A carrier tape punch speed testing device

Abstract

The utility model discloses a kind of carrier tape through-hole blanking speed testing devices, comprising: pedestal;Carrier tape blanking unit is set on the pedestal, including lower die holder and the upper die holder that can be with the upper and lower butt joint of lower die holder, vertically guided structure is provided on the lower die holder;The upper die holder is slidably connected with the vertically guided structure, and the simulation of multistage blanking speed is realized by gravity free falling, and the carrier tape fixed on the lower die holder is punched out.Compared with prior art, the utility model has the beneficial effects that: by adjusting the position of upper die holder on vertically guided structure, combined with gravity free falling mechanism, the precise simulation of multistage blanking speed is realized, effectively covers the speed requirement under different process conditions;System verifies the influence of blanking speed on through-hole formability, can quickly determine the required blanking speed, shorten traditional trial and error cycle, significantly improve process parameter adjustment efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of testing devices and relates to a device for testing the punching speed of a through hole in a carrier tape. Background Technology

[0002] A carrier tape is a strip-shaped carrier used for packaging electronic components. It has equidistantly distributed carrying holes (non-through holes) along its length to support the components and traction holes (through holes) to guide the tape's movement. For small electronic components, a circular through-hole needs to be punched in the center of the carrying holes to prevent material jamming. Before punching the circular through-hole, it is necessary to simulate different punching speeds to test the through-hole and select a suitable punching speed to improve the accuracy of the through-hole forming. However, currently, the industry has not yet developed a device for simulating and testing the punching speed of through holes.

[0003] Therefore, there is an urgent need for a testing device that can simulate different punching speeds to verify the effect of different punching speeds on the formability of through holes. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, this utility model provides a carrier through-hole punching speed testing device that can simulate different punching speeds to verify the influence of different punching speeds on the through-hole formability.

[0005] To solve the above problems, the technical solution adopted by this utility model is as follows: A device for testing the punching speed of through holes in a carrier tape includes: Base; The carrier strip punching unit is mounted on the base and includes a lower die base and an upper die base that can be vertically aligned with the lower die base. The lower die base is provided with a vertical guide structure. The upper die base slides in conjunction with the vertical guide structure and simulates multi-stage punching speeds by falling freely under gravity, and punches the carrier strip fixed on the lower die base.

[0006] This application simulates multi-level punching speeds by adjusting the position of the upper die holder and allowing it to fall at different heights using gravity free fall. This is used to punch a fixed carrier strip below, thereby verifying the influence of different punching speeds on the through-hole formability, selecting a suitable through-hole forming punching speed, and improving the forming accuracy of through holes.

[0007] As a preferred embodiment of this application, the lower mold base includes: The pad is rigidly fixed to the base, and its top surface is provided with a horizontal punching plane to withstand the local pressure during punching. A blanking plate is detachably mounted on the pad, and its lower surface is provided with a carrier tape fixing groove. The carrier tape fixing groove and the blanking plane together form a forming space for restricting the forming of the carrier tape; and The punching holes are arranged along the thickness direction of the pad and the punching plate and penetrate the forming space, and are used to cooperate with the upper die base to punch the carrier strip.

[0008] As a preferred embodiment of this application, the carrier belt fixing groove is a horizontally extending through-type groove structure.

[0009] As a preferred embodiment of this application, the carrier strip punching unit further includes a guide positioning structure to ensure the coaxiality of the upper die holder and the lower die holder, so as to prevent the upper die holder from shifting horizontally during the punching process.

[0010] As a preferred embodiment of this application, the upper mold base includes: A blanking slider is slidably disposed outside the vertical guide structure for adjusting the blanking speed; A pressure block is disposed at the bottom of the punching slide block; and A punch is detachably disposed at the bottom of the punching slider and passes through the pressure block. Its lower end protrudes from the pressure block and corresponds to the position of the punching hole of the lower die base. When the upper die base and the lower die base are engaged, the lower end of the punch is inserted into the punching hole to complete the punching process of the carrier strip in the forming space.

