Automatic tape sticking and tearing device for stick bar

Abstract

The utility model discloses a kind of automatic sticking and tearing adhesive tape devices of stick, belong to the technical field of semiconductor silicon rod processing equipment, including sticking adhesive tape station and tearing adhesive tape station, sticking adhesive tape mechanism is installed on the sticking adhesive tape station, tearing adhesive tape mechanism is installed on the tearing adhesive tape station, the sticking adhesive tape mechanism includes tape reel, air shear, auxiliary wheel, and drive the front and rear movement module one and left and right horizontal movement module one of sticking adhesive tape component, the tape reel is used to wind adhesive tape, the air shear can move up and down and tear off the adhesive tape after sticking, the auxiliary wheel is used to guide adhesive tape and tightly stick its lateral wall in crystal holder, rotary jaw is connected with rotary motor, the bottom of the crystal holder is equipped with the silicon rod tooling for supporting crystal holder, and silicon rod tooling circulates between stations, the technical effect of the utility model is automatically completed sticking and tearing adhesive tape operation, double set mechanism synchronous promotes efficiency, high-precision control avoids glue overflow influence, and adapt to the technical effect of scale production.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor silicon rod processing equipment, and in particular relates to an automatic adhesive tape application and removal device for sticking rods. Background Technology

[0002] In the bonding process of semiconductor silicon ingots, the silicon ingot needs to be bonded to the wafer tray. During bonding, adhesive easily overflows. If the overflowing adhesive adheres directly to the wafer tray, it will seriously affect the accuracy and quality of subsequent processes such as dicing. Traditional processes use manual application and removal of adhesive tape, which has drawbacks such as low efficiency, poor application and removal accuracy, and high labor intensity. In addition, manual operation is prone to problems such as loose tape application or incomplete removal, which cannot meet the needs of large-scale production. Utility Model Content

[0003] To address the problems existing in the prior art, this utility model provides an automatic tape application and removal device for sticking rods. It has the advantages of automating the tape application and removal operation, synchronously improving efficiency with dual-group mechanisms, high-precision control to avoid the impact of adhesive overflow, and adaptability to large-scale production. It solves the problems of low efficiency, poor application and removal accuracy, high labor intensity, and the tendency for the tape to be loosely adhered or not completely removed in the traditional manual tape application and removal technology, which cannot meet the needs of large-scale semiconductor silicon rod processing.

[0004] This invention is implemented as follows: an automatic adhesive tape application and removal device for bonding rods includes a crystal tray, an adhesive tape application station, and an adhesive tape removal station. The adhesive tape application station is equipped with an adhesive tape application mechanism, and the adhesive tape removal station is equipped with an adhesive tape removal mechanism. The adhesive tape application mechanism includes a tape reel, an air shear, an auxiliary wheel, and a forward / backward moving module and a left / right lateral moving module for moving the adhesive tape application component. The tape reel is used to wrap the adhesive tape. The air shear can move up and down and cut the bonded adhesive tape. The auxiliary wheel guides the adhesive tape and tightly adheres it to the side wall of the crystal tray. The adhesive tape removal mechanism includes a rotating gripper, a feeding cylinder, and a second forward / backward moving module and a second left / right lateral moving module for moving the adhesive tape removal component. The rotating gripper is connected to a rotary motor. A silicon rod fixture for supporting the crystal tray is installed at the bottom of the crystal tray, and the silicon rod fixture rotates between stations.

[0005] As a preferred embodiment of this invention, the tape-applying mechanism is configured into two groups, left and right, for simultaneously applying tape to both sides of the crystal tray.

[0006] This setting allows for simultaneous application of tape to both sides of the crystal tray, improving the efficiency of the tape application process and ensuring consistent tape placement on both sides. This avoids deviations caused by unilateral application and provides uniform protection against adhesive overflow.

[0007] As a preferred embodiment of this invention, the tape-tearing mechanism is configured as two sets, left and right, for simultaneously tearing tape from both sides of the crystal tray.

[0008] This setting allows for the simultaneous removal of adhesive tape from both sides of the crystal tray, reducing the time required for the tape removal process. It also ensures that the force and speed at which the tape is removed from both sides are consistent, preventing uneven force on one side from causing the crystal tray to shift or leaving tape residue. This guarantees the cleanliness and positional accuracy of the crystal tray after removal.

