Interlayer stress buffer structure of copper-aluminum composite plate

Abstract

The utility model relates to the technical field of composite board discloses copper aluminium composite board interlayer stress buffer structure, including copper board, the top of copper board is provided with aluminium plate, and the upper surface of copper board is provided with buffer assembly, buffer assembly includes a plurality of recessed holes, a plurality of recessed holes are opened in the upper surface of copper board, the lower surface of aluminium plate is opened with a plurality of recessed groove, and the upper surface of copper board is fixedly connected with a plurality of support frame, a plurality of connecting grooves are opened in the outside of support frame, the inside fixed connection of connecting groove has buffer net, and the inside of support frame is filled with metal foam block. The utility model utilizes the clamping structure of support frame and recessed groove, recessed hole and hemisphere block and buffer block, is convenient for buffering protection when producing stress between copper aluminium plate, and cooperates buffer plate contact support net and metal foam board to further disperse stress, and silk screen absorbs strain energy through reversible phase change, strengthens the buffering effect, prolongs the service life of composite board.

Description

Technical Field

[0001] This utility model relates to the field of composite plate technology, and in particular to an interlayer stress buffer structure for copper-aluminum composite plates. Background Technology

[0002] Copper-aluminum composite panels are bimetallic sheets made of copper and aluminum through a specific process. They combine the advantages of copper, such as high electrical conductivity, thermal conductivity, and corrosion resistance, with aluminum, such as light weight, low cost, and good processability. They exhibit unique performance and application value in many fields. Copper-aluminum composite panels are usually made by combining copper and aluminum layers through metallurgical or mechanical bonding.

[0003] A search revealed that Chinese patent CN201721093U discloses a copper-aluminum composite plate. Copper has excellent electrical conductivity, thermal conductivity, and ductility, and is hard and wear-resistant, making it widely applicable. However, it is a scarce resource, resulting in high costs and limiting its application. Aluminum, on the other hand, is abundant. While its electrical and thermal conductivity are slightly weaker than copper, its low density, light weight, and low cost make it a high-quality, low-cost product that combines the excellent electrical conductivity, thermal conductivity, and ductility of copper with the advantages of light weight and low cost of aluminum.

[0004] In existing copper-aluminum composite panels, the two are usually directly connected, which makes it difficult to buffer the stress between them. This can easily lead to the destruction of the structural strength of the copper and aluminum plates under stress. Under mechanical loads, such as vibration, the deformation of copper and aluminum is inconsistent, and stress concentration areas will form at the interface. Furthermore, during thermal cycling, welding, or temperature fluctuations in the working environment, the expansion or contraction of copper and aluminum are different, which will generate alternating stress at the interface, leading to increased brittleness of the interface and making it prone to interlayer cracking, thus reducing the service life of the copper-aluminum composite panel. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a stress buffer structure for interlayer copper-aluminum composite plates.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a copper-aluminum composite plate interlayer stress buffer structure, comprising a copper plate, an aluminum plate disposed above the copper plate, and a buffer component disposed on the upper surface of the copper plate;

[0007] The buffer assembly includes multiple recessed holes on the upper surface of the copper plate, multiple grooves on the lower surface of the aluminum plate, multiple support frames fixedly connected to the upper surface of the copper plate, multiple connecting grooves on the outside of the support frames, buffer mesh fixedly connected inside the connecting grooves, and metal foam blocks filled inside the support frames.

[0008] As a further description of the above technical solution:

[0009] A wire mesh is fixedly connected to the lower surface of the aluminum plate, and multiple hexagonal frames and multiple buffer blocks are fixedly connected inside the wire mesh.

[0010] As a further description of the above technical solution:

[0011] The buffer block has a columnar groove inside, and an installation groove is formed at one end of the columnar groove. The installation groove is filled with a metal foam board, and a support net is fixedly connected above the metal foam board.

[0012] As a further description of the above technical solution:

[0013] A buffer plate is provided above the support net, and a connecting column is fixedly connected to the upper surface of the buffer plate. A hemispherical block is fixedly connected to one end of the connecting column.

[0014] As a further description of the above technical solution:

[0015] Both the groove and the metal foam block are hexagonal, and the buffer block is located on the upper surface of the hemispherical block.

[0016] As a further description of the above technical solution:

[0017] The concave hole is hemispherical, and the connecting post is located inside the columnar groove.

[0018] As a further description of the above technical solution:

[0019] Both the metal foam block and the metal foam board are made of nickel foam, and both the wire mesh and the support mesh are made of shape memory alloy.