[0011] Preferably, the pressure block has several punch holes, and the punches are inserted into these holes. The punch holes can be designed in a series of sizes to accommodate punches of different sizes, thus verifying the effect of different punching speeds on the formability of through holes of different sizes. During punching, punches can be installed in one of the punch holes, or punches can be installed in all the punch holes of the series of sizes, thereby verifying the effect of different punching speeds on punched through holes of different sizes.

[0012] Preferably, the punching hole includes a first through hole penetrating the pad and a second through hole penetrating the punching plate, which together form a punching channel penetrating the forming space in the vertical direction. During punching, a punch is inserted along the channel to achieve high-precision punching of the carrier tape.

[0013] As a preferred embodiment of this application, the lower die base can be provided with multiple punching holes corresponding to the positions of the punch holes. The dimensions of the punching holes can also be designed into a series of sizes according to the through hole dimensions to facilitate the adaptation of punches of different sizes. During punching, the lower end of the punch passes through the carrier tape and is inserted into the channel corresponding to the punching hole, realizing high-precision punching of the carrier tape. Multiple through holes can be processed simultaneously in one punching operation, greatly improving punching efficiency.

[0014] As a preferred embodiment of this application, the guiding and positioning structure includes: Guide posts, vertically mounted on the base; and A guide groove is provided on the upper mold base and extends through the thickness direction of the upper mold base; when the upper mold base and the lower mold base are engaged, the guide post is inserted into the corresponding guide groove.

[0015] As a preferred embodiment of this application, the top of the guide post is provided with a ball bearing guide sleeve.

[0016] As a preferred embodiment of this application, the vertical guide structure includes a support base disposed on the base and a guide rod disposed vertically on the support base and slidably engaged with the carrier strip punching unit. The guide rod is marked with scale lines to indicate the height of the upper die base falling.

[0017] As a preferred embodiment of this application, the guide rod is provided with guide grooves on its opposite sides, the punching slider is provided with a sliding groove that cooperates with the guide groove, and a ball bearing is provided between the sliding groove and the corresponding guide groove.

[0018] As a preferred embodiment of this application, the guide groove is a V-shaped groove.

[0019] As a preferred embodiment of this application, the upper mold base further includes a limiting component, comprising: A positioning hole is formed on the upper die base and extends through the punching slide and the pressure block; and The positioning bolt is inserted into the positioning hole.

[0020] During installation, first insert the positioning bolt into the positioning hole, then use bolts to fix the aligned punching slider and the pressure block, and then remove the positioning bolt.

[0021] As a preferred embodiment of this application, a height locking mechanism is provided between the guide rod and the upper mold base to fix and adjust the position of the upper mold base in the axial direction of the guide rod.

[0022] As a preferred embodiment of this application, the height locking mechanism includes a positioning element disposed on the punching slide block for locking the upper die holder and the guide rod. The positioning element may be, but is not limited to, fastening bolts, pins, etc.

[0023] Preferably, the height locking mechanism further includes N test positioning points spaced axially along the guide rod, where N is a positive integer. When the upper die base needs to be fixed, the end of the positioning member extends into the test positioning point; when testing is required, the positioning member is released, allowing the upper die base to fall freely, thus providing different punching speeds. More preferably, the test positioning points are equidistantly spaced.

[0024] For ease of explanation, the test positioning points are named sequentially from high to low as the first test point, the second test point, ..., the Nth test point. In use, the carrier tape is passed through the carrier tape fixing groove, confining it within the forming space. The height of the upper die is adjusted to the first test point, and then the tape is lowered to punch it. The carrier tape is moved, and the upper die is controlled to fall from the second test point to punch it. The above actions are repeated to test the formability of each through-hole in the carrier tape after punching, and a suitable through-hole punching speed is selected.

[0025] Compared with the prior art, the beneficial effects of this utility model are: by adjusting the position of the upper die holder on the vertical guide structure and combining it with the gravity free fall mechanism, the accurate simulation of multi-level punching speed is achieved, effectively covering the speed requirements under different process conditions; the system verifies the influence of punching speed on the through hole forming performance, can quickly determine the required punching speed, shorten the traditional trial and error cycle, and significantly improve the efficiency of process parameter adjustment. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of this utility model.