[0009] In a preferred embodiment of this invention, the first forward and backward moving module and the first left and right lateral moving module are driven by a servo motor, and the second forward and backward moving module and the second left and right lateral moving module are driven by a servo motor.

[0010] This setting allows for precise control of the movement path and speed of the forward / backward movement module one and the left / right lateral movement module one, as well as the precise control of the movements of the forward / backward movement module two and the left / right movement module two, thereby improving operational accuracy.

[0011] As a preferred embodiment of this invention, a lifting cylinder is provided above the air shear, and the output end of the lifting cylinder is fixedly connected to the air shear.

[0012] With this setup, the lifting cylinder can drive the air shears to achieve stable up-and-down movement, ensuring that after the bonding process is completed, the air shears can accurately move down to the tape cutting position, and then quickly move back up after cutting. The action response is rapid and accurate, avoiding cutting deviations or low efficiency caused by manual operation of the air shears.

[0013] As a preferred embodiment of this invention, the output end of the feeding cylinder is fixedly equipped with feeding claws, and the feeding claws can peel off the tape on the rotating claws.

[0014] With this setup, the material feeding cylinder drives the material feeding gripper to automatically peel off the waste tape wrapped around the rotating gripper and let it fall into the collection box below, realizing the automated collection of waste tape. There is no need for manual cleaning of the rotating gripper, reducing manual intervention and further improving the automation integration of the device.

[0015] In a preferred embodiment of this invention, the rotating gripper, driven by the left-right lateral movement module two and the front-back movement module two, moves and rotates simultaneously to wrap the tape, thereby achieving the removal of the tape from the crystal tray.

[0016] With this setup, the rotating gripper, driven by the left-right lateral movement module two and the front-back movement module two, in conjunction with the rotation of the rotary motor, can completely wrap the tape from the side wall of the crystal tray to itself, preventing the tape from breaking or leaving residue during the tearing process, ensuring that there are no adhesive marks on the side wall of the crystal tray, and not affecting the subsequent silicon rod processing accuracy.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: It achieves full automation of applying and removing adhesive tape, replacing traditional manual operation and completely solving the problems of low efficiency and high labor intensity of manual operation. At the same time, it avoids quality problems such as loose application and incomplete removal caused by manual operation. The device employs a dual-group left and right tape application and tearing mechanism for simultaneous operation, coupled with a servo motor-driven moving module, which significantly improves work efficiency and positional accuracy, and can meet the production capacity requirements of large-scale semiconductor silicon rod processing. The auxiliary wheel ensures that the tape adheres tightly to the side wall of the crystal tray, effectively catching any excess glue that spills out during the sticking process and preventing it from sticking to the crystal tray and affecting subsequent cutting accuracy. At the same time, the rotating jaws move and the rotating tearing method ensures that the crystal tray is clean and free of residue. It integrates automatic air shear cutting and waste tape collection functions, forming a complete automated process from applying adhesive to cutting adhesive, tearing adhesive, and collecting waste tape, reducing manual connections between processes and further improving the continuous operation capability of the production line. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure provided in an embodiment of the present utility model; Figure 2 This is a schematic diagram of the tape-applying mechanism provided in this embodiment of the utility model; Figure 3 This is a schematic diagram of the tape-tearing mechanism provided in this embodiment of the utility model; Figure 4 This is provided by the embodiment of the present utility model. Figure 2 A schematic diagram of the enlarged middle section.

[0019] In the diagram: 1. Tape application mechanism; 2. Tape tearing mechanism; 3. Tape reel; 4. Pneumatic shear; 5. Auxiliary wheel; 6. Crystal holder; 7. Lifting cylinder; 8. Forward and backward moving module one; 9. Left and right lateral moving module one; 10. Servo motor one; 11. Rotary gripper; 12. Rotary motor; 13. Forward and backward moving module two; 14. Left and right lateral moving module two; 15. Servo motor two; 16. Material feeding cylinder. Detailed Implementation

[0020] To further understand the utility model content, features and effects of this utility model, the following embodiments are provided, and detailed descriptions are given in conjunction with the accompanying drawings.

[0021] The structure of this utility model will now be described in detail with reference to the accompanying drawings.

