge assembly 400 includes an electric push rod 401 fixedly connected to the side of the base frame 100 and a base plate 402 movably inserted into the slot 301a. A push rod 403 is fixedly connected between the output end of the electric push rod 401 and the base plate 402. An L-shaped push plate 404 for pushing scrap materials is rotatably connected to the side of the base plate 402 away from the electric push rod 401. The push rod 403 drives the base plate 402 to move within the slot 301a, and it can be pulled out after the raw material plate 800 is cut, so that the product falls. The L-shaped push plate 404 can push the scrap materials, thereby automatically discharging the scrap materials. The pressing assembly 500 includes an electric cylinder 501 fixedly connected to the top of the upper frame 200 and a slide 502 movably sleeved on the outside of the legs of the upper frame 200, and the slide 502 is fixedly connected to the output end of the electric cylinder 501. The cutting mold 600 includes a mounting plate 601 fixedly connected to the bottom of the slide 502. Multiple cutters 602 corresponding to the raw material plate 800 are fixedly connected to the bottom of the mounting plate 601. The multiple cutters 602 corresponding to the raw material plate 800 can cut multiple areas of the raw material plate 800 simultaneously.

[0025] Specifically, a pusher box 603 is movably sleeved inside the cutter 602. A first movable rod 604 is fixedly connected to the center of the inner cavity of the pusher box 603, and the first movable rod 604 is movably sleeved inside the mounting plate 601. A first pusher spring 605 for pushing the pusher box 603 is movably sleeved outside the first movable rod 604. A rubber pad 606 is fixedly connected to the bottom of the pusher box 603. The elastic force of the first pusher spring 605 can push the pusher box 603 downward to push out the product stuck in the cutter 602, thereby avoiding product jamming and subsequent cutting failures, improving the stability of equipment operation. The rubber pad 606 can buffer the contact force between the pusher box 603 and the product during pushing, preventing the product surface from being scratched and damaged. At each of the four corners of the mounting plate 601, a second movable rod 607 is movably sleeved. The bottom of the four second movable rods 607 is fixedly connected to a pressure frame 608 for pressing down the scrap material. The outside of the four second movable rods 607 is movably sleeved with a second push spring 609 for pushing the pressure frame 608. The second push spring 609 pushes the pressure frame 608 to press down the scrap material of the raw material plate 800, preventing the raw material plate 800 from shifting due to vibration during cutting, and further improving the cutting accuracy. At the same time, the second push spring 609 pushing the pressure frame 608 can also push the scrap material, preventing the scrap material from getting stuck outside the cutter 602.

[0026] Furthermore, the base frame 100 is internally fixedly connected to a product discharge trough 101 for discharging products, and the base frame 100 is fixedly connected to a scrap material discharge trough 102 for discharging scrap materials on the side opposite to the electric push rod 401. The product discharge trough 101 can receive the products discharged from the discharge port 301b and guide the products to fall into the collection device in an orderly manner. The scrap material discharge trough 102 can receive the scrap materials pushed out by the push plate 404, so as to realize the classification and discharge of products and scrap materials, and reduce the subsequent sorting workload. The top of the upper frame 200 is fixedly connected to a controller 700 for controlling the operation of the electric push rod 401 and the electric cylinder 501.

[0027] The operation process of this embodiment is as follows: When it is necessary to cut the raw material plate 800, the electric cylinder 501 is first started by the controller 700. The output end of the electric cylinder 501 drives the slide 502 to move downward along the support leg of the upper frame 200. The slide 502 drives the cutting mold 600 to move downward synchronously. During the downward movement, the second pushing spring 609 outside the second movable rod 607 at the four corners of the mounting plate 601 first pushes the pressure frame 608 to contact and press the scrap material of the raw material plate 800, so as to avoid vibration and displacement of the raw material plate 800 during cutting. Then the cutter 602 continues to move downward to cut the raw material plate 800. The cutting is completed. Then, the controller 700 controls the electric push rod 401 to start. The output end of the electric push rod 401 drives the base plate 402 to move along the slot 301a towards the electric push rod 401 via the push rod 403. The base plate 402 is pulled out from under the product after it is cut from the raw material plate 800. After the product loses its support, the first push spring 605 pushes the push box 603 to move downward, which can push the product out from the discharge port 301b of the plate 301 and finally fall into the product discharge groove 101 inside the base frame 100. The product discharge groove 101 guides the product to the external collection device to complete the product cutting.

[0028] Example 2 Please see Figures 2 to 4 Based on the first specific embodiment, the bottom plate 402 has a mounting groove 402a on the side opposite to the electric push rod 401, and the push plate 404 is rotatably connected to the inside of the mounting groove 402a. Multiple push springs 402b for pushing the push plate 404 are fixedly connected inside the mounting groove 402a. The mounting groove 402a provides storage space for the push plate 404. When the bottom plate 402 retracts, the push plate 404 can be rotated and stored in the mounting groove 402a to avoid interference with the limiting plate 300 or the raw material plate 800. The push springs 402b can continuously provide push force for the push plate 404 to ensure that the push plate 404 can push the scrap material.

