A DIP clock chip manufacturing device

Abstract

The utility model discloses a kind of DIP clock chip manufacturing equipment, it is related to manufacturing equipment technical field, including: manufacturing box, processing platform, large-hole grid net, the inner wall of the processing platform is equipped with collecting groove, the inner wall of the collecting groove is installed with large-hole grid net, the bottom of the processing platform is installed with collecting box, the inner wall of the collecting box is embedded with small-hole air-permeable net, the inner wall of processing groove is installed with mounting frame, the inner wall of the mounting frame is installed with dust fan, the bottom of the manufacturing box is equipped with first air passage, the top of the manufacturing box is equipped with second air passage. The utility model is equipped with waste collecting mechanism, first wafer is cut, waste will enter into collecting box through the gap of large-hole grid net, and wafer is located on large-hole grid net, when powder drift appears, dust fan works through the cooperation of small-hole air-permeable net and first air passage and second air passage, powder is adsorbed into collecting box, avoid the case that powder is adsorbed in processing groove.

Description

Technical Field

[0001] This utility model relates to the field of manufacturing equipment technology, specifically to a DIP clock chip manufacturing equipment. Background Technology

[0002] DIP clock chip manufacturing equipment is a high-precision specialized device used to dicing manufactured clock chip wafers into individual chips. It is mainly used for DIP clock chip wafers that have completed front-end manufacturing processes (such as wafer growth, photolithography, etching, doping, etc.). The wafer is usually made of semiconductor materials (such as quartz crystal wafer substrates made through specific processes) and integrates a large number of repeating clock chip units. These units realize the function of generating and stabilizing clock signals through fine circuits and structures. It can accurately cut and separate each clock chip unit on the wafer according to the predetermined design pattern and size, ensuring that each diced chip meets the size and shape requirements of DIP packaging.

[0003] Patent document CN223369729U discloses a semiconductor silicon wafer cutting device, which "belongs to the field of silicon wafer technology. This semiconductor silicon wafer cutting device includes a processing chamber as a mounting carrier. A cutting mechanism for cutting silicon wafers is located at the top of the processing chamber, a reciprocating moving mechanism is located at the bottom of the processing chamber, and a turntable mechanism for placing silicon wafers is located at the top of the reciprocating moving mechanism. A rinsing mechanism for rinsing the silicon wafers on the turntable mechanism is located on one side of the processing chamber. A chamber door is hinged to the end of the processing chamber away from the rinsing mechanism, and an observation window is located on the outside of the chamber door. A drain pipe is located at the bottom of the processing chamber. This invention cuts silicon wafers by setting two sets of cutting components, while ensuring that the distance between the two sets of cutting components remains the same, thereby further improving the cutting efficiency of the cutting equipment while maintaining cutting accuracy."

[0004] However, the aforementioned semiconductor processing silicon wafer cutting equipment mainly focuses on improving the cutting efficiency of the equipment while ensuring cutting accuracy, which makes it inconvenient to collect the waste generated during processing.

[0005] In view of this, it is necessary to develop a waste collection mechanism to facilitate the collection of waste generated during processing. Utility Model Content

[0006] The purpose of this invention is to provide a DIP clock chip manufacturing equipment to solve the technical problem mentioned in the background art of enabling the DIP clock chip manufacturing equipment to have a waste collection function.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a DIP clock chip manufacturing equipment, comprising: a manufacturing box and a processing table, wherein the outer wall of the processing table is provided with a waste collection mechanism, which is used to facilitate the collection of waste generated during processing; The collection mechanism includes a large-hole grid mesh. The inner wall of the processing table is provided with a collection groove, and the inner wall of the collection groove is equipped with a large-hole grid mesh. A collection box is installed at the bottom of the processing table, and the inner wall of the collection box is inlaid with a small-hole ventilation mesh. An installation frame is installed on the inner wall of the processing groove, and a dust suction fan is installed on the inner wall of the installation frame. The bottom of the manufacturing box is provided with a first ventilation groove, and one end of the first ventilation groove extends into the interior of the installation frame. The top of the manufacturing box is provided with a second ventilation groove. The inner walls of both the first and second ventilation grooves are equipped with dustproof mesh.