[0022] refer to Figures 1 to 4As shown in the figure, an automatic adhesive tape applicator provided by this utility model includes a crystal tray 6, an adhesive tape applicator station, and an adhesive tape tearing station. An adhesive tape applicator 1 is installed at the adhesive tape applicator station, and an adhesive tape tearing station is installed at the adhesive tape tearing station. The adhesive tape applicator 1 includes a tape reel 3, an air shear 4, an auxiliary wheel 5, and a forward / backward moving module 8 and a left / right moving module 9 for moving the adhesive tape applicator components. The tape reel 3 is used for winding the adhesive tape, and the air shear 4... The device can move up and down and cut the tape after it has been applied. The auxiliary wheel 5 is used to guide the tape and make it fit tightly against the side wall of the crystal tray 6. The tape tearing mechanism 2 includes a rotating gripper 11, a feeding cylinder 16, and a forward and backward moving module 2 13 and a left and right transverse moving module 2 14 for driving the tape tearing component to move. The rotating gripper 11 is connected to a rotary motor 12. The bottom of the crystal tray 6 is equipped with a silicon rod fixture for supporting the crystal tray 6 and the silicon rod fixture moves between workstations.

[0023] Specifically, the tape-applying mechanism 1 is configured into two groups, left and right, for simultaneously applying tape to both sides of the crystal tray 6.

[0024] By adopting the above solution, tape can be applied to both sides of the crystal tray 6 at the same time. This improves the efficiency of the tape application process and ensures the consistency of the tape application position on both sides of the crystal tray 6, avoiding the deviation in application caused by unilateral operation and providing uniform protection for subsequent adhesive overflow.

[0025] Specifically, the tape-tearing mechanism 2 is configured as two sets, left and right, for simultaneously tearing tape from both sides of the crystal tray 6.

[0026] By adopting the above solution, the removal of adhesive tape on both sides of the crystal holder 6 can be completed simultaneously, shortening the time spent on the tape removal process. At the same time, it ensures that the force and speed of the tape removal on both sides are consistent, avoiding uneven force on one side that could cause the crystal holder 6 to shift or leave tape residue, thus ensuring the cleanliness and positional accuracy of the crystal holder 6 after removal.

[0027] Specifically, the forward and backward moving module 8 and the left and right lateral moving module 9 are driven by servo motor 10, and the forward and backward moving module 13 and the left and right lateral moving module 14 are driven by servo motor 15.

[0028] By adopting the above scheme, the movement path and speed of the forward and backward moving module 8 and the left and right moving module 9 can be precisely controlled, and the movements of the forward and backward moving module 13 and the left and right moving module 2 can be precisely controlled, thereby improving the accuracy of operation.

[0029] Specifically, a lifting cylinder 7 is provided above the air shear 4, and the output end of the lifting cylinder 7 is fixedly connected to the air shear 4.

[0030] Using the above solution, the lifting cylinder 7 can drive the air shear 4 to achieve stable up and down movement, ensuring that after the bonding process is completed, the air shear 4 can accurately move down to the tape cutting position, and then quickly move back up after cutting. The action response is rapid and accurate, avoiding cutting deviation or low efficiency caused by manual operation of the air shear 4.

[0031] Specifically, the output end of the feeding cylinder 16 is fixedly equipped with feeding claws, which can peel off the tape on the rotating claws 11.

[0032] Using the above solution, the feeding cylinder 16 drives the feeding gripper to automatically peel off the waste tape wrapped on the rotating gripper 11 and let it fall into the collection box below, realizing the automated collection of waste tape. There is no need for manual cleaning of the rotating gripper 11, reducing manual intervention and further improving the automation integration of the device.

[0033] Specifically, the rotating gripper 11, driven by the left-right lateral movement module 14 and the front-back movement module 13, moves and rotates simultaneously to wrap the tape so as to tear the tape off the crystal tray 6.

[0034] Using the above solution, the rotating gripper 11, driven by the left and right horizontal movement module 14 and the front and back movement module 13, and in conjunction with the rotation of the rotary motor 12, can completely wrap the tape from the side wall of the crystal tray 6 to itself, avoiding the tape from breaking or leaving residue during the tearing process, ensuring that there are no adhesive marks on the side wall of the crystal tray 6, and not affecting the subsequent silicon rod processing accuracy.