[0027] Figure 2 for Figure 1 The enlarged view of a portion shows the structure of the lower mold base.

[0028] Figure 3 This is a partial cross-sectional view of the present invention, showing a schematic diagram of the interior of the upper mold base.

[0029] Figure 4 This is a side view of the present invention.

[0030] Figure 5 for Figure 4 A partial schematic diagram shows the structure of the carrier tape fixing groove.

[0031] Figure 6 for Figure 1 The second partial schematic diagram shows the structure of the guide groove on the side of the guide rod.

[0032] Figure 7 This is a schematic diagram of the upper mold base.

[0033] 1-Base; 2-Carrier tape punching unit; 21-Lower die base; 211-Backing plate; 212-Punching plate; 2121-Carrier tape fixing groove; 243-Ball guide sleeve; 214-Punching hole; 22-Upper die base; 221-Punching slider; 2211-Groove; 222-Pressure block; 2221-Punch hole; 223-Punch; 224-Limiting component; 2241-Positioning hole; 2242-Positioning bolt; 23-Vertical guide structure; 231-Support base; 232-Guide rod; 2321-Scale line; 2322-Guide groove; 24-Guide positioning structure; 241-Guide post; 242-Guide groove; 3-Carrier tape. Detailed Implementation

[0034] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application.

[0035] It should be noted that the process equipment or apparatus not specifically mentioned in the following embodiments are all conventional equipment or apparatus in the art.

[0036] Furthermore, it should be understood that the existence of other method steps before or after the combined steps, or the insertion of other method steps between these explicitly mentioned steps, does not preclude the existence of other method steps before or after the combined steps, or the insertion of other method steps between these explicitly mentioned steps, unless otherwise stated. It should also be understood that the combined connection relationship between one or more devices / apparatus mentioned in this application does not preclude the existence of other devices / apparatus before or after the combined devices / apparatus, or the insertion of other devices / apparatus between these explicitly mentioned devices / apparatus, unless otherwise stated. Moreover, unless otherwise stated, the numbering of each method step is merely a convenient tool for identifying each method step, and not for limiting the order of the method steps or limiting the scope of implementation of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of implementation of this application.

[0037] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0038] In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "inner," "outer," "axial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] The present application will be further described below with reference to specific embodiments, but the scope of protection of the present application is not limited thereto.

[0042] like Figures 1-4 As shown, the present invention provides a carrier tape through-hole punching speed testing device, comprising: Base 1; The carrier tape punching unit 2 is disposed on the base 1 and includes a lower die base 21 and an upper die base 22 that can be vertically engaged with the lower die base 21. The lower die base 21 is provided with a vertical guide structure 23. The upper die base 22 is slidably engaged with the vertical guide structure 23. The upper die base 22 is free to fall under gravity to simulate multi-level punching speed and punches the carrier tape 3 fixed on the lower die base 21.

[0043] like Figure 2 As shown, the lower mold base 21 includes: The pad 211 is rigidly fixed to the base 1, and its top surface is provided with a horizontal punching plane; A blanking plate 212 is detachably mounted on the pad 211, and its lower surface is provided with a carrier belt fixing groove 2121. The carrier belt fixing groove 2121 and the blanking plane together form a forming space for restricting the carrier belt 3; and The punching hole 214 is arranged along the thickness direction of the pad 211 and the punching plate 212 and penetrates the forming space, and is used to cooperate with the upper die holder 22 to punch the carrier strip 3.

[0044] like Figure 2 As shown, the carrier strip punching unit 2 also includes a plurality of guide positioning structures 24, which are used to ensure the coaxiality of the upper die holder 22 and the lower die holder 21, so as to prevent the upper die holder 22 from shifting horizontally during the punching process.

