A copper clad plate comprising a graphene glass fiber fabric

Abstract

The application relates to the technical field of copper-clad plates, in particular to a copper-clad plate containing a graphene glass fiber fabric. The copper-clad plate is a press structure formed by combining and arranging an electrically conductive fabric and a prepreg and then pressing the combination with a copper foil; the copper foil is located at the outermost side of the overall structure of the copper-clad plate and is located at opposite sides; the prepreg is a prepreg formed by semi-solidification treatment of glass fibers; the electrically conductive fabric comprises: a fabric base; the fabric base is a graphene glass fiber fabric; at least two bus bars; the bus bars are respectively located at opposite side edges of the fabric base, and there is a spacing between the head and tail of adjacent bus bars; the bus bar comprises: an electrically conductive adhesive layer and a metal electrode layer; the electrically conductive adhesive layer is located between the metal electrode layer and the fabric base; further comprising: a plurality of conductive fibers; the electrically conductive adhesive layer and the metal electrode layer are fixed on the surface of the fabric base through the conductive fibers; and an electrically conductive pad; the electrically conductive pad is located on the local surface of the metal electrode layer on the side away from the fabric base.

Description

Technical Field

[0001] This application relates to the field of copper clad laminate technology, and more specifically to a copper clad laminate containing graphene glass fiber fabric. Background Technology

[0002] Copper clad laminate (CCL) is an indispensable core material in the electronics industry, playing a crucial role in PCB manufacturing. Its applications are widespread, covering numerous fields such as computers, mobile phones, communications, aerospace, and automobiles. However, rigid CCL remains the dominant market demand, accounting for over 85.8%. Among these, fiberglass cloth-based CCL FR-4 is a core industry requirement, but its structure and function are limited. It is mainly composed of fiberglass cloth reinforcing material impregnated with resin and then laminated with copper foil through a hot-pressing process. Ordinary fiberglass cloth-based CCL has poor thermal conductivity (generally less than 1 W / (m*k)) and cannot be heated, failing to meet the urgent need for multifunctional materials in the electronic materials field that combine electromagnetic control and thermal management.

[0003] Therefore, a solution is needed to address the problems of poor thermal conductivity and inability to heat existing fiberglass cloth-based copper clad laminates, which make it difficult to meet multifunctional requirements. Utility Model Content

[0004] In view of this, this application provides a copper-clad laminate containing graphene glass fiber fabric to solve the problems of poor thermal conductivity and inability to heat existing glass fiber cloth-based copper-clad laminates, which make it difficult to meet multifunctional requirements.

[0005] In one aspect of this application, a copper-clad laminate comprising graphene glass fiber fabric is provided. The copper-clad laminate is a laminated structure formed by arranging conductive fabric and prepreg together and then pressing them together with copper foil. The copper foil is located on the outermost side of the overall structure of the copper-clad laminate, and on opposite sides; Prepreg is a prepreg made from glass fiber through a prepreg process; Conductive fabrics include: Fabric substrate; the fabric substrate is graphene glass fiber fabric; At least two busbars; the busbars are located on opposite sides of the fabric substrate, and there is a gap between the beginning and end of adjacent busbars; The busbar includes: a conductive adhesive layer and a metal electrode layer; the conductive adhesive layer is located between the metal electrode layer and the fabric substrate; it also includes: a number of conductive fibers; the conductive adhesive layer and the metal electrode layer are fixed to the surface of the fabric substrate by sewing the conductive fibers. Conductive pads; conductive pads are located on a localized surface of the metal electrode layer on the side facing away from the fabric substrate.