[0008] Preferably, a control panel is installed on the outer wall of the manufacturing box, a processing groove is provided on the outer wall of the manufacturing box, an observation mirror is embedded in the outer wall of the manufacturing box, an electric slide rail is installed on the inner wall of the processing groove, a processing table is installed at the output end of the electric slide rail, a first electric telescopic rod is installed on the top of the processing table, a clamping plate is installed at the output end of the first electric telescopic rod, and a high-precision cutting tool is installed on the inner wall of the processing groove.

[0009] Preferably, the bottom of the processing table is provided with a processing mechanism for discharging the collected waste.

[0010] Preferably, the processing mechanism includes a receiving box, and the inner wall of the receiving box is provided with a discharge trough.

[0011] Preferably, a receiving bracket is installed at the bottom of the processing table, an elastic compression block is installed on the outer wall of the receiving bracket, and a receiving box is installed on the outer wall of the receiving bracket.

[0012] Preferably, a processing frame is installed at the bottom of the processing table, a second electric telescopic rod is installed on the outer wall of the processing frame, a connecting rod is installed at the output end of the second electric telescopic rod, and a cleaning plate is installed on the outer wall of the connecting rod.

[0013] Preferably, the inner wall of the collection box is provided with a matching groove, and a sealing ring is installed on the inner wall of the matching groove.

[0014] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model has a waste collection mechanism to facilitate the collection of waste generated during processing. When cutting wafers, waste or powder is generated and may end up in the processing tank. Therefore, this needs to be improved. First, when the wafer is cut, the waste will enter the collection box through the gaps of the large-hole grid and the wafer is located on the large-hole grid. When powder is scattered, the dust suction fan works by using the small-hole ventilation mesh and the first and second ventilation grooves to adsorb the powder into the collection box, thus avoiding the powder from being adsorbed in the processing tank. 2. This utility model uses a processing mechanism to discharge collected waste. Existing waste and powder are located in the collection box, which can clog the perforated mesh, hindering the normal airflow and adsorption of the vacuum fan. Therefore, this needs to be improved. First, the receiving box is placed on the receiving bracket, and the elastic compression block clamps and fixes the receiving box. Then, the second electric telescopic rod operates, driving the connecting rod to move, and the cleaning plate adheres to the top of the perforated mesh. This pushes and cleans the waste and powder on the perforated mesh and transports it to the receiving box through the discharge chute, thus avoiding the situation where the perforated mesh becomes clogged, preventing the vacuum fan from working properly. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the manufacturing box of this utility model; Figure 2 This is a schematic diagram of the front structure of the manufacturing box of this utility model; Figure 3 This is a schematic diagram of the front structure of the processing table of this utility model; Figure 4 This is a schematic diagram of the side structure of the cleaning plate of this utility model.

[0016] In the diagram: 1. Manufacturing box; 2. Control panel; 3. Machining slot; 4. Observation mirror; 5. Electric slide rail; 6. Machining table; 7. First electric telescopic rod; 8. Clamping plate; 9. High-precision cutting tool; 10. Collection slot; 11. Large-hole grid mesh; 12. Collection box; 13. Small-hole ventilation mesh; 14. Mounting frame; 15. Dust extraction fan; 16. First ventilation slot; 17. Second ventilation slot; 18. Dustproof net; 19. Discharge slot; 20. Receiving bracket; 21. Elastic extrusion block; 22. Receiving box; 23. Processing rack; 24. Second electric telescopic rod; 25. Connecting rod; 26. Cleaning plate; 27. Fitting slot; 28. Sealing ring. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0020] Please see Figure 1 and Figure 2 A DIP clock chip manufacturing device includes: a manufacturing box 1 and a processing table 6. A control panel 2 is installed on the outer wall of the manufacturing box 1. A processing groove 3 is provided on the outer wall of the manufacturing box 1. An observation mirror 4 is embedded in the outer wall of the manufacturing box 1. An electric slide rail 5 is installed on the inner wall of the processing groove 3. The processing table 6 is installed at the output end of the electric slide rail 5. A first electric telescopic rod 7 is installed on the top of the processing table 6. A clamping plate 8 is installed at the output end of the first electric telescopic rod 7. A high-precision cutting tool 9 is installed on the inner wall of the processing groove 3. The chip to be processed is placed on the processing table 6. Then, the first electric telescopic rod 7 moves the clamping plate 8 to fix the chip. Then, the electric slide rail 5 moves the processing table 6 into the processing groove 3 and below the high-precision cutting tool 9. Then, the control panel 2 controls the high-precision cutting tool 9 to process and manufacture the chip.