[0029] Specifically, the mounting groove 402a has multiple limiting posts 402c fixedly connected inside, and the ejector spring 402b is movably sleeved on the outside of the limiting posts 402c. The limiting posts 402c can limit the extension and retraction direction of the ejector spring 402b to prevent the ejector spring 402b from shifting or twisting during compression or extension.

[0030] The operation process of this embodiment is as follows: When it is necessary to discharge scrap, firstly, the ejector spring 402b inside the mounting groove 402a of the base plate 402 pushes the pusher plate 404 under the action of elastic force, so that the pusher plate 404 rotates out of the mounting groove 402a around the rotating connection. Then, the controller 700 controls the electric push rod 401 to start in the reverse direction. The output end of the electric push rod 401 drives the base plate 402 to move away from the electric push rod 401 along the slot 301a through the push rod 403. During the movement, after the pusher plate 404 rotates out, it contacts the scrap left by the cutting of the raw material plate 800. As the base plate 402 continues to move, the pusher plate 404 pushes the scrap towards the side of the base frame 100 away from the electric push rod 401, and finally pushes the scrap into the scrap discharge groove 102 on the side of the base frame 100, and guides it to the external collection device by the scrap discharge groove 102.

[0031] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A semiconductor discrete device lead cutting machine, comprising a base frame (100) and an upper frame (200) fixedly connected to the top of the base frame (100); characterized in that: The top of the base frame (100) is fixedly connected to a limiting plate (300) for placing the raw material plate (800) and a discharge assembly (400) for discharging products and scraps. The interior of the upper frame (200) is provided with a cutting mold (600) for cutting the raw material plate (800) and a pressing assembly (500) for pushing the cutting mold (600) to cut the raw material plate (800). The limiting plate (300) includes a plate body (301) fixedly connected to the top of the base frame (100). The plate body (301) has a slot (301a) inside. The bottom of the slot (301a) has a discharge port (301b) for discharging products. The top of the limiting plate (300) is fixedly connected to two symmetrically distributed L-shaped clips (302) for positioning the raw material plate (800). The material discharge assembly (400) includes an electric push rod (401) fixedly connected to the side of the base frame (100) and a base plate (402) movably inserted into the slot (301a). A push rod (403) is fixedly connected between the output end of the electric push rod (401) and the base plate (402). An L-shaped push plate (404) for pushing scrap materials is rotatably connected to the side of the base plate (402) away from the electric push rod (401). The pressing assembly (500) includes an electric cylinder (501) fixedly connected to the top of the upper frame (200) and a slide (502) movably sleeved on the outside of the support leg of the upper frame (200), and the slide (502) is fixedly connected to the output end of the electric cylinder (501); The cutting mold (600) includes a mounting plate (601) fixedly connected to the bottom of the slide (502), and a plurality of cutters (602) corresponding to the raw material plate (800) are fixedly connected to the bottom of the mounting plate (601).

2. The semiconductor discrete device lead cutting machine according to claim 1, characterized in that, The base plate (402) has an installation groove (402a) on the side away from the electric push rod (401), and the push plate (404) is rotatably connected to the inside of the installation groove (402a). A plurality of push springs (402b) for pushing the push plate (404) are fixedly connected inside the installation groove (402a).

3. A semiconductor discrete device lead cutting machine according to claim 2, characterized in that, The mounting groove (402a) is internally fixedly connected to multiple limiting posts (402c), and the ejector spring (402b) is movably sleeved on the outside of the limiting posts (402c).

4. A semiconductor discrete device lead cutting machine according to claim 1, characterized in that, The cutter (602) is movably sleeved with a pusher box (603). A first movable rod (604) is fixedly connected to the center of the inner cavity of the pusher box (603), and the first movable rod (604) is movably sleeved inside the mounting plate (601). A first pusher spring (605) for pushing the pusher box (603) is movably sleeved on the outside of the first movable rod (604). A rubber pad (606) is fixedly connected to the bottom of the pusher box (603).

5. A semiconductor discrete device lead cutting machine according to claim 1, characterized in that, The mounting plate (601) has a second movable rod (607) movably sleeved at each of its four corners. The bottom of the four second movable rods (607) is fixedly connected to a pressure frame (608) for pressing down the scrap material. The outside of the four second movable rods (607) is movably sleeved with a second push spring (609) for pushing the pressure frame (608).

6. A semiconductor discrete device lead cutting machine according to claim 1, characterized in that, The base frame (100) is fixedly connected to a product discharge chute (101) for discharging products, and the base frame (100) is fixedly connected to a scrap material discharge chute (102) for discharging scrap materials on the side away from the electric push rod (401).

7. A semiconductor discrete device lead cutting machine according to claim 1, characterized in that, The top of the upper frame (200) is fixedly connected to a controller (700) for controlling the operation of the electric push rod (401) and the electric cylinder (501).

Images