[0045] like Figure 1 and Figure 3 As shown, the upper mold base 22 includes: The blanking slider 221 is slidably disposed outside the vertical guide structure 23 for adjusting the blanking speed; A pressure block 222 is disposed at the bottom of the punching slider 221; and Punch 223 is detachably disposed at the bottom of the punching slider 221 and passes through the pressure block 222. Its lower end protrudes from the pressure block 222 and corresponds to the punching hole 214 of the lower die base 21. When the upper die base 22 and the lower die base 21 are engaged, the lower end of the punch 223 is inserted into the corresponding punching hole 214 to complete the punching process of the carrier belt 3 fixed in the forming space.

[0046] like Figure 7 As shown, the bottom surface of the punching slider 221 is provided with a groove 2211 with an opening facing the pressure block.

[0047] like Figure 7 As shown, the pressure block 222 has several punch holes 2221, and the punch 223 is inserted into the punch holes 2221. The punch holes 2221 can be designed in a series of sizes according to the size of the punched through hole, so as to facilitate the adaptation of punches of different sizes, in order to verify the influence of different punching speeds on the formability of through holes of different sizes.

[0048] like Figure 7 As shown, the punch 223 includes an integrally formed head and a plug-in rod portion. The head is received in the groove 2211, and the plug-in rod portion is inserted into the punch hole 2221.

[0049] like Figure 1 As shown, the guide positioning structure 24 includes: Guide post 241, vertically mounted on the base 1; and The guide groove 242 is disposed on the upper mold base 22 and extends through the thickness direction of the upper mold base 22; when the upper mold base 22 and the lower mold base 21 are engaged, the guide post 241 is inserted into the corresponding guide groove 242.

[0050] like Figures 1-4 As shown, the top of the guide post 241 is provided with a ball bearing guide sleeve 243.

[0051] like Figures 1-4 As shown, the vertical guide structure 23 includes a support base 231 disposed on the base and a guide rod 232 disposed vertically on the support base and slidably engaged with the carrier strip punching unit. The guide rod 232 is marked with scale lines 2321 for marking the height of the upper die base falling.

[0052] like Figure 6 As shown, the cross-section of the guide rod 232 is rectangular.

[0053] In some embodiments of this application, a height locking mechanism is provided between the guide rod 232 and the upper mold base 22 to fix and adjust the position of the upper mold base 22 in the axial direction of the guide rod 232.

[0054] like Figure 6 As shown, the guide rod 232 has guide grooves 2322 on its two opposite sides, and the punching slider 221 has a sliding groove that cooperates with the guide grooves 2322. A ball bearing is provided between the sliding groove and the corresponding guide groove 2322.

[0055] like Figure 3 As shown, the upper mold base 22 further includes a limiting component 224, comprising: A positioning hole 2241 is formed on the upper die base 22 and extends through the punching slider 221 and the pressure block 222; and The positioning bolt 2242 is inserted into the positioning hole 2241.

[0056] During installation, first insert the positioning bolt 2242 into the positioning hole 2241, then use bolts to fix the aligned punching slider 221 and the pressure block 222, and then remove the positioning bolt 2242.

[0057] In some embodiments of this application, the height locking mechanism includes a positioning element disposed on the punching slide block for locking the upper die holder and the guide rod. The positioning element may be, but is not limited to, fastening bolts, pins, etc.

[0058] In some embodiments of this application, the height locking mechanism further includes N test positioning points spaced axially along the guide rod on the guide rod, where N is a positive integer. When the upper die base needs to be fixed, the end of the positioning member extends into the test positioning point; when testing is required, the positioning member is released, and the upper die base can fall freely, thereby providing different punching speeds. More preferably, the test positioning points are equidistantly arranged.

[0059] In use, the carrier tape 3 is passed through the carrier tape fixing groove 2122 and confined in the forming space. The height of the upper die holder 22 is adjusted to the first test point, and then the tape is dropped to punch the carrier tape. The carrier tape is moved and the upper die holder 22 is controlled to drop from the second test point to punch the carrier tape 3. The above actions are repeated to test the formability of each through hole of the carrier tape after punching and to select a suitable through hole punching speed.