[0006] The copper-clad laminate provided in this application comprises graphene glass fiber fabric. The graphene glass fiber fabric with electrodes is laminated together with a prepreg and copper foil in a stacked manner. The prepreg is disposed between the graphene glass fiber and the copper foil, serving as insulation, while the copper foil is disposed on the outermost layer. Graphene has excellent thermal and electrical conductivity, which can improve the thermal conductivity of the copper-clad laminate structure under normal conditions. Furthermore, by energizing the electrodes, the graphene surface can be heated, enabling the copper-clad laminate to be used in harsh environments such as cold environments. In addition, graphene also has excellent electromagnetic properties, enabling electromagnetic shielding and other functions, which helps to expand the application scenarios of copper-clad laminates. In the copper-clad laminate provided in this application, graphene exhibits excellent thermal and electrical conductivity, which can improve the thermal conductivity of the copper-clad laminate structure under normal conditions. Furthermore, the conductive fabric provided in this application uses a conductive adhesive layer as a transition between the metal electrode of the busbar and the fabric substrate. On one hand, the conductive adhesive, being softer than the metal electrode, allows for more thorough contact between the busbar and the fabric substrate. On the other hand, the conductive adhesive has a grid pattern corresponding to a screen printing stencil, ensuring a certain porosity. This is beneficial for the subsequent impregnation of resin materials during the composite material fabrication process. The conductive fabric provided in this application also uses conductive fibers to sew and fix the busbar to the fabric substrate surface. This, along with the conductive adhesive, secures the metal electrode, making the entire busbar more stable. Additionally, the conductive fibers themselves provide a conductive path, improving the overall current-carrying capacity of the busbar. Furthermore, by energizing the electrodes, the graphene surface can be heated, enabling copper-clad laminates to be used in harsh environments such as cold, thus realizing the multi-functional application of copper-clad laminates. In addition, graphene also has excellent electromagnetic properties, which can achieve electromagnetic shielding, thereby expanding the application scenarios of copper-clad laminates.

[0007] In some embodiments of this application, the conductive fibers include blended metal fibers such as polyester-cotton, polyester filament, conductive filament, copper fiber, and stainless steel fiber; the specifications include 150D / 3, 250D / 3, 300D / 3, and 420D / 3.

[0008] In some embodiments of this application, the metal electrode layer includes a copper mesh cut into strips; The conductive adhesive layer has the screen printing pattern of a screen printing stencil, corresponding to screen printing stencils of 50 mesh to 400 mesh.

[0009] In some embodiments of this application, the conductive pad includes a metal pad and a solder metal layer; the metal pad is fixedly connected to a local surface of the metal electrode layer through the solder metal layer; the conductive pads of different busbars are located on the same side of the fabric substrate; Metal pads include copper sheets, and the solder metal layer includes a solder paste layer; The maximum length of the metal pad is less than the width of the busbar.

[0010] In some embodiments of this application, the spacing between the busbars is 5mm to 200mm; The width of the busbar is 2mm-10mm; The sheet resistance of the fabric substrate is 1Ω~20000Ω.

[0011] In some embodiments of this application, the prepreg includes glass fibers and a resin material coating the surface of the glass fibers; The glass fiber forms a flat layer structure, and the resin material covers at least the top and bottom surfaces of the flat layer structure.

[0012] In some embodiments of this application, the conductive fabric is located in the center of the copper-clad laminate; Single or multiple layers of prepreg are located on the upper and lower surfaces of the conductive fabric; The copper foil is located on the surface of the prepreg on the upper surface of the conductive fabric facing away from the conductive fabric, and on the surface of the prepreg on the lower surface of the conductive fabric facing away from the conductive fabric.

[0013] In some embodiments of this application, a single-layer or multi-layer prepreg is located in the center of the copper-clad laminate as a central insulating layer; Conductive fabric is located on the upper and lower surfaces of the central insulating layer; Single or multiple layers of prepreg are also located on the surface of the conductive fabric on the side opposite to the central insulating layer, serving as an outer insulating layer. The copper foil is located on the outer insulating layer on both sides of the surface facing away from the conductive fabric. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of a copper-clad laminate containing graphene glass fiber fabric according to an embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the structure of the prepreg in the graphene-containing glass fiber fabric; Figure 3 for Figure 1 A schematic diagram of the conductive fabric in the graphene-containing glass fiber fabric. Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure at section line AA in the diagram; Figure 5This is a schematic diagram of the structure of a copper-clad laminate containing graphene glass fiber fabric according to the second embodiment of this application; Figure 6 This is a schematic diagram of the structure of a copper-clad laminate containing graphene glass fiber fabric according to the third embodiment of this application. Figure 7 This is a schematic diagram of the structure of a copper-clad laminate containing graphene glass fiber fabric according to the fourth embodiment of this application. Figure 8 This is a schematic diagram of the structure of a copper-clad laminate containing graphene glass fiber fabric according to the fifth embodiment of this application. Figure 9 A test table of thermal conductivity of conductive fabric in a copper-clad laminate containing graphene glass fiber fabric, according to an embodiment of this application. Figure 10 This is a diagram showing the electromagnetic shielding performance parameters of the conductive fabric in a copper-clad laminate containing graphene glass fiber fabric, according to an embodiment of this application. Figure 11 This is a schematic flowchart illustrating the manufacturing process of a copper-clad laminate containing graphene glass fiber fabric, according to an embodiment of this application.

