Multifunctional multi-wire sawing sand wire
Patent Information
- Application Number
- CN202520425506.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-03-12
AI Technical Summary
然而，金刚石颗粒的硬度大且易形成棱角，容易在切割过程中在材料表面留下较深的损伤层，这需要在后续工艺中增加研磨、腐蚀或抛光等工序以去除损伤层，从而增加了生产成本和加工时间
1、本实用新型提供一种多功能多线切割砂线，通过分段镀不同材料颗粒，配合多线切割机的控制运动模式，实现了切割、研磨或粗抛光工艺的一次性完成，降低了生产成本和加工时间，提高了切割效率和切割质量，金刚石颗粒段确保高效切割，满足硬脆材料的加工需求，研磨材料颗粒段有效去除切割损伤层，提高产品表面质量。
Smart Images
Figure CN224780980U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of multifunctional multi-wire cutting abrasive wire technology, specifically to a multifunctional multi-wire cutting abrasive wire. Background Technology
[0002] In the field of materials processing, especially for cutting hard and brittle materials such as quartz and silicon wafers, conventional diamond cutting wire is widely used due to its high hardness. However, the high hardness of diamond particles and their tendency to form sharp edges can easily leave a deep damage layer on the material surface during cutting. This necessitates additional processes such as grinding, etching, or polishing in subsequent steps to remove the damage layer, thereby increasing production costs and processing time.
[0003] To address the aforementioned issues, existing technologies attempt to reduce damage by improving the material or structure of the cutting sand wire, but the effects are limited and subsequent processing steps cannot be completely avoided. Utility Model Content
[0004] The purpose of this invention is to provide a multifunctional multi-wire cutting abrasive wire to solve the problems mentioned in the background art.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: A multifunctional multi-wire cutting abrasive wire includes diamond particle segments Ld and abrasive material particle segments Lf. The abrasive material particle segments Lf are made of alumina, silicon carbide, and silicon oxide, with particle sizes ranging from 20µm to 0.1µm. The length ratio of the diamond particle segments Ld to the abrasive material particle segments Lf is Ld:Lf = 110:110, and the material can be distributed in a multi-segment structure.
[0006] A further improvement of this utility model is that the diamond particle segment Ld is responsible for cutting the material, and the particle size is the same as that in conventional diamond cutting wire.
[0007] A further improvement of this utility model is that the grinding material particle segment Lf is responsible for grinding the surface of the material and removing the damaged layer, and the particle size is 3um to 5um.
[0008] A further improvement of this utility model is that the silicon carbide particle segment Lp silicon carbide abrasive can be used for the finishing, polishing and grinding of ceramics, such as the surface treatment, finishing and polishing of ceramic products.
[0009] A further improvement of the present invention is that the silicon oxide particle segment Lg(4) is responsible for polishing the material.
[0010] Using the above technical solution, the length ratio of the diamond particle segment Ld to the abrasive material particle segment Lf is Ld:Lf=4:1, that is, 4 kilometers of diamond wire + 1 kilometer of alumina wire.
[0011] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows: 1. This utility model provides a multi-functional multi-wire cutting abrasive wire. By segmenting and plating different material particles, and coordinating with the control motion mode of the multi-wire cutting machine, it realizes the one-time completion of cutting, grinding or rough polishing processes, reducing production costs and processing time, and improving cutting efficiency and cutting quality. The diamond particle segment ensures efficient cutting and meets the processing needs of hard and brittle materials, while the grinding material particle segment effectively removes the cutting damage layer and improves the surface quality of the product.