[0035] The working principle of this utility model: In use, when applying tape: After the silicon rod fixture carries the crystal tray 6 to the tape application station, the lifting cylinder pushes the clamping block to position the crystal tray 6. The tape is wrapped and fixed on the tape reel 3 and placed on the auxiliary wheel 5 through the corresponding pressure roller. The bonding component moves to the starting point of the edge of the crystal tray 6 under the drive of the front and rear moving module 8. After the tape is applied, it moves to the end point by the left and right transverse moving module 9. After the bonding is completed, the air shear 4 moves down to the tape. The air shear 4 closes to cut the tape and then opens back to its position. One set of tape application mechanism 1 on each side works at the same time. Sticking rods: After the tape is applied, the rods are transferred to the glue sticking station for automatic sticking. During the curing process of the silicone stick adhesive, the excess adhesive on both sides flows onto the applied tape, which can prevent it from flowing onto the crystal tray 6 and affecting the subsequent cutting process. After the silicone rod is pre-cured, the tooling is transferred to the tape tearing station. Once in place, the lifting cylinder pushes the clamping block to position it. The rotating jaw 11 moves to the end of the tape under the drive of the front and rear moving module 13. After the rotating jaw 11 picks up the tape head, it is pulled into the rotating rod. The rotating jaw 11 moves and rotates under the drive of the left and right moving module 14, wrapping the tape around the rotating jaw 11 until the entire tape is torn off. Cleaning: After the material is removed, move it to the material feeding cylinder 16 and the material feeding claw. The material feeding claw will pull the wrapped tape away into the collection box below. Rotate the claw 11 and then move it back to its original position by the forward and backward moving module 13. After the operation is completed, the tooling flows to the next station.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic adhesive tape application and removal device, comprising a crystal tray (6), characterized in that: It also includes a tape-applying station and a tape-tearing station. The tape-applying station is equipped with a tape-applying mechanism (1), and the tape-tearing station is equipped with a tape-tearing mechanism (2). The tape-applying mechanism (1) includes a tape reel (3), an air shear (4), an auxiliary wheel (5), and a forward and backward moving module (8) and a left and right horizontal moving module (9) that drive the tape-applying components to move. The tape reel (3) is used to wrap the tape, and the air shear (4) can move up and down to cut the tape after it is applied. The auxiliary wheel (5) is used to guide the tape and make it fit tightly against the side wall of the crystal tray (6). The tape tearing mechanism (2) includes a rotating gripper (11), a material feeding cylinder (16), and a front-to-back moving module (13) and a left-to-right moving module (14) for driving the tape tearing component to move. The rotating gripper (11) is connected to a rotary motor (12). The bottom of the crystal tray (6) is equipped with a silicon rod fixture for supporting the crystal tray (6) and the silicon rod fixture moves between workstations.

2. The automatic adhesive tape application and removal device as described in claim 1, characterized in that: The tape application mechanism (1) is set into two groups, left and right, for applying tape to both sides of the crystal tray (6) at the same time.

3. The automatic adhesive tape applicator as described in claim 1, characterized in that: The tape-tearing mechanism (2) is set into two groups, left and right, for simultaneously tearing tape from both sides of the crystal tray (6).

4. The automatic adhesive tape application and removal device as described in claim 1, characterized in that: The first forward and backward moving module (8) and the first left and right moving module (9) are driven by the first servo motor (10), and the second forward and backward moving module (13) and the second left and right moving module (14) are driven by the second servo motor (15).

5. The automatic adhesive tape applicator as described in claim 1, characterized in that: A lifting cylinder (7) is provided above the air shear (4), and the output end of the lifting cylinder (7) is fixedly connected to the air shear (4).

6. The automatic adhesive tape application and removal device as described in claim 1, characterized in that: The output end of the material feeding cylinder (16) is fixedly equipped with a material feeding claw, which can peel off the tape on the rotating claw (11).

7. The automatic adhesive tape application and removal device as described in claim 1, characterized in that: Driven by the left-right horizontal movement module two (14) and the front-back movement module two (13), the rotating gripper (11) moves and rotates to wrap the tape so as to tear the tape off the crystal tray (6).

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