[0016] Explanation of reference numerals in the attached figures: 100. Graphene glass fiber; 110. Busbar; 111. Conductive adhesive layer; 112. Metal electrode layer; 113. Conductive fiber; 120. Conductive pad; 121. Welding metal layer; 122. Metal pad; 200. Prepreg; 210. Glass fiber; 220. Resin material; 300. Copper foil. Detailed Implementation

[0017] As mentioned above, existing glass fiber cloth-based copper clad laminates suffer from poor thermal conductivity and cannot be heated, making it difficult to meet multifunctional requirements. Therefore, this application provides a copper clad laminate containing graphene glass fiber fabric to solve the aforementioned problems.

[0018] This application provides a copper-clad laminate comprising graphene glass fiber fabric. The copper-clad laminate is a laminated structure formed by arranging conductive fabric and prepreg together and pressing them with copper foil. The copper foil is located on the outermost side of the overall structure of the copper-clad laminate and on opposite sides. The prepreg is a prepreg formed by prepreg treatment of glass fiber. The conductive fabric includes: a fabric substrate; the fabric substrate is graphene glass fiber fabric; at least two busbars; the busbars are located on opposite sides of the fabric substrate, and there is a gap between the beginning and end of adjacent busbars; the busbars include: a conductive adhesive layer and a metal electrode layer; the conductive adhesive layer is located between the metal electrode layer and the fabric substrate; it also includes: a plurality of conductive fibers; the conductive adhesive layer and the metal electrode layer are sewn to the surface of the fabric substrate by the conductive fibers; and conductive pads; the conductive pads are located on a partial surface of the metal electrode layer facing away from the fabric substrate.

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Example 1 This embodiment provides a copper-clad laminate containing graphene glass fiber fabric. The copper-clad laminate is a laminated structure formed by arranging conductive fabric and prepreg together and then pressing them with copper foil. refer to Figure 1 The copper foil 300 is located on the outermost side of the overall structure of the copper-clad laminate and on opposite sides; Precursor 200 is a precursor formed from glass fiber through a precuring process; refer to Figure 3 and Figure 4 The conductive fabric includes: Fabric substrate 100; Fabric substrate 100 is a graphene glass fiber fabric; At least two busbars 110; the busbars 110 are located on opposite sides of the fabric substrate, and there is a gap between the beginning and end of adjacent busbars 110; Busbar 110 includes: a conductive adhesive layer 111 and a metal electrode layer 112; the conductive adhesive layer 111 is located between the metal electrode layer 112 and the fabric substrate 100; it also includes: a plurality of conductive fibers 113; the conductive adhesive layer 111 and the metal electrode layer 112 are sewn to the surface of the fabric substrate 100 through the conductive fibers 113. Conductive pad 120; Conductive pad 120 is located on a local surface of the metal electrode layer 112 on the side opposite to the fabric substrate 100.

[0021] It should be noted that the busbar 110 and the conductive pad 120 are in Figure 1 The components are combined into a single structure for ease of display. Furthermore, the busbar 110 and conductive pad 120 are pressed into the fabric substrate 100 and simultaneously pressed into the prepreg 200 by the pressure of the prepreg. When not pressed, as... Figure 4 The state shown.