[0060] The above embodiments are for illustrating the implementation schemes disclosed in this utility model and should not be construed as limiting the utility model. Furthermore, various modifications listed herein, as well as variations in the methods and compositions of the utility model, will be apparent to those skilled in the art without departing from the scope and spirit of this utility model. Although this utility model has been specifically described in conjunction with various specific preferred embodiments, it should be understood that this utility model should not be limited to these specific embodiments. In fact, various modifications as described above that are obvious to those skilled in the art to obtain the utility model should be included within the scope of this utility model.

Claims

1. A device for testing the punching speed of through-holes in a carrier tape, characterized in that, include: Base (1); The carrier tape punching unit (2) is set on the base (1) and includes a lower die base (21) and an upper die base (22) that can be engaged with the lower die base (21) vertically. The lower die base (21) is provided with a vertical guide structure (23). The upper die base (22) and the vertical guide structure (23) slide together to simulate multi-level punching speed by falling freely under gravity, and punch the carrier tape (3) fixed on the lower die base (21).

2. The carrier tape through-hole punching speed testing device according to claim 1, characterized in that, The lower mold base (21) includes: The pad (211) is rigidly fixed on the base (1), and its top surface is provided with a horizontal punching plane; A punching plate (212) is detachably mounted on the pad (211), and its lower surface is provided with a carrier belt fixing groove (2121). The carrier belt fixing groove (2121) and the punching plane together form a forming space for restricting the carrier belt (3); and The punching hole (214) is arranged along the thickness direction of the pad (211) and the punching plate (212) and penetrates the forming space, and is used to cooperate with the upper die base (22) to punch the carrier strip (3).

3. The carrier tape through-hole punching speed testing device according to claim 1, characterized in that, The carrier strip punching unit (2) also includes a guide positioning structure (24) to ensure the coaxiality of the upper die holder (22) and the lower die holder (21) to prevent the upper die holder (22) from shifting horizontally during the punching process.

4. The carrier tape through-hole punching speed testing device according to claim 3, characterized in that, The guiding and positioning structure (24) includes: Guide post (241), vertically mounted on the base (1); and The guide groove (242) is disposed on the upper mold base (22) and extends through the thickness direction of the upper mold base (22); when the upper mold base (22) and the lower mold base (21) are engaged, the guide post (241) is inserted into the corresponding guide groove (242).

5. The carrier tape through-hole punching speed testing device according to claim 2, characterized in that, The upper mold base (22) includes: The blanking slider (221) is slidably disposed outside the vertical guide structure (23) for adjusting the blanking speed; A pressure block (222) is disposed at the bottom of the punching slider (221); and A punch (223) is detachably disposed at the bottom of the punching slider (221) and passes through the pressure block (222). Its lower end protrudes from the pressure block (222) and corresponds to the punching hole (214) of the lower die holder (21). When the upper die holder (22) and the lower die holder (21) are engaged, the lower end of the punch (223) is inserted into the corresponding punching hole (214) to complete the punching process of the carrier strip (3) fixed in the forming space.

6. The carrier tape through-hole punching speed testing device according to claim 4, characterized in that, The top of the guide post (241) is provided with a ball bearing guide sleeve (243).

7. The carrier tape through-hole punching speed testing device according to claim 5, characterized in that, The vertical guide structure (23) includes a support base (231) disposed on the base (1) and a guide rod (232) disposed vertically on the support base (231) and slidingly engaged with the carrier strip punching unit (2). The guide rod (232) is marked with scale lines (2321) to mark the height of the upper die base (22) falling.

8. The carrier tape through-hole punching speed testing device according to claim 7, characterized in that, The guide rod (232) has guide grooves (2322) on its opposite sides, and the punching slider (221) has a sliding groove that cooperates with the guide groove (2322). A ball is provided between the sliding groove and the corresponding guide groove (2322).

9. The carrier tape through-hole punching speed testing device according to claim 8, characterized in that, The guide groove (2322) is a V-shaped groove.

10. The carrier tape through-hole punching speed testing device according to claim 7, characterized in that, A height locking mechanism is provided between the guide rod (232) and the upper mold base (22) to fix and adjust the position of the upper mold base (22) in the axial direction of the guide rod (232).

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