[0020] This utility model has the following beneficial effects:

[0021] This invention, through the setting of a buffer component, utilizes the connection and engagement of the support frame and the groove, and the connection and engagement of the concave hole with the hemispherical block and the buffer block, to facilitate the buffering of stress when stress is generated between the copper plate and the aluminum plate. This facilitates the buffering and protection of the interlayer of the composite board. When the hemispherical block and the buffer block are engaged inside the concave hole, the contact between the buffer plate and the support mesh and the metal foam board further facilitates the buffering of stress between the copper plate and the aluminum plate. The wire mesh between the two can absorb strain energy through reversible phase transformation, which helps to enhance the buffering effect against stress. Thus, it protects the composite board formed by the copper plate and the aluminum plate as a whole and helps to extend the service life of the composite board. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the concave hole distribution structure proposed in this utility model;

[0023] Figure 2 This is a schematic diagram of the groove structure proposed in this utility model;

[0024] Figure 3 This is a schematic diagram of the support frame structure proposed in this utility model;

[0025] Figure 4 for Figure 1 Enlarged view of point A in the middle;

[0026] Figure 5 This is a schematic diagram of the hexagonal frame structure proposed in this utility model;

[0027] Figure 6 This is a schematic diagram of the wire mesh structure proposed in this utility model;

[0028] Figure 7 This is a schematic diagram of the cross-sectional structure of the buffer block proposed in this utility model;

[0029] Figure 8 This is a schematic diagram of the support mesh structure proposed in this utility model;

[0030] Figure 9 This is a schematic diagram of the hemispherical block structure proposed in this utility model.

[0031] Legend:

[0032] 1. Copper plate; 2. Aluminum plate; 3. Recessed hole; 4. Groove; 5. Support frame; 6. Connecting groove; 7. Buffer net; 8. Metal foam block; 9. Wire mesh; 10. Hexagonal frame; 11. Buffer block; 12. Columnar groove; 13. Mounting groove; 14. Buffer plate; 15. Connecting column; 16. Hemispherical block; 17. Metal foam board; 18. Support net. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] As attached Figure 1-9 As shown, one embodiment of this utility model is provided: a copper-aluminum composite plate interlayer stress buffer structure, including a copper plate 1, an aluminum plate 2 disposed above the copper plate 1, and a buffer component disposed on the upper surface of the copper plate 1.

[0035] The buffer assembly includes multiple recesses 3, which are formed on the upper surface of the copper plate 1 to accommodate the buffer block 11 and the hemispherical block 16. Multiple grooves 4 are formed on the lower surface of the aluminum plate 2 to accommodate the support frame 5. Multiple support frames 5 are fixedly connected to the upper surface of the copper plate 1. Multiple connecting grooves 6 are formed on the outside of the support frame 5. A buffer net 7 is fixedly connected inside the connecting groove 6 to absorb the stress of the support frame 5. The inside of the support frame 5 is filled with metal foam blocks 8, which absorb strain energy through plastic deformation to buffer the stress.

[0036] As attached Figure 5 As shown, a wire mesh 9 is fixedly connected to the lower surface of the aluminum plate 2. The wire mesh 9 facilitates the buffering of the contact surface between the copper plate 1 and the aluminum plate 2. Multiple hexagonal frames 10 are fixedly connected inside the wire mesh 9 to facilitate the passage of the support frame 5. Multiple buffer blocks 11 are fixedly connected inside the wire mesh 9 to contact and engage with the recessed holes 3.

[0037] As attached Figure 7 As shown, the buffer block 11 has a columnar groove 12 inside, and an installation groove 13 is provided at one end of the columnar groove 12, which facilitates the installation of the metal foam board 17 and the support net 18, and provides a small amount of space for the buffer board 14 to move.

[0038] As attached Figure 8 As shown, the interior of the mounting groove 13 is filled with a metal foam board 17 to absorb stress. A support net 18 is fixedly connected above the metal foam board 17 to support one side of the metal foam board 17. A buffer plate 14 is provided above the support net 18 to limit the connection post 15 and facilitate filling the mounting groove 13 to transfer stress. The upper surface of the buffer plate 14 is fixedly connected to the connection post 15. One end of the connection post 15 is fixedly connected to a hemispherical block 16 to facilitate contact with the interior of the concave hole 3 and form a buffer through the arc shape.