[0022] The copper-clad laminate provided in this application includes graphene glass fiber fabric. The conductive fabric with electrodes, i.e., graphene glass fiber cloth, is laminated together with a prepreg 200 and a copper foil 300 in a stacked manner. The prepreg 200 is disposed between the conductive fabric and the copper foil 300, serving as insulation, while the copper foil 300 is disposed on the outermost layer. Graphene has excellent thermal and electrical conductivity, which can improve the thermal conductivity of the copper-clad laminate structure under normal conditions. Furthermore, by energizing the electrodes, the graphene surface can be heated, enabling the copper-clad laminate to be used in harsh environments such as cold regions. In addition, graphene also has excellent electromagnetic properties, enabling electromagnetic shielding, which helps to expand the application scenarios of copper-clad laminates. In the copper-clad laminate provided in this application, graphene exhibits excellent thermal and electrical conductivity, which can improve the thermal conductivity of the copper-clad laminate structure under normal conditions. Furthermore, the conductive fabric provided in this application uses a conductive adhesive layer 111 as a transition between the metal electrode 112 of the busbar 110 and the fabric substrate 100. On one hand, the conductive adhesive, being softer than the metal electrode 112, allows for more complete contact between the busbar 110 and the fabric substrate 100, resulting in lower overall contact resistance. On the other hand, the conductive adhesive has a grid pattern corresponding to a screen printing stencil, ensuring a certain porosity. This facilitates resin impregnation during subsequent composite material fabrication. The conductive fabric provided in this application also uses conductive fibers 113 to sew and fix the busbar 110 to the surface of the fabric substrate 100. These fibers, together with the conductive adhesive, fix the metal electrode 112, making the entire busbar 110 more securely fixed. Furthermore, the conductive fibers 113 themselves provide a certain conductive path, improving the overall current-carrying capacity of the busbar 110. Furthermore, by energizing the electrodes, the graphene surface can be heated, enabling the copper-clad laminate (CCL) to be used in harsh environments such as cold weather, thus achieving multi-functional applications. In addition, graphene possesses excellent electromagnetic properties, enabling electromagnetic shielding and expanding the application scenarios of CCL. In practical use, the graphene glass fiber fabric is heated by connecting the conductive pads 120 on the busbars 110 on both sides to pre-set or temporarily connected external circuits, thereby actively heating the CCL. The operation is simple and applicable to various scenarios.

[0023] In some embodiments of this application, the conductive fiber 113 includes a blend of polyester-cotton filament or polyester filament with copper fiber or stainless steel fiber. Optional specifications include 150D / 3 to 420D / 3, for example, 150D / 3, 250D / 3, 300D / 3, or 420D / 3.

[0024] In some embodiments of this application, the metal electrode layer 112 comprises a copper mesh cut into strips. In some specific embodiments, the metal electrode layer 112 is a 200-mesh copper mesh. In other embodiments, copper meshes of other mesh sizes may be selected.

[0025] The conductive adhesive layer 111 has the screen printing pattern of a screen printing stencil, corresponding to a screen printing stencil of 50 mesh to 400 mesh.

[0026] In some embodiments of this application, the conductive pad 120 includes a metal pad 122 and a solder metal layer 121; the metal pad 122 is fixedly connected to a local surface of the metal electrode layer 112 through the solder metal layer 121; the conductive pads 120 of different busbars 110 are located on the same side of the fabric substrate 100. Metal pad 122 includes copper sheet, and solder metal layer 121 includes solder paste layer; The maximum length of the metal pad 122 is less than the width of the busbar 110.

[0027] In some embodiments of this application, the spacing between the busbars 110 is 5mm to 200mm; The width of busbar 110 is 2mm-10mm; The sheet resistance of the fabric substrate 100 is 1Ω~20000Ω.

[0028] refer to Figure 2 In some embodiments of this application, the prepreg 200 includes glass fiber 210 and resin material 220 covering the surface of the glass fiber 210; Glass fiber 210 forms a flat layer structure, and resin material 220 covers at least the top and bottom surfaces of the flat layer structure.

[0029] In some embodiments of this application, the conductive fabric is located in the center of the copper-clad laminate; Single or multiple layers of prepreg are located on the upper and lower surfaces of the conductive fabric; The copper foil is located on the surface of the prepreg on the upper surface of the conductive fabric facing away from the conductive fabric, and on the surface of the prepreg on the lower surface of the conductive fabric facing away from the conductive fabric.

[0030] refer to Figure 1In some embodiments, a single-layer prepreg 200 is located on the upper and lower surfaces of the conductive fabric; copper foil 300 is located on the surface of the prepreg 200 on the upper surface of the conductive fabric facing away from the conductive fabric and on the surface of the prepreg 200 on the lower surface of the conductive fabric facing away from the conductive fabric.

[0031] In this embodiment, the thermal conductivity parameters of the conductive fabric, namely the graphene glass fiber conductive fabric, in the copper-clad laminate are referenced. Figure 9 .like Figure 9 As shown, at 30℃, the horizontal thermal diffusivity is 4.73 and the thermal conductivity is 8.9 W / (m·K). This indicates that the thermal conductivity of the copper-clad laminate has been effectively improved.