[0021] Please see Figure 2 and Figure 3The outer wall of the processing table 6 is equipped with a waste collection mechanism for convenient collection of waste generated during processing. The collection mechanism includes a large-hole grid mesh 11. The inner wall of the processing table 6 is equipped with a collection trough 10, and the inner wall of the collection trough 10 is fitted with the large-hole grid mesh 11. A collection box 12 is installed at the bottom of the processing table 6, and the inner wall of the collection box 12 is inlaid with a small-hole ventilation mesh 13. An installation frame 14 is installed on the inner wall of the processing trough 3, and a dust extraction fan 15 is installed on the inner wall of the installation frame 14. The bottom of the manufacturing box 1 is equipped with a first ventilation groove 16, and one end of the first ventilation groove 16 extends into the interior of the installation frame 14. The top of the manufacturing box 1... A second ventilation groove 17 is provided, and dustproof nets 18 are installed on the inner walls of both the first ventilation groove 16 and the second ventilation groove 17. When the wafer is cut, waste or powder will be generated, which will be located in the processing tank 3. Therefore, this needs to be improved. First, when the wafer is cut, the waste will enter the collection box 12 through the gaps of the large-hole grid 11, and the wafer is located on the large-hole grid 11. When powder is scattered, the dust suction fan 15 works to absorb the powder into the collection box 12 through the cooperation of the small-hole ventilation net 13 and the first ventilation groove 16 and the second ventilation groove 17, so as to avoid the powder being absorbed in the processing tank 3.

[0022] Please see Figure 3 and Figure 4 The bottom of the processing table 6 is equipped with a processing mechanism for discharging collected waste. The processing mechanism includes a receiving box 22, the inner wall of which has a discharge trough 19. A receiving bracket 20 is installed at the bottom of the processing table 6, and an elastic compression block 21 is installed on the outer wall of the receiving bracket 20. The receiving box 22 is also installed on the outer wall of the receiving bracket 20. A processing frame 23 is installed at the bottom of the processing table 6, and a second electric telescopic rod 24 is installed on the outer wall of the processing frame 23. A connecting rod 25 is installed at the output end of the second electric telescopic rod 24, and a cleaning plate 26 is installed on the outer wall of the connecting rod 25. A matching groove 27 is provided on the inner wall of the collecting box 12, and a matching groove 27 is installed on the inner wall of the matching groove 27. The existing waste and powder in the collection box 12 can clog the small-hole ventilation mesh 13, making it difficult for the vacuum fan 15 to properly circulate and adsorb air. Therefore, this needs to be improved. First, the receiving box 22 is placed on the receiving bracket 20, and the elastic compression block 21 clamps and fixes the receiving box 22. Then, the second electric telescopic rod 24 drives the connecting rod 25 to move, and the cleaning plate 26 is attached to the top of the small-hole ventilation mesh 13. This pushes and cleans the waste and powder on the small-hole ventilation mesh 13 and transports it to the receiving box 22 through the discharge chute 19, thus avoiding the situation where the small-hole ventilation mesh 13 is clogged and the vacuum fan 15 cannot work properly.