[0039] As attached Figure 1 As shown, both the groove 4 and the metal foam block 8 are hexagonal and honeycomb-shaped, which facilitates multi-directional limiting constraints. The concave hole 3 is hemispherical, which facilitates the insertion of the buffer block 11 and the hemispherical block 16.

[0040] As attached Figure 8 As shown, the buffer block 11 is disposed on the upper surface of the hemispherical block 16, and the buffer block 11 and the hemispherical block 16 form a hemispherical whole. The connecting column 15 is disposed inside the columnar groove 12 and is used to connect the buffer plate 14.

[0041] As attached Figure 4 As shown, both the metal foam block 8 and the metal foam board 17 are made of nickel foam, which absorbs strain energy through plastic deformation.

[0042] As attached Figure 6As shown, both the wire mesh 9 and the support mesh 18 are made of shape memory alloy, which absorbs strain energy through reversible phase transformation.

[0043] Working principle: When copper plate 1 and aluminum plate 2 are joined together to form a composite board through normal connection process, the hexagonal frame 10 will be inserted into the groove 4, the hemispherical block 16 and the buffer block 11 will be inserted into the recess 3, and the wire mesh 9 will be located between copper plate 1 and aluminum plate 2. When stress is generated between the layers of the composite board, the collision between the hexagonal frame 10 and the groove 4 will generate anisotropic constraints, thereby reducing stress concentration. The buffer mesh 7 helps to support and absorb the external force on the hexagonal frame 10. At the same time, in conjunction with the metal foam block 8, it facilitates further absorption of the hexagonal frame. When subjected to external force, the hemispherical block 16 is constrained by the concave hole 3 when subjected to force. The hemispherical block 16 will drive the connecting column 15 and the buffer plate 14 to move inside the mounting groove 13. Under the effect of restricted movement space, the buffer plate 14 touches and squeezes the support mesh 18. The support mesh 18 transmits the pressure to the metal foam board 17, so that the metal foam board 17 absorbs the stress, thereby further reducing stress concentration and playing a buffering role. In conjunction with the wire mesh 9, it is convenient to disperse stress and buffer the copper plate 1 and aluminum plate 2 in the initial stage when subjected to external force.

[0044] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A copper-aluminum composite plate interlayer stress buffer structure, comprising a copper plate (1), wherein an aluminum plate (2) is disposed above the copper plate (1), characterized in that: A buffer assembly is provided on the upper surface of the copper plate (1); The buffer assembly includes multiple recesses (3), which are formed on the upper surface of the copper plate (1). Multiple grooves (4) are formed on the lower surface of the aluminum plate (2). Multiple support frames (5) are fixedly connected to the upper surface of the copper plate (1). Multiple connecting grooves (6) are formed on the outside of the support frames (5). A buffer net (7) is fixedly connected inside the connecting grooves (6). Metal foam blocks (8) are filled inside the support frames (5).

2. The interlayer stress buffer structure of the copper-aluminum composite plate according to claim 1, characterized in that: The lower surface of the aluminum plate (2) is fixedly connected with a wire mesh (9), and a plurality of hexagonal frames (10) are fixedly connected inside the wire mesh (9). A plurality of buffer blocks (11) are fixedly connected inside the wire mesh (9). The buffer block (11) has a columnar groove (12) inside, and an installation groove (13) is provided at one end of the columnar groove (12). The installation groove (13) is filled with a metal foam board (17), and a support net (18) is fixedly connected above the metal foam board (17).

3. The interlayer stress buffer structure of the copper-aluminum composite plate according to claim 2, characterized in that: A buffer plate (14) is provided above the support net (18).

4. The interlayer stress buffer structure of the copper-aluminum composite plate according to claim 3, characterized in that: A connecting post (15) is fixedly connected to the upper surface of the buffer plate (14), and a hemispherical block (16) is fixedly connected to one end of the connecting post (15).

5. The interlayer stress buffer structure of the copper-aluminum composite plate according to claim 2, characterized in that: The groove (4) and the metal foam block (8) are both hexagonal, and the buffer block (11) is set on the upper surface of the hemispherical block (16).

6. The interlayer stress buffer structure of the copper-aluminum composite plate according to claim 4, characterized in that: The concave hole (3) is set to be hemispherical, and the connecting post (15) is set inside the columnar groove (12).

7. The interlayer stress buffer structure of the copper-aluminum composite plate according to claim 2, characterized in that: The metal foam block (8) and metal foam board (17) are both made of nickel foam, and the wire mesh (9) and support mesh (18) are both made of shape memory alloy.

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