[0032] In this embodiment, the electromagnetic shielding performance of the conductive fabric, namely the graphene glass fiber conductive fabric, in the copper-clad laminate is referenced. Figure 10 .like Figure 10 As shown, the shielding performance of three different sheet resistance glass fiber fabrics was tested using the coaxial method. The figure shows three sheet resistance data: the Rs-L coaxial curve is around 25dB, and the waveform is basically stable; the Rs-M coaxial curve is around 22dB, and the waveform is basically stable; the Rs-H coaxial curve is around 10dB, and the waveform is basically stable. This indicates that graphene glass fiber conductive fabrics with different sheet resistances all have good and stable electromagnetic shielding performance, and are suitable for achieving the electromagnetic shielding performance of copper clad laminates.

[0033] Example 2 This embodiment provides a copper-clad laminate containing graphene glass fiber fabric.

[0034] refer to Figure 5 The difference from Embodiment 1 above is that the multilayer prepreg 200 (two layers in this embodiment) is located on the upper and lower surfaces of the conductive fabric; the copper foil 300 is located on the outermost layer of the prepreg 200 on the upper surface of the conductive fabric facing away from the conductive fabric and the outermost layer of the prepreg 200 on the lower surface of the conductive fabric facing away from the conductive fabric.

[0035] In addition, in some other embodiments of this application, such as embodiments 3-5 below, a single or multiple layers of prepreg are located in the center of the copper-clad laminate as a central insulating layer; Conductive fabric is located on the upper and lower surfaces of the central insulating layer; Single or multiple layers of prepreg are also located on the surface of the conductive fabric on the side opposite to the central insulating layer, serving as an outer insulating layer. The copper foil is located on the outer insulating layer on both sides of the surface facing away from the conductive fabric.

[0036] Example 3 This embodiment provides a copper-clad laminate containing graphene glass fiber fabric.

[0037] refer to Figure 6 In this embodiment, the single-layer prepreg 200 is located in the center of the copper-clad laminate, serving as the central insulating layer; Conductive fabric is located on the upper and lower surfaces of the central insulating layer; The single-layer prepreg 200 is also located on the surface of the conductive fabric on the side opposite to the central insulating layer, serving as an outer insulating layer; Copper foil 300 is located on the outer insulating layer of both sides, on the side facing away from the conductive fabric.

[0038] Example 4 This embodiment provides a copper-clad laminate containing graphene glass fiber fabric.

[0039] refer to Figure 7 The multilayer prepreg 200 (4 layers in this embodiment) is located in the center of the copper-clad laminate, serving as the central insulating layer; Conductive fabric is located on the upper and lower surfaces of the central insulating layer; The single-layer prepreg 200 is also located on the surface of the conductive fabric on the side opposite to the central insulating layer, serving as an outer insulating layer; Copper foil 300 is located on the outer insulating layer of both sides, on the side facing away from the conductive fabric.

[0040] Example 5 This embodiment provides a copper-clad laminate containing graphene glass fiber fabric.

[0041] refer to Figure 8 The multilayer prepreg 200 (two layers in this embodiment) is located in the center of the copper-clad laminate, serving as the central insulating layer; Conductive fabric is located on the upper and lower surfaces of the central insulating layer; The multilayer prepreg 200 (two layers in this embodiment) is also located on the surface of the conductive fabric facing away from the central insulating layer, serving as an outer insulating layer; Copper foil 300 is located on the outer insulating layer of both sides, on the side facing away from the conductive fabric.

[0042] Example 6 This embodiment provides a method for manufacturing a copper-clad laminate containing graphene glass fiber fabric according to any one of the above embodiments 1-5.

[0043] refer to Figure 11 The method and process are as follows: Fiberglass is available; Forming a semi-cured sheet: The glass fiber is coated with adhesive, dried, and cut into sheets to obtain... Figure 2 The prepreg shown has a curing degree of approximately 50% after the adhesive is applied.

[0044] Forming graphene glass fiber fabric: Glass fiber is placed into a reaction chamber; a carbon source and a protective gas are introduced into the reaction chamber. The carbon source is one or more of methane, ethylene, propylene, acetylene, propyne, etc., and the protective gas is one or more of nitrogen, argon, hydrogen, etc. The temperature is increased to 900~1100℃ at a rate of 15-20℃ / min, and the pressure in the reaction chamber is maintained between 10 and 100 Pa. The reaction time is 1~7h, and a graphene glass fiber fabric with a thermal conductivity >3W / (m·k) and a sheet resistance of 1Ω~20000Ω is obtained. Fixed busbar: A strip of metal printed with conductive adhesive is used, with the conductive adhesive side facing the fabric substrate surface. The busbar is then sewn to the fabric substrate surface using conductive fibers to fix it in place. The strip of metal forms the metal electrode layer of the busbar, and the conductive adhesive forms the conductive adhesive layer of the busbar. Mounting pads: Conductive pads are provided on a local surface of the busbar on the side of the metal electrode layer facing away from the fabric substrate. Copper foil, prepreg, graphene glass fiber fabric with busbars and pads are arranged and laminated together in a designed combination (such as any of Examples 1-5 above, or other lamination methods) to form a copper-clad laminate containing graphene glass fiber fabric. The lamination temperature is 150℃~200℃, the pressure is 5-20MPa, and the curing time is 3-6 hours to obtain the copper-clad laminate containing graphene glass fiber.