[0023] The working principle is as follows: the wafer to be processed is placed on the processing table 6. Then, the first electric telescopic rod 7 moves the clamping plate 8 to fix the wafer. Subsequently, the electric slide rail 5 moves the processing table 6 into the processing groove 3, which is located below the high-precision cutting tool 9. Then, the control panel 2 controls the high-precision cutting tool 9 to process the wafer. During wafer cutting, waste or powder is generated, which ends up in the processing groove 3. Therefore, this needs to be improved. First, when the wafer is cut, the waste will enter the collection box 12 through the gaps of the large-hole grid 11. Since the wafer is located on the large-hole grid 11, when powder is scattered, the dust suction fan 15 operates through the small-hole ventilation mesh 13 and the first ventilation groove 16 and the second ventilation groove. The use of the trough 17 in conjunction with the collection box 12 will adsorb the powder into the collection box 12, avoiding the situation where the powder is adsorbed into the processing trough 3. The existing waste and powder in the collection box 12 will cause the small hole ventilation mesh 13 to be blocked, making it difficult for the vacuum fan 15 to have normal air flow and adsorption. Therefore, this needs to be improved. First, the receiving box 22 is placed on the receiving bracket 20, and the elastic compression block 21 clamps and fixes the receiving box 22. Then, the second electric telescopic rod 24 works to drive the connecting rod 25 to move, and the cleaning plate 26 is attached to the top of the small hole ventilation mesh 13. This pushes and cleans the waste and powder on the small hole ventilation mesh 13 and transports it to the receiving box 22 through the discharge trough 19, thus avoiding the situation where the small hole ventilation mesh 13 is blocked and the vacuum fan 15 cannot work properly.

[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A DIP clock chip manufacturing apparatus, characterized in that, Includes: manufacturing box (1), processing table (6), the outer wall of the processing table (6) is provided with a waste collection mechanism, the waste collection mechanism is used to facilitate the collection of waste generated during processing; The collection mechanism includes a large-hole grid mesh (11), the inner wall of the processing table (6) is provided with a collection groove (10), the inner wall of the collection groove (10) is installed with a large-hole grid mesh (11), the bottom of the processing table (6) is provided with a collection box (12), the inner wall of the collection box (12) is inlaid with a small-hole breathable mesh (13), the inner wall of the processing groove (3) is provided with an installation frame (14), the inner wall of the installation frame (14) is provided with a dust suction fan (15), the bottom of the manufacturing box (1) is provided with a first venting groove (16), and one end of the first venting groove (16) extends into the interior of the installation frame (14), the top of the manufacturing box (1) is provided with a second venting groove (17), and the inner walls of the first venting groove (16) and the second venting groove (17) are both provided with dustproof mesh (18).

2. The DIP clock chip manufacturing equipment according to claim 1, characterized in that: The outer wall of the manufacturing box (1) is equipped with a control panel (2), the outer wall of the manufacturing box (1) is provided with a processing groove (3), the outer wall of the manufacturing box (1) is inlaid with an observation mirror (4), the inner wall of the processing groove (3) is equipped with an electric slide rail (5), the output end of the electric slide rail (5) is equipped with a processing table (6), the top of the processing table (6) is equipped with a first electric telescopic rod (7), the output end of the first electric telescopic rod (7) is equipped with a clamping plate (8), and the inner wall of the processing groove (3) is equipped with a high-precision cutting tool (9).

3. The DIP clock chip manufacturing equipment according to claim 1, characterized in that: The bottom of the processing table (6) is provided with a processing mechanism, which is used to discharge the collected waste.

4. The DIP clock chip manufacturing equipment according to claim 3, characterized in that: The processing mechanism includes a receiving box (22), and the inner wall of the collecting box (12) is provided with a discharge trough (19).

5. The DIP clock chip manufacturing equipment according to claim 1, characterized in that: The bottom of the processing table (6) is equipped with a receiving bracket (20), the outer wall of the receiving bracket (20) is equipped with an elastic compression block (21), and the outer wall of the receiving bracket (20) is equipped with a receiving box (22).

6. The DIP clock chip manufacturing equipment according to claim 1, characterized in that: The bottom of the processing table (6) is equipped with a processing rack (23), and the outer wall of the processing rack (23) is equipped with a second electric telescopic rod (24). The output end of the second electric telescopic rod (24) is equipped with a connecting rod (25), and the outer wall of the connecting rod (25) is equipped with a cleaning plate (26).

7. The DIP clock chip manufacturing equipment according to claim 1, characterized in that: The inner wall of the collection box (12) is provided with a matching groove (27), and a sealing ring (28) is installed on the inner wall of the matching groove (27).

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