[0012] 2. This utility model provides a multi-functional multi-wire cutting abrasive wire that completes the cutting and grinding process in one go, significantly reducing subsequent processing steps and time, and lowering production costs. The length ratio and material selection of the diamond particle segment and the abrasive material particle segment can be adjusted according to actual needs to achieve personalized customization. Attached Figure Description
[0013] Figure 1 This is a schematic diagram showing the distribution structure of the diamond particle segment Ld and the abrasive material particle segment Lf of this utility model. Figure 2 This is a schematic diagram of the structure of the diamond particle segment Ld of this utility model; Figure 3 This is a schematic diagram of the multi-segment cutting sand wire structure of this utility model; In the diagram: 1. Diamond particle segment Ld; 2. Abrasive material particle segment Lf; 3. Silicon carbide segment Lp; 4. Silicon oxide particle segment Lg. Detailed Implementation
[0014] The present invention will be further described in detail below with reference to embodiments: Example 1 like Figure 1-3 As shown, this utility model provides a multifunctional multi-wire cutting abrasive wire, including diamond particle segment Ld1 and abrasive material particle segment Lf2. The abrasive material particle segment Lf2 consists of silicon carbide segment Lp3 and silicon oxide particle segment Lg4, with particle sizes ranging from 20µm to 0.1µm. The length ratio of diamond particle segment Ld1 to abrasive material particle segment Lf2 is Ld:Lf=110:110, which can be a multi-segment material distribution. It is cut by a multi-wire cutting machine at a line speed of 800 meters per minute and a speed of 0.3mm / minute, reciprocating motion, resulting in a cutting disc with a lower damage layer and shallower saw marks, effectively reducing subsequent processing time.
[0015] Example 2 like Figure 1-3 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the diamond particle segment Ld1 is responsible for cutting the material, and the particle size is the same as that in conventional diamond cutting wire. The abrasive material particle segment Lf2 is responsible for abrading the material surface and removing the damaged layer. The particle size is 3um to 5um. At the same time, the length ratio of the diamond particle segment Ld1 and the abrasive material particle segment Lf2 can also be adjusted according to actual needs to achieve the best cutting effect.
[0016] Example 3 like Figure 1-3 As shown, based on Example 1, this utility model provides a technical solution: Preferably, the silicon carbide segment Lp3 silicon carbide abrasive can be used for the finishing, polishing and grinding of ceramics, such as the surface treatment, finishing and polishing of ceramic products. The silicon oxide particle segment Lg4 is responsible for the polishing of materials. The cutting abrasive wire can also be a multi-segment structure, including the distribution of three or four or more materials, to adapt to more complex cutting process requirements. The silicon carbide segment Lp3 is added as the third segment material. By adjusting the ratio and particle size of the diamond particle segment Ld1, the silicon carbide segment Lp3 and the silicon oxide particle segment Lg4, efficient cutting and precision grinding of specific materials are achieved.
[0017] The working principle of this multi-functional multi-wire cutting abrasive wire will be explained in detail below.
[0018] like Figure 1-3 As shown, during the cutting process, the diamond particle segment Ld1 first contacts the material and uses its high hardness to cut. Subsequently, the abrasive material particle segment Lf2 contacts the material and uses its abrasive action to remove the damaged layer generated during the cutting process. By controlling the motion mode of the multi-wire cutting machine, the cutting, grinding or rough polishing process can be completed in one go.
[0019] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.
Claims
1. A multifunctional multi-wire cutting abrasive wire, comprising diamond particle segment Ld (1) and abrasive material particle segment Lf (2), characterized in that: The grinding material particle segment Lf (2) consists of silicon carbide segment Lp (3) and silicon oxide particle segment Lg (4), with a particle size ranging from 20 μm to 0.1 μm. The length ratio of the diamond particle segment Ld (1) to the grinding material particle segment Lf (2) is Ld:Lf = (110):(110), which can be a multi-segment material distribution.
2. The multifunctional multi-wire cutting abrasive wire according to claim 1, characterized in that: The diamond particle segment Ld(1) is responsible for cutting the material, and the particle size is the same as that in conventional diamond cutting wire.
3. The multifunctional multi-wire cutting abrasive wire according to claim 1, characterized in that: The grinding material particle segment Lf(2) is responsible for grinding the surface of the material and removing the damaged layer. The particle size is 3um to 5um.
4. The multifunctional multi-wire cutting abrasive wire according to claim 1, characterized in that: The silicon carbide segment Lp(3) silicon carbide abrasive can be used for the finishing, polishing and grinding of ceramics, such as the surface treatment, finishing and polishing of ceramic products.
5. The multifunctional multi-wire cutting abrasive wire according to claim 1, characterized in that: The silicon oxide particle segment Lg(4) is responsible for polishing the material.