[0045] Following that, it also includes: Cut the laminated copper-clad laminate to the required size and inspect and package it.

[0046] Use a multimeter to place the two probes on the soldered copper sheet (conductive pad) to measure the resistance of the busbars on both sides. The actual measured resistance is considered to be within 3% of the theoretical resistance calculated and designed for graphene glass fiber.

[0047] The solutions of this application have been disclosed above through embodiments. Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A copper-clad laminate comprising graphene glass fiber fabric, characterized in that, The copper-clad laminate is a laminated structure formed by pressing a combination of conductive fabric and prepreg with copper foil. The copper foil is located on the outermost side of the overall structure of the copper-clad laminate and on opposite sides; The prepreg is a prepreg formed from glass fiber through a prepreg treatment; The conductive fabric includes: Fabric substrate; the fabric substrate is a graphene glass fiber fabric; At least two busbars; the busbars are located on opposite sides of the fabric substrate, and there is a gap between the beginning and end of each adjacent busbar; The busbar includes: a conductive adhesive layer and a metal electrode layer; the conductive adhesive layer is located between the metal electrode layer and the fabric substrate; it also includes: a plurality of conductive fibers; the conductive adhesive layer and the metal electrode layer are sewn to the surface of the fabric substrate by the conductive fibers; Conductive pads; the conductive pads are located on a partial surface of the metal electrode layer on the side opposite to the fabric substrate.

2. The copper-clad laminate comprising graphene glass fiber fabric according to claim 1, characterized in that, The conductive fiber includes a blend of polyester-cotton filament or polyester filament with copper fiber or stainless steel fiber.

3. The copper-clad laminate comprising graphene glass fiber fabric according to claim 1, characterized in that, The metal electrode layer includes a copper mesh cut into strips; The conductive adhesive layer has the screen printing pattern of a screen printing stencil, corresponding to a screen printing stencil of 50 mesh to 400 mesh.

4. The copper-clad laminate comprising graphene glass fiber fabric according to claim 1, characterized in that, The conductive pads include metal pads and a solder metal layer; the metal pads are fixedly connected to a local surface of the metal electrode layer through the solder metal layer; the conductive pads of different busbars are located on the same side of the fabric substrate; The metal pads include copper sheets, and the welding metal layer includes a solder paste layer; The maximum length of the metal pad is less than the width of the busbar.

5. The copper-clad laminate comprising graphene glass fiber fabric according to claim 1, characterized in that, The spacing between the busbars is 5mm to 200mm; The width of the busbar is 2mm-10mm; The sheet resistance of the fabric substrate is 1Ω~20000Ω.

6. The copper-clad laminate comprising graphene glass fiber fabric according to claim 1, characterized in that, The prepreg comprises glass fiber and a resin material coating the surface of the glass fiber; The glass fibers form a flat layer structure, and the resin material covers at least the top and bottom surfaces of the flat layer structure.

7. The copper-clad laminate comprising graphene glass fiber fabric according to claim 1, characterized in that, The conductive fabric is located in the center of the copper-clad laminate; One or more layers of the prepreg are located on the upper and lower surfaces of the conductive fabric; The copper foil is located on the surface of the prepreg on the upper surface of the conductive fabric facing away from the conductive fabric, and on the surface of the prepreg on the lower surface of the conductive fabric facing away from the conductive fabric.

8. The copper-clad laminate comprising graphene glass fiber fabric according to claim 1, characterized in that, One or more layers of the prepreg are located in the center of the copper-clad laminate, serving as a central insulating layer; The conductive fabric is located on the upper and lower surfaces of the central insulating layer; The single or multiple layers of the prepreg are also located on the surface of the conductive fabric facing away from the central insulating layer, serving as an outer insulating layer; The copper foil is located on the outer insulating layer on both sides of the conductive fabric side surface.

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